Part | RoHS | Manufacturer | Memory IC Type | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Surface Mount | No. of Functions | Technology | Screening Level | Terminal Form | Parallel or Serial | Operating Mode | Maximum Supply Current | No. of Words | Nominal Supply Voltage / Vsup (V) | Power Supplies (V) | Memory Width | Package Style (Meter) | Package Equivalence Code | Sub-Category | Minimum Data Retention Time | Terminal Pitch | Maximum Operating Temperature | Organization | No. of Words Code | Minimum Standby Voltage | Minimum Operating Temperature | Terminal Finish | Terminal Position | Write Protection | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Endurance | Maximum Clock Frequency (fCLK) | Width | Qualification | Serial Bus Type | Memory Density | Minimum Supply Voltage (Vsup) | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Maximum Standby Current | Length | Maximum Access Time |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Cypress Semiconductor |
FRAM |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
GULL WING |
SERIAL |
SYNCHRONOUS |
3 mA |
8192 words |
3.3 |
3.3 |
8 |
SMALL OUTLINE |
SOP8,.25 |
SRAMs |
11 |
1.27 mm |
125 Cel |
8KX8 |
8K |
3 V |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G8 |
3 |
3.6 V |
1.727 mm |
10000000000000 Write/Erase Cycles |
16 MHz |
3.8985 mm |
Not Qualified |
SPI |
65536 bit |
3 V |
DATA RETENTION TIME @ 85 DEGREE CENTIGRADE; 4KV ESD AVAILABLE |
e4 |
20 |
260 |
.000006 Amp |
4.889 mm |
|||
|
Cypress Semiconductor |
FRAM |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
GULL WING |
SERIAL |
SYNCHRONOUS |
.34 mA |
8192 words |
3.3 |
3.3 |
8 |
SMALL OUTLINE |
SOP8,.25 |
SRAMs |
10 |
1.27 mm |
125 Cel |
8KX8 |
8K |
3 V |
-40 Cel |
Tin (Sn) |
DUAL |
HARDWARE |
R-PDSO-G8 |
3 |
3.6 V |
1.727 mm |
10000000000000 Write/Erase Cycles |
1 MHz |
3.8985 mm |
Not Qualified |
I2C |
65536 bit |
3 V |
ALSO OPERATES WITH 0.4 MHZ AND 0.1 MHZ :2KV ESD AVAILABLE; @85, 121 retention |
e3 |
30 |
260 |
.00002 Amp |
4.889 mm |
|||
|
Cypress Semiconductor |
FRAM |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
GULL WING |
SERIAL |
SYNCHRONOUS |
3 mA |
8192 words |
3.3 |
3.3 |
8 |
SMALL OUTLINE |
SOP8,.25 |
SRAMs |
11 |
1.27 mm |
125 Cel |
8KX8 |
8K |
3 V |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G8 |
3 |
3.6 V |
1.727 mm |
10000000000000 Write/Erase Cycles |
16 MHz |
3.8985 mm |
Not Qualified |
SPI |
65536 bit |
3 V |
DATA RETENTION TIME @ 85 DEGREE CENTIGRADE; 4KV ESD AVAILABLE |
e4 |
20 |
260 |
.000006 Amp |
4.889 mm |
|||
|
Cypress Semiconductor |
FRAM |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
GULL WING |
SERIAL |
SYNCHRONOUS |
.34 mA |
8192 words |
3.3 |
3.3 |
8 |
SMALL OUTLINE |
SOP8,.25 |
SRAMs |
10 |
1.27 mm |
125 Cel |
8KX8 |
8K |
3 V |
-40 Cel |
Tin (Sn) |
DUAL |
HARDWARE |
R-PDSO-G8 |
3 |
3.6 V |
1.727 mm |
10000000000000 Write/Erase Cycles |
1 MHz |
3.8985 mm |
Not Qualified |
I2C |
65536 bit |
3 V |
ALSO OPERATES WITH 0.4 MHZ AND 0.1 MHZ :2KV ESD AVAILABLE; @85, 121 retention |
e3 |
30 |
260 |
.00002 Amp |
4.889 mm |
|||
|
Cypress Semiconductor |
FRAM |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
2.5 mA |
32768 words |
3.3 |
2.5/3.3 |
8 |
SMALL OUTLINE |
SOP8,.25 |
SRAMs |
10 |
1.27 mm |
85 Cel |
32KX8 |
32K |
2.7 V |
-40 Cel |
Matte Tin (Sn) |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G8 |
1 |
3.6 V |
1.727 mm |
100000000000000 Write/Erase Cycles |
40 MHz |
3.8985 mm |
Not Qualified |
SPI |
262144 bit |
2.7 V |
also operates with 2minv supply @ 25 mhz and 1kv esd availabe |
e3 |
40 |
260 |
.00015 Amp |
4.889 mm |
||||
|
Cypress Semiconductor |
FRAM |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
2.5 mA |
32768 words |
3.3 |
2.5/3.3 |
8 |
SMALL OUTLINE |
SOP8,.25 |
SRAMs |
10 |
1.27 mm |
85 Cel |
32KX8 |
32K |
2.7 V |
-40 Cel |
Matte Tin (Sn) |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G8 |
1 |
3.6 V |
1.727 mm |
100000000000000 Write/Erase Cycles |
40 MHz |
3.8985 mm |
Not Qualified |
SPI |
262144 bit |
2.7 V |
also operates with 2minv supply @ 25 mhz and 1kv esd availabe |
e3 |
30 |
260 |
.00015 Amp |
4.889 mm |
||||
|
Cypress Semiconductor |
FRAM |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
2.5 mA |
16384 words |
3.3 |
2.5/3.3 |
8 |
SMALL OUTLINE |
SOP8,.25 |
SRAMs |
10 |
1.27 mm |
85 Cel |
16KX8 |
16K |
2.7 V |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G8 |
3 |
3.6 V |
1.727 mm |
10000000000000 Write/Erase Cycles |
40 MHz |
3.8985 mm |
Not Qualified |
SPI |
131072 bit |
2.7 V |
also operates with 2minv supply @ 25 mhz and 1kv esd availabe |
e4 |
.00015 Amp |
4.889 mm |
||||||
|
Cypress Semiconductor |
FRAM |
8 |
HVSON |
RECTANGULAR |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
10 mA |
262144 words |
3.3 |
8 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.25 |
10 |
1.27 mm |
85 Cel |
256KX8 |
256K |
2.7 V |
-40 Cel |
TIN |
DUAL |
HARDWARE/SOFTWARE |
R-XDSO-N8 |
1 |
3.6 V |
.8 mm |
100000000000000 Write/Erase Cycles |
40 MHz |
5 mm |
SPI |
2097152 bit |
2.7 V |
DATA RETENTION TIME @ 85 DEGREE CENTIGRADE |
260 |
.00027 Amp |
6 mm |
||||||||||
|
Cypress Semiconductor |
FRAM |
8 |
HVSON |
RECTANGULAR |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
10 mA |
262144 words |
3.3 |
8 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.25 |
10 |
1.27 mm |
85 Cel |
256KX8 |
256K |
2.7 V |
-40 Cel |
TIN |
DUAL |
HARDWARE/SOFTWARE |
R-XDSO-N8 |
1 |
3.6 V |
.8 mm |
100000000000000 Write/Erase Cycles |
40 MHz |
5 mm |
SPI |
2097152 bit |
2.7 V |
DATA RETENTION TIME @ 85 DEGREE CENTIGRADE |
30 |
260 |
.00027 Amp |
6 mm |
|||||||||
|
Cypress Semiconductor |
FRAM |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
2.5 mA |
16384 words |
3.3 |
2.5/3.3 |
8 |
SMALL OUTLINE |
SOP8,.25 |
SRAMs |
10 |
1.27 mm |
85 Cel |
16KX8 |
16K |
2.7 V |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G8 |
3 |
3.6 V |
1.727 mm |
10000000000000 Write/Erase Cycles |
40 MHz |
3.8985 mm |
Not Qualified |
SPI |
131072 bit |
2.7 V |
also operates with 2minv supply @ 25 mhz and 1kv esd availabe |
e4 |
.00015 Amp |
4.889 mm |
||||||
|
Cypress Semiconductor |
FRAM |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
10 mA |
262144 words |
3.3 |
8 |
SMALL OUTLINE |
SOP8,.3 |
10 |
1.27 mm |
85 Cel |
256KX8 |
256K |
2.7 V |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G8 |
1 |
3.6 V |
2.03 mm |
100000000000000 Write/Erase Cycles |
40 MHz |
5.23 mm |
SPI |
2097152 bit |
2.7 V |
DATA RETENTION TIME @ 85 DEGREE CENTIGRADE |
20 |
260 |
.00027 Amp |
5.28 mm |
||||||||
|
Cypress Semiconductor |
FRAM |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
10 mA |
262144 words |
3.3 |
8 |
SMALL OUTLINE |
SOP8,.3 |
10 |
1.27 mm |
85 Cel |
256KX8 |
256K |
2.7 V |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G8 |
3 |
3.6 V |
2.03 mm |
100000000000000 Write/Erase Cycles |
40 MHz |
5.23 mm |
SPI |
2097152 bit |
2.7 V |
DATA RETENTION TIME @ 85 DEGREE CENTIGRADE |
20 |
260 |
.00027 Amp |
5.28 mm |
||||||||
|
Cypress Semiconductor |
FRAM |
44 |
TSOP2 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
12 mA |
131072 words |
3.3 |
3/3.3 |
16 |
SMALL OUTLINE, THIN PROFILE |
TSOP44,.46,32 |
SRAMs |
10 |
.8 mm |
85 Cel |
128KX16 |
128K |
2.7 V |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
DUAL |
R-PDSO-G44 |
3 |
3.6 V |
1.2 mm |
100000000000000 Write/Erase Cycles |
10.16 mm |
Not Qualified |
2097152 bit |
2.7 V |
DATA RETENTION TIME @ 85 DEGREE CENTIGRADE;2.5KV ESD AVAILABLE;ALSO CONFIGURABLE AS 256KX8 |
e4 |
30 |
260 |
.00027 Amp |
18.41 mm |
110 ns |
||||||
|
Cypress Semiconductor |
FRAM |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
GULL WING |
SERIAL |
SYNCHRONOUS |
1.2 mA |
8192 words |
5 |
8 |
SMALL OUTLINE |
SOP8,.25 |
11 |
1.27 mm |
125 Cel |
8KX8 |
8K |
4.5 V |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G8 |
3 |
5.5 V |
1.727 mm |
10000000000000 Write/Erase Cycles |
4 MHz |
3.8985 mm |
Not Qualified |
SPI |
65536 bit |
4.5 V |
DATA RETENTION TIME @ 85 DEGREE CENTIGRADE; 4KV ESD AVAILABLE |
e4 |
.00003 Amp |
4.889 mm |
|||||||
|
Cypress Semiconductor |
FRAM |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
GULL WING |
SERIAL |
SYNCHRONOUS |
3 mA |
2048 words |
5 |
5 |
8 |
SMALL OUTLINE |
SOP8,.25 |
SRAMs |
11 |
1.27 mm |
125 Cel |
2KX8 |
2K |
4.5 V |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G8 |
3 |
5.5 V |
1.727 mm |
10000000000000 Write/Erase Cycles |
15 MHz |
3.8985 mm |
Not Qualified |
SPI |
16384 bit |
4.5 V |
DATA RETENTION TIME @ 85 DEGREE CENTIGRADE; 4KV ESD AVAILABLE |
e4 |
.00003 Amp |
4.889 mm |
|||||
|
Cypress Semiconductor |
FRAM |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
.4 mA |
32768 words |
3.3 |
8 |
SMALL OUTLINE |
SOP8,.3 |
10 |
1.27 mm |
85 Cel |
32KX8 |
32K |
2.7 V |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G8 |
3 |
5.5 V |
2 mm |
100000000000000 Write/Erase Cycles |
1 MHz |
5.23 mm |
I2C |
262144 bit |
2.7 V |
DATA RETENTION TIME @ 85 DEGREE CENTIGRADE |
20 |
260 |
.00003 Amp |
5.28 mm |
|||||||||
|
Cypress Semiconductor |
FRAM |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
.4 mA |
32768 words |
3.3 |
8 |
SMALL OUTLINE |
SOP8,.3 |
10 |
1.27 mm |
85 Cel |
32KX8 |
32K |
2.7 V |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G8 |
3 |
5.5 V |
2 mm |
100000000000000 Write/Erase Cycles |
1 MHz |
5.23 mm |
I2C |
262144 bit |
2.7 V |
DATA RETENTION TIME @ 85 DEGREE CENTIGRADE |
20 |
260 |
.00003 Amp |
5.28 mm |
|||||||||
|
Cypress Semiconductor |
FRAM |
48 |
TFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
12 mA |
131072 words |
3.3 |
3/3.3 |
16 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA48,6X8,30 |
SRAMs |
10 |
.75 mm |
85 Cel |
128KX16 |
128K |
2.7 V |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B48 |
3 |
3.6 V |
1.2 mm |
100000000000000 Write/Erase Cycles |
6 mm |
Not Qualified |
2097152 bit |
2.7 V |
DATA RETENTION TIME @ 85 DEGREE CENTIGRADE;2.5KV ESD AVAILABLE;ALSO CONFIGURABLE AS 256KX8 |
e1 |
260 |
.00027 Amp |
8 mm |
110 ns |
|||||||
|
Cypress Semiconductor |
FRAM |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
1 mA |
16384 words |
3.3 |
2.5/3.3 |
8 |
SMALL OUTLINE |
SOP8,.25 |
SRAMs |
10 |
1.27 mm |
85 Cel |
16KX8 |
16K |
2 V |
-40 Cel |
MATTE TIN |
DUAL |
HARDWARE |
R-PDSO-G8 |
3 |
3.6 V |
1.727 mm |
100000000000000 Write/Erase Cycles |
3.4 MHz |
3.8985 mm |
Not Qualified |
I2C |
131072 bit |
2 V |
also operates with 1 MHZ ; 3.5KV ESD AVAILABLE |
e3 |
30 |
260 |
.00015 Amp |
4.889 mm |
||||
|
Cypress Semiconductor |
FRAM |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
1 mA |
32768 words |
3.3 |
2.5/3.3 |
8 |
SMALL OUTLINE |
SOP8,.25 |
SRAMs |
10 |
1.27 mm |
85 Cel |
32KX8 |
32K |
2 V |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
DUAL |
HARDWARE |
R-PDSO-G8 |
3 |
3.6 V |
1.727 mm |
100000000000000 Write/Erase Cycles |
3.4 MHz |
3.8985 mm |
Not Qualified |
I2C |
262144 bit |
2 V |
also operates with 1 MHZ ; 3.5KV ESD AVAILABLE |
e4 |
20 |
260 |
.00015 Amp |
4.889 mm |
Ferroelectric Random-Access Memories (or FRAMs), are a type of non-volatile memory technology that combines the advantages of both traditional dynamic random-access memory (DRAM) and non-volatile memory (NVRAM) technologies. FRAMs store data using a ferroelectric material, which has the unique property of being able to retain data even when the power is removed.
FRAMs are used in a variety of fields, including industrial automation, automotive systems, smart meters, and more, where their combination of non-volatility, speed, and endurance can be advantageous. While they may not be as prevalent as other memory types like Flash or DRAM, FRAMs offer a unique set of features that make them suitable for specific use cases.
Here are some key features and characteristics of FRAMs:
Non-Volatile: FRAMs are non-volatile, meaning they can retain data even when the power supply is turned off. This is in contrast to traditional DRAM, which is volatile and loses data when power is removed.
Fast Write Speeds: FRAMs offer very fast write speeds, comparable to DRAM. This makes them suitable for applications where high-speed write operations are required.
Low Power Consumption: FRAMs typically consume less power than other non-volatile memory technologies like Flash memory. This makes them suitable for battery-powered devices and applications where power efficiency is critical.
High Endurance: FRAMs have a high endurance, meaning they can withstand a large number of write cycles without degrading. This is in contrast to some Flash memory technologies that have limited write endurance.
Bit-Addressable: FRAMs are bit-addressable, which means you can read or write individual bits of data. This granularity is useful in applications where precise control over specific data is required.
Radiation Resistance: FRAMs are resistant to radiation, which makes them suitable for use in aerospace and other high-radiation environments.
Limited Density: One limitation of FRAM technology is that it has historically had lower storage density compared to other non-volatile memory technologies like Flash. However, advancements in FRAM technology have been made to increase storage capacity.