Part | RoHS | Manufacturer | Memory IC Type | Temperature Grade | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Surface Mount | Cycle Time | No. of Functions | Technology | Screening Level | Terminal Form | Parallel or Serial | Operating Mode | Maximum Supply Current | No. of Words | Nominal Supply Voltage / Vsup (V) | Power Supplies (V) | Memory Width | Package Style (Meter) | Package Equivalence Code | Alternate Memory Width | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Output Characteristics | Organization | No. of Words Code | Minimum Operating Temperature | Terminal Finish | Terminal Position | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Maximum Clock Frequency (fCLK) | Width | Qualification | Memory Density | Minimum Supply Voltage (Vsup) | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Output Enable | Maximum Standby Current | Length | Maximum Access Time |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Texas Instruments |
OTHER FIFO |
COMMERCIAL |
64 |
TFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
15 ns |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
35 mA |
4096 words |
3.3 |
3.3 |
18 |
FLATPACK, THIN PROFILE, FINE PITCH |
TQFP64,.47SQ |
FIFOs |
.5 mm |
70 Cel |
3-STATE |
4KX18 |
4K |
0 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQFP-G64 |
3 |
3.6 V |
1.2 mm |
166 MHz |
10 mm |
Not Qualified |
73728 bit |
3 V |
e4 |
30 |
260 |
YES |
10 mm |
10 ns |
||||||
|
Texas Instruments |
OTHER FIFO |
COMMERCIAL |
64 |
TFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
7.5 ns |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
35 mA |
2048 words |
3.3 |
3.3 |
18 |
FLATPACK, THIN PROFILE, FINE PITCH |
TQFP64,.47SQ |
FIFOs |
.5 mm |
70 Cel |
3-STATE |
2KX18 |
2K |
0 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQFP-G64 |
3 |
3.6 V |
1.2 mm |
166 MHz |
10 mm |
Not Qualified |
36864 bit |
3 V |
e4 |
30 |
260 |
YES |
10 mm |
5 ns |
||||||
|
Texas Instruments |
OTHER FIFO |
COMMERCIAL |
64 |
TFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
10 ns |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
35 mA |
4096 words |
3.3 |
3.3 |
18 |
FLATPACK, THIN PROFILE, FINE PITCH |
TQFP64,.47SQ |
FIFOs |
.5 mm |
70 Cel |
3-STATE |
4KX18 |
4K |
0 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQFP-G64 |
3 |
3.6 V |
1.2 mm |
166 MHz |
10 mm |
Not Qualified |
73728 bit |
3 V |
e4 |
30 |
260 |
YES |
10 mm |
6.5 ns |
||||||
|
Texas Instruments |
OTHER FIFO |
COMMERCIAL |
64 |
TFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
7.5 ns |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
35 mA |
4096 words |
3.3 |
3.3 |
18 |
FLATPACK, THIN PROFILE, FINE PITCH |
TQFP64,.47SQ |
FIFOs |
.5 mm |
70 Cel |
3-STATE |
4KX18 |
4K |
0 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQFP-G64 |
3 |
3.6 V |
1.2 mm |
166 MHz |
10 mm |
Not Qualified |
73728 bit |
3 V |
e4 |
30 |
260 |
YES |
10 mm |
5 ns |
||||||
|
Texas Instruments |
OTHER FIFO |
COMMERCIAL |
64 |
TFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
7.5 ns |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
35 mA |
512 words |
3.3 |
3.3 |
18 |
FLATPACK, THIN PROFILE, FINE PITCH |
TQFP64,.47SQ |
FIFOs |
.5 mm |
70 Cel |
3-STATE |
512X18 |
512 |
0 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQFP-G64 |
3 |
3.6 V |
1.2 mm |
133 MHz |
10 mm |
Not Qualified |
9216 bit |
3 V |
e4 |
30 |
260 |
YES |
10 mm |
5 ns |
||||||
|
Renesas Electronics |
OTHER FIFO |
COMMERCIAL |
64 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
10 ns |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
60 mA |
262144 words |
3.3 |
3.3 |
18 |
FLATPACK, LOW PROFILE |
QFP64,.63SQ,32 |
FIFOs |
.8 mm |
70 Cel |
256KX18 |
256K |
0 Cel |
Matte Tin (Sn) |
QUAD |
S-PQFP-G64 |
3 |
3.6 V |
1.6 mm |
100 MHz |
14 mm |
Not Qualified |
4718592 bit |
3 V |
EASILY EXPANDABLE IN DEPTH AND WIDTH |
e3 |
NOT SPECIFIED |
260 |
YES |
.02 Amp |
14 mm |
6.5 ns |
|||||
|
Renesas Electronics |
COMMERCIAL |
64 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
10 ns |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
262144 words |
3.3 |
18 |
FLATPACK, LOW PROFILE |
.8 mm |
70 Cel |
256KX18 |
256K |
0 Cel |
MATTE TIN |
QUAD |
S-PQFP-G64 |
3 |
3.6 V |
1.6 mm |
14 mm |
Not Qualified |
4718592 bit |
3 V |
EASILY EXPANDABLE IN DEPTH AND WIDTH |
e3 |
40 |
260 |
YES |
14 mm |
6.5 ns |
||||||||||||
|
Renesas Electronics |
OTHER FIFO |
COMMERCIAL |
64 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
10 ns |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
60 mA |
262144 words |
3.3 |
3.3 |
18 |
FLATPACK, LOW PROFILE |
QFP64,.63SQ,32 |
FIFOs |
.8 mm |
70 Cel |
256KX18 |
256K |
0 Cel |
Matte Tin (Sn) |
QUAD |
S-PQFP-G64 |
3 |
3.6 V |
1.6 mm |
100 MHz |
14 mm |
Not Qualified |
4718592 bit |
3 V |
EASILY EXPANDABLE IN DEPTH AND WIDTH |
e3 |
NOT SPECIFIED |
260 |
YES |
.02 Amp |
14 mm |
6.5 ns |
|||||
|
Renesas Electronics |
COMMERCIAL |
64 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
10 ns |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
262144 words |
3.3 |
18 |
FLATPACK, LOW PROFILE |
.8 mm |
70 Cel |
256KX18 |
256K |
0 Cel |
MATTE TIN |
QUAD |
S-PQFP-G64 |
3 |
3.6 V |
1.6 mm |
14 mm |
Not Qualified |
4718592 bit |
3 V |
EASILY EXPANDABLE IN DEPTH AND WIDTH |
e3 |
40 |
260 |
YES |
14 mm |
6.5 ns |
||||||||||||
|
Texas Instruments |
OTHER FIFO |
COMMERCIAL |
64 |
TFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
10 ns |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
35 mA |
512 words |
3.3 |
3.3 |
18 |
FLATPACK, THIN PROFILE, FINE PITCH |
TQFP64,.47SQ |
FIFOs |
.5 mm |
70 Cel |
3-STATE |
512X18 |
512 |
0 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQFP-G64 |
3 |
3.6 V |
1.2 mm |
133 MHz |
10 mm |
Not Qualified |
9216 bit |
3 V |
e4 |
30 |
260 |
YES |
10 mm |
6.5 ns |
||||||
|
Texas Instruments |
OTHER FIFO |
COMMERCIAL |
64 |
TFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
10 ns |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
35 mA |
2048 words |
3.3 |
3.3 |
18 |
FLATPACK, THIN PROFILE, FINE PITCH |
TQFP64,.47SQ |
FIFOs |
.5 mm |
70 Cel |
3-STATE |
2KX18 |
2K |
0 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQFP-G64 |
3 |
3.6 V |
1.2 mm |
166 MHz |
10 mm |
Not Qualified |
36864 bit |
3 V |
e4 |
30 |
260 |
YES |
10 mm |
6.5 ns |
||||||
|
Renesas Electronics |
OTHER FIFO |
COMMERCIAL |
64 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
10 ns |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
55 mA |
524288 words |
3.3 |
3.3 |
9 |
FLATPACK, LOW PROFILE |
QFP64,.63SQ,32 |
FIFOs |
.8 mm |
70 Cel |
512KX9 |
512K |
0 Cel |
Matte Tin (Sn) |
QUAD |
S-PQFP-G64 |
3 |
3.45 V |
1.6 mm |
100 MHz |
14 mm |
Not Qualified |
4718592 bit |
3.15 V |
RETRANSMIT; AUTO POWER DOWN |
e3 |
NOT SPECIFIED |
260 |
YES |
.02 Amp |
14 mm |
6.5 ns |
|||||
Integrated Device Technology |
OTHER FIFO |
COMMERCIAL |
64 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
15 ns |
2 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
270 mA |
256 words |
5 |
5 |
9 |
FLATPACK, LOW PROFILE |
QFP64,.66SQ,32 |
FIFOs |
.8 mm |
70 Cel |
256X9 |
256 |
0 Cel |
TIN LEAD |
QUAD |
S-PQFP-G64 |
3 |
5.5 V |
1.6 mm |
66.7 MHz |
14 mm |
Not Qualified |
2304 bit |
4.5 V |
e0 |
30 |
240 |
YES |
.01 Amp |
14 mm |
10 ns |
|||||||
|
Texas Instruments |
OTHER FIFO |
MILITARY |
64 |
TFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
16 ns |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
35 mA |
4096 words |
3.3 |
3.3 |
18 |
FLATPACK, THIN PROFILE, FINE PITCH |
TQFP64,.47SQ |
FIFOs |
.5 mm |
125 Cel |
3-STATE |
4KX18 |
4K |
-55 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQFP-G64 |
3 |
3.6 V |
1.2 mm |
66.7 MHz |
10 mm |
73728 bit |
3 V |
e4 |
30 |
260 |
YES |
10 mm |
11 ns |
|||||||
|
Renesas Electronics |
OTHER FIFO |
INDUSTRIAL |
64 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
15 ns |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
55 mA |
524288 words |
3.3 |
3.3 |
9 |
FLATPACK, LOW PROFILE |
QFP64,.63SQ,32 |
FIFOs |
.8 mm |
85 Cel |
512KX9 |
512K |
-40 Cel |
Matte Tin (Sn) |
QUAD |
S-PQFP-G64 |
3 |
3.45 V |
1.6 mm |
66.7 MHz |
14 mm |
Not Qualified |
4718592 bit |
3.15 V |
e3 |
NOT SPECIFIED |
260 |
YES |
.02 Amp |
14 mm |
10 ns |
||||||
|
Renesas Electronics |
COMMERCIAL |
64 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
10 ns |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
524288 words |
3.3 |
9 |
FLATPACK, LOW PROFILE |
.8 mm |
70 Cel |
512KX9 |
512K |
0 Cel |
MATTE TIN |
QUAD |
S-PQFP-G64 |
3 |
3.45 V |
1.6 mm |
14 mm |
Not Qualified |
4718592 bit |
3.15 V |
RETRANSMIT; AUTO POWER DOWN |
e3 |
YES |
14 mm |
6.5 ns |
||||||||||||||
Integrated Device Technology |
OTHER FIFO |
COMMERCIAL |
64 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
25 ns |
2 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
270 mA |
256 words |
5 |
5 |
9 |
FLATPACK, LOW PROFILE |
QFP64,.66SQ,32 |
FIFOs |
.8 mm |
70 Cel |
256X9 |
256 |
0 Cel |
TIN LEAD |
QUAD |
S-PQFP-G64 |
3 |
5.5 V |
1.6 mm |
40 MHz |
14 mm |
Not Qualified |
2304 bit |
4.5 V |
e0 |
30 |
240 |
YES |
.01 Amp |
14 mm |
15 ns |
|||||||
Integrated Device Technology |
OTHER FIFO |
COMMERCIAL |
64 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
10 ns |
2 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
60 mA |
256 words |
5 |
5 |
9 |
FLATPACK, LOW PROFILE |
QFP64,.6SQ,32 |
FIFOs |
.8 mm |
70 Cel |
256X9 |
256 |
0 Cel |
TIN LEAD |
QUAD |
S-PQFP-G64 |
3 |
5.5 V |
1.6 mm |
100 MHz |
14 mm |
Not Qualified |
2304 bit |
4.5 V |
e0 |
30 |
240 |
YES |
.01 Amp |
14 mm |
6.5 ns |
|||||||
Integrated Device Technology |
OTHER FIFO |
INDUSTRIAL |
64 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
15 ns |
2 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
60 mA |
256 words |
5 |
5 |
9 |
FLATPACK, LOW PROFILE |
QFP64,.6SQ,32 |
FIFOs |
.8 mm |
85 Cel |
256X9 |
256 |
-40 Cel |
TIN LEAD |
QUAD |
S-PQFP-G64 |
3 |
5.5 V |
1.6 mm |
66.7 MHz |
14 mm |
Not Qualified |
2304 bit |
4.5 V |
e0 |
30 |
240 |
YES |
.01 Amp |
14 mm |
10 ns |
|||||||
Integrated Device Technology |
OTHER FIFO |
INDUSTRIAL |
64 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
15 ns |
2 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
60 mA |
256 words |
5 |
5 |
9 |
FLATPACK, LOW PROFILE |
QFP64,.6SQ,32 |
FIFOs |
.8 mm |
85 Cel |
256X9 |
256 |
-40 Cel |
TIN LEAD |
QUAD |
S-PQFP-G64 |
3 |
5.5 V |
1.6 mm |
66.7 MHz |
14 mm |
Not Qualified |
2304 bit |
4.5 V |
e0 |
30 |
240 |
YES |
.01 Amp |
14 mm |
10 ns |
|||||||
Integrated Device Technology |
OTHER FIFO |
COMMERCIAL |
64 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
35 ns |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
270 mA |
512 words |
5 |
5 |
9 |
FLATPACK, LOW PROFILE |
QFP64,.66SQ,32 |
FIFOs |
.8 mm |
70 Cel |
3-STATE |
512X9 |
512 |
0 Cel |
TIN LEAD |
QUAD |
S-PQFP-G64 |
3 |
5.5 V |
1.6 mm |
28.6 MHz |
14 mm |
Not Qualified |
4608 bit |
4.5 V |
e0 |
30 |
240 |
YES |
.01 Amp |
14 mm |
20 ns |
||||||
|
Renesas Electronics |
OTHER FIFO |
INDUSTRIAL |
64 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
15 ns |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
55 mA |
524288 words |
3.3 |
3.3 |
9 |
FLATPACK, LOW PROFILE |
QFP64,.63SQ,32 |
FIFOs |
.8 mm |
85 Cel |
512KX9 |
512K |
-40 Cel |
Matte Tin (Sn) |
QUAD |
S-PQFP-G64 |
3 |
3.45 V |
1.6 mm |
66.7 MHz |
14 mm |
Not Qualified |
4718592 bit |
3.15 V |
e3 |
NOT SPECIFIED |
260 |
YES |
.02 Amp |
14 mm |
10 ns |
||||||
|
Texas Instruments |
OTHER FIFO |
COMMERCIAL |
64 |
TFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
20 ns |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
35 mA |
512 words |
3.3 |
3.3 |
18 |
FLATPACK, THIN PROFILE, FINE PITCH |
TQFP64,.47SQ |
FIFOs |
.5 mm |
70 Cel |
3-STATE |
512X18 |
512 |
0 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQFP-G64 |
3 |
3.6 V |
1.2 mm |
133 MHz |
10 mm |
Not Qualified |
9216 bit |
3 V |
e4 |
30 |
260 |
YES |
10 mm |
12 ns |
||||||
Integrated Device Technology |
OTHER FIFO |
COMMERCIAL |
64 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
10 ns |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
55 mA |
524288 words |
3.3 |
3.3 |
9 |
FLATPACK, LOW PROFILE |
QFP64,.66SQ,32 |
FIFOs |
.8 mm |
70 Cel |
512KX9 |
512K |
0 Cel |
TIN LEAD |
QUAD |
S-PQFP-G64 |
3 |
3.45 V |
1.6 mm |
100 MHz |
14 mm |
Not Qualified |
4718592 bit |
3.15 V |
RETRANSMIT; AUTO POWER DOWN |
e0 |
30 |
240 |
YES |
.02 Amp |
14 mm |
6.5 ns |
||||||
|
Renesas Electronics |
OTHER FIFO |
COMMERCIAL |
64 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
10 ns |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
55 mA |
8192 words |
3.3 |
3.3 |
18 |
FLATPACK, LOW PROFILE |
QFP64,.66SQ,32 |
FIFOs |
.8 mm |
70 Cel |
8KX18 |
8K |
0 Cel |
Matte Tin (Sn) - annealed |
QUAD |
S-PQFP-G64 |
3 |
3.6 V |
1.6 mm |
100 MHz |
14 mm |
Not Qualified |
147456 bit |
3 V |
RETRANSMIT |
e3 |
30 |
260 |
YES |
.02 Amp |
14 mm |
6.5 ns |
|||||
|
Renesas Electronics |
OTHER FIFO |
COMMERCIAL |
64 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
10 ns |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
55 mA |
8192 words |
3.3 |
3.3 |
18 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP64,.47SQ,20 |
FIFOs |
.5 mm |
70 Cel |
8KX18 |
8K |
0 Cel |
Matte Tin (Sn) - annealed |
QUAD |
S-PQFP-G64 |
3 |
3.6 V |
1.6 mm |
100 MHz |
10 mm |
Not Qualified |
147456 bit |
3 V |
RETRANSMIT |
e3 |
30 |
260 |
YES |
.02 Amp |
10 mm |
6.5 ns |
|||||
|
Renesas Electronics |
OTHER FIFO |
INDUSTRIAL |
64 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
15 ns |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
8192 words |
3.3 |
18 |
FLATPACK, LOW PROFILE |
.8 mm |
85 Cel |
8KX18 |
8K |
-40 Cel |
Matte Tin (Sn) |
QUAD |
S-PQFP-G64 |
3 |
3.6 V |
1.6 mm |
14 mm |
Not Qualified |
147456 bit |
3 V |
e3 |
NOT SPECIFIED |
260 |
YES |
14 mm |
10 ns |
||||||||||||
Integrated Device Technology |
OTHER FIFO |
INDUSTRIAL |
64 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
15 ns |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
55 mA |
8192 words |
3.3 |
3.3 |
18 |
FLATPACK, LOW PROFILE |
QFP64,.6SQ,32 |
FIFOs |
.8 mm |
85 Cel |
8KX18 |
8K |
-40 Cel |
TIN LEAD |
QUAD |
S-PQFP-G64 |
3 |
3.6 V |
1.6 mm |
66.7 MHz |
14 mm |
Not Qualified |
147456 bit |
3 V |
e0 |
30 |
240 |
YES |
.02 Amp |
14 mm |
10 ns |
|||||||
|
Renesas Electronics |
OTHER FIFO |
COMMERCIAL |
64 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
10 ns |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
16384 words |
3.3 |
9 |
FLATPACK, LOW PROFILE |
.8 mm |
70 Cel |
16KX9 |
16K |
0 Cel |
QUAD |
S-PQFP-G64 |
3.6 V |
1.6 mm |
14 mm |
147456 bit |
3 V |
RETRANSMIT |
YES |
14 mm |
6.5 ns |
|||||||||||||||||
|
Renesas Electronics |
OTHER FIFO |
COMMERCIAL |
64 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
10 ns |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
55 mA |
16384 words |
3.3 |
3.3 |
9 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP64,.47SQ,20 |
FIFOs |
.5 mm |
70 Cel |
16KX9 |
16K |
0 Cel |
Matte Tin (Sn) |
QUAD |
S-PQFP-G64 |
3 |
3.6 V |
1.6 mm |
100 MHz |
10 mm |
Not Qualified |
147456 bit |
3 V |
RETRANSMIT |
e3 |
NOT SPECIFIED |
260 |
YES |
.02 Amp |
10 mm |
6.5 ns |
|||||
|
Renesas Electronics |
OTHER FIFO |
COMMERCIAL |
64 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
10 ns |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
55 mA |
16384 words |
3.3 |
3.3 |
18 |
FLATPACK, LOW PROFILE |
QFP64,.63SQ,32 |
FIFOs |
.8 mm |
70 Cel |
16KX18 |
16K |
0 Cel |
Matte Tin (Sn) |
QUAD |
S-PQFP-G64 |
3 |
3.6 V |
1.6 mm |
100 MHz |
14 mm |
Not Qualified |
294912 bit |
3 V |
RETRANSMIT |
e3 |
NOT SPECIFIED |
260 |
YES |
.02 Amp |
14 mm |
6.5 ns |
|||||
Integrated Device Technology |
OTHER FIFO |
INDUSTRIAL |
64 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
15 ns |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
55 mA |
16384 words |
3.3 |
3.3 |
18 |
FLATPACK, LOW PROFILE |
QFP64,.6SQ,32 |
FIFOs |
.8 mm |
85 Cel |
16KX18 |
16K |
-40 Cel |
TIN LEAD |
QUAD |
S-PQFP-G64 |
3 |
3.6 V |
1.6 mm |
66.7 MHz |
14 mm |
Not Qualified |
294912 bit |
3 V |
e0 |
30 |
240 |
YES |
.02 Amp |
14 mm |
10 ns |
|||||||
|
Renesas Electronics |
OTHER FIFO |
INDUSTRIAL |
64 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
15 ns |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
55 mA |
16384 words |
3.3 |
3.3 |
18 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP64,.47SQ,20 |
FIFOs |
.5 mm |
85 Cel |
16KX18 |
16K |
-40 Cel |
Matte Tin (Sn) - annealed |
QUAD |
S-PQFP-G64 |
3 |
3.6 V |
1.6 mm |
66.7 MHz |
10 mm |
Not Qualified |
294912 bit |
3 V |
e3 |
30 |
260 |
YES |
.02 Amp |
10 mm |
10 ns |
||||||
|
Renesas Electronics |
OTHER FIFO |
COMMERCIAL |
64 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
10 ns |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
55 mA |
32768 words |
3.3 |
3.3 |
9 |
FLATPACK, LOW PROFILE |
QFP64,.63SQ,32 |
FIFOs |
.8 mm |
70 Cel |
32KX9 |
32K |
0 Cel |
Matte Tin (Sn) |
QUAD |
S-PQFP-G64 |
3 |
3.6 V |
1.6 mm |
100 MHz |
14 mm |
Not Qualified |
294912 bit |
3 V |
RETRANSMIT; AUTO POWER DOWN |
e3 |
NOT SPECIFIED |
260 |
YES |
.02 Amp |
14 mm |
6.5 ns |
|||||
|
Renesas Electronics |
OTHER FIFO |
COMMERCIAL |
64 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
10 ns |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
60 mA |
256 words |
5 |
5 |
9 |
FLATPACK, LOW PROFILE |
QFP64,.66SQ,32 |
FIFOs |
.8 mm |
70 Cel |
256X9 |
256 |
0 Cel |
Matte Tin (Sn) - annealed |
QUAD |
S-PQFP-G64 |
3 |
5.5 V |
1.6 mm |
100 MHz |
14 mm |
Not Qualified |
2304 bit |
4.5 V |
e3 |
30 |
260 |
YES |
.01 Amp |
14 mm |
6.5 ns |
||||||
Integrated Device Technology |
OTHER FIFO |
INDUSTRIAL |
64 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
25 ns |
2 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
60 mA |
256 words |
5 |
5 |
9 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP64,.47SQ,20 |
FIFOs |
.5 mm |
85 Cel |
256X9 |
256 |
-40 Cel |
TIN LEAD |
QUAD |
S-PQFP-G64 |
3 |
5.5 V |
1.6 mm |
40 MHz |
10 mm |
Not Qualified |
2304 bit |
4.5 V |
e0 |
30 |
240 |
YES |
.01 Amp |
10 mm |
15 ns |
|||||||
|
Renesas Electronics |
OTHER FIFO |
COMMERCIAL |
64 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
10 ns |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
55 mA |
8192 words |
3.3 |
3.3 |
18 |
FLATPACK, LOW PROFILE |
QFP64,.66SQ,32 |
FIFOs |
.8 mm |
70 Cel |
8KX18 |
8K |
0 Cel |
Matte Tin (Sn) - annealed |
QUAD |
S-PQFP-G64 |
3 |
3.6 V |
1.6 mm |
100 MHz |
14 mm |
Not Qualified |
147456 bit |
3 V |
RETRANSMIT |
e3 |
30 |
260 |
YES |
.02 Amp |
14 mm |
6.5 ns |
|||||
|
Renesas Electronics |
OTHER FIFO |
COMMERCIAL |
64 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
10 ns |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
55 mA |
8192 words |
3.3 |
3.3 |
18 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP64,.47SQ,20 |
FIFOs |
.5 mm |
70 Cel |
8KX18 |
8K |
0 Cel |
Matte Tin (Sn) - annealed |
QUAD |
S-PQFP-G64 |
3 |
3.6 V |
1.6 mm |
100 MHz |
10 mm |
Not Qualified |
147456 bit |
3 V |
RETRANSMIT |
e3 |
30 |
260 |
YES |
.02 Amp |
10 mm |
6.5 ns |
|||||
Integrated Device Technology |
OTHER FIFO |
INDUSTRIAL |
64 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
15 ns |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
55 mA |
8192 words |
3.3 |
3.3 |
18 |
FLATPACK, LOW PROFILE |
QFP64,.6SQ,32 |
FIFOs |
.8 mm |
85 Cel |
8KX18 |
8K |
-40 Cel |
TIN LEAD |
QUAD |
S-PQFP-G64 |
3 |
3.6 V |
1.6 mm |
66.7 MHz |
14 mm |
Not Qualified |
147456 bit |
3 V |
e0 |
30 |
240 |
YES |
.02 Amp |
14 mm |
10 ns |
|||||||
|
Renesas Electronics |
COMMERCIAL |
64 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
10 ns |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
16384 words |
3.3 |
18 |
FLATPACK, LOW PROFILE |
.8 mm |
70 Cel |
16KX18 |
16K |
0 Cel |
MATTE TIN |
QUAD |
S-PQFP-G64 |
3 |
3.6 V |
1.6 mm |
14 mm |
Not Qualified |
294912 bit |
3 V |
RETRANSMIT |
e3 |
YES |
14 mm |
6.5 ns |
||||||||||||||
Integrated Device Technology |
OTHER FIFO |
INDUSTRIAL |
64 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
15 ns |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
55 mA |
16384 words |
3.3 |
3.3 |
18 |
FLATPACK, LOW PROFILE |
QFP64,.6SQ,32 |
FIFOs |
.8 mm |
85 Cel |
16KX18 |
16K |
-40 Cel |
TIN LEAD |
QUAD |
S-PQFP-G64 |
3 |
3.6 V |
1.6 mm |
66.7 MHz |
14 mm |
Not Qualified |
294912 bit |
3 V |
e0 |
30 |
240 |
YES |
.02 Amp |
14 mm |
10 ns |
|||||||
|
Renesas Electronics |
COMMERCIAL |
64 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
10 ns |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
32768 words |
3.3 |
9 |
FLATPACK, LOW PROFILE |
.8 mm |
70 Cel |
32KX9 |
32K |
0 Cel |
MATTE TIN |
QUAD |
S-PQFP-G64 |
3 |
3.6 V |
1.6 mm |
14 mm |
Not Qualified |
294912 bit |
3 V |
RETRANSMIT; AUTO POWER DOWN |
e3 |
40 |
260 |
YES |
14 mm |
6.5 ns |
||||||||||||
|
Renesas Electronics |
OTHER FIFO |
COMMERCIAL |
64 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
10 ns |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
55 mA |
524288 words |
3.3 |
3.3 |
9 |
FLATPACK, LOW PROFILE |
QFP64,.63SQ,32 |
FIFOs |
.8 mm |
70 Cel |
512KX9 |
512K |
0 Cel |
Matte Tin (Sn) |
QUAD |
S-PQFP-G64 |
3 |
3.45 V |
1.6 mm |
100 MHz |
14 mm |
Not Qualified |
4718592 bit |
3.15 V |
RETRANSMIT; AUTO POWER DOWN |
e3 |
NOT SPECIFIED |
260 |
YES |
.02 Amp |
14 mm |
6.5 ns |
|||||
|
Renesas Electronics |
OTHER FIFO |
INDUSTRIAL |
64 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
15 ns |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
16384 words |
3.3 |
18 |
FLATPACK, LOW PROFILE |
.8 mm |
85 Cel |
16KX18 |
16K |
-40 Cel |
Matte Tin (Sn) |
QUAD |
S-PQFP-G64 |
3 |
3.6 V |
1.6 mm |
14 mm |
Not Qualified |
294912 bit |
3 V |
e3 |
NOT SPECIFIED |
260 |
YES |
14 mm |
10 ns |
||||||||||||
|
Renesas Electronics |
BI-DIRECTIONAL FIFO |
COMMERCIAL |
64 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
10 ns |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
40 mA |
8192 words |
3.3 |
3.3 |
9 |
FLATPACK, LOW PROFILE |
QFP64,.63SQ,32 |
FIFOs |
.8 mm |
70 Cel |
8KX9 |
8K |
0 Cel |
Matte Tin (Sn) |
QUAD |
S-PQFP-G64 |
3 |
3.6 V |
1.6 mm |
100 MHz |
14 mm |
Not Qualified |
73728 bit |
3 V |
e3 |
NOT SPECIFIED |
260 |
YES |
.01 Amp |
14 mm |
6.5 ns |
||||||
Integrated Device Technology |
OTHER FIFO |
COMMERCIAL |
64 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
10 ns |
2 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
60 mA |
256 words |
5 |
5 |
9 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP64,.47SQ,20 |
FIFOs |
.5 mm |
70 Cel |
256X9 |
256 |
0 Cel |
TIN LEAD |
QUAD |
S-PQFP-G64 |
3 |
5.5 V |
1.6 mm |
100 MHz |
10 mm |
Not Qualified |
2304 bit |
4.5 V |
e0 |
30 |
240 |
YES |
.01 Amp |
10 mm |
6.5 ns |
|||||||
Integrated Device Technology |
OTHER FIFO |
INDUSTRIAL |
64 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
15 ns |
2 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
60 mA |
256 words |
5 |
5 |
9 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP64,.47SQ,20 |
FIFOs |
.5 mm |
85 Cel |
256X9 |
256 |
-40 Cel |
TIN LEAD |
QUAD |
S-PQFP-G64 |
3 |
5.5 V |
1.6 mm |
66.7 MHz |
10 mm |
Not Qualified |
2304 bit |
4.5 V |
e0 |
30 |
240 |
YES |
.01 Amp |
10 mm |
10 ns |
|||||||
Integrated Device Technology |
OTHER FIFO |
INDUSTRIAL |
64 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
25 ns |
2 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
270 mA |
256 words |
5 |
5 |
9 |
FLATPACK, LOW PROFILE |
QFP64,.66SQ,32 |
FIFOs |
.8 mm |
85 Cel |
256X9 |
256 |
-40 Cel |
TIN LEAD |
QUAD |
S-PQFP-G64 |
3 |
5.5 V |
1.6 mm |
40 MHz |
14 mm |
Not Qualified |
2304 bit |
4.5 V |
e0 |
30 |
240 |
YES |
.01 Amp |
14 mm |
15 ns |
FIFO, or First-In, First-Out, is a type of digital circuit that is used in computer systems and digital devices to manage the flow of data. A FIFO circuit stores data in a buffer and retrieves the data in the same order in which it was received, with the first data received being the first data to be retrieved.
FIFO circuits are used in many applications where data needs to be stored and retrieved in a specific order, such as in data communication systems, disk drives, and multimedia devices. For example, in a data communication system, a FIFO circuit can be used to store incoming data packets in a buffer and retrieve them in the order in which they were received, ensuring that the data is processed correctly and in a timely manner.
FIFO circuits are typically implemented using a combination of flip-flops, multiplexers, and control logic. The control logic manages the input and output of data to the FIFO buffer and ensures that the data is stored and retrieved in the correct order.
One of the advantages of using a FIFO circuit is that it provides a simple and efficient way to manage the flow of data. FIFO circuits are easy to implement and can handle large amounts of data. They can also be used in conjunction with other types of digital circuits to implement more complex data processing algorithms.