SQUARE Flash Memory 2,400+

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Part RoHS Manufacturer Memory IC Type Temperature Grade No. of Terminals Package Code Package Shape Package Body Material Surface Mount No. of Functions Technology Screening Level Terminal Form Parallel or Serial Operating Mode Sector Size (Words) Maximum Supply Current No. of Words Input/Output Type Nominal Supply Voltage / Vsup (V) Mixed Memory Type Toggle Bit Power Supplies (V) Memory Width Package Style (Meter) Package Equivalence Code Alternate Memory Width Sub-Category Minimum Data Retention Time Terminal Pitch Maximum Operating Temperature Reverse Pinout Output Characteristics Organization No. of Words Code Minimum Operating Temperature No. of Sectors/Size Command User Interface Terminal Finish Ready or Busy Terminal Position No. of Ports Write Protection JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Supply Voltage (Vsup) Maximum Seated Height Endurance Maximum Clock Frequency (fCLK) Width Qualification Maximum Write Cycle Time (tWC) Serial Bus Type Boot Block Memory Density Minimum Supply Voltage (Vsup) Additional Features Page Size (words) JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Type Maximum Standby Current Length Common Flash Interface Maximum Access Time Programming Voltage (V) Data Polling

S28HS01GTFPBHI033

Infineon Technologies

FLASH

24

VBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

SYNCHRONOUS

100 mA

134217728 words

1.8

8

GRID ARRAY, VERY THIN PROFILE

BGA24,5X5,40

25

1 mm

85 Cel

3-STATE

128MX8

128M

-40 Cel

BOTTOM

HARDWARE

S-PBGA-B24

3

2 V

1 mm

300000 Write/Erase Cycles

166 MHz

8 mm

SPI

1073741824 bit

1.7 V

NOR TYPE

.00016 Amp

8 mm

1.8

S29GL128S110DHIV20

Infineon Technologies

FLASH

64

LBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

128K

100 mA

16777216 words

3

YES

8

GRID ARRAY, LOW PROFILE

BGA64,8X8,40

20

1 mm

85 Cel

3-STATE

16MX8

16M

-40 Cel

128

YES

TIN SILVER COPPER

YES

BOTTOM

S-PBGA-B64

3

3.6 V

1.4 mm

100000 Write/Erase Cycles

9 mm

.00006 ms

134217728 bit

2.7 V

32

e1

30

260

NAND TYPE

.0001 Amp

9 mm

YES

110 ns

3

YES

S28HL01GTGABHB033

Infineon Technologies

FLASH

24

VBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

BALL

SERIAL

SYNCHRONOUS

134217728 words

3

8

GRID ARRAY, VERY THIN PROFILE

BGA24,5X5,40

1

25

1 mm

105 Cel

3-STATE

128MX8

128M

-40 Cel

BOTTOM

HARDWARE

S-PBGA-B24

3.6 V

1 mm

2560000 Write/Erase Cycles

200 MHz

8 mm

SPI

1073741824 bit

2.7 V

NOR TYPE

8 mm

3

S28HL01GTGABHM030

Infineon Technologies

FLASH

24

VBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

BALL

SERIAL

SYNCHRONOUS

134217728 words

3

8

GRID ARRAY, VERY THIN PROFILE

BGA24,5X5,40

1

25

1 mm

125 Cel

3-STATE

128MX8

128M

-40 Cel

BOTTOM

HARDWARE

S-PBGA-B24

3.6 V

1 mm

2560000 Write/Erase Cycles

200 MHz

8 mm

SPI

1073741824 bit

2.7 V

NOR TYPE

8 mm

3

S28HS01GTFPBHV030

Infineon Technologies

FLASH

24

VBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

SYNCHRONOUS

100 mA

134217728 words

1.8

8

GRID ARRAY, VERY THIN PROFILE

BGA24,5X5,40

25

1 mm

105 Cel

3-STATE

128MX8

128M

-40 Cel

BOTTOM

HARDWARE

S-PBGA-B24

3

2 V

1 mm

300000 Write/Erase Cycles

166 MHz

8 mm

SPI

1073741824 bit

1.7 V

NOR TYPE

.000132 Amp

8 mm

1.8

S29GL512T12DHBV30

Infineon Technologies

FLASH

INDUSTRIAL

64

LBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

BALL

PARALLEL

ASYNCHRONOUS

33554432 words

3

16

GRID ARRAY, LOW PROFILE

8

1 mm

105 Cel

32MX16

32M

-40 Cel

BOTTOM

S-PBGA-B64

3.6 V

1.4 mm

9 mm

536870912 bit

2.7 V

CAN ALSO BE ORGANISED AS 512MX1

NOR TYPE

9 mm

120 ns

2.7

S29GL512S12DAE013

Infineon Technologies

FLASH

64

LBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

64K

60 mA

33554432 words

3

YES

16

GRID ARRAY, LOW PROFILE

BGA64,8X8,40

20

1 mm

125 Cel

3-STATE

32MX16

32M

-55 Cel

512

YES

YES

BOTTOM

S-PBGA-B64

3.6 V

1.4 mm

100 Write/Erase Cycles

9 mm

.00006 ms

536870912 bit

2.7 V

16

NOR TYPE

.0002 Amp

9 mm

YES

120 ns

3

YES

S29GL512S12DAE010

Infineon Technologies

FLASH

64

LBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

64K

60 mA

33554432 words

3

YES

16

GRID ARRAY, LOW PROFILE

BGA64,8X8,40

20

1 mm

125 Cel

3-STATE

32MX16

32M

-55 Cel

512

YES

YES

BOTTOM

S-PBGA-B64

3.6 V

1.4 mm

100 Write/Erase Cycles

9 mm

.00006 ms

536870912 bit

2.7 V

16

NOR TYPE

.0002 Amp

9 mm

YES

120 ns

3

YES

S26HL01GTFPBHI003

Infineon Technologies

FLASH

24

VBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

SYNCHRONOUS

134217728 words

3

8

GRID ARRAY, VERY THIN PROFILE

BGA24,5X5,40

25

1 mm

85 Cel

OPEN-DRAIN

128MX8

128M

-40 Cel

BOTTOM

HARDWARE

S-PBGA-B24

3.6 V

1 mm

2560000 Write/Erase Cycles

166 MHz

8 mm

SPI

1073741824 bit

2.7 V

NOR TYPE

8 mm

3

S26HS01GTFPBHM033

Infineon Technologies

FLASH

24

VBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

BALL

SERIAL

SYNCHRONOUS

134217728 words

1.8

8

GRID ARRAY, VERY THIN PROFILE

BGA24,5X5,40

25

1 mm

125 Cel

OPEN-DRAIN

128MX8

128M

-40 Cel

BOTTOM

HARDWARE

S-PBGA-B24

2 V

1 mm

2560000 Write/Erase Cycles

166 MHz

8 mm

SPI

1073741824 bit

1.7 V

NOT SPECIFIED

NOT SPECIFIED

NOR TYPE

8 mm

1.8

S29GL064N11DFAV23

Infineon Technologies

FLASH

INDUSTRIAL

64

LBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

BALL

PARALLEL

ASYNCHRONOUS

4194304 words

3

16

GRID ARRAY, LOW PROFILE

8

1 mm

85 Cel

4MX16

4M

-40 Cel

BOTTOM

S-PBGA-B64

3.6 V

1.4 mm

9 mm

BOTTOM/TOP

67108864 bit

2.7 V

NOR TYPE

9 mm

110 ns

3

S29GL01GT11DHV013

Infineon Technologies

FLASH

INDUSTRIAL

64

LBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

67108864 words

3

16

GRID ARRAY, LOW PROFILE

1 mm

105 Cel

64MX16

64M

-40 Cel

BOTTOM

S-PBGA-B64

3.6 V

1.4 mm

9 mm

BOTTOM/TOP

1073741824 bit

2.7 V

NOR TYPE

9 mm

110 ns

2.7

S26HL01GTFPBHB020

Infineon Technologies

FLASH

24

VBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

BALL

SERIAL

SYNCHRONOUS

134217728 words

3

8

GRID ARRAY, VERY THIN PROFILE

BGA24,5X5,40

25

1 mm

105 Cel

OPEN-DRAIN

128MX8

128M

-40 Cel

BOTTOM

HARDWARE

S-PBGA-B24

3.6 V

1 mm

2560000 Write/Erase Cycles

166 MHz

8 mm

SPI

1073741824 bit

2.7 V

NOT SPECIFIED

NOT SPECIFIED

NOR TYPE

8 mm

3

S28HS01GTFPBHA030

Infineon Technologies

FLASH

24

VBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

BALL

SERIAL

SYNCHRONOUS

100 mA

134217728 words

1.8

8

GRID ARRAY, VERY THIN PROFILE

BGA24,5X5,40

25

1 mm

85 Cel

3-STATE

128MX8

128M

-40 Cel

BOTTOM

HARDWARE

S-PBGA-B24

2 V

1 mm

300000 Write/Erase Cycles

166 MHz

8 mm

SPI

1073741824 bit

1.7 V

NOR TYPE

.00016 Amp

8 mm

1.8

S29GL01GT11DHV033

Infineon Technologies

FLASH

INDUSTRIAL

64

LBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

67108864 words

3

16

GRID ARRAY, LOW PROFILE

1 mm

105 Cel

64MX16

64M

-40 Cel

BOTTOM

S-PBGA-B64

3.6 V

1.4 mm

9 mm

1073741824 bit

2.7 V

NOR TYPE

9 mm

110 ns

2.7

S29GL032N90DFA012

Infineon Technologies

FLASH

INDUSTRIAL

64

LBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

BALL

PARALLEL

ASYNCHRONOUS

2097152 words

3

16

GRID ARRAY, LOW PROFILE

8

1 mm

85 Cel

2MX16

2M

-40 Cel

BOTTOM

S-PBGA-B64

3.6 V

1.4 mm

9 mm

BOTTOM/TOP

33554432 bit

2.7 V

NOR TYPE

9 mm

90 ns

3

S29GL032N90DFI32

Infineon Technologies

FLASH

INDUSTRIAL

64

LBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

2097152 words

3

16

GRID ARRAY, LOW PROFILE

8

1 mm

85 Cel

2MX16

2M

-40 Cel

BOTTOM

S-PBGA-B64

3.6 V

1.4 mm

9 mm

Not Qualified

33554432 bit

2.7 V

9 mm

90 ns

3

S29GL032N90DFI012

Infineon Technologies

FLASH

INDUSTRIAL

64

LBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

64K

50 mA

2097152 words

3

YES

3/3.3

16

GRID ARRAY, LOW PROFILE

BGA64,8X8,40

8

Flash Memories

1 mm

85 Cel

2MX16

2M

-40 Cel

64

YES

YES

BOTTOM

S-PBGA-B64

3.6 V

1.4 mm

9 mm

Not Qualified

BOTTOM/TOP

33554432 bit

2.7 V

8/16

NOR TYPE

.000005 Amp

9 mm

YES

90 ns

3

YES

S29GL064N90DFI012

Infineon Technologies

FLASH

INDUSTRIAL

64

LBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

64K

50 mA

4194304 words

3

YES

3/3.3

16

GRID ARRAY, LOW PROFILE

BGA64,8X8,40

8

Flash Memories

1 mm

85 Cel

4MX16

4M

-40 Cel

128

YES

TIN SILVER COPPER

YES

BOTTOM

S-PBGA-B64

3

3.6 V

1.4 mm

9 mm

Not Qualified

67108864 bit

2.7 V

8/16

e1

NOR TYPE

.000005 Amp

9 mm

YES

90 ns

1.8

YES

S26HS01GTGABHB013

Infineon Technologies

FLASH

24

VBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

BALL

SERIAL

SYNCHRONOUS

134217728 words

1.8

8

GRID ARRAY, VERY THIN PROFILE

BGA24,5X5,40

25

1 mm

105 Cel

OPEN-DRAIN

128MX8

128M

-40 Cel

BOTTOM

HARDWARE

S-PBGA-B24

2 V

1 mm

2560000 Write/Erase Cycles

200 MHz

8 mm

SPI

1073741824 bit

1.7 V

NOR TYPE

8 mm

1.8

S26HL01GTGABHI013

Infineon Technologies

FLASH

24

VBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

SYNCHRONOUS

134217728 words

3

8

GRID ARRAY, VERY THIN PROFILE

BGA24,5X5,40

25

1 mm

85 Cel

OPEN-DRAIN

128MX8

128M

-40 Cel

BOTTOM

HARDWARE

S-PBGA-B24

3.6 V

1 mm

2560000 Write/Erase Cycles

200 MHz

8 mm

SPI

1073741824 bit

2.7 V

NOR TYPE

8 mm

3

S26HL01GTGABHM023

Infineon Technologies

FLASH

24

VBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

BALL

SERIAL

SYNCHRONOUS

134217728 words

3

8

GRID ARRAY, VERY THIN PROFILE

BGA24,5X5,40

25

1 mm

125 Cel

OPEN-DRAIN

128MX8

128M

-40 Cel

BOTTOM

HARDWARE

S-PBGA-B24

3.6 V

1 mm

2560000 Write/Erase Cycles

200 MHz

8 mm

SPI

1073741824 bit

2.7 V

NOR TYPE

8 mm

3

S26HS01GTFPBHV013

Infineon Technologies

FLASH

24

VBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

SYNCHRONOUS

134217728 words

1.8

8

GRID ARRAY, VERY THIN PROFILE

BGA24,5X5,40

25

1 mm

105 Cel

OPEN-DRAIN

128MX8

128M

-40 Cel

BOTTOM

HARDWARE

S-PBGA-B24

2 V

1 mm

2560000 Write/Erase Cycles

166 MHz

8 mm

SPI

1073741824 bit

1.7 V

NOR TYPE

8 mm

1.8

S29GL01GS10DHA023

Infineon Technologies

FLASH

INDUSTRIAL

64

LBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

BALL

PARALLEL

ASYNCHRONOUS

134217728 words

3

8

GRID ARRAY, LOW PROFILE

1 mm

85 Cel

128MX8

128M

-40 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B64

3

3.6 V

1.4 mm

9 mm

1073741824 bit

2.7 V

e1

30

260

9 mm

100 ns

3

S29GL064S90DHVV13

Infineon Technologies

FLASH

INDUSTRIAL

64

LBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

8388608 words

3

8

GRID ARRAY, LOW PROFILE

1 mm

105 Cel

8MX8

8M

-40 Cel

BOTTOM

S-PBGA-B64

3.6 V

1.4 mm

9 mm

BOTTOM/TOP

67108864 bit

2.7 V

NOR TYPE

9 mm

90 ns

3

S29GL01GT11DHIV43

Infineon Technologies

FLASH

INDUSTRIAL

64

LBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

67108864 words

3

16

GRID ARRAY, LOW PROFILE

1 mm

85 Cel

64MX16

64M

-40 Cel

BOTTOM

S-PBGA-B64

3.6 V

1.4 mm

9 mm

BOTTOM/TOP

1073741824 bit

2.7 V

NOR TYPE

9 mm

110 ns

2.7

S26HL01GTFPBHM003

Infineon Technologies

FLASH

24

VBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

BALL

SERIAL

SYNCHRONOUS

134217728 words

3

8

GRID ARRAY, VERY THIN PROFILE

BGA24,5X5,40

25

1 mm

125 Cel

OPEN-DRAIN

128MX8

128M

-40 Cel

BOTTOM

HARDWARE

S-PBGA-B24

3.6 V

1 mm

2560000 Write/Erase Cycles

166 MHz

8 mm

SPI

1073741824 bit

2.7 V

NOR TYPE

8 mm

3

S28HL01GTGABHV030

Infineon Technologies

FLASH

24

VBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

SYNCHRONOUS

134217728 words

3

8

GRID ARRAY, VERY THIN PROFILE

BGA24,5X5,40

1

25

1 mm

105 Cel

3-STATE

128MX8

128M

-40 Cel

BOTTOM

HARDWARE

S-PBGA-B24

3.6 V

1 mm

2560000 Write/Erase Cycles

200 MHz

8 mm

SPI

1073741824 bit

2.7 V

NOR TYPE

8 mm

3

S28HL01GTFPBHM030

Infineon Technologies

FLASH

24

VBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

BALL

SERIAL

SYNCHRONOUS

100 mA

134217728 words

3

8

GRID ARRAY, VERY THIN PROFILE

BGA24,5X5,40

25

1 mm

125 Cel

3-STATE

128MX8

128M

-40 Cel

BOTTOM

HARDWARE

S-PBGA-B24

3

3.6 V

1 mm

300000 Write/Erase Cycles

166 MHz

8 mm

SPI

1073741824 bit

2.7 V

NOR TYPE

.00049 Amp

8 mm

3

S26HS01GTFPBHB013

Infineon Technologies

FLASH

24

VBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

BALL

SERIAL

SYNCHRONOUS

134217728 words

1.8

8

GRID ARRAY, VERY THIN PROFILE

BGA24,5X5,40

25

1 mm

105 Cel

OPEN-DRAIN

128MX8

128M

-40 Cel

BOTTOM

HARDWARE

S-PBGA-B24

2 V

1 mm

2560000 Write/Erase Cycles

166 MHz

8 mm

SPI

1073741824 bit

1.7 V

NOR TYPE

8 mm

1.8

S29GL256S10DHI013

Infineon Technologies

FLASH

INDUSTRIAL

64

LBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

64K

80 mA

33554432 words

3

YES

3/3.3

8

GRID ARRAY, LOW PROFILE

BGA64,8X8,40

Flash Memories

1 mm

85 Cel

32MX8

32M

-40 Cel

256

YES

TIN SILVER COPPER

YES

BOTTOM

S-PBGA-B64

3

3.6 V

1.4 mm

9 mm

Not Qualified

268435456 bit

2.7 V

16

e1

30

260

NOR TYPE

.0001 Amp

9 mm

YES

100 ns

2.7

YES

S29GL01GT11DHIV13

Infineon Technologies

FLASH

INDUSTRIAL

64

LBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

67108864 words

3

16

GRID ARRAY, LOW PROFILE

1 mm

85 Cel

64MX16

64M

-40 Cel

BOTTOM

S-PBGA-B64

3.6 V

1.4 mm

9 mm

1073741824 bit

2.7 V

NOR TYPE

9 mm

110 ns

2.7

S29GL032N11DFIV23

Infineon Technologies

FLASH

INDUSTRIAL

64

LBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

64K

50 mA

2097152 words

3

YES

1.8/3.3,3/3.3

16

GRID ARRAY, LOW PROFILE

BGA64,8X8,40

8

Flash Memories

1 mm

85 Cel

2MX16

2M

-40 Cel

64

YES

YES

BOTTOM

S-PBGA-B64

3.6 V

1.4 mm

9 mm

Not Qualified

BOTTOM/TOP

33554432 bit

2.7 V

8/16

NOR TYPE

.000005 Amp

9 mm

YES

110 ns

3

YES

S29GL512T12DHN040

Infineon Technologies

FLASH

AUTOMOTIVE

64

LBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

33554432 words

3

16

GRID ARRAY, LOW PROFILE

8

1 mm

125 Cel

32MX16

32M

-40 Cel

BOTTOM

S-PBGA-B64

3.6 V

1.4 mm

9 mm

BOTTOM/TOP

536870912 bit

2.7 V

NOR TYPE

9 mm

120 ns

2.7

S28HL01GTFPBHA033

Infineon Technologies

FLASH

24

VBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

BALL

SERIAL

SYNCHRONOUS

100 mA

134217728 words

3

8

GRID ARRAY, VERY THIN PROFILE

BGA24,5X5,40

25

1 mm

85 Cel

3-STATE

128MX8

128M

-40 Cel

BOTTOM

HARDWARE

S-PBGA-B24

3.6 V

1 mm

300000 Write/Erase Cycles

166 MHz

8 mm

SPI

1073741824 bit

2.7 V

NOR TYPE

.00016 Amp

8 mm

3

S29GL01GS12DHE023

Infineon Technologies

FLASH

64

LBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

64K

60 mA

67108864 words

3

YES

16

GRID ARRAY, LOW PROFILE

BGA64,8X8,40

20

1 mm

125 Cel

3-STATE

64MX16

64M

-55 Cel

1K

YES

YES

BOTTOM

S-PBGA-B64

3

3.6 V

1.4 mm

100 Write/Erase Cycles

9 mm

.00006 ms

1073741824 bit

2.7 V

16

NOR TYPE

.0002 Amp

9 mm

YES

120 ns

3

YES

S29GL256S12DHE023

Infineon Technologies

FLASH

64

LBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

64K

60 mA

16777216 words

3

YES

16

GRID ARRAY, LOW PROFILE

BGA64,8X8,40

20

1 mm

125 Cel

3-STATE

16MX16

16M

-55 Cel

256

YES

YES

BOTTOM

S-PBGA-B64

3.6 V

1.4 mm

100 Write/Erase Cycles

9 mm

.00006 ms

268435456 bit

2.7 V

16

NOR TYPE

.0002 Amp

9 mm

YES

120 ns

3

YES

S29GL512S100DHI010

Infineon Technologies

FLASH

64

LBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

128K

100 mA

67108864 words

3

YES

8

GRID ARRAY, LOW PROFILE

BGA64,8X8,40

20

1 mm

85 Cel

3-STATE

64MX8

64M

-40 Cel

512

YES

YES

BOTTOM

S-PBGA-B64

3.6 V

1.4 mm

100000 Write/Erase Cycles

9 mm

.00006 ms

536870912 bit

2.7 V

32

NAND TYPE

.0001 Amp

9 mm

YES

100 ns

3

YES

S26HS01GTGABHI010

Infineon Technologies

FLASH

24

VBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

SYNCHRONOUS

134217728 words

1.8

8

GRID ARRAY, VERY THIN PROFILE

BGA24,5X5,40

25

1 mm

85 Cel

OPEN-DRAIN

128MX8

128M

-40 Cel

BOTTOM

HARDWARE

S-PBGA-B24

2 V

1 mm

2560000 Write/Erase Cycles

200 MHz

8 mm

SPI

1073741824 bit

1.7 V

NOR TYPE

8 mm

1.8

S29GL064S80DHV023

Infineon Technologies

FLASH

INDUSTRIAL

64

LBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

64K

80 mA

4194304 words

3

YES

16

GRID ARRAY, LOW PROFILE

BGA64,8X8,40

8

20

1 mm

105 Cel

3-STATE

4MX16

4M

-40 Cel

128

YES

BOTTOM

S-PBGA-B64

3

3.6 V

1.4 mm

100000 Write/Erase Cycles

9 mm

67108864 bit

2.7 V

8/16

NOR TYPE

.0001 Amp

9 mm

80 ns

3

YES

S26HS01GTGABHA033

Infineon Technologies

FLASH

24

VBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

BALL

SERIAL

SYNCHRONOUS

134217728 words

1.8

8

GRID ARRAY, VERY THIN PROFILE

BGA24,5X5,40

25

1 mm

85 Cel

OPEN-DRAIN

128MX8

128M

-40 Cel

BOTTOM

HARDWARE

S-PBGA-B24

2 V

1 mm

2560000 Write/Erase Cycles

200 MHz

8 mm

SPI

1073741824 bit

1.7 V

NOT SPECIFIED

NOT SPECIFIED

NOR TYPE

8 mm

1.8

S26HS01GTGABHI023

Infineon Technologies

FLASH

24

VBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

SYNCHRONOUS

134217728 words

1.8

8

GRID ARRAY, VERY THIN PROFILE

BGA24,5X5,40

25

1 mm

85 Cel

OPEN-DRAIN

128MX8

128M

-40 Cel

BOTTOM

HARDWARE

S-PBGA-B24

2 V

1 mm

2560000 Write/Erase Cycles

200 MHz

8 mm

SPI

1073741824 bit

1.7 V

NOT SPECIFIED

NOT SPECIFIED

NOR TYPE

8 mm

1.8

S29GL512T12DHN030

Infineon Technologies

FLASH

AUTOMOTIVE

64

LBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

33554432 words

3

16

GRID ARRAY, LOW PROFILE

8

1 mm

125 Cel

32MX16

32M

-40 Cel

BOTTOM

S-PBGA-B64

3.6 V

1.4 mm

9 mm

536870912 bit

2.7 V

NOR TYPE

9 mm

120 ns

2.7

S29GL064N90DFI013

Infineon Technologies

FLASH

INDUSTRIAL

64

LBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

64K

50 mA

4194304 words

3

YES

3/3.3

16

GRID ARRAY, LOW PROFILE

BGA64,8X8,40

8

Flash Memories

1 mm

85 Cel

4MX16

4M

-40 Cel

128

YES

TIN SILVER COPPER

YES

BOTTOM

S-PBGA-B64

3

3.6 V

1.4 mm

9 mm

Not Qualified

67108864 bit

2.7 V

8/16

e1

NOR TYPE

.000005 Amp

9 mm

YES

90 ns

1.8

YES

S26HL01GTFPBHA020

Infineon Technologies

FLASH

24

VBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

BALL

SERIAL

SYNCHRONOUS

134217728 words

3

8

GRID ARRAY, VERY THIN PROFILE

BGA24,5X5,40

25

1 mm

85 Cel

OPEN-DRAIN

128MX8

128M

-40 Cel

BOTTOM

HARDWARE

S-PBGA-B24

3.6 V

1 mm

2560000 Write/Erase Cycles

166 MHz

8 mm

SPI

1073741824 bit

2.7 V

NOR TYPE

8 mm

3

S26HL01GTGABHB013

Infineon Technologies

FLASH

24

VBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

BALL

SERIAL

SYNCHRONOUS

134217728 words

3

8

GRID ARRAY, VERY THIN PROFILE

BGA24,5X5,40

25

1 mm

105 Cel

OPEN-DRAIN

128MX8

128M

-40 Cel

BOTTOM

HARDWARE

S-PBGA-B24

3.6 V

1 mm

2560000 Write/Erase Cycles

200 MHz

8 mm

SPI

1073741824 bit

2.7 V

NOR TYPE

8 mm

3

S29GL01GT11DHBV20

Infineon Technologies

FLASH

INDUSTRIAL

64

LBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

BALL

PARALLEL

ASYNCHRONOUS

134217728 words

3

8

GRID ARRAY, LOW PROFILE

1

1 mm

105 Cel

128MX8

128M

-40 Cel

BOTTOM

S-PBGA-B64

3.6 V

1.4 mm

9 mm

1073741824 bit

2.7 V

9 mm

110 ns

2.7

S29GL032N90DFI23

Infineon Technologies

FLASH

INDUSTRIAL

64

LBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

2097152 words

3

16

GRID ARRAY, LOW PROFILE

8

1 mm

85 Cel

2MX16

2M

-40 Cel

BOTTOM

S-PBGA-B64

3.6 V

1.4 mm

9 mm

Not Qualified

33554432 bit

2.7 V

9 mm

90 ns

3

Flash Memory

Flash memory is a type of non-volatile computer memory that is commonly used in digital devices such as USB drives, solid-state drives, and digital cameras. It is a type of EEPROM (Electrically Erasable Programmable Read-Only Memory) that allows data to be erased and reprogrammed in blocks instead of one byte at a time. Flash memory uses a floating gate transistor to store data, which allows it to retain information even when the power is turned off.

Flash memory is widely used in digital devices because of its high capacity, small size, and fast access times. It is also more durable than other types of memory, such as hard disk drives, because it has no moving parts. This makes it ideal for use in portable devices that may be subject to physical shock or vibration.

There are two types of flash memory: NOR flash and NAND flash. NOR flash is faster than NAND flash, but it has lower density and higher cost per bit. NOR flash is typically used for code storage, such as firmware or boot code, because it provides faster access times. NAND flash has higher density and lower cost per bit, which makes it ideal for data storage applications.

Flash memory has a limited lifespan, as it can only be erased and reprogrammed a limited number of times. This is because the process of erasing and reprogramming the memory causes wear and tear on the floating gate transistor. However, modern flash memory devices have a sophisticated wear-leveling algorithm that distributes writes evenly across the memory, which extends the lifespan of the device.