Part | RoHS | Manufacturer | Memory IC Type | Temperature Grade | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Surface Mount | Cycle Time | No. of Functions | Technology | Screening Level | Terminal Form | Parallel or Serial | Operating Mode | Maximum Supply Current | No. of Words | Nominal Supply Voltage / Vsup (V) | Power Supplies (V) | Memory Width | Package Style (Meter) | Package Equivalence Code | Alternate Memory Width | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Output Characteristics | Organization | No. of Words Code | Minimum Operating Temperature | Terminal Finish | Terminal Position | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Maximum Clock Frequency (fCLK) | Width | Qualification | Memory Density | Minimum Supply Voltage (Vsup) | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Output Enable | Maximum Standby Current | Length | Maximum Access Time |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Renesas Electronics |
COMMERCIAL |
32 |
QCCN |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
YES |
100 ns |
1 |
CMOS |
NO LEAD |
PARALLEL |
ASYNCHRONOUS |
1024 words |
5 |
9 |
CHIP CARRIER |
70 Cel |
3-STATE |
1KX9 |
1K |
0 Cel |
TIN LEAD |
QUAD |
R-CQCC-N32 |
5.5 V |
Not Qualified |
9216 bit |
4.5 V |
RETRANSMIT |
e0 |
NO |
80 ns |
|||||||||||||||||||
|
Renesas Electronics |
OTHER FIFO |
COMMERCIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
25 ns |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
75 mA |
16384 words |
3.3 |
3.3 |
9 |
CHIP CARRIER |
LDCC32,.5X.6 |
FIFOs |
1.27 mm |
70 Cel |
16KX9 |
16K |
0 Cel |
Matte Tin (Sn) - annealed |
QUAD |
R-PQCC-J32 |
3 |
3.6 V |
3.55 mm |
40 MHz |
11.43 mm |
Not Qualified |
147456 bit |
3 V |
RETRANSMIT |
e3 |
30 |
260 |
NO |
.005 Amp |
13.97 mm |
15 ns |
|||||
Renesas Electronics |
OTHER FIFO |
MILITARY |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
30 ns |
1 |
CMOS |
MIL-STD-883 Class B |
J BEND |
PARALLEL |
ASYNCHRONOUS |
150 mA |
4096 words |
5 |
5 |
9 |
CHIP CARRIER |
LDCC32,.5X.6 |
FIFOs |
1.27 mm |
125 Cel |
4KX9 |
4K |
-55 Cel |
Tin/Lead (Sn85Pb15) |
QUAD |
R-PQCC-J32 |
1 |
5.5 V |
3.556 mm |
33.3 MHz |
11.4554 mm |
Not Qualified |
36864 bit |
4.5 V |
RETRANSMIT |
e0 |
20 |
225 |
NO |
.025 Amp |
13.9954 mm |
20 ns |
|||||
|
Renesas Electronics |
INDUSTRIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
35 ns |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
2048 words |
5 |
9 |
CHIP CARRIER |
1.27 mm |
85 Cel |
2KX9 |
2K |
-40 Cel |
MATTE TIN |
QUAD |
R-PQCC-J32 |
5.5 V |
3.556 mm |
11.4554 mm |
Not Qualified |
18432 bit |
4.5 V |
RETRANSMIT |
e3 |
NO |
13.9954 mm |
25 ns |
|||||||||||||||
|
Renesas Electronics |
BI-DIRECTIONAL FIFO |
MILITARY |
32 |
QCCN |
RECTANGULAR |
UNSPECIFIED |
YES |
30 ns |
1 |
CMOS |
MIL-STD-883 Class B |
NO LEAD |
PARALLEL |
ASYNCHRONOUS |
150 mA |
4096 words |
5 |
9 |
CHIP CARRIER |
125 Cel |
3-STATE |
4KX9 |
4K |
-55 Cel |
QUAD |
R-XQCC-N32 |
5.5 V |
33.3 MHz |
36864 bit |
4.5 V |
NO |
.025 Amp |
20 ns |
|||||||||||||||||
|
Renesas Electronics |
INDUSTRIAL |
32 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
15 ns |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
64 words |
5 |
9 |
FLATPACK, LOW PROFILE |
.8 mm |
85 Cel |
64X9 |
64 |
-40 Cel |
MATTE TIN |
QUAD |
S-PQFP-G32 |
3 |
5.5 V |
1.6 mm |
7 mm |
Not Qualified |
576 bit |
4.5 V |
e3 |
YES |
7 mm |
10 ns |
|||||||||||||||
|
Renesas Electronics |
OTHER FIFO |
COMMERCIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
35 ns |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
80 mA |
256 words |
5 |
5 |
9 |
CHIP CARRIER |
LDCC32,.5X.6 |
FIFOs |
1.27 mm |
70 Cel |
256X9 |
256 |
0 Cel |
Matte Tin (Sn) - annealed |
QUAD |
R-PQCC-J32 |
3 |
5.5 V |
3.55 mm |
28.5 MHz |
11.43 mm |
Not Qualified |
2304 bit |
4.5 V |
RETRANSMIT |
e3 |
30 |
260 |
NO |
.005 Amp |
13.97 mm |
25 ns |
|||||
|
Renesas Electronics |
OTHER FIFO |
COMMERCIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
35 ns |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
8192 words |
3.3 |
9 |
CHIP CARRIER |
1.27 mm |
70 Cel |
8KX9 |
8K |
0 Cel |
Matte Tin (Sn) - annealed |
QUAD |
R-PQCC-J32 |
3 |
3.6 V |
3.55 mm |
11.43 mm |
Not Qualified |
73728 bit |
3 V |
e3 |
30 |
260 |
NO |
13.97 mm |
25 ns |
||||||||||||
|
Renesas Electronics |
COMMERCIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
35 ns |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
512 words |
5 |
9 |
CHIP CARRIER |
1.27 mm |
70 Cel |
3-STATE |
512X9 |
512 |
0 Cel |
MATTE TIN |
QUAD |
R-PQCC-J32 |
5.5 V |
3.55 mm |
11.43 mm |
Not Qualified |
4608 bit |
4.5 V |
RETRANSMIT |
e3 |
NO |
13.97 mm |
25 ns |
||||||||||||||
|
Renesas Electronics |
OTHER FIFO |
COMMERCIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
15 ns |
1 |
CMOS |
J BEND |
PARALLEL |
SYNCHRONOUS |
35 mA |
512 words |
5 |
5 |
9 |
CHIP CARRIER |
LDCC32,.5X.6 |
FIFOs |
1.27 mm |
70 Cel |
3-STATE |
512X9 |
512 |
0 Cel |
Matte Tin (Sn) - annealed |
QUAD |
R-PQCC-J32 |
3 |
5.5 V |
3.5 mm |
66.7 MHz |
11.43 mm |
Not Qualified |
4608 bit |
4.5 V |
e3 |
30 |
260 |
YES |
.005 Amp |
13.97 mm |
10 ns |
|||||
|
Renesas Electronics |
BI-DIRECTIONAL FIFO |
COMMERCIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
65 ns |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
120 mA |
4096 words |
5 |
9 |
CHIP CARRIER |
LDCC32,.5X.6 |
1.27 mm |
70 Cel |
3-STATE |
4KX9 |
4K |
0 Cel |
Matte Tin (Sn) - annealed |
QUAD |
R-PQCC-J32 |
3 |
5.5 V |
3.556 mm |
15 MHz |
11.4554 mm |
Not Qualified |
36864 bit |
4.5 V |
e3 |
30 |
260 |
NO |
.012 Amp |
13.9954 mm |
50 ns |
|||||||
|
Renesas Electronics |
COMMERCIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
15 ns |
1 |
CMOS |
J BEND |
PARALLEL |
SYNCHRONOUS |
512 words |
3.3 |
9 |
CHIP CARRIER |
1.27 mm |
70 Cel |
512X9 |
512 |
0 Cel |
MATTE TIN |
QUAD |
R-PQCC-J32 |
3.6 V |
3.55 mm |
11.4554 mm |
Not Qualified |
4608 bit |
3 V |
e3 |
YES |
13.9954 mm |
10 ns |
||||||||||||||||
|
Renesas Electronics |
MILITARY |
32 |
QCCN |
RECTANGULAR |
UNSPECIFIED |
YES |
40 ns |
1 |
CMOS |
MIL-STD-883 Class B |
NO LEAD |
PARALLEL |
ASYNCHRONOUS |
4096 words |
5 |
9 |
CHIP CARRIER |
1.27 mm |
125 Cel |
3-STATE |
4KX9 |
4K |
-55 Cel |
MATTE TIN |
QUAD |
R-XQCC-N32 |
5.5 V |
3.048 mm |
11.4554 mm |
Not Qualified |
36864 bit |
4.5 V |
RETRANSMIT |
e3 |
NO |
13.97 mm |
30 ns |
|||||||||||||
|
Renesas Electronics |
OTHER FIFO |
INDUSTRIAL |
32 |
QCCN |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
35 ns |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
60 mA |
512 words |
3.3 |
9 |
CHIP CARRIER |
LCC32,.45X.55 |
1.27 mm |
85 Cel |
3-STATE |
512X9 |
512 |
-40 Cel |
Matte Tin (Sn) - annealed |
QUAD |
R-PQCC-N32 |
3 |
3.6 V |
2.79 mm |
11.43 mm |
4608 bit |
3 V |
e3 |
30 |
260 |
NO |
.005 Amp |
13.97 mm |
25 ns |
|||||||||
Renesas Electronics |
OTHER FIFO |
INDUSTRIAL |
32 |
QCCN |
RECTANGULAR |
UNSPECIFIED |
YES |
35 ns |
1 |
CMOS |
NO LEAD |
PARALLEL |
ASYNCHRONOUS |
80 mA |
512 words |
5 |
5 |
9 |
CHIP CARRIER |
LCC32,.45X.55 |
FIFOs |
1.27 mm |
85 Cel |
512X9 |
512 |
-40 Cel |
TIN LEAD |
QUAD |
R-XQCC-N32 |
5.5 V |
28.5 MHz |
Not Qualified |
4608 bit |
4.5 V |
e0 |
NO |
.005 Amp |
25 ns |
|||||||||||||
|
Renesas Electronics |
INDUSTRIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
35 ns |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
512 words |
3.3 |
9 |
CHIP CARRIER |
1.27 mm |
85 Cel |
3-STATE |
512X9 |
512 |
-40 Cel |
MATTE TIN |
QUAD |
R-PQCC-J32 |
3.6 V |
3.55 mm |
11.43 mm |
Not Qualified |
4608 bit |
3 V |
e3 |
NO |
13.97 mm |
25 ns |
|||||||||||||||
|
Renesas Electronics |
COMMERCIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
35 ns |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
32768 words |
5 |
9 |
CHIP CARRIER |
1.27 mm |
70 Cel |
3-STATE |
32KX9 |
32K |
0 Cel |
MATTE TIN |
QUAD |
R-PQCC-J32 |
5.5 V |
3.556 mm |
11.4554 mm |
Not Qualified |
294912 bit |
4.5 V |
RETRANSMIT |
e3 |
NO |
13.9954 mm |
25 ns |
||||||||||||||
|
Renesas Electronics |
OTHER FIFO |
COMMERCIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
20 ns |
1 |
CMOS |
J BEND |
PARALLEL |
SYNCHRONOUS |
2048 words |
3.3 |
9 |
CHIP CARRIER |
1.27 mm |
70 Cel |
2KX9 |
2K |
0 Cel |
Matte Tin (Sn) - annealed |
QUAD |
R-PQCC-J32 |
3 |
3.6 V |
3.556 mm |
11.4554 mm |
18432 bit |
3 V |
e3 |
30 |
260 |
YES |
13.9954 mm |
12 ns |
|||||||||||||
|
Renesas Electronics |
COMMERCIAL |
32 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
10 ns |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
2048 words |
5 |
9 |
FLATPACK, LOW PROFILE |
.8 mm |
70 Cel |
3-STATE |
2KX9 |
2K |
0 Cel |
MATTE TIN |
QUAD |
S-PQFP-G32 |
3 |
5.5 V |
1.6 mm |
7 mm |
Not Qualified |
18432 bit |
4.5 V |
e3 |
YES |
7 mm |
6.5 ns |
||||||||||||||
|
Renesas Electronics |
OTHER FIFO |
INDUSTRIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
35 ns |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
60 mA |
4096 words |
3.3 |
3.3 |
9 |
CHIP CARRIER |
LDCC32,.5X.6 |
FIFOs |
1.27 mm |
85 Cel |
3-STATE |
4KX9 |
4K |
-40 Cel |
Matte Tin (Sn) - annealed |
QUAD |
R-PQCC-J32 |
3 |
3.6 V |
3.55 mm |
28.5 MHz |
11.43 mm |
Not Qualified |
36864 bit |
3 V |
RETRANSMIT |
e3 |
30 |
260 |
NO |
.005 Amp |
13.97 mm |
25 ns |
||||
|
Renesas Electronics |
INDUSTRIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
15 ns |
1 |
CMOS |
J BEND |
PARALLEL |
SYNCHRONOUS |
256 words |
3.3 |
9 |
CHIP CARRIER |
1.27 mm |
85 Cel |
256X9 |
256 |
-40 Cel |
MATTE TIN |
QUAD |
R-PQCC-J32 |
3.6 V |
3.55 mm |
11.4554 mm |
Not Qualified |
2304 bit |
3 V |
e3 |
YES |
13.9954 mm |
10 ns |
||||||||||||||||
|
Renesas Electronics |
OTHER FIFO |
COMMERCIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
10 ns |
1 |
CMOS |
J BEND |
PARALLEL |
SYNCHRONOUS |
20 mA |
2048 words |
3.3 |
3.3 |
9 |
CHIP CARRIER |
LDCC32,.5X.6 |
FIFOs |
1.27 mm |
70 Cel |
2KX9 |
2K |
0 Cel |
Matte Tin (Sn) - annealed |
QUAD |
R-PQCC-J32 |
3 |
3.6 V |
3.556 mm |
100 MHz |
11.4554 mm |
Not Qualified |
18432 bit |
3 V |
e3 |
30 |
260 |
YES |
.005 Amp |
13.9954 mm |
6.5 ns |
||||||
|
Renesas Electronics |
OTHER FIFO |
INDUSTRIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
15 ns |
1 |
CMOS |
J BEND |
PARALLEL |
SYNCHRONOUS |
35 mA |
4096 words |
5 |
5 |
9 |
CHIP CARRIER |
LDCC32,.5X.6 |
FIFOs |
1.27 mm |
85 Cel |
4KX9 |
4K |
-40 Cel |
Matte Tin (Sn) - annealed |
QUAD |
R-PQCC-J32 |
3 |
5.5 V |
3.5 mm |
66.7 MHz |
11.43 mm |
Not Qualified |
36864 bit |
4.5 V |
e3 |
30 |
260 |
YES |
.005 Amp |
13.97 mm |
10 ns |
||||||
|
Renesas Electronics |
COMMERCIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
25 ns |
1 |
CMOS |
J BEND |
PARALLEL |
SYNCHRONOUS |
8192 words |
5 |
9 |
CHIP CARRIER |
1.27 mm |
70 Cel |
8KX9 |
8K |
0 Cel |
MATTE TIN |
QUAD |
R-PQCC-J32 |
5.5 V |
3.55 mm |
11.43 mm |
Not Qualified |
73728 bit |
4.5 V |
e3 |
YES |
13.97 mm |
15 ns |
||||||||||||||||
Renesas Electronics |
OTHER FIFO |
COMMERCIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
J BEND |
SYNCHRONOUS |
50 mA |
64 words |
5 |
5 |
9 |
CHIP CARRIER |
LDCC32,.5X.6 |
FIFOs |
1.27 mm |
70 Cel |
64X9 |
64 |
0 Cel |
Tin/Lead (Sn85Pb15) |
QUAD |
R-PQCC-J32 |
1 |
28.6 MHz |
Not Qualified |
e0 |
20 |
225 |
.005 Amp |
20 ns |
|||||||||||||||||
|
Renesas Electronics |
COMMERCIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
25 ns |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
1024 words |
5 |
9 |
CHIP CARRIER |
1.27 mm |
70 Cel |
3-STATE |
1KX9 |
1K |
0 Cel |
MATTE TIN |
QUAD |
R-PQCC-J32 |
5.5 V |
3.55 mm |
11.43 mm |
Not Qualified |
9216 bit |
4.5 V |
RETRANSMIT |
e3 |
NO |
13.97 mm |
15 ns |
||||||||||||||
|
Renesas Electronics |
OTHER FIFO |
INDUSTRIAL |
32 |
QCCN |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
YES |
25 ns |
1 |
CMOS |
NO LEAD |
PARALLEL |
ASYNCHRONOUS |
80 mA |
1024 words |
5 |
5 |
9 |
CHIP CARRIER |
LCC32,.45X.55 |
FIFOs |
1.27 mm |
85 Cel |
1KX9 |
1K |
-40 Cel |
MATTE TIN |
QUAD |
R-CQCC-N32 |
5.5 V |
3.048 mm |
40 MHz |
11.43 mm |
Not Qualified |
9216 bit |
4.5 V |
RETRANSMIT |
e3 |
NO |
.005 Amp |
13.97 mm |
15 ns |
||||||||
Renesas Electronics |
OTHER FIFO |
INDUSTRIAL |
32 |
QCCN |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
NO LEAD |
ASYNCHRONOUS |
80 mA |
512 words |
5 |
5 |
9 |
CHIP CARRIER |
LCC32,.45X.55 |
FIFOs |
1.27 mm |
85 Cel |
512X9 |
512 |
-40 Cel |
TIN LEAD |
QUAD |
R-PQCC-N32 |
40 MHz |
Not Qualified |
e0 |
.005 Amp |
15 ns |
||||||||||||||||||||
|
Renesas Electronics |
COMMERCIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
20 ns |
1 |
CMOS |
J BEND |
PARALLEL |
SYNCHRONOUS |
4096 words |
3.3 |
9 |
CHIP CARRIER |
1.27 mm |
70 Cel |
4KX9 |
4K |
0 Cel |
MATTE TIN |
QUAD |
R-PQCC-J32 |
3.6 V |
3.55 mm |
11.4554 mm |
Not Qualified |
36864 bit |
3 V |
e3 |
YES |
13.9954 mm |
12 ns |
||||||||||||||||
|
Renesas Electronics |
OTHER FIFO |
COMMERCIAL |
32 |
QCCN |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
35 ns |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
60 mA |
512 words |
3.3 |
9 |
CHIP CARRIER |
LCC32,.45X.55 |
1.27 mm |
70 Cel |
3-STATE |
512X9 |
512 |
0 Cel |
Matte Tin (Sn) - annealed |
QUAD |
R-PQCC-N32 |
3 |
3.6 V |
2.79 mm |
11.43 mm |
4608 bit |
3 V |
e3 |
30 |
260 |
NO |
.005 Amp |
13.97 mm |
25 ns |
|||||||||
|
Renesas Electronics |
BI-DIRECTIONAL FIFO |
COMMERCIAL |
32 |
QCCN |
RECTANGULAR |
UNSPECIFIED |
YES |
45 ns |
1 |
CMOS |
NO LEAD |
PARALLEL |
ASYNCHRONOUS |
80 mA |
512 words |
5 |
5 |
9 |
CHIP CARRIER |
LCC32,.45X.55 |
FIFOs |
1.27 mm |
70 Cel |
512X9 |
512 |
0 Cel |
MATTE TIN |
QUAD |
R-XQCC-N32 |
5.5 V |
22.2 MHz |
Not Qualified |
4608 bit |
4.5 V |
e3 |
NO |
.005 Amp |
35 ns |
||||||||||||
|
Renesas Electronics |
OTHER FIFO |
COMMERCIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
15 ns |
1 |
CMOS |
J BEND |
PARALLEL |
SYNCHRONOUS |
256 words |
3.3 |
9 |
CHIP CARRIER |
1.27 mm |
70 Cel |
256X9 |
256 |
0 Cel |
Matte Tin (Sn) - annealed |
QUAD |
R-PQCC-J32 |
3 |
3.6 V |
3.556 mm |
11.4554 mm |
2304 bit |
3 V |
e3 |
30 |
260 |
YES |
13.9954 mm |
10 ns |
|||||||||||||
Renesas Electronics |
COMMERCIAL |
32 |
QCCN |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
YES |
30 ns |
1 |
CMOS |
NO LEAD |
PARALLEL |
ASYNCHRONOUS |
32768 words |
5 |
9 |
CHIP CARRIER |
1.27 mm |
70 Cel |
32KX9 |
32K |
0 Cel |
TIN LEAD |
QUAD |
R-CQCC-N32 |
5.5 V |
3.048 mm |
11.43 mm |
Not Qualified |
294912 bit |
4.5 V |
e0 |
NO |
13.97 mm |
20 ns |
|||||||||||||||||
Renesas Electronics |
OTHER FIFO |
MILITARY |
32 |
QCCN |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
YES |
65 ns |
1 |
CMOS |
MIL-STD-883 |
NO LEAD |
PARALLEL |
ASYNCHRONOUS |
135 mA |
8192 words |
5 |
5 |
9 |
CHIP CARRIER |
LCC32,.45X.55 |
FIFOs |
1.27 mm |
125 Cel |
3-STATE |
8KX9 |
8K |
-55 Cel |
TIN LEAD |
QUAD |
R-CQCC-N32 |
5.5 V |
3.048 mm |
15 MHz |
11.43 mm |
Not Qualified |
73728 bit |
4.5 V |
RETRANSMIT |
e0 |
NO |
.012 Amp |
13.97 mm |
50 ns |
|||||||
|
Renesas Electronics |
OTHER FIFO |
COMMERCIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
35 ns |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
75 mA |
8192 words |
3.3 |
3.3 |
9 |
CHIP CARRIER |
LDCC32,.5X.6 |
FIFOs |
1.27 mm |
70 Cel |
8KX9 |
8K |
0 Cel |
Matte Tin (Sn) - annealed |
QUAD |
R-PQCC-J32 |
3 |
3.6 V |
3.55 mm |
28.5 MHz |
11.43 mm |
Not Qualified |
73728 bit |
3 V |
RETRANSMIT |
e3 |
30 |
260 |
NO |
.005 Amp |
13.97 mm |
25 ns |
|||||
|
Renesas Electronics |
OTHER FIFO |
COMMERCIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
25 ns |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
60 mA |
2048 words |
3.3 |
3.3 |
9 |
CHIP CARRIER |
LDCC32,.5X.6 |
FIFOs |
1.27 mm |
70 Cel |
3-STATE |
2KX9 |
2K |
0 Cel |
Matte Tin (Sn) - annealed |
QUAD |
R-PQCC-J32 |
3 |
3.6 V |
3.55 mm |
40 MHz |
11.43 mm |
Not Qualified |
18432 bit |
3 V |
RETRANSMIT |
e3 |
30 |
260 |
NO |
.005 Amp |
13.97 mm |
15 ns |
||||
|
Renesas Electronics |
MILITARY |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
65 ns |
1 |
CMOS |
MIL-STD-883 Class B |
J BEND |
PARALLEL |
ASYNCHRONOUS |
512 words |
5 |
9 |
CHIP CARRIER |
1.27 mm |
125 Cel |
512X9 |
512 |
-55 Cel |
MATTE TIN |
QUAD |
R-PQCC-J32 |
5.5 V |
3.55 mm |
11.43 mm |
Not Qualified |
4608 bit |
4.5 V |
RETRANSMIT |
e3 |
NO |
13.97 mm |
50 ns |
||||||||||||||
|
Renesas Electronics |
MILITARY |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
40 ns |
1 |
CMOS |
MIL-STD-883 Class B |
J BEND |
PARALLEL |
ASYNCHRONOUS |
512 words |
5 |
9 |
CHIP CARRIER |
1.27 mm |
125 Cel |
512X9 |
512 |
-55 Cel |
MATTE TIN |
QUAD |
R-PQCC-J32 |
5.5 V |
3.55 mm |
11.43 mm |
Not Qualified |
4608 bit |
4.5 V |
RETRANSMIT |
e3 |
NO |
13.97 mm |
30 ns |
||||||||||||||
Renesas Electronics |
OTHER FIFO |
INDUSTRIAL |
32 |
QCCN |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
YES |
35 ns |
1 |
CMOS |
NO LEAD |
PARALLEL |
ASYNCHRONOUS |
80 mA |
512 words |
5 |
5 |
9 |
CHIP CARRIER |
LCC32,.45X.55 |
FIFOs |
1.27 mm |
85 Cel |
512X9 |
512 |
-40 Cel |
TIN LEAD |
QUAD |
R-CQCC-N32 |
5.5 V |
3.048 mm |
28.5 MHz |
11.43 mm |
Not Qualified |
4608 bit |
4.5 V |
e0 |
NO |
.005 Amp |
13.97 mm |
25 ns |
||||||||||
Renesas Electronics |
MILITARY |
32 |
QCCN |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
YES |
50 ns |
1 |
CMOS |
NO LEAD |
PARALLEL |
ASYNCHRONOUS |
2048 words |
5 |
9 |
CHIP CARRIER |
1.27 mm |
125 Cel |
2KX9 |
2K |
-55 Cel |
TIN LEAD |
QUAD |
R-CQCC-N32 |
5.5 V |
3.048 mm |
11.43 mm |
Qualified |
18432 bit |
4.5 V |
RETRANSMIT |
e0 |
NO |
13.97 mm |
40 ns |
||||||||||||||||
|
Renesas Electronics |
INDUSTRIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
25 ns |
1 |
CMOS |
J BEND |
PARALLEL |
SYNCHRONOUS |
4096 words |
5 |
9 |
CHIP CARRIER |
1.27 mm |
85 Cel |
4KX9 |
4K |
-40 Cel |
MATTE TIN |
QUAD |
R-PQCC-J32 |
5.5 V |
3.55 mm |
11.43 mm |
Not Qualified |
36864 bit |
4.5 V |
e3 |
YES |
13.97 mm |
15 ns |
||||||||||||||||
|
Renesas Electronics |
OTHER FIFO |
INDUSTRIAL |
32 |
QCCN |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
35 ns |
CMOS |
NO LEAD |
PARALLEL |
ASYNCHRONOUS |
80 mA |
1024 words |
5 |
5 |
9 |
CHIP CARRIER |
LCC32,.45X.55 |
FIFOs |
1.27 mm |
85 Cel |
1KX9 |
1K |
-40 Cel |
MATTE TIN |
QUAD |
R-PQCC-N32 |
28.5 MHz |
Not Qualified |
9216 bit |
e3 |
NO |
.005 Amp |
25 ns |
|||||||||||||||
|
Renesas Electronics |
COMMERCIAL |
32 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
10 ns |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
8192 words |
3.3 |
9 |
FLATPACK, LOW PROFILE |
.8 mm |
70 Cel |
8KX9 |
8K |
0 Cel |
Matte Tin (Sn) - annealed |
QUAD |
S-PQFP-G32 |
3 |
3.6 V |
1.6 mm |
7 mm |
Not Qualified |
73728 bit |
3 V |
e3 |
30 |
260 |
YES |
7 mm |
6.5 ns |
|||||||||||||
Renesas Electronics |
BI-DIRECTIONAL FIFO |
MILITARY |
32 |
QCCN |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
YES |
40 ns |
1 |
CMOS |
MIL-STD-883 Class B |
NO LEAD |
PARALLEL |
ASYNCHRONOUS |
140 mA |
512 words |
5 |
5 |
9 |
CHIP CARRIER |
LCC32,.45X.55 |
FIFOs |
1.27 mm |
125 Cel |
512X9 |
512 |
-55 Cel |
TIN LEAD |
QUAD |
R-CQCC-N32 |
1 |
5.5 V |
3.048 mm |
25 MHz |
11.43 mm |
Not Qualified |
4608 bit |
4.5 V |
RETRANSMIT |
e0 |
240 |
NO |
.0009 Amp |
13.97 mm |
30 ns |
||||||
|
Renesas Electronics |
OTHER FIFO |
COMMERCIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
65 ns |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
80 mA |
256 words |
5 |
5 |
9 |
CHIP CARRIER |
LDCC32,.5X.6 |
FIFOs |
1.27 mm |
70 Cel |
256X9 |
256 |
0 Cel |
Matte Tin (Sn) - annealed |
QUAD |
R-PQCC-J32 |
3 |
5.5 V |
3.55 mm |
15 MHz |
11.43 mm |
Not Qualified |
2304 bit |
4.5 V |
RETRANSMIT |
e3 |
30 |
260 |
NO |
.005 Amp |
13.97 mm |
50 ns |
|||||
Renesas Electronics |
BI-DIRECTIONAL FIFO |
MILITARY |
32 |
QCCN |
RECTANGULAR |
UNSPECIFIED |
YES |
40 ns |
1 |
CMOS |
MIL-STD-883 Class B |
NO LEAD |
PARALLEL |
ASYNCHRONOUS |
150 mA |
4096 words |
5 |
5 |
9 |
CHIP CARRIER |
LCC32,.45X.55 |
FIFOs |
1.27 mm |
125 Cel |
4KX9 |
4K |
-55 Cel |
TIN LEAD |
QUAD |
R-XQCC-N32 |
1 |
5.5 V |
3.048 mm |
25 MHz |
11.4554 mm |
Not Qualified |
36864 bit |
4.5 V |
RETRANSMIT |
e0 |
240 |
NO |
.004 Amp |
13.97 mm |
30 ns |
||||||
|
Renesas Electronics |
OTHER FIFO |
COMMERCIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
15 ns |
1 |
CMOS |
J BEND |
PARALLEL |
SYNCHRONOUS |
20 mA |
4096 words |
3.3 |
3.3 |
9 |
CHIP CARRIER |
LDCC32,.5X.6 |
FIFOs |
1.27 mm |
70 Cel |
4KX9 |
4K |
0 Cel |
Matte Tin (Sn) - annealed |
QUAD |
R-PQCC-J32 |
3 |
3.6 V |
3.556 mm |
66.7 MHz |
11.4554 mm |
Not Qualified |
36864 bit |
3 V |
e3 |
30 |
260 |
YES |
.005 Amp |
13.9954 mm |
10 ns |
||||||
|
Renesas Electronics |
COMMERCIAL |
32 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
15 ns |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
8192 words |
3.3 |
9 |
FLATPACK, LOW PROFILE |
.8 mm |
70 Cel |
8KX9 |
8K |
0 Cel |
MATTE TIN |
QUAD |
S-PQFP-G32 |
3 |
3.6 V |
1.6 mm |
7 mm |
Not Qualified |
73728 bit |
3 V |
e3 |
YES |
7 mm |
10 ns |
FIFO, or First-In, First-Out, is a type of digital circuit that is used in computer systems and digital devices to manage the flow of data. A FIFO circuit stores data in a buffer and retrieves the data in the same order in which it was received, with the first data received being the first data to be retrieved.
FIFO circuits are used in many applications where data needs to be stored and retrieved in a specific order, such as in data communication systems, disk drives, and multimedia devices. For example, in a data communication system, a FIFO circuit can be used to store incoming data packets in a buffer and retrieve them in the order in which they were received, ensuring that the data is processed correctly and in a timely manner.
FIFO circuits are typically implemented using a combination of flip-flops, multiplexers, and control logic. The control logic manages the input and output of data to the FIFO buffer and ensures that the data is stored and retrieved in the correct order.
One of the advantages of using a FIFO circuit is that it provides a simple and efficient way to manage the flow of data. FIFO circuits are easy to implement and can handle large amounts of data. They can also be used in conjunction with other types of digital circuits to implement more complex data processing algorithms.