Part | RoHS | Manufacturer | Memory IC Type | Temperature Grade | No. of Terminals | Package Code | Package Shape | Package Body Material | Surface Mount | No. of Functions | Technology | Screening Level | Nominal Negative Supply Voltage | Terminal Form | Parallel or Serial | Operating Mode | Maximum Supply Current | No. of Words | Input/Output Type | Nominal Supply Voltage / Vsup (V) | Power Supplies (V) | Memory Width | Package Style (Meter) | Package Equivalence Code | Alternate Memory Width | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Output Characteristics | Organization | No. of Words Code | Minimum Operating Temperature | Terminal Finish | Terminal Position | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Width | Qualification | Memory Density | Minimum Supply Voltage (Vsup) | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Maximum Standby Current | Length | Maximum Access Time | Programming Voltage (V) |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Toshiba |
COMMERCIAL |
28 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
MOS |
THROUGH-HOLE |
16384 words |
COMMON |
5 |
5 |
8 |
IN-LINE |
DIP28,.6 |
EPROMs |
2.54 mm |
70 Cel |
3-STATE |
16KX8 |
16K |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-XDIP-T28 |
Not Qualified |
131072 bit |
e0 |
200 ns |
12.5 |
||||||||||||||||||||
Toshiba |
COMMERCIAL |
24 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
MOS |
THROUGH-HOLE |
4096 words |
COMMON |
5 |
5 |
8 |
IN-LINE |
DIP24,.6 |
EPROMs |
2.54 mm |
70 Cel |
3-STATE |
4KX8 |
4K |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-XDIP-T24 |
Not Qualified |
32768 bit |
e0 |
350 ns |
25 |
||||||||||||||||||||
Toshiba |
UVPROM |
COMMERCIAL |
28 |
WDIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
NMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
120 mA |
65536 words |
COMMON |
5 |
5 |
8 |
IN-LINE, WINDOW |
DIP28,.6 |
EPROMs |
2.54 mm |
70 Cel |
3-STATE |
64KX8 |
64K |
0 Cel |
TIN LEAD |
DUAL |
R-GDIP-T28 |
5.25 V |
5.2 mm |
15.24 mm |
Not Qualified |
524288 bit |
4.75 V |
e0 |
170 ns |
||||||||||||
Toshiba |
INDUSTRIAL |
24 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
MOS |
THROUGH-HOLE |
4096 words |
COMMON |
5 |
5 |
8 |
IN-LINE |
DIP24,.6 |
EPROMs |
2.54 mm |
85 Cel |
3-STATE |
4KX8 |
4K |
-40 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-XDIP-T24 |
Not Qualified |
32768 bit |
e0 |
350 ns |
25 |
||||||||||||||||||||
Toshiba |
UVPROM |
COMMERCIAL |
28 |
WDIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
NMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
130 mA |
65536 words |
COMMON |
5 |
5 |
8 |
IN-LINE, WINDOW |
DIP28,.6 |
EPROMs |
2.54 mm |
70 Cel |
3-STATE |
64KX8 |
64K |
0 Cel |
TIN LEAD |
DUAL |
R-GDIP-T28 |
5.5 V |
5.2 mm |
15.24 mm |
Not Qualified |
524288 bit |
4.5 V |
e0 |
250 ns |
||||||||||||
Toshiba |
UVPROM |
INDUSTRIAL |
32 |
WDIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
131072 words |
5 |
8 |
IN-LINE, WINDOW |
2.54 mm |
85 Cel |
128KX8 |
128K |
-40 Cel |
TIN LEAD |
DUAL |
R-GDIP-T32 |
5.25 V |
6.1 mm |
15.24 mm |
Not Qualified |
1048576 bit |
4.75 V |
e0 |
42 mm |
250 ns |
|||||||||||||||||
Toshiba |
UVPROM |
COMMERCIAL |
40 |
WDIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
524288 words |
5 |
8 |
IN-LINE, WINDOW |
16 |
2.54 mm |
70 Cel |
3-STATE |
512KX8 |
512K |
0 Cel |
TIN LEAD |
DUAL |
R-GDIP-T40 |
5.5 V |
6.05 mm |
15.24 mm |
Not Qualified |
4194304 bit |
4.5 V |
e0 |
52.07 mm |
120 ns |
|||||||||||||||
Toshiba |
UVPROM |
INDUSTRIAL |
32 |
WDIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
131072 words |
5 |
8 |
IN-LINE, WINDOW |
2.54 mm |
85 Cel |
128KX8 |
128K |
-40 Cel |
TIN LEAD |
DUAL |
R-GDIP-T32 |
5.25 V |
6.1 mm |
15.24 mm |
Not Qualified |
1048576 bit |
4.75 V |
e0 |
42 mm |
200 ns |
|||||||||||||||||
Toshiba |
UVPROM |
INDUSTRIAL |
32 |
WDIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
131072 words |
5 |
8 |
IN-LINE, WINDOW |
2.54 mm |
85 Cel |
128KX8 |
128K |
-40 Cel |
TIN LEAD |
DUAL |
R-GDIP-T32 |
5.25 V |
6.1 mm |
15.24 mm |
Not Qualified |
1048576 bit |
4.75 V |
e0 |
42 mm |
200 ns |
|||||||||||||||||
Toshiba |
UVPROM |
COMMERCIAL |
1 |
CMOS |
131072 words |
5 |
8 |
70 Cel |
128KX8 |
128K |
0 Cel |
5.25 V |
Not Qualified |
1048576 bit |
4.75 V |
85 ns |
||||||||||||||||||||||||||||||||||
Toshiba |
COMMERCIAL |
28 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
MOS |
THROUGH-HOLE |
100 mA |
32768 words |
COMMON |
5 |
5 |
8 |
IN-LINE |
DIP28,.6 |
EPROMs |
2.54 mm |
70 Cel |
3-STATE |
32KX8 |
32K |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-XDIP-T28 |
Not Qualified |
262144 bit |
e0 |
200 ns |
21 |
|||||||||||||||||||
Toshiba |
UVPROM |
COMMERCIAL |
40 |
WDIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
524288 words |
5 |
8 |
IN-LINE, WINDOW |
16 |
2.54 mm |
70 Cel |
3-STATE |
512KX8 |
512K |
0 Cel |
TIN LEAD |
DUAL |
R-GDIP-T40 |
5.5 V |
6.05 mm |
15.24 mm |
Not Qualified |
4194304 bit |
4.5 V |
e0 |
52.07 mm |
200 ns |
|||||||||||||||
Toshiba |
UVPROM |
COMMERCIAL |
32 |
WDIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
131072 words |
5 |
8 |
IN-LINE, WINDOW |
2.54 mm |
70 Cel |
3-STATE |
128KX8 |
128K |
0 Cel |
TIN LEAD |
DUAL |
R-GDIP-T32 |
5.5 V |
6 mm |
15.24 mm |
Not Qualified |
1048576 bit |
4.5 V |
e0 |
42 mm |
150 ns |
||||||||||||||||
Toshiba |
UVPROM |
COMMERCIAL |
1 |
CMOS |
65536 words |
5 |
16 |
70 Cel |
64KX16 |
64K |
0 Cel |
5.5 V |
Not Qualified |
1048576 bit |
4.5 V |
100 ns |
||||||||||||||||||||||||||||||||||
Toshiba |
COMMERCIAL |
28 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
MOS |
THROUGH-HOLE |
100 mA |
32768 words |
COMMON |
5 |
5 |
8 |
IN-LINE |
DIP28,.6 |
EPROMs |
2.54 mm |
70 Cel |
3-STATE |
32KX8 |
32K |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-XDIP-T28 |
Not Qualified |
262144 bit |
e0 |
150 ns |
12.5 |
|||||||||||||||||||
Toshiba |
UVPROM |
COMMERCIAL |
28 |
WDIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
NMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
130 mA |
65536 words |
COMMON |
5 |
5 |
8 |
IN-LINE, WINDOW |
DIP28,.6 |
EPROMs |
2.54 mm |
70 Cel |
3-STATE |
64KX8 |
64K |
0 Cel |
TIN LEAD |
DUAL |
R-GDIP-T28 |
5.5 V |
5.2 mm |
15.24 mm |
Not Qualified |
524288 bit |
4.5 V |
e0 |
200 ns |
||||||||||||
Toshiba |
UVPROM |
COMMERCIAL |
40 |
WDIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
65536 words |
5 |
16 |
IN-LINE, WINDOW |
2.54 mm |
70 Cel |
3-STATE |
64KX16 |
64K |
0 Cel |
TIN LEAD |
DUAL |
R-GDIP-T40 |
5.25 V |
6.05 mm |
15.24 mm |
Not Qualified |
1048576 bit |
4.75 V |
e0 |
52.07 mm |
85 ns |
||||||||||||||||
Toshiba |
UVPROM |
INDUSTRIAL |
32 |
WDIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
131072 words |
5 |
8 |
IN-LINE, WINDOW |
2.54 mm |
85 Cel |
128KX8 |
128K |
-40 Cel |
TIN LEAD |
DUAL |
R-GDIP-T32 |
5.25 V |
6.1 mm |
15.24 mm |
Not Qualified |
1048576 bit |
4.75 V |
e0 |
42 mm |
250 ns |
|||||||||||||||||
Toshiba |
COMMERCIAL |
28 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
MOS |
THROUGH-HOLE |
130 mA |
65536 words |
COMMON |
5 |
5 |
8 |
IN-LINE |
DIP28,.6 |
EPROMs |
2.54 mm |
70 Cel |
3-STATE |
64KX8 |
64K |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-XDIP-T28 |
Not Qualified |
524288 bit |
e0 |
200 ns |
||||||||||||||||||||
Toshiba |
UVPROM |
COMMERCIAL |
32 |
WDIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
524288 words |
5 |
8 |
IN-LINE, WINDOW |
2.54 mm |
70 Cel |
3-STATE |
512KX8 |
512K |
0 Cel |
TIN LEAD |
DUAL |
R-GDIP-T32 |
5.5 V |
6 mm |
15.24 mm |
Not Qualified |
4194304 bit |
4.5 V |
e0 |
42 mm |
150 ns |
||||||||||||||||
Toshiba |
INDUSTRIAL |
28 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
MOS |
THROUGH-HOLE |
16384 words |
COMMON |
5 |
5 |
8 |
IN-LINE |
DIP28,.6 |
EPROMs |
2.54 mm |
85 Cel |
3-STATE |
16KX8 |
16K |
-40 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-XDIP-T28 |
Not Qualified |
131072 bit |
e0 |
200 ns |
21 |
||||||||||||||||||||
Toshiba |
UVPROM |
COMMERCIAL |
28 |
WDIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
NMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
100 mA |
32768 words |
COMMON |
5 |
5 |
8 |
IN-LINE, WINDOW |
DIP28,.6 |
EPROMs |
2.54 mm |
70 Cel |
3-STATE |
32KX8 |
32K |
0 Cel |
TIN LEAD |
DUAL |
R-GDIP-T28 |
5.25 V |
5.2 mm |
15.24 mm |
Not Qualified |
262144 bit |
4.75 V |
e0 |
150 ns |
12.5 |
|||||||||||
Toshiba |
UVPROM |
COMMERCIAL |
42 |
WDIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
2097152 words |
5 |
8 |
IN-LINE, WINDOW |
16 |
2.54 mm |
70 Cel |
3-STATE |
2MX8 |
2M |
0 Cel |
TIN LEAD |
DUAL |
R-GDIP-T42 |
5.5 V |
6.05 mm |
15.24 mm |
Not Qualified |
16777216 bit |
4.5 V |
e0 |
54.61 mm |
150 ns |
|||||||||||||||
Toshiba |
UVPROM |
COMMERCIAL |
32 |
WDIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
131072 words |
5 |
8 |
IN-LINE, WINDOW |
2.54 mm |
70 Cel |
3-STATE |
128KX8 |
128K |
0 Cel |
TIN LEAD |
DUAL |
R-GDIP-T32 |
5.5 V |
6 mm |
15.24 mm |
Not Qualified |
1048576 bit |
4.5 V |
e0 |
42 mm |
100 ns |
||||||||||||||||
Toshiba |
UVPROM |
COMMERCIAL |
28 |
WDIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
NMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
120 mA |
32768 words |
COMMON |
5 |
5 |
8 |
IN-LINE, WINDOW |
DIP28,.6 |
EPROMs |
2.54 mm |
70 Cel |
3-STATE |
32KX8 |
32K |
0 Cel |
TIN LEAD |
DUAL |
R-GDIP-T28 |
5.5 V |
5.2 mm |
15.24 mm |
Not Qualified |
262144 bit |
4.5 V |
e0 |
200 ns |
12.5 |
|||||||||||
Toshiba |
UVPROM |
COMMERCIAL |
40 |
WDIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
262144 words |
5 |
16 |
IN-LINE, WINDOW |
2.54 mm |
70 Cel |
3-STATE |
256KX16 |
256K |
0 Cel |
TIN LEAD |
DUAL |
R-GDIP-T40 |
5.25 V |
6.05 mm |
15.24 mm |
Not Qualified |
4194304 bit |
4.75 V |
e0 |
52.07 mm |
100 ns |
||||||||||||||||
Toshiba |
INDUSTRIAL |
28 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
MOS |
THROUGH-HOLE |
8192 words |
COMMON |
5 |
5 |
8 |
IN-LINE |
DIP28,.6 |
EPROMs |
2.54 mm |
85 Cel |
3-STATE |
8KX8 |
8K |
-40 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-XDIP-T28 |
Not Qualified |
65536 bit |
e0 |
250 ns |
21 |
||||||||||||||||||||
Toshiba |
UVPROM |
COMMERCIAL |
32 |
WDIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
131072 words |
5 |
8 |
IN-LINE, WINDOW |
2.54 mm |
70 Cel |
128KX8 |
128K |
0 Cel |
TIN LEAD |
DUAL |
R-GDIP-T32 |
5.25 V |
6.1 mm |
15.24 mm |
Not Qualified |
1048576 bit |
4.75 V |
e0 |
42 mm |
150 ns |
|||||||||||||||||
Toshiba |
UVPROM |
INDUSTRIAL |
32 |
WDIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
524288 words |
5 |
8 |
IN-LINE, WINDOW |
2.54 mm |
85 Cel |
3-STATE |
512KX8 |
512K |
-40 Cel |
TIN LEAD |
DUAL |
R-GDIP-T32 |
5.5 V |
6 mm |
15.24 mm |
Not Qualified |
4194304 bit |
4.5 V |
e0 |
42 mm |
200 ns |
||||||||||||||||
Toshiba |
UVPROM |
COMMERCIAL |
32 |
WDIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
524288 words |
5 |
8 |
IN-LINE, WINDOW |
2.54 mm |
70 Cel |
512KX8 |
512K |
0 Cel |
TIN LEAD |
DUAL |
R-GDIP-T32 |
5.5 V |
6 mm |
15.24 mm |
Not Qualified |
4194304 bit |
4.5 V |
e0 |
42 mm |
150 ns |
|||||||||||||||||
Toshiba |
COMMERCIAL |
28 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
MOS |
THROUGH-HOLE |
100 mA |
32768 words |
COMMON |
5 |
5 |
8 |
IN-LINE |
DIP28,.6 |
EPROMs |
2.54 mm |
70 Cel |
3-STATE |
32KX8 |
32K |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-XDIP-T28 |
Not Qualified |
262144 bit |
e0 |
200 ns |
12.5 |
|||||||||||||||||||
Toshiba |
COMMERCIAL |
28 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
MOS |
THROUGH-HOLE |
8192 words |
COMMON |
5 |
5 |
8 |
IN-LINE |
DIP28,.6 |
EPROMs |
2.54 mm |
70 Cel |
3-STATE |
8KX8 |
8K |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-XDIP-T28 |
Not Qualified |
65536 bit |
e0 |
150 ns |
12.5 |
||||||||||||||||||||
Toshiba |
UVPROM |
COMMERCIAL |
40 |
WDIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
65536 words |
5 |
16 |
IN-LINE, WINDOW |
2.54 mm |
70 Cel |
64KX16 |
64K |
0 Cel |
TIN LEAD |
DUAL |
R-GDIP-T40 |
5.25 V |
6.05 mm |
15.24 mm |
Not Qualified |
1048576 bit |
4.75 V |
e0 |
52.07 mm |
70 ns |
|||||||||||||||||
Toshiba |
UVPROM |
COMMERCIAL |
40 |
WDIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
65536 words |
5 |
16 |
IN-LINE, WINDOW |
2.54 mm |
70 Cel |
3-STATE |
64KX16 |
64K |
0 Cel |
TIN LEAD |
DUAL |
R-GDIP-T40 |
5.25 V |
6.05 mm |
15.24 mm |
Not Qualified |
1048576 bit |
4.75 V |
e0 |
52.07 mm |
85 ns |
||||||||||||||||
Toshiba |
UVPROM |
COMMERCIAL |
40 |
WDIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
65536 words |
5 |
16 |
IN-LINE, WINDOW |
2.54 mm |
70 Cel |
3-STATE |
64KX16 |
64K |
0 Cel |
TIN LEAD |
DUAL |
R-GDIP-T40 |
5.25 V |
6.05 mm |
15.24 mm |
Not Qualified |
1048576 bit |
4.75 V |
e0 |
52.07 mm |
55 ns |
||||||||||||||||
Toshiba |
UVPROM |
INDUSTRIAL |
28 |
WDIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
65536 words |
5 |
8 |
IN-LINE, WINDOW |
2.54 mm |
85 Cel |
3-STATE |
64KX8 |
64K |
-40 Cel |
TIN LEAD |
DUAL |
R-GDIP-T28 |
5.25 V |
6 mm |
15.24 mm |
Not Qualified |
524288 bit |
4.75 V |
e0 |
36.83 mm |
150 ns |
||||||||||||||||
Toshiba |
UVPROM |
INDUSTRIAL |
28 |
WDIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
NMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
120 mA |
32768 words |
COMMON |
5 |
5 |
8 |
IN-LINE, WINDOW |
DIP28,.6 |
EPROMs |
2.54 mm |
85 Cel |
3-STATE |
32KX8 |
32K |
-40 Cel |
TIN LEAD |
DUAL |
R-GDIP-T28 |
5.25 V |
5.2 mm |
15.24 mm |
Not Qualified |
262144 bit |
4.75 V |
e0 |
150 ns |
12.5 |
|||||||||||
Toshiba |
UVPROM |
COMMERCIAL |
32 |
WDIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
131072 words |
5 |
8 |
IN-LINE, WINDOW |
2.54 mm |
70 Cel |
3-STATE |
128KX8 |
128K |
0 Cel |
TIN LEAD |
DUAL |
R-GDIP-T32 |
5.5 V |
6 mm |
15.24 mm |
Not Qualified |
1048576 bit |
4.5 V |
e0 |
42 mm |
150 ns |
||||||||||||||||
Toshiba |
UVPROM |
COMMERCIAL |
1 |
CMOS |
524288 words |
5 |
8 |
70 Cel |
512KX8 |
512K |
0 Cel |
5.5 V |
Not Qualified |
4194304 bit |
4.5 V |
150 ns |
||||||||||||||||||||||||||||||||||
Toshiba |
UVPROM |
COMMERCIAL |
40 |
WDIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
262144 words |
5 |
16 |
IN-LINE, WINDOW |
2.54 mm |
70 Cel |
3-STATE |
256KX16 |
256K |
0 Cel |
TIN LEAD |
DUAL |
R-GDIP-T40 |
5.5 V |
6.05 mm |
15.24 mm |
Not Qualified |
4194304 bit |
4.5 V |
e0 |
52.07 mm |
150 ns |
||||||||||||||||
Toshiba |
UVPROM |
COMMERCIAL |
32 |
WDIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
524288 words |
5 |
8 |
IN-LINE, WINDOW |
2.54 mm |
70 Cel |
512KX8 |
512K |
0 Cel |
TIN LEAD |
DUAL |
R-GDIP-T32 |
5.5 V |
6 mm |
15.24 mm |
Not Qualified |
4194304 bit |
4.5 V |
e0 |
42 mm |
200 ns |
|||||||||||||||||
Toshiba |
UVPROM |
COMMERCIAL |
32 |
WDIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
524288 words |
5 |
8 |
IN-LINE, WINDOW |
2.54 mm |
70 Cel |
3-STATE |
512KX8 |
512K |
0 Cel |
TIN LEAD |
DUAL |
R-GDIP-T32 |
5.5 V |
6 mm |
15.24 mm |
Not Qualified |
4194304 bit |
4.5 V |
e0 |
42 mm |
120 ns |
||||||||||||||||
Toshiba |
UVPROM |
COMMERCIAL |
40 |
WDIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
65536 words |
5 |
16 |
IN-LINE, WINDOW |
2.54 mm |
70 Cel |
3-STATE |
64KX16 |
64K |
0 Cel |
TIN LEAD |
DUAL |
R-GDIP-T40 |
5.5 V |
6.05 mm |
15.24 mm |
Not Qualified |
1048576 bit |
4.5 V |
e0 |
52.07 mm |
100 ns |
||||||||||||||||
Toshiba |
COMMERCIAL |
28 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
MOS |
THROUGH-HOLE |
16384 words |
COMMON |
5 |
5 |
8 |
IN-LINE |
DIP28,.6 |
EPROMs |
2.54 mm |
70 Cel |
3-STATE |
16KX8 |
16K |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-XDIP-T28 |
Not Qualified |
131072 bit |
e0 |
150 ns |
21 |
||||||||||||||||||||
Toshiba |
UVPROM |
COMMERCIAL |
40 |
WDIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
65536 words |
5 |
16 |
IN-LINE, WINDOW |
2.54 mm |
70 Cel |
3-STATE |
64KX16 |
64K |
0 Cel |
TIN LEAD |
DUAL |
R-GDIP-T40 |
5.25 V |
6.05 mm |
15.24 mm |
Not Qualified |
1048576 bit |
4.75 V |
e0 |
52.07 mm |
35 ns |
||||||||||||||||
Toshiba |
UVPROM |
COMMERCIAL |
32 |
WDIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
131072 words |
5 |
8 |
IN-LINE, WINDOW |
2.54 mm |
70 Cel |
128KX8 |
128K |
0 Cel |
TIN LEAD |
DUAL |
R-GDIP-T32 |
5.25 V |
6.1 mm |
15.24 mm |
Not Qualified |
1048576 bit |
4.75 V |
e0 |
42 mm |
150 ns |
|||||||||||||||||
Toshiba |
UVPROM |
COMMERCIAL |
40 |
WDIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
65536 words |
5 |
16 |
IN-LINE, WINDOW |
2.54 mm |
70 Cel |
3-STATE |
64KX16 |
64K |
0 Cel |
TIN LEAD |
DUAL |
R-GDIP-T40 |
5.25 V |
6.05 mm |
15.24 mm |
Not Qualified |
1048576 bit |
4.75 V |
e0 |
52.07 mm |
45 ns |
||||||||||||||||
Toshiba |
INDUSTRIAL |
28 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
MOS |
THROUGH-HOLE |
16384 words |
COMMON |
5 |
5 |
8 |
IN-LINE |
DIP28,.6 |
EPROMs |
2.54 mm |
85 Cel |
3-STATE |
16KX8 |
16K |
-40 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-XDIP-T28 |
Not Qualified |
131072 bit |
e0 |
150 ns |
12.5 |
EPROM, or Erasable Programmable Read-Only Memory, is a type of non-volatile computer memory that can be programmed and erased multiple times. EPROM was commonly used in computer systems and electronic devices in the 1970s and 1980s, but has largely been replaced by more advanced memory technologies.
EPROM works by storing data in a grid of memory cells that can be individually programmed and erased using ultraviolet light. Each memory cell consists of a transistor and a floating gate. To program the memory cell, a high voltage is applied to the transistor, which charges the floating gate. To erase the memory cell, ultraviolet light is applied to the chip, which removes the charge from the floating gate. The programming and erasing process can be repeated multiple times, making EPROM a reprogrammable memory technology.
EPROM has several advantages over other types of computer memory, such as ROM and RAM. EPROM can be reprogrammed multiple times, which makes it a versatile and flexible memory technology. EPROM is also non-volatile, which means that it can store data even when the power is turned off. This makes it ideal for storing critical data, such as system settings and firmware.