Part | RoHS | Manufacturer | Memory IC Type | Temperature Grade | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Surface Mount | Cycle Time | No. of Functions | Technology | Screening Level | Terminal Form | Parallel or Serial | Operating Mode | Maximum Supply Current | No. of Words | Nominal Supply Voltage / Vsup (V) | Power Supplies (V) | Memory Width | Package Style (Meter) | Package Equivalence Code | Alternate Memory Width | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Output Characteristics | Organization | No. of Words Code | Minimum Operating Temperature | Terminal Finish | Terminal Position | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Maximum Clock Frequency (fCLK) | Width | Qualification | Memory Density | Minimum Supply Voltage (Vsup) | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Output Enable | Maximum Standby Current | Length | Maximum Access Time |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Texas Instruments |
OTHER FIFO |
MILITARY |
20 |
QCCN |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
40 ns |
1 |
TTL |
NO LEAD |
PARALLEL |
SYNCHRONOUS |
16 words |
5 |
5 |
5 |
CHIP CARRIER |
LCC20,.35SQ |
FIFOs |
1.27 mm |
125 Cel |
3-STATE |
16X5 |
16 |
-55 Cel |
QUAD |
S-CQCC-N20 |
5.5 V |
2.03 mm |
25 MHz |
8.89 mm |
Not Qualified |
80 bit |
4.5 V |
FALL-THROUGH TIME 24NS |
NOT SPECIFIED |
NOT SPECIFIED |
YES |
8.89 mm |
35 ns |
||||||||||
Texas Instruments |
COMMERCIAL |
20 |
ZIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
30 ns |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
262144 words |
5 |
4 |
IN-LINE |
1.27 mm |
70 Cel |
3-STATE |
256KX4 |
256K |
0 Cel |
ZIG-ZAG |
R-PZIP-T20 |
5.5 V |
10.16 mm |
2.8 mm |
Not Qualified |
1048576 bit |
4.5 V |
NO |
25 ns |
|||||||||||||||||||
Texas Instruments |
OTHER FIFO |
MILITARY |
20 |
QCCN |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
40 ns |
1 |
CMOS |
38535Q/M;38534H;883B |
NO LEAD |
PARALLEL |
SYNCHRONOUS |
16 words |
5 |
5 |
5 |
CHIP CARRIER |
LCC20,.35SQ |
FIFOs |
1.27 mm |
125 Cel |
16X5 |
16 |
-55 Cel |
QUAD |
S-CQCC-N20 |
5.5 V |
2.03 mm |
25 MHz |
8.89 mm |
Not Qualified |
80 bit |
4.5 V |
FALL-THROUGH TIME 24NS |
NOT SPECIFIED |
NOT SPECIFIED |
YES |
8.89 mm |
35 ns |
||||||||||
Texas Instruments |
COMMERCIAL |
20 |
ZIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
30 ns |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
SYNCHRONOUS |
50 mA |
262144 words |
5 |
5 |
4 |
IN-LINE |
ZIP20,.1 |
Other Memory ICs |
1.27 mm |
70 Cel |
3-STATE |
256KX4 |
256K |
0 Cel |
ZIG-ZAG |
R-PZIP-T20 |
5.5 V |
10.16 mm |
2.8 mm |
Not Qualified |
1048576 bit |
4.5 V |
NOT SPECIFIED |
NOT SPECIFIED |
NO |
.005 Amp |
25 ns |
||||||||||||
Texas Instruments |
COMMERCIAL |
20 |
ZIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
40 ns |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
262144 words |
5 |
4 |
IN-LINE |
1.27 mm |
70 Cel |
3-STATE |
256KX4 |
256K |
0 Cel |
ZIG-ZAG |
R-PZIP-T20 |
5.5 V |
10.16 mm |
2.8 mm |
Not Qualified |
1048576 bit |
4.5 V |
YES |
30 ns |
|||||||||||||||||||
Texas Instruments |
OTHER FIFO |
MILITARY |
20 |
DFP |
RECTANGULAR |
CERAMIC |
YES |
TTL |
38535Q/M;38534H;883B |
FLAT |
ASYNCHRONOUS |
16 words |
4 |
FLATPACK |
FL20,.3 |
FIFOs |
1.27 mm |
125 Cel |
16X4 |
16 |
-55 Cel |
DUAL |
R-XDFP-F20 |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
|||||||||||||||||||||||||
Texas Instruments |
OTHER FIFO |
MILITARY |
20 |
QCCN |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
40 ns |
1 |
CMOS |
38535Q/M;38534H;883B |
NO LEAD |
PARALLEL |
SYNCHRONOUS |
16 words |
5 |
5 |
5 |
CHIP CARRIER |
LCC20,.35SQ |
FIFOs |
1.27 mm |
125 Cel |
16X5 |
16 |
-55 Cel |
QUAD |
S-CQCC-N20 |
5.5 V |
2.03 mm |
8.89 mm |
Not Qualified |
80 bit |
4.5 V |
FALL-THROUGH TIME 24NS |
NOT SPECIFIED |
NOT SPECIFIED |
YES |
8.89 mm |
35 ns |
|||||||||||
Texas Instruments |
COMMERCIAL |
20 |
SOJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
40 ns |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
262144 words |
5 |
4 |
SMALL OUTLINE |
1.27 mm |
70 Cel |
3-STATE |
256KX4 |
256K |
0 Cel |
DUAL |
R-PDSO-J20 |
5.5 V |
3.76 mm |
7.57 mm |
Not Qualified |
1048576 bit |
4.5 V |
NO |
17.145 mm |
30 ns |
||||||||||||||||||
Texas Instruments |
OTHER FIFO |
MILITARY |
20 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
TTL |
MIL-STD-883 Class B (Modified) |
THROUGH-HOLE |
ASYNCHRONOUS |
16 words |
4 |
IN-LINE |
DIP20,.3 |
FIFOs |
2.54 mm |
125 Cel |
16X4 |
16 |
-55 Cel |
DUAL |
R-XDIP-T20 |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
|||||||||||||||||||||||||
Texas Instruments |
OTHER FIFO |
MILITARY |
20 |
QCCN |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
TTL |
MIL-PRF-38535 |
NO LEAD |
PARALLEL |
SYNCHRONOUS |
16 words |
5 |
5 |
4 |
CHIP CARRIER |
LCC(UNSPEC) |
FIFOs |
1.27 mm |
125 Cel |
16X4 |
16 |
-55 Cel |
QUAD |
S-CQCC-N20 |
5.5 V |
2.03 mm |
8.89 mm |
Not Qualified |
64 bit |
4.5 V |
NOT SPECIFIED |
NOT SPECIFIED |
YES |
8.89 mm |
80 ns |
|||||||||||||
Texas Instruments |
OTHER FIFO |
MILITARY |
20 |
QCCN |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
40 ns |
1 |
CMOS |
38535Q/M;38534H;883B |
NO LEAD |
PARALLEL |
SYNCHRONOUS |
16 words |
5 |
5 |
4 |
CHIP CARRIER |
LCC20,.35SQ |
FIFOs |
1.27 mm |
125 Cel |
16X4 |
16 |
-55 Cel |
QUAD |
S-CQCC-N20 |
5.5 V |
2.03 mm |
25 MHz |
8.89 mm |
Not Qualified |
64 bit |
4.5 V |
FALL-THROUGH TIME 24NS |
NOT SPECIFIED |
NOT SPECIFIED |
YES |
8.89 mm |
35 ns |
||||||||||
Texas Instruments |
OTHER FIFO |
MILITARY |
20 |
DFP |
RECTANGULAR |
CERAMIC |
YES |
TTL |
FLAT |
ASYNCHRONOUS |
16 words |
5 |
5 |
4 |
FLATPACK |
FL20,.3 |
FIFOs |
1.27 mm |
125 Cel |
16X4 |
16 |
-55 Cel |
DUAL |
R-XDFP-F20 |
Not Qualified |
||||||||||||||||||||||||||
Texas Instruments |
OTHER FIFO |
MILITARY |
20 |
DIP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
NO |
40 ns |
1 |
CMOS |
38535Q/M;38534H;883B |
THROUGH-HOLE |
PARALLEL |
SYNCHRONOUS |
16 words |
5 |
5 |
5 |
IN-LINE |
DIP20,.3 |
FIFOs |
2.54 mm |
125 Cel |
16X5 |
16 |
-55 Cel |
DUAL |
R-CDIP-T20 |
5.5 V |
5.08 mm |
25 MHz |
7.62 mm |
Not Qualified |
80 bit |
4.5 V |
FALL-THROUGH TIME 24NS |
NOT SPECIFIED |
NOT SPECIFIED |
YES |
24.195 mm |
35 ns |
||||||||||
Texas Instruments |
OTHER FIFO |
MILITARY |
20 |
DFP |
RECTANGULAR |
CERAMIC |
YES |
TTL |
MIL-STD-883 Class B (Modified) |
FLAT |
ASYNCHRONOUS |
16 words |
4 |
FLATPACK |
FL20,.3 |
FIFOs |
1.27 mm |
125 Cel |
16X4 |
16 |
-55 Cel |
DUAL |
R-XDFP-F20 |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
|||||||||||||||||||||||||
Texas Instruments |
OTHER FIFO |
MILITARY |
20 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
50 ns |
1 |
TTL |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
170 mA |
64 words |
5 |
5 |
IN-LINE |
DIP20,.3 |
FIFOs |
2.54 mm |
125 Cel |
3-STATE |
64X5 |
64 |
-55 Cel |
DUAL |
R-GDIP-T20 |
5.5 V |
5.08 mm |
25 MHz |
7.62 mm |
Not Qualified |
320 bit |
4.5 V |
NOT SPECIFIED |
NOT SPECIFIED |
YES |
24.195 mm |
24 ns |
|||||||||||
Texas Instruments |
OTHER FIFO |
MILITARY |
20 |
DFP |
RECTANGULAR |
CERAMIC |
YES |
TTL |
38535Q/M;38534H;883B |
FLAT |
ASYNCHRONOUS |
16 words |
5 |
5 |
4 |
FLATPACK |
FL20,.3 |
FIFOs |
1.27 mm |
125 Cel |
16X4 |
16 |
-55 Cel |
DUAL |
R-XDFP-F20 |
Not Qualified |
|||||||||||||||||||||||||
Texas Instruments |
OTHER FIFO |
MILITARY |
20 |
DIP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
NO |
40 ns |
1 |
CMOS |
38535Q/M;38534H;883B |
THROUGH-HOLE |
PARALLEL |
SYNCHRONOUS |
16 words |
5 |
5 |
5 |
IN-LINE |
DIP20,.3 |
FIFOs |
2.54 mm |
125 Cel |
16X5 |
16 |
-55 Cel |
DUAL |
R-CDIP-T20 |
5.5 V |
5.08 mm |
7.62 mm |
Not Qualified |
80 bit |
4.5 V |
FALL-THROUGH TIME 24NS |
NOT SPECIFIED |
NOT SPECIFIED |
YES |
24.195 mm |
35 ns |
|||||||||||
Texas Instruments |
OTHER FIFO |
MILITARY |
20 |
DFP |
RECTANGULAR |
CERAMIC |
YES |
TTL |
FLAT |
ASYNCHRONOUS |
16 words |
4 |
FLATPACK |
FL20,.3 |
FIFOs |
1.27 mm |
125 Cel |
16X4 |
16 |
-55 Cel |
DUAL |
R-XDFP-F20 |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
||||||||||||||||||||||||||
Texas Instruments |
OTHER FIFO |
MILITARY |
20 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
40 ns |
1 |
TTL |
THROUGH-HOLE |
PARALLEL |
SYNCHRONOUS |
16 words |
5 |
5 |
5 |
IN-LINE |
DIP20,.3 |
FIFOs |
2.54 mm |
125 Cel |
3-STATE |
16X5 |
16 |
-55 Cel |
DUAL |
R-GDIP-T20 |
5.5 V |
5.08 mm |
7.62 mm |
Not Qualified |
80 bit |
4.5 V |
FALL-THROUGH TIME 24NS |
NOT SPECIFIED |
NOT SPECIFIED |
YES |
24.195 mm |
35 ns |
|||||||||||
Texas Instruments |
OTHER FIFO |
MILITARY |
20 |
QCCN |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
50 ns |
1 |
TTL |
38535Q/M;38534H;883B |
NO LEAD |
PARALLEL |
ASYNCHRONOUS |
180 mA |
64 words |
5 |
5 |
CHIP CARRIER |
LCC20,.35SQ |
FIFOs |
1.27 mm |
125 Cel |
3-STATE |
64X5 |
64 |
-55 Cel |
QUAD |
S-CQCC-N20 |
5.5 V |
2.03 mm |
20 MHz |
8.89 mm |
Not Qualified |
320 bit |
4.5 V |
NOT SPECIFIED |
NOT SPECIFIED |
YES |
8.89 mm |
24 ns |
||||||||||
Texas Instruments |
COMMERCIAL |
20 |
ZIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
40 ns |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
262144 words |
5 |
4 |
IN-LINE |
1.27 mm |
70 Cel |
3-STATE |
256KX4 |
256K |
0 Cel |
ZIG-ZAG |
R-PZIP-T20 |
5.5 V |
10.16 mm |
2.8 mm |
Not Qualified |
1048576 bit |
4.5 V |
NO |
30 ns |
|||||||||||||||||||
Texas Instruments |
OTHER FIFO |
MILITARY |
20 |
QCCN |
SQUARE |
CERAMIC |
YES |
TTL |
NO LEAD |
ASYNCHRONOUS |
16 words |
5 |
5 |
5 |
CHIP CARRIER |
LCC20,.35SQ |
FIFOs |
1.27 mm |
125 Cel |
16X5 |
16 |
-55 Cel |
QUAD |
S-XQCC-N20 |
20 MHz |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
|||||||||||||||||||||||
Texas Instruments |
COMMERCIAL |
20 |
SOJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
60 ns |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
262144 words |
5 |
4 |
SMALL OUTLINE |
1.27 mm |
70 Cel |
3-STATE |
256KX4 |
256K |
0 Cel |
DUAL |
R-PDSO-J20 |
5.5 V |
3.76 mm |
7.57 mm |
Not Qualified |
1048576 bit |
4.5 V |
NO |
17.145 mm |
50 ns |
||||||||||||||||||
Texas Instruments |
COMMERCIAL |
20 |
SOJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
60 ns |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
262144 words |
5 |
4 |
SMALL OUTLINE |
1.27 mm |
70 Cel |
3-STATE |
256KX4 |
256K |
0 Cel |
DUAL |
R-PDSO-J20 |
5.5 V |
3.76 mm |
7.57 mm |
Not Qualified |
1048576 bit |
4.5 V |
NO |
17.145 mm |
50 ns |
||||||||||||||||||
Texas Instruments |
OTHER FIFO |
MILITARY |
20 |
QCCN |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
40 ns |
1 |
TTL |
NO LEAD |
PARALLEL |
SYNCHRONOUS |
16 words |
5 |
5 |
4 |
CHIP CARRIER |
LCC20,.35SQ |
FIFOs |
1.27 mm |
125 Cel |
3-STATE |
16X4 |
16 |
-55 Cel |
QUAD |
S-CQCC-N20 |
5.5 V |
2.03 mm |
25 MHz |
8.89 mm |
Not Qualified |
64 bit |
4.5 V |
FALL-THROUGH TIME 24NS |
NOT SPECIFIED |
NOT SPECIFIED |
YES |
8.89 mm |
35 ns |
||||||||||
Texas Instruments |
COMMERCIAL |
20 |
SOJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
30 ns |
1 |
CMOS |
J BEND |
PARALLEL |
SYNCHRONOUS |
50 mA |
262144 words |
5 |
5 |
4 |
SMALL OUTLINE |
SOJ20/26,.34 |
Other Memory ICs |
1.27 mm |
70 Cel |
3-STATE |
256KX4 |
256K |
0 Cel |
DUAL |
R-PDSO-J20 |
5.5 V |
3.76 mm |
7.57 mm |
Not Qualified |
1048576 bit |
4.5 V |
NOT SPECIFIED |
NOT SPECIFIED |
NO |
.005 Amp |
17.145 mm |
25 ns |
|||||||||||
Texas Instruments |
COMMERCIAL |
20 |
ZIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
40 ns |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
SYNCHRONOUS |
45 mA |
262144 words |
5 |
5 |
4 |
IN-LINE |
ZIP20,.1 |
Other Memory ICs |
1.27 mm |
70 Cel |
3-STATE |
256KX4 |
256K |
0 Cel |
ZIG-ZAG |
R-PZIP-T20 |
5.5 V |
10.16 mm |
2.8 mm |
Not Qualified |
1048576 bit |
4.5 V |
NOT SPECIFIED |
NOT SPECIFIED |
NO |
.005 Amp |
30 ns |
||||||||||||
Texas Instruments |
OTHER FIFO |
COMMERCIAL |
20 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
TTL |
GULL WING |
ASYNCHRONOUS |
16 words |
5 |
5 |
5 |
SMALL OUTLINE |
SOP20,.4 |
FIFOs |
1.27 mm |
70 Cel |
16X5 |
16 |
0 Cel |
DUAL |
R-PDSO-G20 |
|||||||||||||||||||||||||||
Texas Instruments |
OTHER FIFO |
COMMERCIAL |
20 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
25 ns |
1 |
TTL |
J BEND |
PARALLEL |
ASYNCHRONOUS |
125 mA |
16 words |
5 |
5 |
4 |
CHIP CARRIER |
LDCC20,.4SQ |
FIFOs |
1.27 mm |
70 Cel |
3-STATE |
16X4 |
16 |
0 Cel |
QUAD |
S-PQCC-J20 |
5.5 V |
4.57 mm |
40 MHz |
8.965 mm |
Not Qualified |
64 bit |
4.5 V |
NOT SPECIFIED |
NOT SPECIFIED |
YES |
8.965 mm |
30 ns |
||||||||||
Texas Instruments |
OTHER FIFO |
COMMERCIAL |
20 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
TTL |
GULL WING |
ASYNCHRONOUS |
16 words |
5 |
5 |
5 |
SMALL OUTLINE |
SOP20,.4 |
FIFOs |
1.27 mm |
70 Cel |
16X5 |
16 |
0 Cel |
DUAL |
R-PDSO-G20 |
30 MHz |
NOT SPECIFIED |
NOT SPECIFIED |
||||||||||||||||||||||||
Texas Instruments |
OTHER FIFO |
COMMERCIAL |
20 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
TTL |
THROUGH-HOLE |
PARALLEL |
SYNCHRONOUS |
16 words |
5 |
5 |
4 |
IN-LINE |
DIP20,.3 |
FIFOs |
2.54 mm |
70 Cel |
3-STATE |
16X4 |
16 |
0 Cel |
DUAL |
R-PDIP-T20 |
5.25 V |
5.08 mm |
7.62 mm |
Not Qualified |
64 bit |
4.75 V |
NOT SPECIFIED |
NOT SPECIFIED |
YES |
24.325 mm |
||||||||||||||
Texas Instruments |
OTHER FIFO |
COMMERCIAL |
20 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
33.33 ns |
1 |
TTL |
GULL WING |
PARALLEL |
SYNCHRONOUS |
16 words |
5 |
5 |
5 |
SMALL OUTLINE |
SOP20,.4 |
FIFOs |
1.27 mm |
70 Cel |
3-STATE |
16X5 |
16 |
0 Cel |
DUAL |
R-PDSO-G20 |
5.5 V |
2.65 mm |
30 MHz |
7.5 mm |
Not Qualified |
80 bit |
4.5 V |
FALL-THROUGH TIME 24NS |
NOT SPECIFIED |
NOT SPECIFIED |
YES |
12.8 mm |
33 ns |
||||||||||
Texas Instruments |
OTHER FIFO |
COMMERCIAL |
20 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
TTL |
THROUGH-HOLE |
ASYNCHRONOUS |
16 words |
5 |
5 |
5 |
IN-LINE |
DIP20,.3 |
FIFOs |
2.54 mm |
70 Cel |
16X5 |
16 |
0 Cel |
DUAL |
R-PDIP-T20 |
10 MHz |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
|||||||||||||||||||||||
|
Texas Instruments |
OTHER FIFO |
COMMERCIAL |
20 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
25 ns |
1 |
TTL |
GULL WING |
PARALLEL |
SYNCHRONOUS |
140 mA |
16 words |
5 |
5 |
5 |
SMALL OUTLINE |
SOP20,.4 |
FIFOs |
1.27 mm |
70 Cel |
3-STATE |
16X5 |
16 |
0 Cel |
DUAL |
R-PDSO-G20 |
5.5 V |
2.65 mm |
40 MHz |
7.5 mm |
Not Qualified |
80 bit |
4.5 V |
NOT SPECIFIED |
NOT SPECIFIED |
YES |
12.8 mm |
30 ns |
|||||||||
Texas Instruments |
OTHER FIFO |
COMMERCIAL |
20 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
100 ns |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
SYNCHRONOUS |
16 words |
5 |
4 |
IN-LINE |
DIP20,.3 |
FIFOs |
2.54 mm |
70 Cel |
16X4 |
16 |
0 Cel |
DUAL |
R-GDIP-T20 |
5.25 V |
5.08 mm |
7.62 mm |
Not Qualified |
64 bit |
4.75 V |
FALL-THROUGH TIME 50NS |
NOT SPECIFIED |
NOT SPECIFIED |
YES |
24.195 mm |
80 ns |
|||||||||||||
Texas Instruments |
OTHER FIFO |
COMMERCIAL |
20 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
TTL |
THROUGH-HOLE |
ASYNCHRONOUS |
16 words |
5 |
5 |
5 |
IN-LINE |
DIP20,.3 |
FIFOs |
2.54 mm |
70 Cel |
16X5 |
16 |
0 Cel |
DUAL |
R-PDIP-T20 |
Not Qualified |
||||||||||||||||||||||||||
Texas Instruments |
OTHER FIFO |
COMMERCIAL |
20 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
TTL |
THROUGH-HOLE |
ASYNCHRONOUS |
16 words |
4 |
IN-LINE |
DIP20,.3 |
FIFOs |
2.54 mm |
70 Cel |
16X4 |
16 |
0 Cel |
DUAL |
R-PDIP-T20 |
NOT SPECIFIED |
NOT SPECIFIED |
|||||||||||||||||||||||||||
Texas Instruments |
OTHER FIFO |
COMMERCIAL |
20 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
TTL |
GULL WING |
ASYNCHRONOUS |
170 mA |
64 words |
5 |
SMALL OUTLINE |
SOP20,.4 |
FIFOs |
1.27 mm |
70 Cel |
64X5 |
64 |
0 Cel |
DUAL |
R-PDSO-G20 |
25 MHz |
|||||||||||||||||||||||||||
|
Texas Instruments |
OTHER FIFO |
COMMERCIAL |
20 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
100 ns |
1 |
TTL |
THROUGH-HOLE |
PARALLEL |
SYNCHRONOUS |
120 mA |
16 words |
5 |
5 |
5 |
IN-LINE |
DIP20,.3 |
FIFOs |
2.54 mm |
70 Cel |
3-STATE |
16X5 |
16 |
0 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDIP-T20 |
5.25 V |
5.08 mm |
10 MHz |
7.62 mm |
Not Qualified |
80 bit |
4.75 V |
e4 |
YES |
25.4 mm |
75 ns |
|||||||||
Texas Instruments |
OTHER FIFO |
COMMERCIAL |
20 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
25 ns |
1 |
TTL |
GULL WING |
PARALLEL |
SYNCHRONOUS |
133 mA |
16 words |
5 |
5 |
5 |
SMALL OUTLINE |
SOP20,.4 |
FIFOs |
1.27 mm |
70 Cel |
3-STATE |
16X5 |
16 |
0 Cel |
DUAL |
R-PDSO-G20 |
5.5 V |
2.65 mm |
40 MHz |
7.5 mm |
Not Qualified |
80 bit |
4.5 V |
NOT SPECIFIED |
NOT SPECIFIED |
YES |
12.8 mm |
30 ns |
||||||||||
Texas Instruments |
OTHER FIFO |
COMMERCIAL |
20 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
TTL |
GULL WING |
ASYNCHRONOUS |
16 words |
5 |
5 |
5 |
SMALL OUTLINE |
SOP20,.4 |
FIFOs |
1.27 mm |
70 Cel |
16X5 |
16 |
0 Cel |
DUAL |
R-PDSO-G20 |
|||||||||||||||||||||||||||
Texas Instruments |
OTHER FIFO |
COMMERCIAL |
20 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
TTL |
THROUGH-HOLE |
ASYNCHRONOUS |
16 words |
5 |
5 |
4 |
IN-LINE |
DIP20,.3 |
FIFOs |
2.54 mm |
70 Cel |
16X4 |
16 |
0 Cel |
DUAL |
R-PDIP-T20 |
Not Qualified |
||||||||||||||||||||||||||
Texas Instruments |
OTHER FIFO |
COMMERCIAL |
20 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
33.33 ns |
1 |
TTL |
J BEND |
PARALLEL |
SYNCHRONOUS |
16 words |
5 |
5 |
4 |
CHIP CARRIER |
LDCC20,.4SQ |
FIFOs |
1.27 mm |
70 Cel |
3-STATE |
16X4 |
16 |
0 Cel |
QUAD |
S-PQCC-J20 |
5.5 V |
4.57 mm |
30 MHz |
8.9662 mm |
Not Qualified |
64 bit |
4.5 V |
FALL-THROUGH TIME 24NS |
NOT SPECIFIED |
NOT SPECIFIED |
YES |
8.9662 mm |
31 ns |
||||||||||
Texas Instruments |
OTHER FIFO |
COMMERCIAL |
20 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
33.33 ns |
1 |
TTL |
J BEND |
PARALLEL |
ASYNCHRONOUS |
145 mA |
64 words |
5 |
5 |
4 |
CHIP CARRIER |
LDCC20,.4SQ |
FIFOs |
1.27 mm |
70 Cel |
3-STATE |
64X4 |
64 |
0 Cel |
QUAD |
S-PQCC-J20 |
5.5 V |
4.57 mm |
30 MHz |
8.9662 mm |
Not Qualified |
256 bit |
4.5 V |
NOT SPECIFIED |
NOT SPECIFIED |
NO |
8.9662 mm |
22 ns |
||||||||||
Texas Instruments |
OTHER FIFO |
COMMERCIAL |
20 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
100 ns |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
SYNCHRONOUS |
16 words |
5 |
4 |
IN-LINE |
DIP20,.3 |
FIFOs |
2.54 mm |
70 Cel |
16X4 |
16 |
0 Cel |
DUAL |
R-PDIP-T20 |
5.25 V |
5.08 mm |
7.62 mm |
Not Qualified |
64 bit |
4.75 V |
FALL-THROUGH TIME 50NS |
NOT SPECIFIED |
NOT SPECIFIED |
YES |
24.325 mm |
80 ns |
|||||||||||||
Texas Instruments |
OTHER FIFO |
COMMERCIAL |
20 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
TTL |
THROUGH-HOLE |
ASYNCHRONOUS |
16 words |
5 |
5 |
4 |
IN-LINE |
DIP20,.3 |
FIFOs |
2.54 mm |
70 Cel |
16X4 |
16 |
0 Cel |
DUAL |
R-XDIP-T20 |
|||||||||||||||||||||||||||
Texas Instruments |
OTHER FIFO |
COMMERCIAL |
20 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
TTL |
THROUGH-HOLE |
ASYNCHRONOUS |
16 words |
5 |
5 |
4 |
IN-LINE |
DIP20,.3 |
FIFOs |
2.54 mm |
70 Cel |
16X4 |
16 |
0 Cel |
DUAL |
R-XDIP-T20 |
|||||||||||||||||||||||||||
Texas Instruments |
OTHER FIFO |
COMMERCIAL |
20 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
25 ns |
1 |
TTL |
THROUGH-HOLE |
PARALLEL |
SYNCHRONOUS |
133 mA |
16 words |
5 |
5 |
5 |
IN-LINE |
DIP20,.3 |
FIFOs |
2.54 mm |
70 Cel |
3-STATE |
16X5 |
16 |
0 Cel |
DUAL |
R-PDIP-T20 |
5.5 V |
5.08 mm |
40 MHz |
7.62 mm |
Not Qualified |
80 bit |
4.5 V |
NOT SPECIFIED |
NOT SPECIFIED |
YES |
24.325 mm |
30 ns |
FIFO, or First-In, First-Out, is a type of digital circuit that is used in computer systems and digital devices to manage the flow of data. A FIFO circuit stores data in a buffer and retrieves the data in the same order in which it was received, with the first data received being the first data to be retrieved.
FIFO circuits are used in many applications where data needs to be stored and retrieved in a specific order, such as in data communication systems, disk drives, and multimedia devices. For example, in a data communication system, a FIFO circuit can be used to store incoming data packets in a buffer and retrieve them in the order in which they were received, ensuring that the data is processed correctly and in a timely manner.
FIFO circuits are typically implemented using a combination of flip-flops, multiplexers, and control logic. The control logic manages the input and output of data to the FIFO buffer and ensures that the data is stored and retrieved in the correct order.
One of the advantages of using a FIFO circuit is that it provides a simple and efficient way to manage the flow of data. FIFO circuits are easy to implement and can handle large amounts of data. They can also be used in conjunction with other types of digital circuits to implement more complex data processing algorithms.