Part | RoHS | Manufacturer | Memory IC Type | Temperature Grade | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Surface Mount | No. of Functions | Technology | Screening Level | Terminal Form | Parallel or Serial | Operating Mode | Sector Size (Words) | Maximum Supply Current | No. of Words | Input/Output Type | Nominal Supply Voltage / Vsup (V) | Toggle Bit | Power Supplies (V) | Memory Width | Package Style (Meter) | Package Equivalence Code | Alternate Memory Width | Sub-Category | Minimum Data Retention Time | Terminal Pitch | Maximum Operating Temperature | Reverse Pinout | Output Characteristics | Organization | No. of Words Code | Minimum Operating Temperature | No. of Sectors/Size | Command User Interface | Terminal Finish | I2C Control Byte | Ready or Busy | Terminal Position | No. of Ports | Write Protection | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Endurance | Maximum Clock Frequency (fCLK) | Width | Qualification | Maximum Write Cycle Time (tWC) | Serial Bus Type | Boot Block | Memory Density | Minimum Supply Voltage (Vsup) | Additional Features | Page Size (words) | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Type | Maximum Standby Current | Length | Common Flash Interface | Maximum Access Time | Programming Voltage (V) | Data Polling |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Renesas Electronics |
EEPROM |
INDUSTRIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
32768 words |
5 |
8 |
CHIP CARRIER |
1.27 mm |
85 Cel |
32KX8 |
32K |
-40 Cel |
MATTE TIN |
QUAD |
R-PQCC-J32 |
3 |
5.5 V |
3.55 mm |
11.43 mm |
Not Qualified |
5 ms |
262144 bit |
4.5 V |
e3 |
30 |
260 |
13.97 mm |
120 ns |
5 |
||||||||||||||||||||||||||||||
|
Renesas Electronics |
EEPROM |
INDUSTRIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
32768 words |
5 |
8 |
CHIP CARRIER |
1.27 mm |
85 Cel |
32KX8 |
32K |
-40 Cel |
MATTE TIN |
QUAD |
R-PQCC-J32 |
3 |
5.5 V |
3.55 mm |
11.43 mm |
5 ms |
262144 bit |
4.5 V |
e3 |
30 |
260 |
13.97 mm |
120 ns |
5 |
|||||||||||||||||||||||||||||||
|
Renesas Electronics |
EEPROM |
INDUSTRIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
32768 words |
5 |
8 |
CHIP CARRIER |
1.27 mm |
85 Cel |
32KX8 |
32K |
-40 Cel |
MATTE TIN |
QUAD |
R-PQCC-J32 |
3 |
5.5 V |
3.55 mm |
11.43 mm |
5 ms |
262144 bit |
4.5 V |
e3 |
30 |
260 |
13.97 mm |
90 ns |
5 |
|||||||||||||||||||||||||||||||
|
Renesas Electronics |
EEPROM |
INDUSTRIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
32768 words |
5 |
8 |
CHIP CARRIER |
1.27 mm |
85 Cel |
32KX8 |
32K |
-40 Cel |
MATTE TIN |
QUAD |
R-PQCC-J32 |
3 |
5.5 V |
3.55 mm |
11.43 mm |
Not Qualified |
5 ms |
262144 bit |
4.5 V |
e3 |
30 |
260 |
13.97 mm |
90 ns |
5 |
||||||||||||||||||||||||||||||
|
Renesas Electronics |
EEPROM |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
2.5 mA |
256 words |
3.3 |
3/5 |
8 |
SMALL OUTLINE |
SOP8,.25 |
EEPROMs |
100 |
1.27 mm |
85 Cel |
256X8 |
256 |
-40 Cel |
1010DDDR |
DUAL |
HARDWARE |
R-PDSO-G8 |
5.5 V |
1.73 mm |
1000000 Write/Erase Cycles |
.4 MHz |
3.9 mm |
Not Qualified |
5 ms |
I2C |
2048 bit |
2.5 V |
260 |
.000002 Amp |
4.89 mm |
3.3 |
||||||||||||||||||||||||
|
Renesas Electronics |
EEPROM |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
256 words |
8 |
SMALL OUTLINE |
1.27 mm |
85 Cel |
256X8 |
256 |
-40 Cel |
DUAL |
R-PDSO-G8 |
5.5 V |
1.73 mm |
.4 MHz |
3.9 mm |
5 ms |
I2C |
2048 bit |
2.5 V |
NOT SPECIFIED |
NOT SPECIFIED |
4.89 mm |
|||||||||||||||||||||||||||||||||||
|
Renesas Electronics |
EEPROM |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
2.5 mA |
512 words |
3.3 |
3/5 |
8 |
SMALL OUTLINE |
SOP8,.25 |
EEPROMs |
100 |
1.27 mm |
85 Cel |
512X8 |
512 |
-40 Cel |
1010DDMR |
DUAL |
HARDWARE |
R-PDSO-G8 |
5.5 V |
1.73 mm |
1000000 Write/Erase Cycles |
.4 MHz |
3.9 mm |
Not Qualified |
5 ms |
I2C |
4096 bit |
2.5 V |
260 |
.000002 Amp |
4.89 mm |
3.3 |
||||||||||||||||||||||||
Renesas Electronics |
EEPROM |
INDUSTRIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
32768 words |
5 |
8 |
CHIP CARRIER |
1.27 mm |
85 Cel |
32KX8 |
32K |
-40 Cel |
QUAD |
R-PQCC-J32 |
5.5 V |
3.55 mm |
11.43 mm |
5 ms |
262144 bit |
4.5 V |
13.97 mm |
120 ns |
5 |
|||||||||||||||||||||||||||||||||||||
Renesas Electronics |
EEPROM |
INDUSTRIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
32768 words |
5 |
8 |
CHIP CARRIER |
1.27 mm |
85 Cel |
32KX8 |
32K |
-40 Cel |
QUAD |
R-PQCC-J32 |
5.5 V |
3.55 mm |
11.43 mm |
5 ms |
262144 bit |
4.5 V |
13.97 mm |
150 ns |
5 |
|||||||||||||||||||||||||||||||||||||
Renesas Electronics |
EEPROM |
INDUSTRIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
8192 words |
5 |
8 |
CHIP CARRIER |
1.27 mm |
85 Cel |
8KX8 |
8K |
-40 Cel |
QUAD |
R-PQCC-J32 |
5.5 V |
3.55 mm |
11.43 mm |
5 ms |
65536 bit |
4.5 V |
13.97 mm |
90 ns |
5 |
|||||||||||||||||||||||||||||||||||||
Renesas Electronics |
EEPROM |
INDUSTRIAL |
28 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
32768 words |
5 |
8 |
SMALL OUTLINE |
1.27 mm |
85 Cel |
32KX8 |
32K |
-40 Cel |
DUAL |
R-PDSO-G28 |
5.5 V |
2.65 mm |
7.5 mm |
5 ms |
262144 bit |
4.5 V |
17.9 mm |
120 ns |
5 |
|||||||||||||||||||||||||||||||||||||
Renesas Electronics |
EEPROM |
INDUSTRIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
32768 words |
5 |
8 |
CHIP CARRIER |
1.27 mm |
85 Cel |
32KX8 |
32K |
-40 Cel |
QUAD |
R-PQCC-J32 |
5.5 V |
3.55 mm |
11.43 mm |
5 ms |
262144 bit |
4.5 V |
13.97 mm |
90 ns |
5 |
|||||||||||||||||||||||||||||||||||||
|
Renesas Electronics |
EEPROM |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
4096 words |
3.6 |
8 |
SMALL OUTLINE |
1.27 mm |
85 Cel |
4KX8 |
4K |
-40 Cel |
DUAL |
R-PDSO-G8 |
5.5 V |
1.73 mm |
5 MHz |
3.9 mm |
5 ms |
SPI |
32768 bit |
2.5 V |
IT IS ALSO OPERATES IN 3MHZ CLOCK FREQUENCY AT 1.8V MIN SUPPLY |
NOT SPECIFIED |
NOT SPECIFIED |
4.89 mm |
|||||||||||||||||||||||||||||||||
|
Renesas Electronics |
EEPROM |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
8192 words |
3.6 |
8 |
SMALL OUTLINE |
1.27 mm |
85 Cel |
8KX8 |
8K |
-40 Cel |
DUAL |
R-PDSO-G8 |
5.5 V |
1.73 mm |
5 MHz |
3.9 mm |
5 ms |
SPI |
65536 bit |
2.5 V |
IT IS ALSO OPERATES IN 3MHZ CLOCK FREQUENCY AT 1.8V MIN SUPPLY |
NOT SPECIFIED |
NOT SPECIFIED |
4.89 mm |
|||||||||||||||||||||||||||||||||
|
Renesas Electronics |
EEPROM |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
2.5 mA |
512 words |
2/5 |
8 |
SMALL OUTLINE |
SOP8,.25 |
EEPROMs |
100 |
1.27 mm |
85 Cel |
512X8 |
512 |
-40 Cel |
MATTE TIN |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G8 |
1 |
5.5 V |
1.73 mm |
1000000 Write/Erase Cycles |
5 MHz |
3.9 mm |
Not Qualified |
5 ms |
SPI |
4096 bit |
2.5 V |
IT IS ALSO OPERATES IN 3MHZ CLOCK FREQUENCY AT 1.8V MIN SUPPLY |
e3 |
.000002 Amp |
4.89 mm |
||||||||||||||||||||||||
|
Renesas Electronics |
EEPROM |
SPI |
NOT SPECIFIED |
NOT SPECIFIED |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Renesas Electronics |
EEPROM |
TIN |
1 |
e3 |
260 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Renesas Electronics |
EEPROM |
INDUSTRIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
8192 words |
5 |
8 |
CHIP CARRIER |
1.27 mm |
85 Cel |
8KX8 |
8K |
-40 Cel |
MATTE TIN |
QUAD |
R-PQCC-J32 |
3 |
5.5 V |
3.55 mm |
11.43 mm |
5 ms |
65536 bit |
4.5 V |
e3 |
30 |
245 |
13.97 mm |
120 ns |
5 |
|||||||||||||||||||||||||||||||
|
Renesas Electronics |
EEPROM |
INDUSTRIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
40 mA |
8192 words |
5 |
YES |
5 |
8 |
CHIP CARRIER |
LDCC32,.5X.6 |
EEPROMs |
1.27 mm |
85 Cel |
8KX8 |
8K |
-40 Cel |
NO |
MATTE TIN |
QUAD |
R-PQCC-J32 |
3 |
5.5 V |
3.55 mm |
1000000 Write/Erase Cycles |
11.43 mm |
Not Qualified |
5 ms |
65536 bit |
4.5 V |
64 |
e3 |
30 |
245 |
.0002 Amp |
13.97 mm |
120 ns |
5 |
YES |
||||||||||||||||||||
Renesas Electronics |
EEPROM |
32 |
DIP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
NO |
1 |
CMOS |
MIL-STD-883 |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
50 mA |
131072 words |
5 |
YES |
8 |
IN-LINE |
DIP32,.6 |
100 |
2.54 mm |
125 Cel |
NO |
3-STATE |
128KX8 |
128K |
-55 Cel |
DUAL |
R-CDIP-T32 |
5.5 V |
5.92 mm |
100000 Write/Erase Cycles |
15.24 mm |
10 ms |
1048576 bit |
4.5 V |
LG_MAX |
256 |
.0005 Amp |
42.95 mm |
120 ns |
5 |
YES |
||||||||||||||||||||||||||
|
Renesas Electronics |
EEPROM |
INDUSTRIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
32768 words |
5 |
8 |
CHIP CARRIER |
1.27 mm |
85 Cel |
32KX8 |
32K |
-40 Cel |
MATTE TIN |
QUAD |
R-PQCC-J32 |
3 |
5.5 V |
3.55 mm |
11.43 mm |
5 ms |
262144 bit |
4.5 V |
e3 |
30 |
260 |
13.97 mm |
150 ns |
5 |
|||||||||||||||||||||||||||||||
|
Renesas Electronics |
EEPROM |
INDUSTRIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
8192 words |
5 |
8 |
CHIP CARRIER |
1.27 mm |
85 Cel |
8KX8 |
8K |
-40 Cel |
MATTE TIN |
QUAD |
R-PQCC-J32 |
3 |
5.5 V |
3.55 mm |
11.43 mm |
5 ms |
65536 bit |
4.5 V |
e3 |
30 |
245 |
13.97 mm |
90 ns |
5 |
|||||||||||||||||||||||||||||||
|
Renesas Electronics |
EEPROM |
INDUSTRIAL |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
8192 words |
5 |
8 |
IN-LINE |
2.54 mm |
85 Cel |
8KX8 |
8K |
-40 Cel |
MATTE TIN |
DUAL |
R-PDIP-T28 |
5.5 V |
6.35 mm |
15.24 mm |
5 ms |
65536 bit |
4.5 V |
e3 |
37.4 mm |
120 ns |
5 |
||||||||||||||||||||||||||||||||||
|
Renesas Electronics |
EEPROM |
COMMERCIAL |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
8192 words |
5 |
8 |
IN-LINE |
2.54 mm |
70 Cel |
8KX8 |
8K |
0 Cel |
MATTE TIN |
DUAL |
R-PDIP-T28 |
5.5 V |
6.35 mm |
15.24 mm |
5 ms |
65536 bit |
4.5 V |
e3 |
37.4 mm |
120 ns |
5 |
||||||||||||||||||||||||||||||||||
|
Renesas Electronics |
EEPROM |
COMMERCIAL |
28 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
25 mA |
8192 words |
3.3 |
YES |
3/5 |
8 |
SMALL OUTLINE |
SOP28,.45 |
EEPROMs |
1.27 mm |
70 Cel |
8KX8 |
8K |
0 Cel |
NO |
YES |
DUAL |
R-PDSO-G28 |
5.5 V |
2.5 mm |
8.4 mm |
Not Qualified |
10 ms |
65536 bit |
2.7 V |
64 |
NOT SPECIFIED |
NOT SPECIFIED |
.000005 Amp |
18.3 mm |
100 ns |
3 |
YES |
|||||||||||||||||||||||
Renesas Electronics |
EEPROM |
INDUSTRIAL |
32 |
SOP |
RECTANGULAR |
CERAMIC |
YES |
CMOS |
GULL WING |
PARALLEL |
50 mA |
65536 words |
5 |
YES |
5 |
8 |
SMALL OUTLINE |
SOP32,.56 |
EEPROMs |
1.27 mm |
85 Cel |
64KX8 |
64K |
-40 Cel |
NO |
DUAL |
R-XDSO-G32 |
100000 Write/Erase Cycles |
Not Qualified |
10 ms |
524288 bit |
128 |
.0005 Amp |
90 ns |
YES |
||||||||||||||||||||||||||||||||||
Renesas Electronics |
EEPROM |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
512 words |
2.5 |
8 |
SMALL OUTLINE |
1.27 mm |
85 Cel |
512X8 |
512 |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-G8 |
5.5 V |
1.73 mm |
.4 MHz |
3.9 mm |
Not Qualified |
15 ms |
I2C |
4096 bit |
1.8 V |
e0 |
4.89 mm |
||||||||||||||||||||||||||||||||||
Renesas Electronics |
EEPROM |
32 |
QCCN |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
CMOS |
MIL-STD-883 |
NO LEAD |
PARALLEL |
ASYNCHRONOUS |
50 mA |
65536 words |
5 |
YES |
8 |
CHIP CARRIER |
LCC32,.45X.55 |
10 |
1.27 mm |
125 Cel |
3-STATE |
64KX8 |
64K |
-55 Cel |
NO |
QUAD |
R-CQCC-N32 |
5.5 V |
3.05 mm |
100000 Write/Erase Cycles |
11.425 mm |
10 ms |
524288 bit |
4.5 V |
.0005 Amp |
13.965 mm |
120 ns |
5 |
YES |
||||||||||||||||||||||||||||
|
Renesas Electronics |
EEPROM |
INDUSTRIAL |
8 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
3 mA |
1024 words |
2.5 |
2/5 |
8 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.25 |
EEPROMs |
10 |
.65 mm |
85 Cel |
1KX8 |
1K |
-40 Cel |
1010DMMR |
DUAL |
HARDWARE |
R-PDSO-G8 |
5.5 V |
1.1 mm |
100000 Write/Erase Cycles |
.4 MHz |
3 mm |
Not Qualified |
15 ms |
I2C |
8192 bit |
1.8 V |
.000003 Amp |
4.4 mm |
||||||||||||||||||||||||||
|
Renesas Electronics |
EEPROM |
INDUSTRIAL |
8 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
4 mA |
16384 words |
2/5 |
8 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP14,.25 |
EEPROMs |
10 |
.65 mm |
85 Cel |
16KX8 |
16K |
-40 Cel |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G8 |
1 |
5.5 V |
1.1 mm |
1000000 Write/Erase Cycles |
3 MHz |
3 mm |
Not Qualified |
8 ms |
SPI |
131072 bit |
1.8 V |
.000003 Amp |
4.4 mm |
|||||||||||||||||||||||||||
Renesas Electronics |
EEPROM |
32 |
SOP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
50 mA |
131072 words |
5 |
YES |
8 |
SMALL OUTLINE |
SOP32,.56 |
100 |
1.27 mm |
85 Cel |
NO |
3-STATE |
128KX8 |
128K |
-40 Cel |
DUAL |
R-CQCC-N32 |
5.5 V |
4.191 mm |
100000 Write/Erase Cycles |
11.176 mm |
10 ms |
1048576 bit |
4.5 V |
256 |
.0005 Amp |
21.082 mm |
120 ns |
5 |
YES |
||||||||||||||||||||||||||||
Renesas Electronics |
EEPROM |
COMMERCIAL |
32 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
50 mA |
131072 words |
5 |
YES |
5 |
8 |
SMALL OUTLINE |
SOP32,.56 |
EEPROMs |
1.27 mm |
70 Cel |
128KX8 |
128K |
0 Cel |
NO |
TIN LEAD |
YES |
DUAL |
R-PDSO-G32 |
5.5 V |
3 mm |
11.3 mm |
Not Qualified |
10 ms |
1048576 bit |
4.5 V |
128 |
e0 |
.00002 Amp |
20.45 mm |
150 ns |
5 |
YES |
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Renesas Electronics |
EEPROM |
MILITARY |
36 |
PGA |
SQUARE |
CERAMIC |
NO |
CMOS |
38535Q/M;38534H;883B |
PIN/PEG |
PARALLEL |
50 mA |
65536 words |
5 |
YES |
5 |
8 |
GRID ARRAY |
PGA36,7X7 |
EEPROMs |
2.54 mm |
125 Cel |
64KX8 |
64K |
-55 Cel |
NO |
PERPENDICULAR |
S-XPGA-P36 |
100000 Write/Erase Cycles |
Not Qualified |
10 ms |
524288 bit |
128 |
.0005 Amp |
120 ns |
YES |
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|
Renesas Electronics |
EEPROM |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
50 mA |
65536 words |
5 |
YES |
8 |
CHIP CARRIER |
LDCC32,.5X.6 |
10 |
1.27 mm |
70 Cel |
3-STATE |
64KX8 |
64K |
0 Cel |
NO |
QUAD |
R-PQCC-J32 |
5.5 V |
3.55 mm |
100000 Write/Erase Cycles |
13.97 mm |
10 ms |
524288 bit |
4.5 V |
.0005 Amp |
11.43 mm |
150 ns |
5 |
YES |
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Renesas Electronics |
EEPROM |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
2048 words |
2.5 |
8 |
SMALL OUTLINE |
1.27 mm |
85 Cel |
2KX8 |
2K |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-G8 |
5.5 V |
1.73 mm |
.4 MHz |
3.9 mm |
Not Qualified |
15 ms |
I2C |
16384 bit |
1.8 V |
e0 |
4.89 mm |
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Renesas Electronics |
EEPROM |
36 |
PGA |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
NO |
1 |
CMOS |
PIN/PEG |
PARALLEL |
ASYNCHRONOUS |
50 mA |
65536 words |
5 |
YES |
8 |
GRID ARRAY |
PGA36,7X7 |
10 |
2.54 mm |
125 Cel |
3-STATE |
64KX8 |
64K |
-55 Cel |
NO |
PERPENDICULAR |
S-CPGA-P36 |
5.5 V |
4.88 mm |
100000 Write/Erase Cycles |
19.305 mm |
10 ms |
524288 bit |
4.5 V |
.0005 Amp |
19.305 mm |
120 ns |
5 |
YES |
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Renesas Electronics |
EEPROM |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
SERIAL |
5 mA |
16384 words |
2/5 |
8 |
SMALL OUTLINE |
SOP8,.25 |
EEPROMs |
10 |
1.27 mm |
85 Cel |
16KX8 |
16K |
-40 Cel |
1010DDDR |
DUAL |
HARDWARE |
R-PDSO-G8 |
100000 Write/Erase Cycles |
Not Qualified |
I2C |
131072 bit |
.000003 Amp |
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Renesas Electronics |
EEPROM |
INDUSTRIAL |
8 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
2048 words |
2.5 |
8 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.65 mm |
85 Cel |
2KX8 |
2K |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-G8 |
5.5 V |
1.1 mm |
.4 MHz |
3 mm |
Not Qualified |
15 ms |
I2C |
16384 bit |
1.8 V |
e0 |
4.4 mm |
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|
Renesas Electronics |
EEPROM |
COMMERCIAL |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
30 mA |
32768 words |
5 |
YES |
5 |
8 |
IN-LINE |
DIP28,.6 |
EEPROMs |
2.54 mm |
70 Cel |
32KX8 |
32K |
0 Cel |
NO |
DUAL |
R-PDIP-T28 |
1 |
5.5 V |
5.7 mm |
100000 Write/Erase Cycles |
15.24 mm |
Not Qualified |
10 ms |
262144 bit |
4.5 V |
64 |
.00002 Amp |
35.6 mm |
85 ns |
5 |
YES |
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Renesas Electronics |
EEPROM |
MILITARY |
32 |
SOP |
RECTANGULAR |
CERAMIC |
YES |
CMOS |
GULL WING |
PARALLEL |
50 mA |
65536 words |
5 |
YES |
5 |
8 |
SMALL OUTLINE |
SOP32,.56 |
EEPROMs |
1.27 mm |
125 Cel |
64KX8 |
64K |
-55 Cel |
NO |
DUAL |
R-XDSO-G32 |
100000 Write/Erase Cycles |
Not Qualified |
10 ms |
524288 bit |
128 |
.0005 Amp |
150 ns |
YES |
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Renesas Electronics |
EEPROM |
COMMERCIAL |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
NMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
8192 words |
5 |
8 |
IN-LINE |
2.54 mm |
70 Cel |
8KX8 |
8K |
0 Cel |
TIN LEAD |
DUAL |
R-PDIP-T28 |
5.5 V |
5.7 mm |
15.24 mm |
Not Qualified |
65536 bit |
4.5 V |
e0 |
35.6 mm |
300 ns |
5 |
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Renesas Electronics |
EEPROM |
COMMERCIAL |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
32768 words |
5 |
8 |
IN-LINE |
DIP28,.6 |
2.54 mm |
70 Cel |
32KX8 |
32K |
0 Cel |
TIN LEAD |
DUAL |
R-PDIP-T28 |
5.7 mm |
15.24 mm |
Not Qualified |
262144 bit |
e0 |
35.6 mm |
150 ns |
5 |
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Renesas Electronics |
EEPROM |
INDUSTRIAL |
8 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
4096 words |
2.5 |
8 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.65 mm |
85 Cel |
4KX8 |
4K |
-40 Cel |
DUAL |
R-PDSO-G8 |
5.5 V |
1.1 mm |
3 MHz |
3 mm |
Not Qualified |
8 ms |
SPI |
32768 bit |
1.8 V |
NOT SPECIFIED |
NOT SPECIFIED |
4.4 mm |
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Renesas Electronics |
EEPROM |
MILITARY |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
38535Q/M;38534H;883B |
J BEND |
PARALLEL |
50 mA |
65536 words |
5 |
YES |
5 |
8 |
CHIP CARRIER |
LDCC32,.5X.6 |
EEPROMs |
1.27 mm |
125 Cel |
64KX8 |
64K |
-55 Cel |
NO |
QUAD |
R-PQCC-J32 |
100000 Write/Erase Cycles |
Not Qualified |
10 ms |
524288 bit |
128 |
.0005 Amp |
250 ns |
YES |
|||||||||||||||||||||||||||||||||
Renesas Electronics |
EEPROM |
MILITARY |
32 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
CMOS |
THROUGH-HOLE |
PARALLEL |
50 mA |
65536 words |
5 |
YES |
5 |
8 |
IN-LINE |
DIP32,.6 |
EEPROMs |
2.54 mm |
125 Cel |
64KX8 |
64K |
-55 Cel |
NO |
DUAL |
R-XDIP-T32 |
100000 Write/Erase Cycles |
Not Qualified |
10 ms |
524288 bit |
128 |
.0005 Amp |
90 ns |
YES |
||||||||||||||||||||||||||||||||||
Renesas Electronics |
EEPROM |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
50 mA |
65536 words |
5 |
YES |
8 |
CHIP CARRIER |
LDCC32,.5X.6 |
10 |
1.27 mm |
70 Cel |
3-STATE |
64KX8 |
64K |
0 Cel |
NO |
QUAD |
R-PQCC-J32 |
5.5 V |
3.55 mm |
100000 Write/Erase Cycles |
13.97 mm |
10 ms |
524288 bit |
4.5 V |
.0005 Amp |
11.43 mm |
150 ns |
5 |
YES |
|||||||||||||||||||||||||||||
Renesas Electronics |
EEPROM |
OTHER |
14 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
32768 words |
8 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
10 |
.65 mm |
85 Cel |
32KX8 |
32K |
-20 Cel |
DUAL |
R-PDSO-G14 |
5.5 V |
1.1 mm |
.4 MHz |
4.4 mm |
Not Qualified |
15 ms |
262144 bit |
1.8 V |
10 YEAR DATA RETENTION |
5 mm |
3 |
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Renesas Electronics |
EEPROM |
OTHER |
28 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
25 mA |
8192 words |
3.6 |
YES |
3/5 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSSOP28,.53,22 |
EEPROMs |
.55 mm |
85 Cel |
8KX8 |
8K |
-20 Cel |
NO |
YES |
DUAL |
R-PDSO-G28 |
1 |
5.5 V |
1.2 mm |
8 mm |
Not Qualified |
10 ms |
65536 bit |
2.7 V |
64 |
.000005 Amp |
11.8 mm |
100 ns |
3 |
YES |
EEPROM, or Electrically Erasable Programmable Read-Only Memory, is a type of non-volatile computer memory that can store and retrieve data even when the power is turned off. EEPROM is commonly used in digital devices, such as computers, mobile phones, and digital cameras, to store configuration data, firmware, and other important information.
EEPROM works by storing data in a grid of memory cells that can be individually programmed and erased using electrical signals. Each memory cell consists of a transistor and a floating gate. The floating gate can hold an electric charge, which determines the state of the memory cell. To write data to the EEPROM, an electrical signal is applied to the transistor, which charges or discharges the floating gate. To read data from the EEPROM, an electrical signal is applied to the transistor, which determines the state of the floating gate.
One of the advantages of EEPROM is that it is non-volatile, which means that it can store data even when the power is turned off. This makes it ideal for storing critical data, such as system settings and firmware, that must be retained even in the absence of power.
EEPROM can also be reprogrammed and erased many times, which makes it a versatile and flexible memory technology. EEPROM can be programmed and erased in blocks or individually, depending on the specific requirements of the application.
One of the disadvantages of EEPROM is that it is slower than other types of computer memory, such as RAM or cache memory. EEPROM access times are measured in microseconds, which is much slower than access times for other types of memory. This makes EEPROM less suitable for applications that require high-speed data access.