Part | RoHS | Manufacturer | Memory IC Type | Temperature Grade | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Surface Mount | Cycle Time | No. of Functions | Technology | Screening Level | Terminal Form | Parallel or Serial | Operating Mode | Maximum Supply Current | No. of Words | Nominal Supply Voltage / Vsup (V) | Power Supplies (V) | Memory Width | Package Style (Meter) | Package Equivalence Code | Alternate Memory Width | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Output Characteristics | Organization | No. of Words Code | Minimum Operating Temperature | Terminal Finish | Terminal Position | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Maximum Clock Frequency (fCLK) | Width | Qualification | Memory Density | Minimum Supply Voltage (Vsup) | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Output Enable | Maximum Standby Current | Length | Maximum Access Time |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Texas Instruments |
OTHER FIFO |
MILITARY |
16 |
DFP |
RECTANGULAR |
CERAMIC |
YES |
TTL |
FLAT |
ASYNCHRONOUS |
16 words |
4 |
FLATPACK |
FL16,.3 |
FIFOs |
1.27 mm |
125 Cel |
16X4 |
16 |
-55 Cel |
DUAL |
R-XDFP-F16 |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
||||||||||||||||||||||||||
Texas Instruments |
OTHER FIFO |
MILITARY |
20 |
DFP |
RECTANGULAR |
CERAMIC |
YES |
TTL |
MIL-STD-883 Class B (Modified) |
FLAT |
ASYNCHRONOUS |
16 words |
5 |
5 |
4 |
FLATPACK |
FL20,.3 |
FIFOs |
1.27 mm |
125 Cel |
16X4 |
16 |
-55 Cel |
DUAL |
R-XDFP-F20 |
Not Qualified |
|||||||||||||||||||||||||
Texas Instruments |
OTHER FIFO |
MILITARY |
16 |
DFP |
RECTANGULAR |
CERAMIC |
YES |
TTL |
38535Q/M;38534H;883B |
FLAT |
ASYNCHRONOUS |
16 words |
4 |
FLATPACK |
FL16,.3 |
FIFOs |
1.27 mm |
125 Cel |
16X4 |
16 |
-55 Cel |
DUAL |
R-XDFP-F16 |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
|||||||||||||||||||||||||
Texas Instruments |
OTHER FIFO |
MILITARY |
16 |
DFP |
RECTANGULAR |
CERAMIC |
YES |
TTL |
FLAT |
ASYNCHRONOUS |
16 words |
5 |
5 |
4 |
FLATPACK |
FL16,.3 |
FIFOs |
1.27 mm |
125 Cel |
16X4 |
16 |
-55 Cel |
DUAL |
R-XDFP-F16 |
Not Qualified |
||||||||||||||||||||||||||
Texas Instruments |
OTHER FIFO |
MILITARY |
16 |
DFP |
RECTANGULAR |
CERAMIC |
YES |
TTL |
MIL-STD-883 Class B (Modified) |
FLAT |
ASYNCHRONOUS |
16 words |
4 |
FLATPACK |
FL16,.3 |
FIFOs |
1.27 mm |
125 Cel |
16X4 |
16 |
-55 Cel |
DUAL |
R-XDFP-F16 |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
|||||||||||||||||||||||||
Texas Instruments |
OTHER FIFO |
MILITARY |
20 |
DFP |
RECTANGULAR |
CERAMIC |
YES |
TTL |
38535Q/M;38534H;883B |
FLAT |
ASYNCHRONOUS |
16 words |
4 |
FLATPACK |
FL20,.3 |
FIFOs |
1.27 mm |
125 Cel |
16X4 |
16 |
-55 Cel |
DUAL |
R-XDFP-F20 |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
|||||||||||||||||||||||||
Texas Instruments |
OTHER FIFO |
MILITARY |
20 |
DFP |
RECTANGULAR |
CERAMIC |
YES |
TTL |
FLAT |
ASYNCHRONOUS |
16 words |
5 |
5 |
4 |
FLATPACK |
FL20,.3 |
FIFOs |
1.27 mm |
125 Cel |
16X4 |
16 |
-55 Cel |
DUAL |
R-XDFP-F20 |
Not Qualified |
||||||||||||||||||||||||||
Texas Instruments |
OTHER FIFO |
MILITARY |
16 |
DFP |
RECTANGULAR |
CERAMIC |
YES |
TTL |
38535Q/M;38534H;883B |
FLAT |
ASYNCHRONOUS |
16 words |
5 |
5 |
4 |
FLATPACK |
FL16,.3 |
FIFOs |
1.27 mm |
125 Cel |
16X4 |
16 |
-55 Cel |
DUAL |
R-XDFP-F16 |
Not Qualified |
|||||||||||||||||||||||||
Texas Instruments |
OTHER FIFO |
MILITARY |
20 |
DFP |
RECTANGULAR |
CERAMIC |
YES |
TTL |
MIL-STD-883 Class B (Modified) |
FLAT |
ASYNCHRONOUS |
16 words |
4 |
FLATPACK |
FL20,.3 |
FIFOs |
1.27 mm |
125 Cel |
16X4 |
16 |
-55 Cel |
DUAL |
R-XDFP-F20 |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
|||||||||||||||||||||||||
Texas Instruments |
OTHER FIFO |
MILITARY |
20 |
DFP |
RECTANGULAR |
CERAMIC |
YES |
TTL |
38535Q/M;38534H;883B |
FLAT |
ASYNCHRONOUS |
16 words |
5 |
5 |
4 |
FLATPACK |
FL20,.3 |
FIFOs |
1.27 mm |
125 Cel |
16X4 |
16 |
-55 Cel |
DUAL |
R-XDFP-F20 |
Not Qualified |
|||||||||||||||||||||||||
Texas Instruments |
OTHER FIFO |
MILITARY |
20 |
DFP |
RECTANGULAR |
CERAMIC |
YES |
TTL |
FLAT |
ASYNCHRONOUS |
16 words |
4 |
FLATPACK |
FL20,.3 |
FIFOs |
1.27 mm |
125 Cel |
16X4 |
16 |
-55 Cel |
DUAL |
R-XDFP-F20 |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
||||||||||||||||||||||||||
Texas Instruments |
OTHER FIFO |
MILITARY |
16 |
DFP |
RECTANGULAR |
CERAMIC |
YES |
TTL |
MIL-STD-883 Class B (Modified) |
FLAT |
ASYNCHRONOUS |
16 words |
5 |
5 |
4 |
FLATPACK |
FL16,.3 |
FIFOs |
1.27 mm |
125 Cel |
16X4 |
16 |
-55 Cel |
DUAL |
R-XDFP-F16 |
Not Qualified |
|||||||||||||||||||||||||
Texas Instruments |
MILITARY |
132 |
DFP |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
20 ns |
1 |
CMOS |
FLAT |
PARALLEL |
SYNCHRONOUS |
512 words |
5 |
36 |
FLATPACK |
.635 mm |
125 Cel |
512X36 |
512 |
-55 Cel |
QUAD |
S-CQFP-F132 |
5.5 V |
3.81 mm |
24.13 mm |
Not Qualified |
18432 bit |
4.5 V |
NO |
24.13 mm |
15 ns |
|||||||||||||||||||
Texas Instruments |
OTHER FIFO |
MILITARY |
68 |
DFP |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
CMOS |
MIL-PRF-38535 Class Q |
FLAT |
PARALLEL |
SYNCHRONOUS |
1024 words |
5 |
5 |
18 |
FLATPACK |
QFL68,.5SQ,25 |
FIFOs |
.635 mm |
125 Cel |
1KX18 |
1K |
-55 Cel |
QUAD |
S-CQFP-F68 |
5.5 V |
3.192 mm |
50 MHz |
12.51 mm |
Not Qualified |
18432 bit |
4.5 V |
NOT SPECIFIED |
NOT SPECIFIED |
YES |
.0012 Amp |
12.51 mm |
13 ns |
|||||||||||
Texas Instruments |
BI-DIRECTIONAL FIFO |
MILITARY |
132 |
DFP |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
20 ns |
1 |
CMOS |
MIL-STD-883 |
FLAT |
PARALLEL |
SYNCHRONOUS |
512 words |
5 |
5 |
36 |
FLATPACK |
QFL132,.95SQ,25 |
FIFOs |
.635 mm |
125 Cel |
512X36 |
512 |
-55 Cel |
QUAD |
S-CQFP-F132 |
5.5 V |
3.81 mm |
50 MHz |
24.13 mm |
Not Qualified |
18432 bit |
4.5 V |
NOT SPECIFIED |
NOT SPECIFIED |
NO |
.0004 Amp |
24.13 mm |
15 ns |
||||||||||
Texas Instruments |
MILITARY |
68 |
DFP |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
CMOS |
FLAT |
PARALLEL |
SYNCHRONOUS |
1024 words |
5 |
18 |
FLATPACK |
.635 mm |
125 Cel |
1KX18 |
1K |
-55 Cel |
QUAD |
S-CQFP-F68 |
5.5 V |
3.192 mm |
12.51 mm |
Not Qualified |
18432 bit |
4.5 V |
YES |
12.51 mm |
13 ns |
||||||||||||||||||||
|
Renesas Electronics |
MILITARY |
16 |
DFP |
RECTANGULAR |
100k Rad(Si) |
CERAMIC, METAL-SEALED COFIRED |
YES |
900.9 ns |
1 |
CMOS |
FLAT |
PARALLEL |
SYNCHRONOUS |
16 words |
15 |
4 |
FLATPACK |
1.27 mm |
125 Cel |
16X4 |
16 |
-55 Cel |
GOLD |
DUAL |
R-CDFP-F16 |
18 V |
2.92 mm |
6.73 mm |
Not Qualified |
64 bit |
3 V |
INPUT AC PARAMETRIC VALUES NOT FROM POST RADIATION MEASUREMENT; REGISTER BASED |
e4 |
YES |
||||||||||||||||
Renesas Electronics |
COMMERCIAL |
28 |
DFP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
YES |
65 ns |
1 |
CMOS |
FLAT |
PARALLEL |
ASYNCHRONOUS |
4096 words |
5 |
9 |
FLATPACK |
1.27 mm |
70 Cel |
3-STATE |
4KX9 |
4K |
0 Cel |
TIN LEAD |
DUAL |
R-GDFP-F28 |
5.5 V |
2.921 mm |
12.446 mm |
Not Qualified |
36864 bit |
4.5 V |
RETRANSMIT |
e0 |
NO |
18.288 mm |
50 ns |
|||||||||||||||
Renesas Electronics |
COMMERCIAL |
28 |
DFP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
YES |
30 ns |
1 |
CMOS |
FLAT |
PARALLEL |
ASYNCHRONOUS |
4096 words |
5 |
9 |
FLATPACK |
1.27 mm |
70 Cel |
3-STATE |
4KX9 |
4K |
0 Cel |
TIN LEAD |
DUAL |
R-GDFP-F28 |
5.5 V |
2.921 mm |
12.446 mm |
Not Qualified |
36864 bit |
4.5 V |
RETRANSMIT |
e0 |
NO |
18.288 mm |
20 ns |
|||||||||||||||
Renesas Electronics |
COMMERCIAL |
28 |
DFP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
YES |
25 ns |
1 |
CMOS |
FLAT |
PARALLEL |
ASYNCHRONOUS |
4096 words |
5 |
9 |
FLATPACK |
1.27 mm |
70 Cel |
3-STATE |
4KX9 |
4K |
0 Cel |
TIN LEAD |
DUAL |
R-GDFP-F28 |
5.5 V |
2.921 mm |
12.446 mm |
Not Qualified |
36864 bit |
4.5 V |
RETRANSMIT |
e0 |
NO |
18.288 mm |
15 ns |
|||||||||||||||
Renesas Electronics |
COMMERCIAL |
28 |
DFP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
YES |
35 ns |
1 |
CMOS |
FLAT |
PARALLEL |
ASYNCHRONOUS |
256 words |
5 |
9 |
FLATPACK |
1.27 mm |
70 Cel |
3-STATE |
256X9 |
256 |
0 Cel |
TIN LEAD |
DUAL |
R-GDFP-F28 |
5.5 V |
2.921 mm |
12.446 mm |
Not Qualified |
2304 bit |
4.5 V |
RETRANSMIT |
e0 |
NO |
18.288 mm |
25 ns |
|||||||||||||||
Renesas Electronics |
COMMERCIAL |
28 |
DFP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
YES |
35 ns |
1 |
CMOS |
FLAT |
PARALLEL |
ASYNCHRONOUS |
256 words |
5 |
9 |
FLATPACK |
1.27 mm |
70 Cel |
3-STATE |
256X9 |
256 |
0 Cel |
TIN LEAD |
DUAL |
R-GDFP-F28 |
5.5 V |
2.921 mm |
12.446 mm |
Not Qualified |
2304 bit |
4.5 V |
RETRANSMIT |
e0 |
NO |
18.288 mm |
25 ns |
|||||||||||||||
Renesas Electronics |
COMMERCIAL |
28 |
DFP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
YES |
65 ns |
1 |
CMOS |
FLAT |
PARALLEL |
ASYNCHRONOUS |
256 words |
5 |
9 |
FLATPACK |
1.27 mm |
70 Cel |
3-STATE |
256X9 |
256 |
0 Cel |
TIN LEAD |
DUAL |
R-GDFP-F28 |
5.5 V |
2.921 mm |
12.446 mm |
Not Qualified |
2304 bit |
4.5 V |
RETRANSMIT |
e0 |
NO |
18.288 mm |
50 ns |
|||||||||||||||
Renesas Electronics |
MILITARY |
16 |
DFP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
YES |
900.9 ns |
1 |
CMOS |
FLAT |
PARALLEL |
SYNCHRONOUS |
16 words |
15 |
4 |
FLATPACK |
1.27 mm |
125 Cel |
16X4 |
16 |
-55 Cel |
DUAL |
R-CDFP-F16 |
18 V |
2.92 mm |
6.73 mm |
Qualified |
64 bit |
3 V |
INPUT AC PARAMETRIC VALUES NOT FROM POST RADIATION MEASUREMENT; REGISTER BASED |
YES |
||||||||||||||||||||
Renesas Electronics |
MILITARY |
16 |
DFP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
YES |
900.9 ns |
1 |
CMOS |
FLAT |
PARALLEL |
SYNCHRONOUS |
16 words |
15 |
4 |
FLATPACK |
1.27 mm |
125 Cel |
16X4 |
16 |
-55 Cel |
GOLD |
DUAL |
R-CDFP-F16 |
18 V |
2.92 mm |
6.73 mm |
Qualified |
64 bit |
3 V |
INPUT AC PARAMETRIC VALUES NOT FROM POST RADIATION MEASUREMENT; REGISTER BASED |
e4 |
YES |
||||||||||||||||||
Renesas Electronics |
COMMERCIAL |
28 |
DFP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
YES |
25 ns |
1 |
CMOS |
FLAT |
PARALLEL |
ASYNCHRONOUS |
256 words |
5 |
9 |
FLATPACK |
1.27 mm |
70 Cel |
3-STATE |
256X9 |
256 |
0 Cel |
TIN LEAD |
DUAL |
R-GDFP-F28 |
5.5 V |
2.921 mm |
12.446 mm |
Not Qualified |
2304 bit |
4.5 V |
RETRANSMIT |
e0 |
NO |
18.288 mm |
15 ns |
|||||||||||||||
Renesas Electronics |
COMMERCIAL |
28 |
DFP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
YES |
45 ns |
1 |
CMOS |
FLAT |
PARALLEL |
ASYNCHRONOUS |
256 words |
5 |
9 |
FLATPACK |
1.27 mm |
70 Cel |
3-STATE |
256X9 |
256 |
0 Cel |
TIN LEAD |
DUAL |
R-GDFP-F28 |
5.5 V |
2.921 mm |
12.446 mm |
Not Qualified |
2304 bit |
4.5 V |
RETRANSMIT |
e0 |
NO |
18.288 mm |
35 ns |
|||||||||||||||
Renesas Electronics |
COMMERCIAL |
28 |
DFP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
YES |
30 ns |
1 |
CMOS |
FLAT |
PARALLEL |
ASYNCHRONOUS |
256 words |
5 |
9 |
FLATPACK |
1.27 mm |
70 Cel |
3-STATE |
256X9 |
256 |
0 Cel |
TIN LEAD |
DUAL |
R-GDFP-F28 |
5.5 V |
2.921 mm |
12.446 mm |
Not Qualified |
2304 bit |
4.5 V |
RETRANSMIT |
e0 |
NO |
18.288 mm |
20 ns |
|||||||||||||||
Renesas Electronics |
COMMERCIAL |
28 |
DFP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
YES |
35 ns |
1 |
CMOS |
FLAT |
PARALLEL |
ASYNCHRONOUS |
4096 words |
5 |
9 |
FLATPACK |
1.27 mm |
70 Cel |
3-STATE |
4KX9 |
4K |
0 Cel |
TIN LEAD |
DUAL |
R-GDFP-F28 |
5.5 V |
2.921 mm |
12.446 mm |
Not Qualified |
36864 bit |
4.5 V |
RETRANSMIT |
e0 |
NO |
18.288 mm |
25 ns |
|||||||||||||||
Renesas Electronics |
COMMERCIAL |
28 |
DFP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
YES |
45 ns |
1 |
CMOS |
FLAT |
PARALLEL |
ASYNCHRONOUS |
256 words |
5 |
9 |
FLATPACK |
1.27 mm |
70 Cel |
3-STATE |
256X9 |
256 |
0 Cel |
TIN LEAD |
DUAL |
R-GDFP-F28 |
5.5 V |
2.921 mm |
12.446 mm |
Not Qualified |
2304 bit |
4.5 V |
RETRANSMIT |
e0 |
NO |
18.288 mm |
35 ns |
|||||||||||||||
Micron Technology |
MILITARY |
28 |
DFP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
YES |
30 ns |
1 |
CMOS |
MIL-STD-883 |
FLAT |
PARALLEL |
ASYNCHRONOUS |
2048 words |
5 |
9 |
FLATPACK |
125 Cel |
2KX9 |
2K |
-55 Cel |
TIN LEAD |
DUAL |
R-GDFP-F28 |
5.5 V |
Not Qualified |
18432 bit |
4.5 V |
e0 |
NO |
20 ns |
||||||||||||||||||||
Micron Technology |
MILITARY |
28 |
DFP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
YES |
40 ns |
1 |
CMOS |
FLAT |
PARALLEL |
ASYNCHRONOUS |
2048 words |
5 |
9 |
FLATPACK |
1.27 mm |
125 Cel |
2KX9 |
2K |
-55 Cel |
TIN LEAD |
DUAL |
R-GDFP-F28 |
5.5 V |
2.286 mm |
9.144 mm |
Not Qualified |
18432 bit |
4.5 V |
RETRANSMIT |
e0 |
NO |
18.288 mm |
30 ns |
FIFO, or First-In, First-Out, is a type of digital circuit that is used in computer systems and digital devices to manage the flow of data. A FIFO circuit stores data in a buffer and retrieves the data in the same order in which it was received, with the first data received being the first data to be retrieved.
FIFO circuits are used in many applications where data needs to be stored and retrieved in a specific order, such as in data communication systems, disk drives, and multimedia devices. For example, in a data communication system, a FIFO circuit can be used to store incoming data packets in a buffer and retrieve them in the order in which they were received, ensuring that the data is processed correctly and in a timely manner.
FIFO circuits are typically implemented using a combination of flip-flops, multiplexers, and control logic. The control logic manages the input and output of data to the FIFO buffer and ensures that the data is stored and retrieved in the correct order.
One of the advantages of using a FIFO circuit is that it provides a simple and efficient way to manage the flow of data. FIFO circuits are easy to implement and can handle large amounts of data. They can also be used in conjunction with other types of digital circuits to implement more complex data processing algorithms.