Part | RoHS | Manufacturer | Memory IC Type | Temperature Grade | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Surface Mount | Cycle Time | No. of Functions | Technology | Screening Level | Terminal Form | Parallel or Serial | Operating Mode | Maximum Supply Current | No. of Words | Nominal Supply Voltage / Vsup (V) | Power Supplies (V) | Memory Width | Package Style (Meter) | Package Equivalence Code | Alternate Memory Width | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Output Characteristics | Organization | No. of Words Code | Minimum Operating Temperature | Terminal Finish | Terminal Position | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Maximum Clock Frequency (fCLK) | Width | Qualification | Memory Density | Minimum Supply Voltage (Vsup) | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Output Enable | Maximum Standby Current | Length | Maximum Access Time |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Maxim Integrated |
OTHER FIFO |
COMMERCIAL |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
80 ns |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
100 mA |
512 words |
5 |
5 |
9 |
IN-LINE |
DIP28,.3 |
FIFOs |
2.54 mm |
70 Cel |
512X9 |
512 |
0 Cel |
TIN LEAD |
DUAL |
R-PDIP-T28 |
5.5 V |
4.572 mm |
12.5 MHz |
7.62 mm |
Not Qualified |
4608 bit |
4.5 V |
RETRANSMIT |
e0 |
NO |
.008 Amp |
34.795 mm |
65 ns |
|||||||||
Maxim Integrated |
OTHER FIFO |
INDUSTRIAL |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
120 mA |
2048 words |
5 |
5 |
9 |
IN-LINE |
DIP28,.6 |
FIFOs |
2.54 mm |
85 Cel |
2KX9 |
2K |
-40 Cel |
TIN LEAD |
DUAL |
R-PDIP-T28 |
5.08 mm |
15.38 MHz |
15.24 mm |
Not Qualified |
18432 bit |
RETRANSMIT |
e0 |
NO |
.002 Amp |
36.83 mm |
50 ns |
||||||||||||
Maxim Integrated |
OTHER FIFO |
INDUSTRIAL |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
120 mA |
2048 words |
5 |
5 |
9 |
IN-LINE |
DIP28,.3 |
FIFOs |
2.54 mm |
85 Cel |
2KX9 |
2K |
-40 Cel |
TIN LEAD |
DUAL |
R-PDIP-T28 |
4.572 mm |
15.38 MHz |
7.62 mm |
Not Qualified |
18432 bit |
RETRANSMIT |
e0 |
NO |
.002 Amp |
34.795 mm |
50 ns |
||||||||||||
Maxim Integrated |
OTHER FIFO |
COMMERCIAL |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
100 ns |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
120 mA |
1024 words |
5 |
5 |
9 |
IN-LINE |
DIP28,.3 |
FIFOs |
2.54 mm |
70 Cel |
1KX9 |
1K |
0 Cel |
TIN LEAD |
DUAL |
R-PDIP-T28 |
5.5 V |
4.572 mm |
10 MHz |
7.62 mm |
Not Qualified |
9216 bit |
4.5 V |
RETRANSMIT |
e0 |
NO |
.008 Amp |
34.795 mm |
80 ns |
|||||||||
Maxim Integrated |
OTHER FIFO |
INDUSTRIAL |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
100 mA |
512 words |
5 |
5 |
9 |
IN-LINE |
DIP28,.3 |
FIFOs |
2.54 mm |
85 Cel |
512X9 |
512 |
-40 Cel |
TIN LEAD |
DUAL |
R-PDIP-T28 |
4.572 mm |
15.38 MHz |
7.62 mm |
Not Qualified |
4608 bit |
RETRANSMIT |
e0 |
NO |
.008 Amp |
34.795 mm |
50 ns |
||||||||||||
Maxim Integrated |
OTHER FIFO |
COMMERCIAL |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
65 ns |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
120 mA |
1024 words |
5 |
5 |
9 |
IN-LINE |
DIP28,.3 |
FIFOs |
2.54 mm |
70 Cel |
1KX9 |
1K |
0 Cel |
TIN LEAD |
DUAL |
R-PDIP-T28 |
5.5 V |
4.572 mm |
15.38 MHz |
7.62 mm |
Not Qualified |
9216 bit |
4.5 V |
RETRANSMIT |
e0 |
NO |
.008 Amp |
34.795 mm |
50 ns |
|||||||||
Maxim Integrated |
OTHER FIFO |
INDUSTRIAL |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
100 mA |
512 words |
5 |
5 |
9 |
IN-LINE |
DIP28,.3 |
FIFOs |
2.54 mm |
85 Cel |
512X9 |
512 |
-40 Cel |
TIN LEAD |
DUAL |
R-PDIP-T28 |
4.572 mm |
22.22 MHz |
7.62 mm |
Not Qualified |
4608 bit |
RETRANSMIT |
e0 |
NO |
.008 Amp |
34.795 mm |
35 ns |
||||||||||||
Xilinx |
TIN LEAD |
3 |
e0 |
30 |
225 |
||||||||||||||||||||||||||||||||||||||||||||||
Xilinx |
TIN LEAD |
3 |
e0 |
30 |
225 |
||||||||||||||||||||||||||||||||||||||||||||||
Xilinx |
TIN LEAD |
3 |
e0 |
30 |
225 |
||||||||||||||||||||||||||||||||||||||||||||||
Xilinx |
TIN LEAD |
3 |
e0 |
30 |
225 |
||||||||||||||||||||||||||||||||||||||||||||||
|
Toshiba |
OTHER FIFO |
INDUSTRIAL |
16 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
SYNCHRONOUS |
4 words |
5 |
2/6 |
16 |
IN-LINE |
DIP16,.3 |
FIFOs |
2.54 mm |
85 Cel |
3-STATE |
4X16 |
4 |
-40 Cel |
DUAL |
R-PDIP-T16 |
6 V |
4.45 mm |
12 MHz |
7.62 mm |
Not Qualified |
64 bit |
2 V |
NOT SPECIFIED |
NOT SPECIFIED |
YES |
19.25 mm |
550 ns |
|||||||||||
Toshiba |
INDUSTRIAL |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
83.33 ns |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
16 words |
5 |
4 |
SMALL OUTLINE |
1.27 mm |
85 Cel |
3-STATE |
16X4 |
16 |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-G16 |
6 V |
1.9 mm |
5.3 mm |
Not Qualified |
64 bit |
2 V |
REGISTER BASED |
e0 |
YES |
10.3 mm |
||||||||||||||||
|
Toshiba |
OTHER FIFO |
INDUSTRIAL |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
ASYNCHRONOUS |
16 words |
2/6 |
4 |
SMALL OUTLINE |
SOP16,.3 |
FIFOs |
1.27 mm |
85 Cel |
16X4 |
16 |
-40 Cel |
DUAL |
R-PDSO-G16 |
12 MHz |
Not Qualified |
|||||||||||||||||||||||||
Toshiba |
OTHER FIFO |
INDUSTRIAL |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
4 words |
5 |
2/6 |
16 |
SMALL OUTLINE |
SOP16,.3 |
FIFOs |
1.27 mm |
85 Cel |
3-STATE |
4X16 |
4 |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-G16 |
6 V |
1.9 mm |
12 MHz |
5.3 mm |
Not Qualified |
64 bit |
2 V |
e0 |
YES |
10.3 mm |
550 ns |
||||||||||||
Toshiba |
INDUSTRIAL |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
100 ns |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
16 words |
5 |
4 |
SMALL OUTLINE |
1.27 mm |
85 Cel |
3-STATE |
16X4 |
16 |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-G16 |
6 V |
1.9 mm |
5.3 mm |
Not Qualified |
64 bit |
2 V |
e0 |
YES |
10.3 mm |
|||||||||||||||||
Toshiba |
INDUSTRIAL |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
100 ns |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
16 words |
5 |
4 |
SMALL OUTLINE |
1.27 mm |
85 Cel |
3-STATE |
16X4 |
16 |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-G16 |
6 V |
1.9 mm |
5.3 mm |
Not Qualified |
64 bit |
2 V |
e0 |
YES |
10.3 mm |
|||||||||||||||||
|
Toshiba |
OTHER FIFO |
INDUSTRIAL |
16 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
THROUGH-HOLE |
ASYNCHRONOUS |
16 words |
2/6 |
4 |
IN-LINE |
DIP16,.3 |
FIFOs |
2.54 mm |
85 Cel |
16X4 |
16 |
-40 Cel |
DUAL |
R-PDIP-T16 |
12 MHz |
Not Qualified |
|||||||||||||||||||||||||
Toshiba |
INDUSTRIAL |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
83.33 ns |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
16 words |
5 |
4 |
SMALL OUTLINE |
1.27 mm |
85 Cel |
3-STATE |
16X4 |
16 |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-G16 |
6 V |
1.9 mm |
5.3 mm |
Not Qualified |
64 bit |
2 V |
REGISTER BASED |
e0 |
YES |
10.3 mm |
||||||||||||||||
Toshiba |
INDUSTRIAL |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
100 ns |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
16 words |
5 |
4 |
SMALL OUTLINE |
1.27 mm |
85 Cel |
3-STATE |
16X4 |
16 |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-G16 |
6 V |
1.9 mm |
5.3 mm |
Not Qualified |
64 bit |
2 V |
e0 |
YES |
10.3 mm |
|||||||||||||||||
|
Toshiba |
OTHER FIFO |
INDUSTRIAL |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
ASYNCHRONOUS |
16 words |
2/6 |
4 |
SMALL OUTLINE |
SOP16,.3 |
FIFOs |
1.27 mm |
85 Cel |
16X4 |
16 |
-40 Cel |
DUAL |
R-PDSO-G16 |
12 MHz |
Not Qualified |
|||||||||||||||||||||||||
|
Renesas Electronics |
COMMERCIAL |
128 |
LFQFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
10 ns |
2 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
256 words |
5 |
18 |
FLATPACK, LOW PROFILE, FINE PITCH |
.5 mm |
70 Cel |
256X18 |
256 |
0 Cel |
QUAD |
R-PQFP-G128 |
5.5 V |
1.6 mm |
14 mm |
4608 bit |
4.5 V |
NOT SPECIFIED |
NOT SPECIFIED |
YES |
20 mm |
6.5 ns |
|||||||||||||||||
|
Renesas Electronics |
BI-DIRECTIONAL FIFO |
COMMERCIAL |
64 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
25 ns |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
60 mA |
256 words |
5 |
5 |
9 |
FLATPACK, LOW PROFILE |
QFP64,.66SQ,32 |
FIFOs |
.8 mm |
70 Cel |
256X9 |
256 |
0 Cel |
Matte Tin (Sn) - annealed |
QUAD |
S-PQFP-G64 |
3 |
5.5 V |
1.6 mm |
40 MHz |
14 mm |
Not Qualified |
2304 bit |
4.5 V |
e3 |
30 |
260 |
YES |
.01 Amp |
14 mm |
15 ns |
||||||
Renesas Electronics |
BI-DIRECTIONAL FIFO |
COMMERCIAL |
128 |
QFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
SYNCHRONOUS |
100 mA |
512 words |
5 |
5 |
18 |
FLATPACK |
QFP128,.63X.87,20 |
FIFOs |
.5 mm |
70 Cel |
512X18 |
512 |
0 Cel |
TIN LEAD |
QUAD |
R-PQFP-G128 |
3 |
40 MHz |
Not Qualified |
9216 bit |
e0 |
.01 Amp |
15 ns |
||||||||||||||||||
|
Renesas Electronics |
COMMERCIAL |
121 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
20 ns |
2 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
256 words |
5 |
18 |
GRID ARRAY |
1.27 mm |
70 Cel |
256X18 |
256 |
0 Cel |
MATTE TIN |
BOTTOM |
S-PBGA-B121 |
5.5 V |
3.5 mm |
15 mm |
Not Qualified |
4608 bit |
4.5 V |
e3 |
YES |
15 mm |
6.5 ns |
||||||||||||||||
|
Renesas Electronics |
INDUSTRIAL |
56 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
25 ns |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
256 words |
5 |
9 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.5 mm |
85 Cel |
256X9 |
256 |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G56 |
1 |
5.5 V |
1.2 mm |
6.1 mm |
Not Qualified |
2304 bit |
4.5 V |
RETRANSMIT |
e3 |
NO |
14 mm |
15 ns |
||||||||||||||
Renesas Electronics |
OTHER FIFO |
COMMERCIAL |
121 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
15 ns |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
100 mA |
256 words |
5 |
5 |
18 |
GRID ARRAY |
BGA121,11X11,50 |
FIFOs |
1.27 mm |
70 Cel |
256X18 |
256 |
0 Cel |
TIN LEAD |
BOTTOM |
S-PBGA-B121 |
3 |
5.5 V |
3.5 mm |
66 MHz |
15 mm |
Not Qualified |
4608 bit |
4.5 V |
e0 |
225 |
YES |
.01 Amp |
15 mm |
10 ns |
||||||||
Renesas Electronics |
BI-DIRECTIONAL FIFO |
COMMERCIAL |
128 |
QFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
SYNCHRONOUS |
100 mA |
512 words |
5 |
5 |
18 |
FLATPACK |
QFP128,.63X.87,20 |
FIFOs |
.5 mm |
70 Cel |
512X18 |
512 |
0 Cel |
TIN LEAD |
QUAD |
R-PQFP-G128 |
3 |
100 MHz |
Not Qualified |
9216 bit |
e0 |
.01 Amp |
6.5 ns |
||||||||||||||||||
|
Renesas Electronics |
OTHER FIFO |
INDUSTRIAL |
128 |
LFQFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
15 ns |
2 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
100 mA |
256 words |
5 |
5 |
18 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP128,.63X.87,20 |
FIFOs |
.5 mm |
85 Cel |
256X18 |
256 |
-40 Cel |
Matte Tin (Sn) - annealed |
QUAD |
R-PQFP-G128 |
3 |
5.5 V |
1.6 mm |
66.7 MHz |
14 mm |
Not Qualified |
4608 bit |
4.5 V |
e3 |
30 |
260 |
YES |
.01 Amp |
20 mm |
10 ns |
||||||
|
Renesas Electronics |
COMMERCIAL |
121 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
25 ns |
2 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
256 words |
5 |
18 |
GRID ARRAY |
1.27 mm |
70 Cel |
256X18 |
256 |
0 Cel |
BOTTOM |
S-PBGA-B121 |
5.5 V |
15 mm |
4608 bit |
4.5 V |
30 |
260 |
YES |
15 mm |
15 ns |
||||||||||||||||||
|
Renesas Electronics |
BI-DIRECTIONAL FIFO |
COMMERCIAL |
64 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
25 ns |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
512 words |
5 |
9 |
FLATPACK, LOW PROFILE, FINE PITCH |
.5 mm |
70 Cel |
512X9 |
512 |
0 Cel |
QUAD |
S-PQFP-G64 |
5.5 V |
1.6 mm |
10 mm |
4608 bit |
4.5 V |
YES |
10 mm |
15 ns |
||||||||||||||||||
Renesas Electronics |
OTHER FIFO |
COMMERCIAL |
121 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
25 ns |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
100 mA |
256 words |
5 |
5 |
18 |
GRID ARRAY |
BGA121,11X11,50 |
FIFOs |
1.27 mm |
70 Cel |
256X18 |
256 |
0 Cel |
TIN LEAD |
BOTTOM |
S-PBGA-B121 |
3 |
5.5 V |
40 MHz |
15 mm |
Not Qualified |
4608 bit |
4.5 V |
e0 |
225 |
YES |
.01 Amp |
15 mm |
15 ns |
|||||||||
|
Renesas Electronics |
BI-DIRECTIONAL FIFO |
COMMERCIAL |
64 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
15 ns |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
512 words |
5 |
9 |
FLATPACK, LOW PROFILE, FINE PITCH |
.5 mm |
70 Cel |
512X9 |
512 |
0 Cel |
QUAD |
S-PQFP-G64 |
5.5 V |
1.6 mm |
10 mm |
4608 bit |
4.5 V |
YES |
10 mm |
10 ns |
||||||||||||||||||
|
Renesas Electronics |
BI-DIRECTIONAL FIFO |
INDUSTRIAL |
64 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
25 ns |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
512 words |
5 |
9 |
FLATPACK, LOW PROFILE |
.8 mm |
85 Cel |
512X9 |
512 |
-40 Cel |
QUAD |
S-PQFP-G64 |
5.5 V |
1.6 mm |
14 mm |
4608 bit |
4.5 V |
YES |
14 mm |
15 ns |
||||||||||||||||||
|
Renesas Electronics |
INDUSTRIAL |
121 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
15 ns |
2 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
256 words |
5 |
18 |
GRID ARRAY |
1.27 mm |
85 Cel |
256X18 |
256 |
-40 Cel |
BOTTOM |
S-PBGA-B121 |
5.5 V |
3.5 mm |
15 mm |
4608 bit |
4.5 V |
30 |
260 |
YES |
15 mm |
10 ns |
|||||||||||||||||
|
Renesas Electronics |
BI-DIRECTIONAL FIFO |
INDUSTRIAL |
64 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
15 ns |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
60 mA |
256 words |
5 |
5 |
9 |
FLATPACK, LOW PROFILE |
QFP64,.66SQ,32 |
FIFOs |
.8 mm |
85 Cel |
256X9 |
256 |
-40 Cel |
Matte Tin (Sn) - annealed |
QUAD |
S-PQFP-G64 |
3 |
5.5 V |
1.6 mm |
66.7 MHz |
14 mm |
Not Qualified |
2304 bit |
4.5 V |
e3 |
30 |
260 |
YES |
.01 Amp |
14 mm |
10 ns |
||||||
|
Renesas Electronics |
BI-DIRECTIONAL FIFO |
COMMERCIAL |
64 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
25 ns |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
256 words |
5 |
9 |
FLATPACK, LOW PROFILE |
.8 mm |
70 Cel |
256X9 |
256 |
0 Cel |
QUAD |
S-PQFP-G64 |
5.5 V |
1.6 mm |
14 mm |
2304 bit |
4.5 V |
YES |
14 mm |
15 ns |
||||||||||||||||||
|
Renesas Electronics |
BI-DIRECTIONAL FIFO |
COMMERCIAL |
64 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
10 ns |
2 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
60 mA |
256 words |
5 |
5 |
9 |
FLATPACK, LOW PROFILE |
QFP64,.66SQ,32 |
FIFOs |
.8 mm |
70 Cel |
256X9 |
256 |
0 Cel |
MATTE TIN |
QUAD |
S-PQFP-G64 |
3 |
5.5 V |
1.6 mm |
100 MHz |
14 mm |
Not Qualified |
2304 bit |
4.5 V |
e3 |
30 |
260 |
YES |
.01 Amp |
14 mm |
6.5 ns |
||||||
|
Renesas Electronics |
COMMERCIAL |
128 |
LFQFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
25 ns |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
256 words |
5 |
18 |
FLATPACK, LOW PROFILE, FINE PITCH |
.5 mm |
70 Cel |
256X18 |
256 |
0 Cel |
MATTE TIN |
QUAD |
R-PQFP-G128 |
3 |
5.5 V |
1.6 mm |
14 mm |
Not Qualified |
4608 bit |
4.5 V |
e3 |
YES |
20 mm |
15 ns |
|||||||||||||||
Renesas Electronics |
BI-DIRECTIONAL FIFO |
COMMERCIAL |
121 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
SYNCHRONOUS |
100 mA |
512 words |
5 |
5 |
18 |
GRID ARRAY |
BGA121,11X11,50 |
FIFOs |
1.27 mm |
70 Cel |
512X18 |
512 |
0 Cel |
TIN LEAD |
BOTTOM |
S-PBGA-B121 |
66.7 MHz |
Not Qualified |
9216 bit |
e0 |
.01 Amp |
10 ns |
|||||||||||||||||||
|
Renesas Electronics |
OTHER FIFO |
COMMERCIAL |
128 |
LFQFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
10 ns |
2 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
100 mA |
256 words |
5 |
5 |
18 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP128,.63X.87,20 |
FIFOs |
.5 mm |
70 Cel |
256X18 |
256 |
0 Cel |
MATTE TIN |
QUAD |
R-PQFP-G128 |
3 |
5.5 V |
1.6 mm |
100 MHz |
14 mm |
Not Qualified |
4608 bit |
4.5 V |
e3 |
30 |
260 |
YES |
.01 Amp |
20 mm |
6.5 ns |
||||||
|
Renesas Electronics |
BI-DIRECTIONAL FIFO |
COMMERCIAL |
64 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
10 ns |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
60 mA |
256 words |
5 |
5 |
9 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP64,.47SQ,20 |
FIFOs |
.5 mm |
70 Cel |
256X9 |
256 |
0 Cel |
Matte Tin (Sn) - annealed |
QUAD |
S-PQFP-G64 |
3 |
5.5 V |
1.6 mm |
100 MHz |
10 mm |
Not Qualified |
2304 bit |
4.5 V |
e3 |
30 |
260 |
YES |
.01 Amp |
10 mm |
6.5 ns |
||||||
|
Renesas Electronics |
OTHER FIFO |
COMMERCIAL |
56 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
20 ns |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
125 mA |
256 words |
5 |
5 |
9 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP56,.3,20 |
FIFOs |
.5 mm |
70 Cel |
256X9 |
256 |
0 Cel |
MATTE TIN |
DUAL |
R-PDSO-G56 |
1 |
5.5 V |
1.2 mm |
50 MHz |
6.1 mm |
Not Qualified |
2304 bit |
4.5 V |
RETRANSMIT |
e3 |
30 |
260 |
NO |
.015 Amp |
14 mm |
12 ns |
|||||
Renesas Electronics |
|||||||||||||||||||||||||||||||||||||||||||||||||||
|
Renesas Electronics |
BI-DIRECTIONAL FIFO |
INDUSTRIAL |
64 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
25 ns |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
60 mA |
256 words |
5 |
5 |
9 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP64,.47SQ,20 |
FIFOs |
.5 mm |
85 Cel |
256X9 |
256 |
-40 Cel |
Matte Tin (Sn) - annealed |
QUAD |
S-PQFP-G64 |
3 |
5.5 V |
1.6 mm |
40 MHz |
10 mm |
Not Qualified |
2304 bit |
4.5 V |
e3 |
30 |
260 |
YES |
.01 Amp |
10 mm |
15 ns |
||||||
Renesas Electronics |
COMMERCIAL |
56 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
25 ns |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
512 words |
5 |
9 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.5 mm |
70 Cel |
512X9 |
512 |
0 Cel |
DUAL |
R-PDSO-G56 |
5.5 V |
1.2 mm |
6.1 mm |
4608 bit |
4.5 V |
RETRANSMIT |
NO |
14 mm |
15 ns |
|||||||||||||||||||
|
Renesas Electronics |
COMMERCIAL |
121 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
10 ns |
2 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
256 words |
5 |
18 |
GRID ARRAY |
1.27 mm |
70 Cel |
256X18 |
256 |
0 Cel |
MATTE TIN |
BOTTOM |
S-PBGA-B121 |
5.5 V |
3.5 mm |
15 mm |
Not Qualified |
4608 bit |
4.5 V |
e3 |
YES |
15 mm |
6.5 ns |
||||||||||||||||
|
Renesas Electronics |
COMMERCIAL |
121 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
15 ns |
2 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
256 words |
5 |
18 |
GRID ARRAY |
1.27 mm |
70 Cel |
256X18 |
256 |
0 Cel |
BOTTOM |
S-PBGA-B121 |
5.5 V |
3.5 mm |
15 mm |
4608 bit |
4.5 V |
30 |
260 |
YES |
15 mm |
10 ns |
FIFO, or First-In, First-Out, is a type of digital circuit that is used in computer systems and digital devices to manage the flow of data. A FIFO circuit stores data in a buffer and retrieves the data in the same order in which it was received, with the first data received being the first data to be retrieved.
FIFO circuits are used in many applications where data needs to be stored and retrieved in a specific order, such as in data communication systems, disk drives, and multimedia devices. For example, in a data communication system, a FIFO circuit can be used to store incoming data packets in a buffer and retrieve them in the order in which they were received, ensuring that the data is processed correctly and in a timely manner.
FIFO circuits are typically implemented using a combination of flip-flops, multiplexers, and control logic. The control logic manages the input and output of data to the FIFO buffer and ensures that the data is stored and retrieved in the correct order.
One of the advantages of using a FIFO circuit is that it provides a simple and efficient way to manage the flow of data. FIFO circuits are easy to implement and can handle large amounts of data. They can also be used in conjunction with other types of digital circuits to implement more complex data processing algorithms.