Part | RoHS | Manufacturer | Memory IC Type | Temperature Grade | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Surface Mount | Cycle Time | No. of Functions | Technology | Screening Level | Terminal Form | Parallel or Serial | Operating Mode | Maximum Supply Current | No. of Words | Nominal Supply Voltage / Vsup (V) | Power Supplies (V) | Memory Width | Package Style (Meter) | Package Equivalence Code | Alternate Memory Width | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Output Characteristics | Organization | No. of Words Code | Minimum Operating Temperature | Terminal Finish | Terminal Position | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Maximum Clock Frequency (fCLK) | Width | Qualification | Memory Density | Minimum Supply Voltage (Vsup) | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Output Enable | Maximum Standby Current | Length | Maximum Access Time |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Cypress Semiconductor |
OTHER FIFO |
COMMERCIAL |
64 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
25 ns |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
30 mA |
8192 words |
3.3 |
3.3 |
18 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP64,.47SQ,20 |
FIFOs |
.5 mm |
70 Cel |
3-STATE |
8KX18 |
8K |
0 Cel |
TIN LEAD |
QUAD |
S-PQFP-G64 |
3.6 V |
1.6 mm |
40 MHz |
10 mm |
Not Qualified |
147456 bit |
3 V |
RETRANSMIT |
e0 |
YES |
.004 Amp |
10 mm |
15 ns |
||||||||
|
Cypress Semiconductor |
OTHER FIFO |
INDUSTRIAL |
64 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
10 ns |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
50 mA |
16384 words |
5 |
5 |
18 |
FLATPACK, LOW PROFILE |
QFP64,.63SQ,32 |
FIFOs |
.8 mm |
85 Cel |
16KX18 |
16K |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQFP-G64 |
3 |
5.5 V |
1.6 mm |
100 MHz |
14 mm |
Not Qualified |
294912 bit |
4.5 V |
RETRANSMIT |
e4 |
20 |
260 |
YES |
.015 Amp |
14 mm |
8 ns |
|||||
|
Cypress Semiconductor |
OTHER FIFO |
COMMERCIAL |
32 |
TQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
15 ns |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
35 mA |
32768 words |
5 |
5 |
9 |
FLATPACK, THIN PROFILE |
TQFP32,.35SQ,32 |
FIFOs |
.8 mm |
70 Cel |
3-STATE |
32KX9 |
32K |
0 Cel |
Matte Tin (Sn) |
QUAD |
S-PQFP-G32 |
3 |
5.5 V |
1.2 mm |
66.7 MHz |
7 mm |
Not Qualified |
294912 bit |
4.5 V |
RETRANSMIT |
e3 |
20 |
260 |
YES |
.01 Amp |
7 mm |
10 ns |
||||
|
Infineon Technologies |
OTHER FIFO |
COMMERCIAL |
64 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
15 ns |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
30 mA |
65536 words |
3.3 |
3.3 |
18 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP64,.47SQ,20 |
FIFOs |
.5 mm |
70 Cel |
64KX18 |
64K |
0 Cel |
Matte Tin (Sn) |
QUAD |
S-PQFP-G64 |
3 |
3.6 V |
1.6 mm |
66.7 MHz |
10 mm |
Not Qualified |
1179648 bit |
3 V |
RETRANSMIT |
e3 |
20 |
260 |
YES |
.004 Amp |
10 mm |
10 ns |
|||||
|
Infineon Technologies |
OTHER FIFO |
INDUSTRIAL |
64 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
15 ns |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
35 mA |
65536 words |
3.3 |
3.3 |
18 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP64,.47SQ,20 |
FIFOs |
.5 mm |
85 Cel |
64KX18 |
64K |
-40 Cel |
Matte Tin (Sn) |
QUAD |
S-PQFP-G64 |
3 |
3.6 V |
1.6 mm |
66.7 MHz |
10 mm |
Not Qualified |
1179648 bit |
3 V |
RETRANSMIT |
e3 |
20 |
260 |
YES |
.004 Amp |
10 mm |
10 ns |
|||||
|
Cypress Semiconductor |
OTHER FIFO |
COMMERCIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
10 ns |
1 |
CMOS |
J BEND |
PARALLEL |
SYNCHRONOUS |
25 mA |
131072 words |
3.3 |
3.3 |
9 |
CHIP CARRIER |
LDCC32,.5X.6 |
FIFOs |
1.27 mm |
70 Cel |
128KX9 |
128K |
0 Cel |
Matte Tin (Sn) |
QUAD |
R-PQCC-J32 |
3 |
3.6 V |
3.556 mm |
100 MHz |
11.43 mm |
Not Qualified |
1179648 bit |
3 V |
e3 |
20 |
260 |
YES |
.004 Amp |
13.97 mm |
8 ns |
||||||
|
Cypress Semiconductor |
OTHER FIFO |
COMMERCIAL |
32 |
TQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
20 ns |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
85 mA |
4096 words |
5 |
5 |
9 |
FLATPACK, THIN PROFILE |
QFP32,.35SQ,32 |
FIFOs |
.8 mm |
70 Cel |
4KX9 |
4K |
0 Cel |
Matte Tin (Sn) |
QUAD |
S-PQFP-G32 |
3 |
5.5 V |
1.2 mm |
50 MHz |
7 mm |
Not Qualified |
36864 bit |
4.5 V |
RETRANSMIT |
e3 |
20 |
260 |
NO |
.005 Amp |
7 mm |
10 ns |
|||||
Cypress Semiconductor |
OTHER FIFO |
COMMERCIAL |
64 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
10 ns |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
100 mA |
256 words |
5 |
5 |
9 |
FLATPACK |
QFP64,.66SQ,32 |
FIFOs |
.8 mm |
70 Cel |
3-STATE |
256X9 |
256 |
0 Cel |
TIN LEAD |
QUAD |
S-PQFP-G64 |
5.5 V |
1.6 mm |
100 MHz |
14 mm |
Not Qualified |
2304 bit |
4.5 V |
e0 |
YES |
.1 Amp |
14 mm |
8 ns |
|||||||||
|
Cypress Semiconductor |
OTHER FIFO |
INDUSTRIAL |
209 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
7.5 ns |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
600 mA |
524288 words |
1.5 |
1.5,1.8 |
36 |
GRID ARRAY |
BGA209,11X19,40 |
FIFOs |
1 mm |
85 Cel |
512KX36 |
512K |
-40 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
R-PBGA-B209 |
3 |
1.575 V |
1.96 mm |
133 MHz |
14 mm |
Not Qualified |
18874368 bit |
1.425 V |
ALSO REQUIRED 1.8V SUPPLY NOM, ALTERNATE MIN MEMORY WIDTH : 9 |
e1 |
30 |
260 |
YES |
22 mm |
10 ns |
||||||
Texas Instruments |
OTHER FIFO |
OTHER |
28 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
MOS |
THROUGH-HOLE |
ASYNCHRONOUS |
13 words |
6 |
IN-LINE |
DIP28,.6 |
FIFOs |
2.54 mm |
85 Cel |
13X6 |
13 |
-25 Cel |
DUAL |
R-XDIP-T28 |
Not Qualified |
||||||||||||||||||||||||||||
Texas Instruments |
OTHER FIFO |
MILITARY |
16 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
TTL |
THROUGH-HOLE |
PARALLEL |
SYNCHRONOUS |
16 words |
5 |
5 |
4 |
IN-LINE |
DIP16,.3 |
FIFOs |
2.54 mm |
125 Cel |
3-STATE |
16X4 |
16 |
-55 Cel |
DUAL |
R-GDIP-T16 |
5.5 V |
5.08 mm |
7.62 mm |
Not Qualified |
64 bit |
4.5 V |
NOT SPECIFIED |
NOT SPECIFIED |
YES |
19.56 mm |
||||||||||||||
|
Texas Instruments |
OTHER FIFO |
MILITARY |
80 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
7.5 ns |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
35 mA |
16384 words |
3.3 |
3.3 |
18 |
FLATPACK, LOW PROFILE |
QFP80,.64SQ |
9 |
FIFOs |
.65 mm |
125 Cel |
3-STATE |
16KX18 |
16K |
-55 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQFP-G80 |
4 |
3.45 V |
1.6 mm |
133 MHz |
14 mm |
Not Qualified |
294912 bit |
3.15 V |
CAN ALSO BE CONFIGURED AS 32768 X 9 |
e4 |
30 |
260 |
YES |
.015 Amp |
14 mm |
5 ns |
|||
Texas Instruments |
OTHER FIFO |
MILITARY |
20 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
TTL |
38535Q/M;38534H;883B |
THROUGH-HOLE |
ASYNCHRONOUS |
16 words |
4 |
IN-LINE |
DIP20,.3 |
FIFOs |
2.54 mm |
125 Cel |
16X4 |
16 |
-55 Cel |
DUAL |
R-XDIP-T20 |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
|||||||||||||||||||||||||
Texas Instruments |
OTHER FIFO |
MILITARY |
68 |
PGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
NO |
35.08 ns |
1 |
CMOS |
PIN/PEG |
PARALLEL |
SYNCHRONOUS |
1 mA |
1024 words |
5 |
5 |
18 |
GRID ARRAY |
PGA68(UNSPEC) |
FIFOs |
2.54 mm |
125 Cel |
3-STATE |
1KX18 |
1K |
-55 Cel |
PERPENDICULAR |
S-CPGA-P68 |
NOT APPLICABLE |
5.5 V |
5.21 mm |
28.5 MHz |
24.385 mm |
Not Qualified |
18432 bit |
4.5 V |
NOT APPLICABLE |
NOT APPLICABLE |
YES |
.0004 Amp |
24.385 mm |
20 ns |
||||||||
Texas Instruments |
OTHER FIFO |
MILITARY |
20 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
TTL |
38535Q/M;38534H;883B |
THROUGH-HOLE |
ASYNCHRONOUS |
16 words |
5 |
5 |
5 |
IN-LINE |
DIP20,.3 |
FIFOs |
2.54 mm |
125 Cel |
16X5 |
16 |
-55 Cel |
DUAL |
R-XDIP-T20 |
20 MHz |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
||||||||||||||||||||||
Texas Instruments |
OTHER FIFO |
MILITARY |
20 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
TTL |
THROUGH-HOLE |
PARALLEL |
SYNCHRONOUS |
16 words |
5 |
5 |
4 |
IN-LINE |
DIP(UNSPEC) |
FIFOs |
2.54 mm |
125 Cel |
16X4 |
16 |
-55 Cel |
DUAL |
R-GDIP-T20 |
5.5 V |
5.08 mm |
7.62 mm |
Not Qualified |
64 bit |
4.5 V |
NOT SPECIFIED |
NOT SPECIFIED |
YES |
24.195 mm |
80 ns |
||||||||||||||
|
Texas Instruments |
OTHER FIFO |
COMMERCIAL |
64 |
TFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
15 ns |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
.4 mA |
2048 words |
5 |
5 |
9 |
FLATPACK, THIN PROFILE, FINE PITCH |
TQFP64,.47SQ |
FIFOs |
.5 mm |
70 Cel |
2KX9 |
2K |
0 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQFP-G64 |
3 |
5.5 V |
1.2 mm |
67 MHz |
10 mm |
Not Qualified |
18432 bit |
4.5 V |
e4 |
30 |
260 |
YES |
.0004 Amp |
10 mm |
12 ns |
||||||
Texas Instruments |
OTHER FIFO |
MILITARY |
16 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
500 ns |
1 |
CMOS |
38535Q/M;38534H;883B |
THROUGH-HOLE |
PARALLEL |
SYNCHRONOUS |
16 words |
4.5 |
2/6 |
4 |
IN-LINE |
DIP16,.3 |
FIFOs |
2.54 mm |
125 Cel |
3-STATE |
16X4 |
16 |
-55 Cel |
TIN LEAD |
DUAL |
R-GDIP-T16 |
6 V |
5.08 mm |
10 MHz |
7.62 mm |
Not Qualified |
64 bit |
2 V |
e0 |
YES |
21.34 mm |
2250 ns |
||||||||||
Texas Instruments |
OTHER FIFO |
MILITARY |
16 |
DIP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
NO |
125 ns |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
SYNCHRONOUS |
16 words |
5/15 |
4 |
IN-LINE |
DIP16,.3 |
FIFOs |
2.54 mm |
125 Cel |
16X4 |
16 |
-55 Cel |
DUAL |
R-CDIP-T16 |
18 V |
5.08 mm |
1.5 MHz |
7.62 mm |
Not Qualified |
64 bit |
3 V |
NOT SPECIFIED |
NOT SPECIFIED |
YES |
420 ns |
||||||||||||||
Texas Instruments |
OTHER FIFO |
MILITARY |
20 |
QCCN |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
TTL |
NO LEAD |
PARALLEL |
SYNCHRONOUS |
155 mA |
16 words |
5 |
5 |
4 |
CHIP CARRIER |
LCC20,.35SQ |
FIFOs |
1.27 mm |
125 Cel |
16X4 |
16 |
-55 Cel |
QUAD |
S-CQCC-N20 |
5.5 V |
2.03 mm |
8.89 mm |
Not Qualified |
64 bit |
4.5 V |
YES |
8.89 mm |
80 ns |
|||||||||||||||
Texas Instruments |
OTHER FIFO |
MILITARY |
16 |
DFP |
RECTANGULAR |
CERAMIC |
YES |
TTL |
FLAT |
ASYNCHRONOUS |
16 words |
4 |
FLATPACK |
FL16,.3 |
FIFOs |
1.27 mm |
125 Cel |
16X4 |
16 |
-55 Cel |
DUAL |
R-XDFP-F16 |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
||||||||||||||||||||||||||
Texas Instruments |
OTHER FIFO |
MILITARY |
20 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
40 ns |
1 |
TTL |
THROUGH-HOLE |
PARALLEL |
SYNCHRONOUS |
16 words |
5 |
5 |
5 |
IN-LINE |
DIP20,.3 |
FIFOs |
2.54 mm |
125 Cel |
3-STATE |
16X5 |
16 |
-55 Cel |
DUAL |
R-GDIP-T20 |
5.5 V |
5.08 mm |
25 MHz |
7.62 mm |
Not Qualified |
80 bit |
4.5 V |
FALL-THROUGH TIME 24NS |
NOT SPECIFIED |
NOT SPECIFIED |
YES |
24.195 mm |
35 ns |
||||||||||
|
Texas Instruments |
OTHER FIFO |
COMMERCIAL |
56 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
.4 mA |
512 words |
5 |
5 |
18 |
SMALL OUTLINE, SHRINK PITCH |
SSOP56,.4 |
FIFOs |
.635 mm |
70 Cel |
512X18 |
512 |
0 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G56 |
1 |
5.5 V |
2.79 mm |
50 MHz |
7.5 mm |
Not Qualified |
9216 bit |
4.5 V |
e4 |
30 |
260 |
YES |
18.415 mm |
15 ns |
||||||||
Texas Instruments |
OTHER FIFO |
MILITARY |
20 |
QCCN |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
40 ns |
1 |
TTL |
NO LEAD |
PARALLEL |
SYNCHRONOUS |
16 words |
5 |
5 |
5 |
CHIP CARRIER |
LCC20,.35SQ |
FIFOs |
1.27 mm |
125 Cel |
3-STATE |
16X5 |
16 |
-55 Cel |
QUAD |
S-CQCC-N20 |
5.5 V |
2.03 mm |
8.89 mm |
Not Qualified |
80 bit |
4.5 V |
FALL-THROUGH TIME 24NS |
NOT SPECIFIED |
NOT SPECIFIED |
YES |
8.89 mm |
35 ns |
|||||||||||
Texas Instruments |
OTHER FIFO |
MILITARY |
20 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
TTL |
THROUGH-HOLE |
ASYNCHRONOUS |
16 words |
5 |
5 |
5 |
IN-LINE |
DIP20,.3 |
FIFOs |
2.54 mm |
125 Cel |
16X5 |
16 |
-55 Cel |
DUAL |
R-XDIP-T20 |
20 MHz |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
|||||||||||||||||||||||
|
Texas Instruments |
OTHER FIFO |
COMMERCIAL |
56 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
25 ns |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
.4 mA |
64 words |
5 |
5 |
18 |
SMALL OUTLINE, SHRINK PITCH |
SSOP56,.4 |
FIFOs |
.635 mm |
70 Cel |
64X18 |
64 |
0 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G56 |
1 |
5.5 V |
2.79 mm |
40 MHz |
7.5 mm |
Not Qualified |
1152 bit |
4.5 V |
e4 |
30 |
260 |
YES |
18.415 mm |
15 ns |
|||||||
Texas Instruments |
OTHER FIFO |
MILITARY |
16 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
40 ns |
1 |
TTL |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
155 mA |
64 words |
5 |
5 |
4 |
IN-LINE |
DIP16,.3 |
FIFOs |
2.54 mm |
125 Cel |
TOTEM POLE |
64X4 |
64 |
-55 Cel |
DUAL |
R-GDIP-T16 |
5.5 V |
5.08 mm |
25 MHz |
7.62 mm |
Not Qualified |
256 bit |
4.5 V |
NOT SPECIFIED |
NOT SPECIFIED |
NO |
19.56 mm |
24 ns |
||||||||||
Texas Instruments |
OTHER FIFO |
MILITARY |
20 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
TTL |
MIL-STD-883 Class B (Modified) |
THROUGH-HOLE |
ASYNCHRONOUS |
16 words |
5 |
5 |
4 |
IN-LINE |
DIP20,.3 |
FIFOs |
2.54 mm |
125 Cel |
16X4 |
16 |
-55 Cel |
DUAL |
R-XDIP-T20 |
Not Qualified |
|||||||||||||||||||||||||
Texas Instruments |
OTHER FIFO |
MILITARY |
16 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
100 ns |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
SYNCHRONOUS |
16 words |
5 |
5 |
4 |
IN-LINE |
DIP16,.3 |
FIFOs |
2.54 mm |
125 Cel |
16X4 |
16 |
-55 Cel |
DUAL |
R-GDIP-T16 |
5.5 V |
5.08 mm |
10 MHz |
7.62 mm |
Not Qualified |
64 bit |
4.5 V |
YES |
19.56 mm |
2250 ns |
||||||||||||||
|
Texas Instruments |
OTHER FIFO |
COMMERCIAL |
56 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
.4 mA |
512 words |
5 |
5 |
18 |
SMALL OUTLINE, SHRINK PITCH |
SSOP56,.4 |
FIFOs |
.635 mm |
70 Cel |
512X18 |
512 |
0 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G56 |
1 |
5.5 V |
2.79 mm |
50 MHz |
7.5 mm |
Not Qualified |
9216 bit |
4.5 V |
e4 |
30 |
260 |
YES |
18.415 mm |
15 ns |
||||||||
Texas Instruments |
OTHER FIFO |
COMMERCIAL |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
THROUGH-HOLE |
ASYNCHRONOUS |
1024 words |
5 |
5 |
9 |
IN-LINE |
DIP28,.6 |
FIFOs |
2.54 mm |
70 Cel |
1KX9 |
1K |
0 Cel |
DUAL |
R-PDIP-T28 |
Not Qualified |
9216 bit |
|||||||||||||||||||||||||
Texas Instruments |
OTHER FIFO |
MILITARY |
QCCN |
CERAMIC |
YES |
TTL |
38535Q/M;38534H;883B |
NO LEAD |
ASYNCHRONOUS |
16 words |
5 |
5 |
4 |
CHIP CARRIER |
LCC(UNSPEC) |
FIFOs |
125 Cel |
16X4 |
16 |
-55 Cel |
QUAD |
Not Qualified |
|||||||||||||||||||||||||||||
Texas Instruments |
OTHER FIFO |
MILITARY |
16 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
40 ns |
1 |
TTL |
THROUGH-HOLE |
PARALLEL |
SYNCHRONOUS |
16 words |
5 |
5 |
4 |
IN-LINE |
DIP16,.3 |
FIFOs |
2.54 mm |
125 Cel |
3-STATE |
16X4 |
16 |
-55 Cel |
DUAL |
R-GDIP-T16 |
5.5 V |
5.08 mm |
25 MHz |
7.62 mm |
Not Qualified |
64 bit |
4.5 V |
FALL-THROUGH TIME 24NS |
NOT SPECIFIED |
NOT SPECIFIED |
YES |
19.56 mm |
35 ns |
||||||||||
Texas Instruments |
OTHER FIFO |
MILITARY |
20 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
TTL |
THROUGH-HOLE |
PARALLEL |
SYNCHRONOUS |
16 words |
5 |
5 |
4 |
IN-LINE |
DIP20,.3 |
FIFOs |
2.54 mm |
125 Cel |
3-STATE |
16X4 |
16 |
-55 Cel |
DUAL |
R-GDIP-T20 |
5.5 V |
5.08 mm |
7.62 mm |
Not Qualified |
64 bit |
4.5 V |
NOT SPECIFIED |
NOT SPECIFIED |
YES |
24.195 mm |
||||||||||||||
|
Texas Instruments |
OTHER FIFO |
COMMERCIAL |
64 |
TFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
10 ns |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
35 mA |
512 words |
3.3 |
3.3 |
18 |
FLATPACK, THIN PROFILE, FINE PITCH |
TQFP64,.47SQ |
FIFOs |
.5 mm |
70 Cel |
512X18 |
512 |
0 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQFP-G64 |
3 |
3.6 V |
1.2 mm |
100 MHz |
10 mm |
Not Qualified |
9216 bit |
3 V |
e4 |
30 |
260 |
YES |
10 mm |
6.5 ns |
|||||||
Texas Instruments |
OTHER FIFO |
MILITARY |
16 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
TTL |
MIL-STD-883 Class B (Modified) |
THROUGH-HOLE |
ASYNCHRONOUS |
16 words |
5 |
5 |
4 |
IN-LINE |
DIP16,.3 |
FIFOs |
2.54 mm |
125 Cel |
16X4 |
16 |
-55 Cel |
DUAL |
R-XDIP-T16 |
Not Qualified |
|||||||||||||||||||||||||
Texas Instruments |
OTHER FIFO |
MILITARY |
20 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
TTL |
MIL-PRF-38535 |
THROUGH-HOLE |
PARALLEL |
SYNCHRONOUS |
16 words |
5 |
5 |
4 |
IN-LINE |
DIP(UNSPEC) |
FIFOs |
2.54 mm |
125 Cel |
16X4 |
16 |
-55 Cel |
DUAL |
R-GDIP-T20 |
5.5 V |
5.08 mm |
7.62 mm |
Not Qualified |
64 bit |
4.5 V |
NOT SPECIFIED |
NOT SPECIFIED |
YES |
24.195 mm |
80 ns |
|||||||||||||
Texas Instruments |
OTHER FIFO |
MILITARY |
20 |
QCCN |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
50 ns |
1 |
TTL |
NO LEAD |
PARALLEL |
ASYNCHRONOUS |
170 mA |
64 words |
5 |
5 |
CHIP CARRIER |
LCC20,.35SQ |
FIFOs |
1.27 mm |
125 Cel |
3-STATE |
64X5 |
64 |
-55 Cel |
QUAD |
S-CQCC-N20 |
5.5 V |
2.03 mm |
25 MHz |
8.89 mm |
Not Qualified |
320 bit |
4.5 V |
NOT SPECIFIED |
NOT SPECIFIED |
YES |
8.89 mm |
24 ns |
|||||||||||
Texas Instruments |
OTHER FIFO |
MILITARY |
24 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
TTL |
THROUGH-HOLE |
ASYNCHRONOUS |
64 words |
5 |
5 |
8 |
IN-LINE |
DIP24,.3 |
FIFOs |
2.54 mm |
125 Cel |
64X8 |
64 |
-55 Cel |
DUAL |
R-XDIP-T24 |
Not Qualified |
||||||||||||||||||||||||||
Texas Instruments |
OTHER FIFO |
COMMERCIAL |
20 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
TTL |
38535Q/M;38534H;883B |
THROUGH-HOLE |
ASYNCHRONOUS |
16 words |
5 |
5 |
5 |
IN-LINE |
DIP20,.3 |
FIFOs |
2.54 mm |
70 Cel |
16X5 |
16 |
0 Cel |
DUAL |
R-XDIP-T20 |
10 MHz |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
||||||||||||||||||||||
Texas Instruments |
OTHER FIFO |
MILITARY |
20 |
QCCN |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
40 ns |
1 |
TTL |
38535Q/M;38534H;883B |
NO LEAD |
PARALLEL |
ASYNCHRONOUS |
155 mA |
64 words |
5 |
5 |
4 |
CHIP CARRIER |
LCC20,.35SQ |
FIFOs |
1.27 mm |
125 Cel |
TOTEM POLE |
64X4 |
64 |
-55 Cel |
QUAD |
S-CQCC-N20 |
5.5 V |
2.03 mm |
25 MHz |
8.89 mm |
Not Qualified |
256 bit |
4.5 V |
NOT SPECIFIED |
NOT SPECIFIED |
NO |
8.89 mm |
24 ns |
|||||||||
|
Texas Instruments |
OTHER FIFO |
MILITARY |
16 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
16 words |
5 |
5/15 |
4 |
IN-LINE |
DIP16,.3 |
FIFOs |
2.54 mm |
125 Cel |
16X4 |
16 |
-55 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDIP-T16 |
18 V |
5.08 mm |
1.5 MHz |
7.62 mm |
Not Qualified |
64 bit |
3 V |
e4 |
YES |
19.305 mm |
420 ns |
||||||||||||
|
Texas Instruments |
OTHER FIFO |
MILITARY |
80 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
7.5 ns |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
35 mA |
32768 words |
3.3 |
3.3 |
18 |
FLATPACK, LOW PROFILE |
QFP80,.64SQ |
9 |
FIFOs |
.65 mm |
125 Cel |
3-STATE |
32KX18 |
32K |
-55 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQFP-G80 |
4 |
3.45 V |
1.6 mm |
133 MHz |
14 mm |
Not Qualified |
589824 bit |
3.15 V |
CAN ALSO BE CONFIGURED AS 65536 X 9 |
e4 |
30 |
260 |
YES |
.015 Amp |
14 mm |
5 ns |
|||
Texas Instruments |
OTHER FIFO |
MILITARY |
20 |
DFP |
RECTANGULAR |
CERAMIC |
YES |
TTL |
MIL-STD-883 Class B (Modified) |
FLAT |
ASYNCHRONOUS |
16 words |
5 |
5 |
4 |
FLATPACK |
FL20,.3 |
FIFOs |
1.27 mm |
125 Cel |
16X4 |
16 |
-55 Cel |
DUAL |
R-XDFP-F20 |
Not Qualified |
|||||||||||||||||||||||||
Texas Instruments |
OTHER FIFO |
OTHER |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
THROUGH-HOLE |
SYNCHRONOUS/ASYNCHRONOUS |
8 mA |
64 words |
+-5,-12 |
9 |
IN-LINE |
DIP28,.6 |
FIFOs |
2.54 mm |
85 Cel |
64X9 |
64 |
-25 Cel |
DUAL |
R-PDIP-T28 |
Not Qualified |
1200 ns |
|||||||||||||||||||||||||
Texas Instruments |
OTHER FIFO |
MILITARY |
16 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
666.66 ns |
1 |
CMOS |
38535Q/M;38534H;883B |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
16 words |
5 |
5/15 |
4 |
IN-LINE |
DIP16,.3 |
FIFOs |
2.54 mm |
125 Cel |
3-STATE |
16X4 |
16 |
-55 Cel |
TIN LEAD |
DUAL |
R-GDIP-T16 |
18 V |
5.08 mm |
1.5 MHz |
7.62 mm |
Not Qualified |
64 bit |
3 V |
e0 |
YES |
420 ns |
|||||||||||
Texas Instruments |
OTHER FIFO |
MILITARY |
QCCN |
CERAMIC |
YES |
TTL |
38535Q/M;38534H;883B |
NO LEAD |
ASYNCHRONOUS |
16 words |
5 |
5 |
4 |
CHIP CARRIER |
LCC(UNSPEC) |
FIFOs |
125 Cel |
16X4 |
16 |
-55 Cel |
QUAD |
Not Qualified |
|||||||||||||||||||||||||||||
Texas Instruments |
OTHER FIFO |
MILITARY |
16 |
DFP |
RECTANGULAR |
CERAMIC |
YES |
TTL |
38535Q/M;38534H;883B |
FLAT |
ASYNCHRONOUS |
16 words |
4 |
FLATPACK |
FL16,.3 |
FIFOs |
1.27 mm |
125 Cel |
16X4 |
16 |
-55 Cel |
DUAL |
R-XDFP-F16 |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
FIFO, or First-In, First-Out, is a type of digital circuit that is used in computer systems and digital devices to manage the flow of data. A FIFO circuit stores data in a buffer and retrieves the data in the same order in which it was received, with the first data received being the first data to be retrieved.
FIFO circuits are used in many applications where data needs to be stored and retrieved in a specific order, such as in data communication systems, disk drives, and multimedia devices. For example, in a data communication system, a FIFO circuit can be used to store incoming data packets in a buffer and retrieve them in the order in which they were received, ensuring that the data is processed correctly and in a timely manner.
FIFO circuits are typically implemented using a combination of flip-flops, multiplexers, and control logic. The control logic manages the input and output of data to the FIFO buffer and ensures that the data is stored and retrieved in the correct order.
One of the advantages of using a FIFO circuit is that it provides a simple and efficient way to manage the flow of data. FIFO circuits are easy to implement and can handle large amounts of data. They can also be used in conjunction with other types of digital circuits to implement more complex data processing algorithms.