Part | RoHS | Manufacturer | Memory IC Type | Temperature Grade | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Surface Mount | Cycle Time | No. of Functions | Technology | Screening Level | Terminal Form | Parallel or Serial | Operating Mode | Maximum Supply Current | No. of Words | Nominal Supply Voltage / Vsup (V) | Power Supplies (V) | Memory Width | Package Style (Meter) | Package Equivalence Code | Alternate Memory Width | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Output Characteristics | Organization | No. of Words Code | Minimum Operating Temperature | Terminal Finish | Terminal Position | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Maximum Clock Frequency (fCLK) | Width | Qualification | Memory Density | Minimum Supply Voltage (Vsup) | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Output Enable | Maximum Standby Current | Length | Maximum Access Time |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Texas Instruments |
OTHER FIFO |
COMMERCIAL |
80 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
6 ns |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
35 mA |
65536 words |
3.3 |
3.3 |
18 |
FLATPACK, LOW PROFILE |
QFP80,.64SQ |
9 |
FIFOs |
.65 mm |
70 Cel |
3-STATE |
64KX18 |
64K |
0 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQFP-G80 |
4 |
3.45 V |
1.6 mm |
166 MHz |
14 mm |
Not Qualified |
1179648 bit |
3.15 V |
CAN ALSO BE CONFIGURED AS 131072 X 9 |
e4 |
30 |
260 |
YES |
.015 Amp |
14 mm |
4.5 ns |
|||
|
Texas Instruments |
OTHER FIFO |
COMMERCIAL |
64 |
TFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
15 ns |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
35 mA |
4096 words |
3.3 |
3.3 |
18 |
FLATPACK, THIN PROFILE, FINE PITCH |
TQFP64,.47SQ |
FIFOs |
.5 mm |
70 Cel |
3-STATE |
4KX18 |
4K |
0 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQFP-G64 |
3 |
3.6 V |
1.2 mm |
166 MHz |
10 mm |
Not Qualified |
73728 bit |
3 V |
e4 |
30 |
260 |
YES |
10 mm |
10 ns |
||||||
|
Texas Instruments |
OTHER FIFO |
COMMERCIAL |
80 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
7.5 ns |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
35 mA |
65536 words |
3.3 |
3.3 |
18 |
FLATPACK, LOW PROFILE |
QFP80,.64SQ |
9 |
FIFOs |
.65 mm |
70 Cel |
3-STATE |
64KX18 |
64K |
0 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQFP-G80 |
4 |
3.45 V |
1.6 mm |
166 MHz |
14 mm |
Not Qualified |
1179648 bit |
3.15 V |
CAN ALSO BE CONFIGURED AS 131072 X 9 |
e4 |
30 |
260 |
YES |
.015 Amp |
14 mm |
5 ns |
|||
|
Texas Instruments |
OTHER FIFO |
COMMERCIAL |
64 |
TFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
7.5 ns |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
35 mA |
2048 words |
3.3 |
3.3 |
18 |
FLATPACK, THIN PROFILE, FINE PITCH |
TQFP64,.47SQ |
FIFOs |
.5 mm |
70 Cel |
3-STATE |
2KX18 |
2K |
0 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQFP-G64 |
3 |
3.6 V |
1.2 mm |
166 MHz |
10 mm |
Not Qualified |
36864 bit |
3 V |
e4 |
30 |
260 |
YES |
10 mm |
5 ns |
||||||
|
Texas Instruments |
OTHER FIFO |
COMMERCIAL |
64 |
TFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
10 ns |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
35 mA |
4096 words |
3.3 |
3.3 |
18 |
FLATPACK, THIN PROFILE, FINE PITCH |
TQFP64,.47SQ |
FIFOs |
.5 mm |
70 Cel |
3-STATE |
4KX18 |
4K |
0 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQFP-G64 |
3 |
3.6 V |
1.2 mm |
166 MHz |
10 mm |
Not Qualified |
73728 bit |
3 V |
e4 |
30 |
260 |
YES |
10 mm |
6.5 ns |
||||||
|
Texas Instruments |
OTHER FIFO |
COMMERCIAL |
64 |
TFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
7.5 ns |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
35 mA |
4096 words |
3.3 |
3.3 |
18 |
FLATPACK, THIN PROFILE, FINE PITCH |
TQFP64,.47SQ |
FIFOs |
.5 mm |
70 Cel |
3-STATE |
4KX18 |
4K |
0 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQFP-G64 |
3 |
3.6 V |
1.2 mm |
166 MHz |
10 mm |
Not Qualified |
73728 bit |
3 V |
e4 |
30 |
260 |
YES |
10 mm |
5 ns |
||||||
|
Texas Instruments |
OTHER FIFO |
COMMERCIAL |
64 |
TFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
7.5 ns |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
35 mA |
512 words |
3.3 |
3.3 |
18 |
FLATPACK, THIN PROFILE, FINE PITCH |
TQFP64,.47SQ |
FIFOs |
.5 mm |
70 Cel |
3-STATE |
512X18 |
512 |
0 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQFP-G64 |
3 |
3.6 V |
1.2 mm |
133 MHz |
10 mm |
Not Qualified |
9216 bit |
3 V |
e4 |
30 |
260 |
YES |
10 mm |
5 ns |
||||||
|
Renesas Electronics |
OTHER FIFO |
COMMERCIAL |
64 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
10 ns |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
60 mA |
262144 words |
3.3 |
3.3 |
18 |
FLATPACK, LOW PROFILE |
QFP64,.63SQ,32 |
FIFOs |
.8 mm |
70 Cel |
256KX18 |
256K |
0 Cel |
Matte Tin (Sn) |
QUAD |
S-PQFP-G64 |
3 |
3.6 V |
1.6 mm |
100 MHz |
14 mm |
Not Qualified |
4718592 bit |
3 V |
EASILY EXPANDABLE IN DEPTH AND WIDTH |
e3 |
NOT SPECIFIED |
260 |
YES |
.02 Amp |
14 mm |
6.5 ns |
|||||
|
Renesas Electronics |
COMMERCIAL |
64 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
10 ns |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
262144 words |
3.3 |
18 |
FLATPACK, LOW PROFILE |
.8 mm |
70 Cel |
256KX18 |
256K |
0 Cel |
MATTE TIN |
QUAD |
S-PQFP-G64 |
3 |
3.6 V |
1.6 mm |
14 mm |
Not Qualified |
4718592 bit |
3 V |
EASILY EXPANDABLE IN DEPTH AND WIDTH |
e3 |
40 |
260 |
YES |
14 mm |
6.5 ns |
||||||||||||
Texas Instruments |
OTHER FIFO |
COMMERCIAL |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
35 ns |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
125 mA |
512 words |
5 |
5 |
9 |
IN-LINE |
DIP28,.3 |
FIFOs |
2.54 mm |
70 Cel |
3-STATE |
512X9 |
512 |
0 Cel |
TIN LEAD |
DUAL |
R-PDIP-T28 |
5.5 V |
4.57 mm |
28.5 MHz |
7.62 mm |
Not Qualified |
4608 bit |
4.5 V |
RETRANSMIT |
e0 |
NO |
.0005 Amp |
34.545 mm |
25 ns |
||||||||
Texas Instruments |
OTHER FIFO |
COMMERCIAL |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
35 ns |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
125 mA |
1024 words |
5 |
5 |
9 |
IN-LINE |
DIP28,.3 |
FIFOs |
2.54 mm |
70 Cel |
1KX9 |
1K |
0 Cel |
DUAL |
R-PDIP-T28 |
5.5 V |
4.57 mm |
28.5 MHz |
7.62 mm |
Not Qualified |
9216 bit |
4.5 V |
NOT SPECIFIED |
NOT SPECIFIED |
NO |
.0005 Amp |
34.545 mm |
25 ns |
||||||||||
|
Renesas Electronics |
OTHER FIFO |
COMMERCIAL |
64 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
10 ns |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
60 mA |
262144 words |
3.3 |
3.3 |
18 |
FLATPACK, LOW PROFILE |
QFP64,.63SQ,32 |
FIFOs |
.8 mm |
70 Cel |
256KX18 |
256K |
0 Cel |
Matte Tin (Sn) |
QUAD |
S-PQFP-G64 |
3 |
3.6 V |
1.6 mm |
100 MHz |
14 mm |
Not Qualified |
4718592 bit |
3 V |
EASILY EXPANDABLE IN DEPTH AND WIDTH |
e3 |
NOT SPECIFIED |
260 |
YES |
.02 Amp |
14 mm |
6.5 ns |
|||||
|
Renesas Electronics |
OTHER FIFO |
COMMERCIAL |
80 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
6 ns |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
35 mA |
262144 words |
3.3 |
3.3 |
18 |
FLATPACK, LOW PROFILE |
QFP80,.64SQ |
9 |
FIFOs |
.65 mm |
70 Cel |
256KX18 |
256K |
0 Cel |
MATTE TIN |
QUAD |
S-PQFP-G80 |
3 |
3.45 V |
1.6 mm |
166 MHz |
14 mm |
Not Qualified |
4718592 bit |
3.15 V |
ALTERNATIVE MEMORY WIDTH 9; ASYNCHRONOUS MODE ALSO POSSIBLE |
e3 |
30 |
260 |
YES |
.015 Amp |
14 mm |
4 ns |
||||
|
Renesas Electronics |
COMMERCIAL |
64 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
10 ns |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
262144 words |
3.3 |
18 |
FLATPACK, LOW PROFILE |
.8 mm |
70 Cel |
256KX18 |
256K |
0 Cel |
MATTE TIN |
QUAD |
S-PQFP-G64 |
3 |
3.6 V |
1.6 mm |
14 mm |
Not Qualified |
4718592 bit |
3 V |
EASILY EXPANDABLE IN DEPTH AND WIDTH |
e3 |
40 |
260 |
YES |
14 mm |
6.5 ns |
||||||||||||
|
Texas Instruments |
OTHER FIFO |
COMMERCIAL |
80 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
6 ns |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
35 mA |
8192 words |
3.3 |
3.3 |
18 |
FLATPACK, LOW PROFILE |
QFP80,.64SQ |
9 |
FIFOs |
.65 mm |
70 Cel |
3-STATE |
8KX18 |
8K |
0 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQFP-G80 |
4 |
3.45 V |
1.6 mm |
166 MHz |
14 mm |
Not Qualified |
147456 bit |
3.15 V |
CAN ALSO BE CONFIGURED AS 16384 X 9 |
e4 |
30 |
260 |
YES |
.015 Amp |
14 mm |
4.5 ns |
|||
|
Texas Instruments |
OTHER FIFO |
COMMERCIAL |
80 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
15 ns |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
35 mA |
32768 words |
3.3 |
3.3 |
18 |
FLATPACK, LOW PROFILE |
QFP80,.64SQ |
9 |
FIFOs |
.65 mm |
70 Cel |
3-STATE |
32KX18 |
32K |
0 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQFP-G80 |
4 |
3.45 V |
1.6 mm |
166 MHz |
14 mm |
Not Qualified |
589824 bit |
3.15 V |
CAN ALSO BE CONFIGURED AS 65536 X 9 |
e4 |
30 |
260 |
YES |
.015 Amp |
14 mm |
10 ns |
|||
|
Texas Instruments |
OTHER FIFO |
COMMERCIAL |
64 |
TFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
10 ns |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
35 mA |
512 words |
3.3 |
3.3 |
18 |
FLATPACK, THIN PROFILE, FINE PITCH |
TQFP64,.47SQ |
FIFOs |
.5 mm |
70 Cel |
3-STATE |
512X18 |
512 |
0 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQFP-G64 |
3 |
3.6 V |
1.2 mm |
133 MHz |
10 mm |
Not Qualified |
9216 bit |
3 V |
e4 |
30 |
260 |
YES |
10 mm |
6.5 ns |
||||||
|
Texas Instruments |
OTHER FIFO |
COMMERCIAL |
64 |
TFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
10 ns |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
35 mA |
2048 words |
3.3 |
3.3 |
18 |
FLATPACK, THIN PROFILE, FINE PITCH |
TQFP64,.47SQ |
FIFOs |
.5 mm |
70 Cel |
3-STATE |
2KX18 |
2K |
0 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQFP-G64 |
3 |
3.6 V |
1.2 mm |
166 MHz |
10 mm |
Not Qualified |
36864 bit |
3 V |
e4 |
30 |
260 |
YES |
10 mm |
6.5 ns |
||||||
|
Renesas Electronics |
OTHER FIFO |
COMMERCIAL |
64 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
10 ns |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
55 mA |
524288 words |
3.3 |
3.3 |
9 |
FLATPACK, LOW PROFILE |
QFP64,.63SQ,32 |
FIFOs |
.8 mm |
70 Cel |
512KX9 |
512K |
0 Cel |
Matte Tin (Sn) |
QUAD |
S-PQFP-G64 |
3 |
3.45 V |
1.6 mm |
100 MHz |
14 mm |
Not Qualified |
4718592 bit |
3.15 V |
RETRANSMIT; AUTO POWER DOWN |
e3 |
NOT SPECIFIED |
260 |
YES |
.02 Amp |
14 mm |
6.5 ns |
|||||
|
Cypress Semiconductor |
OTHER FIFO |
COMMERCIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
30 ns |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
55 mA |
512 words |
5 |
5 |
9 |
CHIP CARRIER |
LDCC32,.5X.6 |
FIFOs |
1.27 mm |
70 Cel |
512X9 |
512 |
0 Cel |
Matte Tin (Sn) |
QUAD |
R-PQCC-J32 |
3 |
5.5 V |
3.55 mm |
33.33 MHz |
11.43 mm |
Not Qualified |
4608 bit |
4.5 V |
RETRANSMIT |
e3 |
20 |
260 |
NO |
.005 Amp |
13.97 mm |
20 ns |
|||||
Integrated Device Technology |
OTHER FIFO |
COMMERCIAL |
64 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
15 ns |
2 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
270 mA |
256 words |
5 |
5 |
9 |
FLATPACK, LOW PROFILE |
QFP64,.66SQ,32 |
FIFOs |
.8 mm |
70 Cel |
256X9 |
256 |
0 Cel |
TIN LEAD |
QUAD |
S-PQFP-G64 |
3 |
5.5 V |
1.6 mm |
66.7 MHz |
14 mm |
Not Qualified |
2304 bit |
4.5 V |
e0 |
30 |
240 |
YES |
.01 Amp |
14 mm |
10 ns |
|||||||
|
Renesas Electronics |
COMMERCIAL |
64 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
10 ns |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
524288 words |
3.3 |
9 |
FLATPACK, LOW PROFILE |
.8 mm |
70 Cel |
512KX9 |
512K |
0 Cel |
MATTE TIN |
QUAD |
S-PQFP-G64 |
3 |
3.45 V |
1.6 mm |
14 mm |
Not Qualified |
4718592 bit |
3.15 V |
RETRANSMIT; AUTO POWER DOWN |
e3 |
YES |
14 mm |
6.5 ns |
||||||||||||||
|
Renesas Electronics |
COMMERCIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
45 ns |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
512 words |
5 |
9 |
CHIP CARRIER |
1.27 mm |
70 Cel |
3-STATE |
512X9 |
512 |
0 Cel |
Matte Tin (Sn) |
QUAD |
R-PQCC-J32 |
5.5 V |
3.55 mm |
11.43 mm |
Not Qualified |
4608 bit |
4.5 V |
RETRANSMIT |
e3 |
NO |
13.97 mm |
35 ns |
||||||||||||||
|
Renesas Electronics |
OTHER FIFO |
COMMERCIAL |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
20 ns |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
80 mA |
1024 words |
5 |
5 |
9 |
IN-LINE |
DIP28,.6 |
FIFOs |
2.54 mm |
70 Cel |
1KX9 |
1K |
0 Cel |
Matte Tin (Sn) - annealed |
DUAL |
R-PDIP-T28 |
1 |
5.5 V |
4.699 mm |
50 MHz |
15.24 mm |
Not Qualified |
9216 bit |
4.5 V |
RETRANSMIT |
e3 |
30 |
260 |
NO |
.005 Amp |
36.576 mm |
12 ns |
|||||
Integrated Device Technology |
OTHER FIFO |
COMMERCIAL |
64 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
25 ns |
2 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
270 mA |
256 words |
5 |
5 |
9 |
FLATPACK, LOW PROFILE |
QFP64,.66SQ,32 |
FIFOs |
.8 mm |
70 Cel |
256X9 |
256 |
0 Cel |
TIN LEAD |
QUAD |
S-PQFP-G64 |
3 |
5.5 V |
1.6 mm |
40 MHz |
14 mm |
Not Qualified |
2304 bit |
4.5 V |
e0 |
30 |
240 |
YES |
.01 Amp |
14 mm |
15 ns |
|||||||
Integrated Device Technology |
OTHER FIFO |
COMMERCIAL |
56 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
30 ns |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
125 mA |
512 words |
5 |
5 |
9 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP56,.3,20 |
FIFOs |
.5 mm |
70 Cel |
3-STATE |
512X9 |
512 |
0 Cel |
Tin/Lead (Sn85Pb15) |
DUAL |
R-PDSO-G56 |
1 |
5.5 V |
1.1 mm |
33.3 MHz |
6.1 mm |
Not Qualified |
4608 bit |
4.5 V |
RETRANSMIT |
e0 |
20 |
240 |
NO |
14 mm |
20 ns |
||||||
Integrated Device Technology |
OTHER FIFO |
COMMERCIAL |
64 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
10 ns |
2 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
60 mA |
256 words |
5 |
5 |
9 |
FLATPACK, LOW PROFILE |
QFP64,.6SQ,32 |
FIFOs |
.8 mm |
70 Cel |
256X9 |
256 |
0 Cel |
TIN LEAD |
QUAD |
S-PQFP-G64 |
3 |
5.5 V |
1.6 mm |
100 MHz |
14 mm |
Not Qualified |
2304 bit |
4.5 V |
e0 |
30 |
240 |
YES |
.01 Amp |
14 mm |
6.5 ns |
|||||||
Integrated Device Technology |
OTHER FIFO |
COMMERCIAL |
64 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
35 ns |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
270 mA |
512 words |
5 |
5 |
9 |
FLATPACK, LOW PROFILE |
QFP64,.66SQ,32 |
FIFOs |
.8 mm |
70 Cel |
3-STATE |
512X9 |
512 |
0 Cel |
TIN LEAD |
QUAD |
S-PQFP-G64 |
3 |
5.5 V |
1.6 mm |
28.6 MHz |
14 mm |
Not Qualified |
4608 bit |
4.5 V |
e0 |
30 |
240 |
YES |
.01 Amp |
14 mm |
20 ns |
||||||
Integrated Device Technology |
OTHER FIFO |
COMMERCIAL |
56 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
25 ns |
2 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
125 mA |
256 words |
5 |
5 |
9 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP56,.3,20 |
FIFOs |
.5 mm |
70 Cel |
3-STATE |
256X9 |
256 |
0 Cel |
Tin/Lead (Sn85Pb15) |
DUAL |
R-PDSO-G56 |
1 |
5.5 V |
1.2 mm |
40 MHz |
6.1 mm |
Not Qualified |
2304 bit |
4.5 V |
RETRANSMIT |
e0 |
20 |
240 |
NO |
14 mm |
15 ns |
||||||
Integrated Device Technology |
OTHER FIFO |
COMMERCIAL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
10 ns |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
75 mA |
16384 words |
3.3 |
3.3 |
72 |
GRID ARRAY |
BGA256,16X16,40 |
FIFOs |
1 mm |
70 Cel |
16KX72 |
16K |
0 Cel |
Tin/Lead (Sn63Pb37) |
BOTTOM |
S-PBGA-B256 |
3 |
3.45 V |
3.5 mm |
100 MHz |
17 mm |
Not Qualified |
1179648 bit |
3.15 V |
RETRANSMIT |
e0 |
30 |
225 |
YES |
.015 Amp |
17 mm |
6.5 ns |
||||||
|
Integrated Device Technology |
COMMERCIAL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
10 ns |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
16384 words |
3.3 |
72 |
GRID ARRAY |
1 mm |
70 Cel |
16KX72 |
16K |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B256 |
3 |
3.45 V |
3.5 mm |
17 mm |
Not Qualified |
1179648 bit |
3.15 V |
RETRANSMIT |
e1 |
40 |
260 |
YES |
17 mm |
6.5 ns |
||||||||||||
|
Renesas Electronics |
OTHER FIFO |
COMMERCIAL |
32 |
QCCN |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
25 ns |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
60 mA |
1024 words |
3.3 |
9 |
CHIP CARRIER |
LCC32,.45X.55 |
1.27 mm |
70 Cel |
3-STATE |
1KX9 |
1K |
0 Cel |
Matte Tin (Sn) - annealed |
QUAD |
R-PQCC-N32 |
3 |
3.6 V |
2.79 mm |
11.43 mm |
9216 bit |
3 V |
e3 |
30 |
260 |
NO |
.005 Amp |
13.97 mm |
15 ns |
|||||||||
|
Renesas Electronics |
OTHER FIFO |
COMMERCIAL |
32 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
10 ns |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
20 mA |
512 words |
3.3 |
3.3 |
9 |
FLATPACK, LOW PROFILE |
QFP32,.35SQ,32 |
FIFOs |
.8 mm |
70 Cel |
512X9 |
512 |
0 Cel |
Matte Tin (Sn) - annealed |
QUAD |
S-PQFP-G32 |
3 |
3.6 V |
1.6 mm |
100 MHz |
7 mm |
Not Qualified |
4608 bit |
3 V |
e3 |
30 |
260 |
YES |
.005 Amp |
7 mm |
6.5 ns |
||||||
|
Renesas Electronics |
OTHER FIFO |
COMMERCIAL |
32 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
10 ns |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
20 mA |
4096 words |
3.3 |
3.3 |
9 |
FLATPACK, LOW PROFILE |
QFP32,.35SQ,32 |
FIFOs |
.8 mm |
70 Cel |
4KX9 |
4K |
0 Cel |
Matte Tin (Sn) - annealed |
QUAD |
S-PQFP-G32 |
3 |
3.6 V |
1.6 mm |
100 MHz |
7 mm |
Not Qualified |
36864 bit |
3 V |
e3 |
30 |
260 |
YES |
.005 Amp |
7 mm |
6.5 ns |
||||||
|
Renesas Electronics |
COMMERCIAL |
32 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
10 ns |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
4096 words |
3.3 |
9 |
FLATPACK, LOW PROFILE |
.8 mm |
70 Cel |
4KX9 |
4K |
0 Cel |
Matte Tin (Sn) - annealed |
QUAD |
S-PQFP-G32 |
3 |
3.6 V |
1.6 mm |
7 mm |
Not Qualified |
36864 bit |
3 V |
e3 |
30 |
260 |
YES |
7 mm |
6.5 ns |
|||||||||||||
Integrated Device Technology |
OTHER FIFO |
COMMERCIAL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
15 ns |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
75 mA |
16384 words |
3.3 |
3.3 |
72 |
GRID ARRAY |
BGA256,16X16,40 |
FIFOs |
1 mm |
70 Cel |
16KX72 |
16K |
0 Cel |
Tin/Lead (Sn63Pb37) |
BOTTOM |
S-PBGA-B256 |
3 |
3.45 V |
3.5 mm |
66.7 MHz |
17 mm |
Not Qualified |
1179648 bit |
3.15 V |
RETRANSMIT |
e0 |
30 |
225 |
YES |
.015 Amp |
17 mm |
10 ns |
||||||
|
Texas Instruments |
OTHER FIFO |
COMMERCIAL |
64 |
TFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
20 ns |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
35 mA |
512 words |
3.3 |
3.3 |
18 |
FLATPACK, THIN PROFILE, FINE PITCH |
TQFP64,.47SQ |
FIFOs |
.5 mm |
70 Cel |
3-STATE |
512X18 |
512 |
0 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQFP-G64 |
3 |
3.6 V |
1.2 mm |
133 MHz |
10 mm |
Not Qualified |
9216 bit |
3 V |
e4 |
30 |
260 |
YES |
10 mm |
12 ns |
||||||
|
Renesas Electronics |
BI-DIRECTIONAL FIFO |
COMMERCIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
20 ns |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
120 mA |
2048 words |
5 |
5 |
9 |
CHIP CARRIER |
LDCC32,.5X.6 |
FIFOs |
1.27 mm |
70 Cel |
3-STATE |
2KX9 |
2K |
0 Cel |
MATTE TIN |
QUAD |
R-PQCC-J32 |
3 |
5.5 V |
3.556 mm |
50 MHz |
11.4554 mm |
Not Qualified |
18432 bit |
4.5 V |
e3 |
30 |
260 |
NO |
.012 Amp |
13.9954 mm |
12 ns |
|||||
Integrated Device Technology |
OTHER FIFO |
COMMERCIAL |
64 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
10 ns |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
55 mA |
524288 words |
3.3 |
3.3 |
9 |
FLATPACK, LOW PROFILE |
QFP64,.66SQ,32 |
FIFOs |
.8 mm |
70 Cel |
512KX9 |
512K |
0 Cel |
TIN LEAD |
QUAD |
S-PQFP-G64 |
3 |
3.45 V |
1.6 mm |
100 MHz |
14 mm |
Not Qualified |
4718592 bit |
3.15 V |
RETRANSMIT; AUTO POWER DOWN |
e0 |
30 |
240 |
YES |
.02 Amp |
14 mm |
6.5 ns |
||||||
|
Renesas Electronics |
OTHER FIFO |
COMMERCIAL |
64 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
10 ns |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
55 mA |
8192 words |
3.3 |
3.3 |
18 |
FLATPACK, LOW PROFILE |
QFP64,.66SQ,32 |
FIFOs |
.8 mm |
70 Cel |
8KX18 |
8K |
0 Cel |
Matte Tin (Sn) - annealed |
QUAD |
S-PQFP-G64 |
3 |
3.6 V |
1.6 mm |
100 MHz |
14 mm |
Not Qualified |
147456 bit |
3 V |
RETRANSMIT |
e3 |
30 |
260 |
YES |
.02 Amp |
14 mm |
6.5 ns |
|||||
|
Renesas Electronics |
OTHER FIFO |
COMMERCIAL |
64 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
10 ns |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
55 mA |
8192 words |
3.3 |
3.3 |
18 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP64,.47SQ,20 |
FIFOs |
.5 mm |
70 Cel |
8KX18 |
8K |
0 Cel |
Matte Tin (Sn) - annealed |
QUAD |
S-PQFP-G64 |
3 |
3.6 V |
1.6 mm |
100 MHz |
10 mm |
Not Qualified |
147456 bit |
3 V |
RETRANSMIT |
e3 |
30 |
260 |
YES |
.02 Amp |
10 mm |
6.5 ns |
|||||
|
Renesas Electronics |
OTHER FIFO |
COMMERCIAL |
64 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
10 ns |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
16384 words |
3.3 |
9 |
FLATPACK, LOW PROFILE |
.8 mm |
70 Cel |
16KX9 |
16K |
0 Cel |
QUAD |
S-PQFP-G64 |
3.6 V |
1.6 mm |
14 mm |
147456 bit |
3 V |
RETRANSMIT |
YES |
14 mm |
6.5 ns |
|||||||||||||||||
|
Renesas Electronics |
OTHER FIFO |
COMMERCIAL |
64 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
10 ns |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
55 mA |
16384 words |
3.3 |
3.3 |
9 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP64,.47SQ,20 |
FIFOs |
.5 mm |
70 Cel |
16KX9 |
16K |
0 Cel |
Matte Tin (Sn) |
QUAD |
S-PQFP-G64 |
3 |
3.6 V |
1.6 mm |
100 MHz |
10 mm |
Not Qualified |
147456 bit |
3 V |
RETRANSMIT |
e3 |
NOT SPECIFIED |
260 |
YES |
.02 Amp |
10 mm |
6.5 ns |
|||||
|
Renesas Electronics |
OTHER FIFO |
COMMERCIAL |
64 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
10 ns |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
55 mA |
16384 words |
3.3 |
3.3 |
18 |
FLATPACK, LOW PROFILE |
QFP64,.63SQ,32 |
FIFOs |
.8 mm |
70 Cel |
16KX18 |
16K |
0 Cel |
Matte Tin (Sn) |
QUAD |
S-PQFP-G64 |
3 |
3.6 V |
1.6 mm |
100 MHz |
14 mm |
Not Qualified |
294912 bit |
3 V |
RETRANSMIT |
e3 |
NOT SPECIFIED |
260 |
YES |
.02 Amp |
14 mm |
6.5 ns |
|||||
|
Renesas Electronics |
OTHER FIFO |
COMMERCIAL |
64 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
10 ns |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
55 mA |
32768 words |
3.3 |
3.3 |
9 |
FLATPACK, LOW PROFILE |
QFP64,.63SQ,32 |
FIFOs |
.8 mm |
70 Cel |
32KX9 |
32K |
0 Cel |
Matte Tin (Sn) |
QUAD |
S-PQFP-G64 |
3 |
3.6 V |
1.6 mm |
100 MHz |
14 mm |
Not Qualified |
294912 bit |
3 V |
RETRANSMIT; AUTO POWER DOWN |
e3 |
NOT SPECIFIED |
260 |
YES |
.02 Amp |
14 mm |
6.5 ns |
|||||
|
Renesas Electronics |
BI-DIRECTIONAL FIFO |
COMMERCIAL |
120 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
10 ns |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
1024 words |
3.3 |
3.3 |
36 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP120,.63SQ,16 |
FIFOs |
.4 mm |
70 Cel |
1KX36 |
1K |
0 Cel |
MATTE TIN |
QUAD |
S-PQFP-G120 |
3 |
3.45 V |
1.6 mm |
100 MHz |
14 mm |
Not Qualified |
36864 bit |
3.15 V |
MAIL BOX BYPASS REGISTER |
e3 |
260 |
YES |
.005 Amp |
14 mm |
6.5 ns |
|||||||
|
Renesas Electronics |
OTHER FIFO |
COMMERCIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
20 ns |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
120 mA |
2048 words |
5 |
5 |
9 |
CHIP CARRIER |
LDCC32,.5X.6 |
FIFOs |
1.27 mm |
70 Cel |
3-STATE |
2KX9 |
2K |
0 Cel |
Matte Tin (Sn) - annealed |
QUAD |
R-PQCC-J32 |
3 |
5.5 V |
3.55 mm |
50 MHz |
11.43 mm |
Not Qualified |
18432 bit |
4.5 V |
RETRANSMIT |
e3 |
30 |
260 |
NO |
.012 Amp |
13.97 mm |
12 ns |
||||
|
Renesas Electronics |
OTHER FIFO |
COMMERCIAL |
64 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
10 ns |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
60 mA |
256 words |
5 |
5 |
9 |
FLATPACK, LOW PROFILE |
QFP64,.66SQ,32 |
FIFOs |
.8 mm |
70 Cel |
256X9 |
256 |
0 Cel |
Matte Tin (Sn) - annealed |
QUAD |
S-PQFP-G64 |
3 |
5.5 V |
1.6 mm |
100 MHz |
14 mm |
Not Qualified |
2304 bit |
4.5 V |
e3 |
30 |
260 |
YES |
.01 Amp |
14 mm |
6.5 ns |
FIFO, or First-In, First-Out, is a type of digital circuit that is used in computer systems and digital devices to manage the flow of data. A FIFO circuit stores data in a buffer and retrieves the data in the same order in which it was received, with the first data received being the first data to be retrieved.
FIFO circuits are used in many applications where data needs to be stored and retrieved in a specific order, such as in data communication systems, disk drives, and multimedia devices. For example, in a data communication system, a FIFO circuit can be used to store incoming data packets in a buffer and retrieve them in the order in which they were received, ensuring that the data is processed correctly and in a timely manner.
FIFO circuits are typically implemented using a combination of flip-flops, multiplexers, and control logic. The control logic manages the input and output of data to the FIFO buffer and ensures that the data is stored and retrieved in the correct order.
One of the advantages of using a FIFO circuit is that it provides a simple and efficient way to manage the flow of data. FIFO circuits are easy to implement and can handle large amounts of data. They can also be used in conjunction with other types of digital circuits to implement more complex data processing algorithms.