Part | RoHS | Manufacturer | Memory IC Type | Temperature Grade | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Surface Mount | Cycle Time | No. of Functions | Technology | Screening Level | Terminal Form | Parallel or Serial | Operating Mode | Maximum Supply Current | No. of Words | Nominal Supply Voltage / Vsup (V) | Power Supplies (V) | Memory Width | Package Style (Meter) | Package Equivalence Code | Alternate Memory Width | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Output Characteristics | Organization | No. of Words Code | Minimum Operating Temperature | Terminal Finish | Terminal Position | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Maximum Clock Frequency (fCLK) | Width | Qualification | Memory Density | Minimum Supply Voltage (Vsup) | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Output Enable | Maximum Standby Current | Length | Maximum Access Time |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Renesas Electronics |
OTHER FIFO |
INDUSTRIAL |
324 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
5 ns |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
130 mA |
16384 words |
2.5 |
2.5 |
72 |
GRID ARRAY |
BGA324,18X18,40 |
FIFOs |
1 mm |
85 Cel |
16KX72 |
16K |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B324 |
3 |
2.625 V |
1.97 mm |
200 MHz |
19 mm |
Not Qualified |
1179648 bit |
2.375 V |
ASYNCHRONOUS OPERATION ALSO POSSIBLE |
e1 |
YES |
.02 Amp |
19 mm |
3.6 ns |
|||||||
|
Renesas Electronics |
OTHER FIFO |
COMMERCIAL |
324 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
5 ns |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
130 mA |
32768 words |
2.5 |
2.5 |
72 |
GRID ARRAY |
BGA324,18X18,40 |
FIFOs |
1 mm |
70 Cel |
32KX72 |
32K |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B324 |
3 |
2.625 V |
1.97 mm |
200 MHz |
19 mm |
Not Qualified |
2359296 bit |
2.375 V |
ASYNCHRONOUS OPERATION ALSO POSSIBLE |
e1 |
YES |
.02 Amp |
19 mm |
3.6 ns |
|||||||
|
Renesas Electronics |
OTHER FIFO |
COMMERCIAL |
324 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
4.44 ns |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
130 mA |
16384 words |
2.5 |
2.5 |
72 |
GRID ARRAY |
BGA324,18X18,40 |
FIFOs |
1 mm |
70 Cel |
16KX72 |
16K |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B324 |
3 |
2.625 V |
1.97 mm |
225 MHz |
19 mm |
Not Qualified |
1179648 bit |
2.375 V |
ASYNCHRONOUS OPERATION ALSO POSSIBLE |
e1 |
YES |
.02 Amp |
19 mm |
3.4 ns |
|||||||
|
Renesas Electronics |
OTHER FIFO |
COMMERCIAL |
324 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
4.44 ns |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
130 mA |
65536 words |
2.5 |
2.5 |
72 |
GRID ARRAY |
BGA324,18X18,40 |
FIFOs |
1 mm |
70 Cel |
64KX72 |
64K |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B324 |
3 |
2.625 V |
1.97 mm |
225 MHz |
19 mm |
Not Qualified |
4718592 bit |
2.375 V |
ASYNCHRONOUS OPERATION ALSO POSSIBLE |
e1 |
YES |
.02 Amp |
19 mm |
3.4 ns |
|||||||
|
Renesas Electronics |
OTHER FIFO |
COMMERCIAL |
324 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
5 ns |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
130 mA |
131072 words |
2.5 |
2.5 |
72 |
GRID ARRAY |
BGA324,18X18,40 |
FIFOs |
1 mm |
70 Cel |
128KX72 |
128K |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B324 |
3 |
2.625 V |
1.97 mm |
200 MHz |
19 mm |
Not Qualified |
9437184 bit |
2.375 V |
ASYNCHRONOUS OPERATION ALSO POSSIBLE |
e1 |
YES |
.02 Amp |
19 mm |
3.6 ns |
|||||||
Renesas Electronics |
OTHER FIFO |
COMMERCIAL |
324 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
6.7 ns |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
60 mA |
32768 words |
2.5 |
2.5 |
72 |
GRID ARRAY |
BGA324,18X18,40 |
FIFOs |
1 mm |
70 Cel |
32KX72 |
32K |
0 Cel |
TIN LEAD |
BOTTOM |
S-PBGA-B324 |
3 |
2.625 V |
1.97 mm |
150 MHz |
19 mm |
Not Qualified |
2359296 bit |
2.375 V |
ASYNCHRONOUS OPERATION ALSO POSSIBLE |
e0 |
30 |
225 |
YES |
.05 Amp |
19 mm |
3.8 ns |
||||||
|
Renesas Electronics |
OTHER FIFO |
COMMERCIAL |
324 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
6.7 ns |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
130 mA |
32768 words |
2.5 |
2.5 |
72 |
GRID ARRAY |
BGA324,18X18,40 |
FIFOs |
1 mm |
70 Cel |
32KX72 |
32K |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B324 |
3 |
2.625 V |
1.97 mm |
150 MHz |
19 mm |
Not Qualified |
2359296 bit |
2.375 V |
ASYNCHRONOUS OPERATION ALSO POSSIBLE |
e1 |
YES |
.02 Amp |
19 mm |
3.8 ns |
|||||||
|
Renesas Electronics |
OTHER FIFO |
COMMERCIAL |
324 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
10 ns |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
130 mA |
16384 words |
2.5 |
2.5 |
72 |
GRID ARRAY |
BGA324,18X18,40 |
FIFOs |
1 mm |
70 Cel |
16KX72 |
16K |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B324 |
3 |
2.625 V |
1.97 mm |
100 MHz |
19 mm |
Not Qualified |
1179648 bit |
2.375 V |
ASYNCHRONOUS OPERATION ALSO POSSIBLE |
e1 |
YES |
.02 Amp |
19 mm |
4.5 ns |
|||||||
Renesas Electronics |
OTHER FIFO |
COMMERCIAL |
324 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
4.44 ns |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
60 mA |
131072 words |
2.5 |
2.5 |
72 |
GRID ARRAY |
BGA324,18X18,40 |
FIFOs |
1 mm |
70 Cel |
128KX72 |
128K |
0 Cel |
TIN LEAD |
BOTTOM |
S-PBGA-B324 |
3 |
2.625 V |
1.97 mm |
225 MHz |
19 mm |
Not Qualified |
9437184 bit |
2.375 V |
ASYNCHRONOUS OPERATION ALSO POSSIBLE |
e0 |
30 |
225 |
YES |
.05 Amp |
19 mm |
3.4 ns |
||||||
Renesas Electronics |
INDUSTRIAL |
324 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
16384 words |
2.5 |
72 |
GRID ARRAY |
1 mm |
85 Cel |
16KX72 |
16K |
-40 Cel |
TIN LEAD |
BOTTOM |
S-PBGA-B324 |
3 |
1.97 mm |
19 mm |
Not Qualified |
1179648 bit |
e0 |
30 |
225 |
YES |
19 mm |
||||||||||||||||||
Renesas Electronics |
OTHER FIFO |
COMMERCIAL |
324 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
4.44 ns |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
60 mA |
65536 words |
2.5 |
2.5 |
72 |
GRID ARRAY |
BGA324,18X18,40 |
FIFOs |
1 mm |
70 Cel |
64KX72 |
64K |
0 Cel |
TIN LEAD |
BOTTOM |
S-PBGA-B324 |
3 |
2.625 V |
1.97 mm |
225 MHz |
19 mm |
Not Qualified |
4718592 bit |
2.375 V |
ASYNCHRONOUS OPERATION ALSO POSSIBLE |
e0 |
30 |
225 |
YES |
.05 Amp |
19 mm |
3.4 ns |
||||||
Renesas Electronics |
OTHER FIFO |
COMMERCIAL |
324 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
6.7 ns |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
60 mA |
16384 words |
2.5 |
2.5 |
72 |
GRID ARRAY |
BGA324,18X18,40 |
FIFOs |
1 mm |
70 Cel |
16KX72 |
16K |
0 Cel |
TIN LEAD |
BOTTOM |
S-PBGA-B324 |
3 |
2.625 V |
1.97 mm |
150 MHz |
19 mm |
Not Qualified |
1179648 bit |
2.375 V |
ASYNCHRONOUS OPERATION ALSO POSSIBLE |
e0 |
30 |
225 |
YES |
.05 Amp |
19 mm |
3.8 ns |
||||||
|
Renesas Electronics |
OTHER FIFO |
COMMERCIAL |
324 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
10 ns |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
130 mA |
131072 words |
2.5 |
2.5 |
72 |
GRID ARRAY |
BGA324,18X18,40 |
FIFOs |
1 mm |
70 Cel |
128KX72 |
128K |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B324 |
3 |
2.625 V |
1.97 mm |
100 MHz |
19 mm |
Not Qualified |
9437184 bit |
2.375 V |
ASYNCHRONOUS OPERATION ALSO POSSIBLE |
e1 |
YES |
.02 Amp |
19 mm |
4.5 ns |
|||||||
Renesas Electronics |
OTHER FIFO |
COMMERCIAL |
324 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
4.44 ns |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
60 mA |
32768 words |
2.5 |
2.5 |
72 |
GRID ARRAY |
BGA324,18X18,40 |
FIFOs |
1 mm |
70 Cel |
32KX72 |
32K |
0 Cel |
TIN LEAD |
BOTTOM |
S-PBGA-B324 |
3 |
2.625 V |
1.97 mm |
225 MHz |
19 mm |
Not Qualified |
2359296 bit |
2.375 V |
ASYNCHRONOUS OPERATION ALSO POSSIBLE |
e0 |
30 |
225 |
YES |
.05 Amp |
19 mm |
3.4 ns |
||||||
Renesas Electronics |
OTHER FIFO |
COMMERCIAL |
324 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
6.7 ns |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
60 mA |
65536 words |
2.5 |
2.5 |
72 |
GRID ARRAY |
BGA324,18X18,40 |
FIFOs |
1 mm |
70 Cel |
64KX72 |
64K |
0 Cel |
TIN LEAD |
BOTTOM |
S-PBGA-B324 |
3 |
2.625 V |
1.97 mm |
150 MHz |
19 mm |
Not Qualified |
4718592 bit |
2.375 V |
ASYNCHRONOUS OPERATION ALSO POSSIBLE |
e0 |
30 |
225 |
YES |
.05 Amp |
19 mm |
3.8 ns |
||||||
|
Renesas Electronics |
INDUSTRIAL |
324 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
16384 words |
2.5 |
72 |
GRID ARRAY |
1 mm |
85 Cel |
16KX72 |
16K |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B324 |
3 |
1.97 mm |
19 mm |
Not Qualified |
1179648 bit |
e1 |
YES |
19 mm |
|||||||||||||||||||
Renesas Electronics |
INDUSTRIAL |
324 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
65536 words |
2.5 |
72 |
GRID ARRAY |
1 mm |
85 Cel |
64KX72 |
64K |
-40 Cel |
TIN LEAD |
BOTTOM |
S-PBGA-B324 |
3 |
1.97 mm |
19 mm |
Not Qualified |
4718592 bit |
e0 |
30 |
225 |
YES |
19 mm |
||||||||||||||||||
Renesas Electronics |
OTHER FIFO |
COMMERCIAL |
324 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
10 ns |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
60 mA |
131072 words |
2.5 |
2.5 |
72 |
GRID ARRAY |
BGA324,18X18,40 |
FIFOs |
1 mm |
70 Cel |
128KX72 |
128K |
0 Cel |
TIN LEAD |
BOTTOM |
S-PBGA-B324 |
3 |
2.625 V |
1.97 mm |
100 MHz |
19 mm |
Not Qualified |
9437184 bit |
2.375 V |
ASYNCHRONOUS OPERATION ALSO POSSIBLE |
e0 |
30 |
225 |
YES |
.05 Amp |
19 mm |
4.5 ns |
||||||
|
Renesas Electronics |
OTHER FIFO |
COMMERCIAL |
324 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
10 ns |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
130 mA |
65536 words |
2.5 |
2.5 |
72 |
GRID ARRAY |
BGA324,18X18,40 |
FIFOs |
1 mm |
70 Cel |
64KX72 |
64K |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B324 |
3 |
2.625 V |
1.97 mm |
100 MHz |
19 mm |
Not Qualified |
4718592 bit |
2.375 V |
ASYNCHRONOUS OPERATION ALSO POSSIBLE |
e1 |
YES |
.02 Amp |
19 mm |
4.5 ns |
|||||||
Renesas Electronics |
OTHER FIFO |
INDUSTRIAL |
324 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
5 ns |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
60 mA |
65536 words |
2.5 |
2.5 |
72 |
GRID ARRAY |
BGA324,18X18,40 |
FIFOs |
1 mm |
85 Cel |
64KX72 |
64K |
-40 Cel |
TIN LEAD |
BOTTOM |
S-PBGA-B324 |
3 |
2.625 V |
1.97 mm |
200 MHz |
19 mm |
Not Qualified |
4718592 bit |
2.375 V |
ASYNCHRONOUS OPERATION ALSO POSSIBLE |
e0 |
30 |
225 |
YES |
.05 Amp |
19 mm |
3.6 ns |
||||||
|
Renesas Electronics |
INDUSTRIAL |
324 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
32768 words |
2.5 |
72 |
GRID ARRAY |
1 mm |
85 Cel |
32KX72 |
32K |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B324 |
3 |
1.97 mm |
19 mm |
Not Qualified |
2359296 bit |
e1 |
YES |
19 mm |
|||||||||||||||||||
|
Renesas Electronics |
INDUSTRIAL |
324 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
131072 words |
2.5 |
72 |
GRID ARRAY |
1 mm |
85 Cel |
128KX72 |
128K |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B324 |
3 |
1.97 mm |
19 mm |
Not Qualified |
9437184 bit |
e1 |
YES |
19 mm |
|||||||||||||||||||
|
Renesas Electronics |
OTHER FIFO |
COMMERCIAL |
324 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
5 ns |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
130 mA |
65536 words |
2.5 |
2.5 |
72 |
GRID ARRAY |
BGA324,18X18,40 |
FIFOs |
1 mm |
70 Cel |
64KX72 |
64K |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B324 |
3 |
2.625 V |
1.97 mm |
200 MHz |
19 mm |
Not Qualified |
4718592 bit |
2.375 V |
ASYNCHRONOUS OPERATION ALSO POSSIBLE |
e1 |
YES |
.02 Amp |
19 mm |
3.6 ns |
|||||||
|
Renesas Electronics |
INDUSTRIAL |
324 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
65536 words |
2.5 |
72 |
GRID ARRAY |
1 mm |
85 Cel |
64KX72 |
64K |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B324 |
3 |
1.97 mm |
19 mm |
Not Qualified |
4718592 bit |
e1 |
YES |
19 mm |
|||||||||||||||||||
|
Renesas Electronics |
OTHER FIFO |
COMMERCIAL |
324 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
6.7 ns |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
130 mA |
131072 words |
2.5 |
2.5 |
72 |
GRID ARRAY |
BGA324,18X18,40 |
FIFOs |
1 mm |
70 Cel |
128KX72 |
128K |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B324 |
3 |
2.625 V |
1.97 mm |
150 MHz |
19 mm |
Not Qualified |
9437184 bit |
2.375 V |
ASYNCHRONOUS OPERATION ALSO POSSIBLE |
e1 |
YES |
.02 Amp |
19 mm |
3.8 ns |
|||||||
|
Renesas Electronics |
OTHER FIFO |
COMMERCIAL |
324 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
4.44 ns |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
130 mA |
131072 words |
2.5 |
2.5 |
72 |
GRID ARRAY |
BGA324,18X18,40 |
FIFOs |
1 mm |
70 Cel |
128KX72 |
128K |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B324 |
3 |
2.625 V |
1.97 mm |
225 MHz |
19 mm |
Not Qualified |
9437184 bit |
2.375 V |
ASYNCHRONOUS OPERATION ALSO POSSIBLE |
e1 |
YES |
.02 Amp |
19 mm |
3.4 ns |
|||||||
|
Renesas Electronics |
OTHER FIFO |
COMMERCIAL |
324 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
10 ns |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
130 mA |
32768 words |
2.5 |
2.5 |
72 |
GRID ARRAY |
BGA324,18X18,40 |
FIFOs |
1 mm |
70 Cel |
32KX72 |
32K |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B324 |
3 |
2.625 V |
1.97 mm |
100 MHz |
19 mm |
Not Qualified |
2359296 bit |
2.375 V |
ASYNCHRONOUS OPERATION ALSO POSSIBLE |
e1 |
YES |
.02 Amp |
19 mm |
4.5 ns |
|||||||
Renesas Electronics |
INDUSTRIAL |
324 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
131072 words |
2.5 |
72 |
GRID ARRAY |
1 mm |
85 Cel |
128KX72 |
128K |
-40 Cel |
TIN LEAD |
BOTTOM |
S-PBGA-B324 |
3 |
1.97 mm |
19 mm |
Not Qualified |
9437184 bit |
e0 |
30 |
225 |
YES |
19 mm |
||||||||||||||||||
|
Renesas Electronics |
OTHER FIFO |
COMMERCIAL |
324 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
6.7 ns |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
130 mA |
65536 words |
2.5 |
2.5 |
72 |
GRID ARRAY |
BGA324,18X18,40 |
FIFOs |
1 mm |
70 Cel |
64KX72 |
64K |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B324 |
3 |
2.625 V |
1.97 mm |
150 MHz |
19 mm |
Not Qualified |
4718592 bit |
2.375 V |
ASYNCHRONOUS OPERATION ALSO POSSIBLE |
e1 |
YES |
.02 Amp |
19 mm |
3.8 ns |
|||||||
Renesas Electronics |
OTHER FIFO |
COMMERCIAL |
324 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
10 ns |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
60 mA |
16384 words |
2.5 |
2.5 |
72 |
GRID ARRAY |
BGA324,18X18,40 |
FIFOs |
1 mm |
70 Cel |
16KX72 |
16K |
0 Cel |
TIN LEAD |
BOTTOM |
S-PBGA-B324 |
3 |
2.625 V |
1.97 mm |
100 MHz |
19 mm |
Not Qualified |
1179648 bit |
2.375 V |
ASYNCHRONOUS OPERATION ALSO POSSIBLE |
e0 |
30 |
225 |
YES |
.05 Amp |
19 mm |
4.5 ns |
||||||
|
Renesas Electronics |
OTHER FIFO |
INDUSTRIAL |
324 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
5 ns |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
130 mA |
131072 words |
2.5 |
2.5 |
72 |
GRID ARRAY |
BGA324,18X18,40 |
FIFOs |
1 mm |
85 Cel |
128KX72 |
128K |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B324 |
3 |
2.625 V |
1.97 mm |
200 MHz |
19 mm |
Not Qualified |
9437184 bit |
2.375 V |
ASYNCHRONOUS OPERATION ALSO POSSIBLE |
e1 |
YES |
.02 Amp |
19 mm |
3.6 ns |
|||||||
Renesas Electronics |
OTHER FIFO |
INDUSTRIAL |
324 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
5 ns |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
60 mA |
32768 words |
2.5 |
2.5 |
72 |
GRID ARRAY |
BGA324,18X18,40 |
FIFOs |
1 mm |
85 Cel |
32KX72 |
32K |
-40 Cel |
TIN LEAD |
BOTTOM |
S-PBGA-B324 |
3 |
2.625 V |
1.97 mm |
200 MHz |
19 mm |
Not Qualified |
2359296 bit |
2.375 V |
ASYNCHRONOUS OPERATION ALSO POSSIBLE |
e0 |
30 |
225 |
YES |
.05 Amp |
19 mm |
3.6 ns |
||||||
Renesas Electronics |
INDUSTRIAL |
324 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
32768 words |
2.5 |
72 |
GRID ARRAY |
1 mm |
85 Cel |
32KX72 |
32K |
-40 Cel |
TIN LEAD |
BOTTOM |
S-PBGA-B324 |
3 |
1.97 mm |
19 mm |
Not Qualified |
2359296 bit |
e0 |
30 |
225 |
YES |
19 mm |
||||||||||||||||||
Renesas Electronics |
OTHER FIFO |
COMMERCIAL |
324 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
6.7 ns |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
60 mA |
131072 words |
2.5 |
2.5 |
72 |
GRID ARRAY |
BGA324,18X18,40 |
FIFOs |
1 mm |
70 Cel |
128KX72 |
128K |
0 Cel |
TIN LEAD |
BOTTOM |
S-PBGA-B324 |
3 |
2.625 V |
1.97 mm |
150 MHz |
19 mm |
Not Qualified |
9437184 bit |
2.375 V |
ASYNCHRONOUS OPERATION ALSO POSSIBLE |
e0 |
30 |
225 |
YES |
.05 Amp |
19 mm |
3.8 ns |
||||||
|
Renesas Electronics |
OTHER FIFO |
COMMERCIAL |
324 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
4.44 ns |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
130 mA |
32768 words |
2.5 |
2.5 |
72 |
GRID ARRAY |
BGA324,18X18,40 |
FIFOs |
1 mm |
70 Cel |
32KX72 |
32K |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B324 |
3 |
2.625 V |
1.97 mm |
225 MHz |
19 mm |
Not Qualified |
2359296 bit |
2.375 V |
ASYNCHRONOUS OPERATION ALSO POSSIBLE |
e1 |
YES |
.02 Amp |
19 mm |
3.4 ns |
|||||||
Renesas Electronics |
OTHER FIFO |
COMMERCIAL |
324 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
10 ns |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
60 mA |
65536 words |
2.5 |
2.5 |
72 |
GRID ARRAY |
BGA324,18X18,40 |
FIFOs |
1 mm |
70 Cel |
64KX72 |
64K |
0 Cel |
TIN LEAD |
BOTTOM |
S-PBGA-B324 |
3 |
2.625 V |
1.97 mm |
100 MHz |
19 mm |
Not Qualified |
4718592 bit |
2.375 V |
ASYNCHRONOUS OPERATION ALSO POSSIBLE |
e0 |
30 |
225 |
YES |
.05 Amp |
19 mm |
4.5 ns |
||||||
|
Renesas Electronics |
OTHER FIFO |
INDUSTRIAL |
324 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
5 ns |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
130 mA |
65536 words |
2.5 |
2.5 |
72 |
GRID ARRAY |
BGA324,18X18,40 |
FIFOs |
1 mm |
85 Cel |
64KX72 |
64K |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B324 |
3 |
2.625 V |
1.97 mm |
200 MHz |
19 mm |
Not Qualified |
4718592 bit |
2.375 V |
ASYNCHRONOUS OPERATION ALSO POSSIBLE |
e1 |
YES |
.02 Amp |
19 mm |
3.6 ns |
|||||||
Renesas Electronics |
OTHER FIFO |
COMMERCIAL |
324 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
4.44 ns |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
60 mA |
16384 words |
2.5 |
2.5 |
72 |
GRID ARRAY |
BGA324,18X18,40 |
FIFOs |
1 mm |
70 Cel |
16KX72 |
16K |
0 Cel |
TIN LEAD |
BOTTOM |
S-PBGA-B324 |
3 |
2.625 V |
1.97 mm |
225 MHz |
19 mm |
Not Qualified |
1179648 bit |
2.375 V |
ASYNCHRONOUS OPERATION ALSO POSSIBLE |
e0 |
30 |
225 |
YES |
.05 Amp |
19 mm |
3.4 ns |
||||||
|
Renesas Electronics |
OTHER FIFO |
COMMERCIAL |
324 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
5 ns |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
130 mA |
16384 words |
2.5 |
2.5 |
72 |
GRID ARRAY |
BGA324,18X18,40 |
FIFOs |
1 mm |
70 Cel |
16KX72 |
16K |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B324 |
3 |
2.625 V |
1.97 mm |
200 MHz |
19 mm |
Not Qualified |
1179648 bit |
2.375 V |
ASYNCHRONOUS OPERATION ALSO POSSIBLE |
e1 |
YES |
.02 Amp |
19 mm |
3.6 ns |
|||||||
Renesas Electronics |
OTHER FIFO |
COMMERCIAL |
324 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
5 ns |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
60 mA |
32768 words |
2.5 |
2.5 |
72 |
GRID ARRAY |
BGA324,18X18,40 |
FIFOs |
1 mm |
70 Cel |
32KX72 |
32K |
0 Cel |
TIN LEAD |
BOTTOM |
S-PBGA-B324 |
3 |
2.625 V |
1.97 mm |
200 MHz |
19 mm |
Not Qualified |
2359296 bit |
2.375 V |
ASYNCHRONOUS OPERATION ALSO POSSIBLE |
e0 |
30 |
225 |
YES |
.05 Amp |
19 mm |
3.6 ns |
||||||
|
Renesas Electronics |
OTHER FIFO |
COMMERCIAL |
324 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
6.7 ns |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
130 mA |
16384 words |
2.5 |
2.5 |
72 |
GRID ARRAY |
BGA324,18X18,40 |
FIFOs |
1 mm |
70 Cel |
16KX72 |
16K |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B324 |
3 |
2.625 V |
1.97 mm |
150 MHz |
19 mm |
Not Qualified |
1179648 bit |
2.375 V |
ASYNCHRONOUS OPERATION ALSO POSSIBLE |
e1 |
YES |
.02 Amp |
19 mm |
3.8 ns |
|||||||
Renesas Electronics |
OTHER FIFO |
COMMERCIAL |
324 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
5 ns |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
60 mA |
16384 words |
2.5 |
2.5 |
72 |
GRID ARRAY |
BGA324,18X18,40 |
FIFOs |
1 mm |
70 Cel |
16KX72 |
16K |
0 Cel |
TIN LEAD |
BOTTOM |
S-PBGA-B324 |
3 |
2.625 V |
1.97 mm |
200 MHz |
19 mm |
Not Qualified |
1179648 bit |
2.375 V |
ASYNCHRONOUS OPERATION ALSO POSSIBLE |
e0 |
30 |
225 |
YES |
.05 Amp |
19 mm |
3.6 ns |
||||||
Renesas Electronics |
OTHER FIFO |
INDUSTRIAL |
324 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
5 ns |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
60 mA |
131072 words |
2.5 |
2.5 |
72 |
GRID ARRAY |
BGA324,18X18,40 |
FIFOs |
1 mm |
85 Cel |
128KX72 |
128K |
-40 Cel |
TIN LEAD |
BOTTOM |
S-PBGA-B324 |
3 |
2.625 V |
1.97 mm |
200 MHz |
19 mm |
Not Qualified |
9437184 bit |
2.375 V |
ASYNCHRONOUS OPERATION ALSO POSSIBLE |
e0 |
30 |
225 |
YES |
.05 Amp |
19 mm |
3.6 ns |
||||||
Renesas Electronics |
OTHER FIFO |
COMMERCIAL |
324 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
5 ns |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
60 mA |
65536 words |
2.5 |
2.5 |
72 |
GRID ARRAY |
BGA324,18X18,40 |
FIFOs |
1 mm |
70 Cel |
64KX72 |
64K |
0 Cel |
TIN LEAD |
BOTTOM |
S-PBGA-B324 |
3 |
2.625 V |
1.97 mm |
200 MHz |
19 mm |
Not Qualified |
4718592 bit |
2.375 V |
ASYNCHRONOUS OPERATION ALSO POSSIBLE |
e0 |
30 |
225 |
YES |
.05 Amp |
19 mm |
3.6 ns |
||||||
|
Renesas Electronics |
OTHER FIFO |
INDUSTRIAL |
324 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
5 ns |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
130 mA |
32768 words |
2.5 |
2.5 |
72 |
GRID ARRAY |
BGA324,18X18,40 |
FIFOs |
1 mm |
85 Cel |
32KX72 |
32K |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B324 |
3 |
2.625 V |
1.97 mm |
200 MHz |
19 mm |
Not Qualified |
2359296 bit |
2.375 V |
ASYNCHRONOUS OPERATION ALSO POSSIBLE |
e1 |
YES |
.02 Amp |
19 mm |
3.6 ns |
|||||||
Renesas Electronics |
OTHER FIFO |
INDUSTRIAL |
324 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
5 ns |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
60 mA |
16384 words |
2.5 |
2.5 |
72 |
GRID ARRAY |
BGA324,18X18,40 |
FIFOs |
1 mm |
85 Cel |
16KX72 |
16K |
-40 Cel |
TIN LEAD |
BOTTOM |
S-PBGA-B324 |
3 |
2.625 V |
1.97 mm |
200 MHz |
19 mm |
Not Qualified |
1179648 bit |
2.375 V |
ASYNCHRONOUS OPERATION ALSO POSSIBLE |
e0 |
30 |
225 |
YES |
.05 Amp |
19 mm |
3.6 ns |
||||||
Renesas Electronics |
OTHER FIFO |
COMMERCIAL |
324 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
5 ns |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
60 mA |
131072 words |
2.5 |
2.5 |
72 |
GRID ARRAY |
BGA324,18X18,40 |
FIFOs |
1 mm |
70 Cel |
128KX72 |
128K |
0 Cel |
TIN LEAD |
BOTTOM |
S-PBGA-B324 |
3 |
2.625 V |
1.97 mm |
200 MHz |
19 mm |
Not Qualified |
9437184 bit |
2.375 V |
ASYNCHRONOUS OPERATION ALSO POSSIBLE |
e0 |
30 |
225 |
YES |
.05 Amp |
19 mm |
3.6 ns |
||||||
Renesas Electronics |
OTHER FIFO |
COMMERCIAL |
324 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
10 ns |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
60 mA |
32768 words |
2.5 |
2.5 |
72 |
GRID ARRAY |
BGA324,18X18,40 |
FIFOs |
1 mm |
70 Cel |
32KX72 |
32K |
0 Cel |
TIN LEAD |
BOTTOM |
S-PBGA-B324 |
3 |
2.625 V |
1.97 mm |
100 MHz |
19 mm |
Not Qualified |
2359296 bit |
2.375 V |
ASYNCHRONOUS OPERATION ALSO POSSIBLE |
e0 |
30 |
225 |
YES |
.05 Amp |
19 mm |
4.5 ns |
FIFO, or First-In, First-Out, is a type of digital circuit that is used in computer systems and digital devices to manage the flow of data. A FIFO circuit stores data in a buffer and retrieves the data in the same order in which it was received, with the first data received being the first data to be retrieved.
FIFO circuits are used in many applications where data needs to be stored and retrieved in a specific order, such as in data communication systems, disk drives, and multimedia devices. For example, in a data communication system, a FIFO circuit can be used to store incoming data packets in a buffer and retrieve them in the order in which they were received, ensuring that the data is processed correctly and in a timely manner.
FIFO circuits are typically implemented using a combination of flip-flops, multiplexers, and control logic. The control logic manages the input and output of data to the FIFO buffer and ensures that the data is stored and retrieved in the correct order.
One of the advantages of using a FIFO circuit is that it provides a simple and efficient way to manage the flow of data. FIFO circuits are easy to implement and can handle large amounts of data. They can also be used in conjunction with other types of digital circuits to implement more complex data processing algorithms.