9 Flash Memory 5

Reset All
Part RoHS Manufacturer Memory IC Type Temperature Grade No. of Terminals Package Code Package Shape Package Body Material Surface Mount No. of Functions Technology Screening Level Terminal Form Parallel or Serial Operating Mode Sector Size (Words) Maximum Supply Current No. of Words Input/Output Type Nominal Supply Voltage / Vsup (V) Mixed Memory Type Toggle Bit Power Supplies (V) Memory Width Package Style (Meter) Package Equivalence Code Alternate Memory Width Sub-Category Minimum Data Retention Time Terminal Pitch Maximum Operating Temperature Reverse Pinout Output Characteristics Organization No. of Words Code Minimum Operating Temperature No. of Sectors/Size Command User Interface Terminal Finish Ready or Busy Terminal Position No. of Ports Write Protection JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Supply Voltage (Vsup) Maximum Seated Height Endurance Maximum Clock Frequency (fCLK) Width Qualification Maximum Write Cycle Time (tWC) Serial Bus Type Boot Block Memory Density Minimum Supply Voltage (Vsup) Additional Features Page Size (words) JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Type Maximum Standby Current Length Common Flash Interface Maximum Access Time Programming Voltage (V) Data Polling

THNSW016GAA-C

Toshiba

FLASH CARD

OTHER

9

DIE

RECTANGULAR

UNSPECIFIED

YES

1

CMOS

NO LEAD

SERIAL

SYNCHRONOUS

17179869184 words

3.3

8

UNCASED CHIP

85 Cel

16GX8

16G

-25 Cel

UPPER

R-XUUC-N9

3.6 V

2.25 mm

24 mm

25 ms

137438953472 bit

2.7 V

32 mm

3.3

THNSW032GAA-C

Toshiba

FLASH CARD

OTHER

9

DIE

RECTANGULAR

UNSPECIFIED

YES

1

CMOS

NO LEAD

SERIAL

SYNCHRONOUS

34359738368 words

3.3

8

UNCASED CHIP

85 Cel

32GX8

32G

-25 Cel

UPPER

R-XUUC-N9

3.6 V

2.25 mm

24 mm

25 ms

274877906944 bit

2.7 V

32 mm

3.3

THNSW008GAA-C

Toshiba

FLASH CARD

OTHER

9

DIE

RECTANGULAR

UNSPECIFIED

YES

1

CMOS

NO LEAD

SERIAL

SYNCHRONOUS

8589934592 words

3.3

8

UNCASED CHIP

85 Cel

8GX8

8G

-25 Cel

UPPER

R-XUUC-N9

3.6 V

2.25 mm

24 mm

25 ms

68719476736 bit

2.7 V

32 mm

3.3

AT45DQ161-CCUF-T

Renesas Electronics

FLASH

INDUSTRIAL

9

VBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

SYNCHRONOUS

16777216 words

3

1

GRID ARRAY, VERY THIN PROFILE

1 mm

85 Cel

16MX1

16M

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

S-PBGA-B9

3.6 V

.6 mm

100 MHz

6 mm

16777216 bit

2.5 V

IT ALSO OPERATES AT FREQUENCY 85 MHZ AT 2.3 TO 3.6 V SUPPLY VOLTAGE

e1

6 mm

3

AT45DQ321-CCUF-T

Renesas Electronics

FLASH

INDUSTRIAL

9

VBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

SYNCHRONOUS

33554432 words

3

1

GRID ARRAY, VERY THIN PROFILE

1 mm

85 Cel

32MX1

32M

-40 Cel

BOTTOM

S-PBGA-B9

3.6 V

.6 mm

104 MHz

6 mm

33554432 bit

2.3 V

NOT SPECIFIED

NOT SPECIFIED

6 mm

3

Flash Memory

Flash memory is a type of non-volatile computer memory that is commonly used in digital devices such as USB drives, solid-state drives, and digital cameras. It is a type of EEPROM (Electrically Erasable Programmable Read-Only Memory) that allows data to be erased and reprogrammed in blocks instead of one byte at a time. Flash memory uses a floating gate transistor to store data, which allows it to retain information even when the power is turned off.

Flash memory is widely used in digital devices because of its high capacity, small size, and fast access times. It is also more durable than other types of memory, such as hard disk drives, because it has no moving parts. This makes it ideal for use in portable devices that may be subject to physical shock or vibration.

There are two types of flash memory: NOR flash and NAND flash. NOR flash is faster than NAND flash, but it has lower density and higher cost per bit. NOR flash is typically used for code storage, such as firmware or boot code, because it provides faster access times. NAND flash has higher density and lower cost per bit, which makes it ideal for data storage applications.

Flash memory has a limited lifespan, as it can only be erased and reprogrammed a limited number of times. This is because the process of erasing and reprogramming the memory causes wear and tear on the floating gate transistor. However, modern flash memory devices have a sophisticated wear-leveling algorithm that distributes writes evenly across the memory, which extends the lifespan of the device.