DIP MASK ROM 841

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Part RoHS Manufacturer Memory IC Type Temperature Grade No. of Terminals Package Code Package Shape Package Body Material Surface Mount No. of Functions Technology Screening Level Nominal Negative Supply Voltage Terminal Form Parallel or Serial Operating Mode Maximum Supply Current No. of Words Nominal Supply Voltage / Vsup (V) Power Supplies (V) Memory Width Package Style (Meter) Package Equivalence Code Alternate Memory Width Sub-Category Terminal Pitch Maximum Operating Temperature Output Characteristics Organization No. of Words Code Minimum Operating Temperature Terminal Finish Terminal Position JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Supply Voltage (Vsup) Maximum Seated Height Width Qualification Memory Density Minimum Supply Voltage (Vsup) Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Maximum Standby Current Length Maximum Access Time

KM23C8100-15

Samsung

MASK ROM

COMMERCIAL

42

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

CMOS

THROUGH-HOLE

PARALLEL

ASYNCHRONOUS

50 mA

1048576 words

5

5

8

IN-LINE

DIP42,.6

16

MASK ROMs

2.54 mm

70 Cel

3-STATE

1MX8

1M

0 Cel

TIN LEAD

DUAL

R-PDIP-T42

5.5 V

5.08 mm

15.24 mm

Not Qualified

8388608 bit

4.5 V

e0

.00005 Amp

52.43 mm

150 ns

KM23C8100B-12

Samsung

MASK ROM

COMMERCIAL

42

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

CMOS

THROUGH-HOLE

PARALLEL

ASYNCHRONOUS

60 mA

1048576 words

5

5

8

IN-LINE

DIP42,.6

16

MASK ROMs

2.54 mm

70 Cel

3-STATE

1MX8

1M

0 Cel

TIN LEAD

DUAL

R-PDIP-T42

5.5 V

5.08 mm

15.24 mm

Not Qualified

8388608 bit

4.5 V

e0

.00005 Amp

52.43 mm

120 ns

KM2365PI-25

Samsung

MASK ROM

INDUSTRIAL

28

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

MOS

THROUGH-HOLE

60 mA

8192 words

5

5

8

IN-LINE

DIP28,.6

MASK ROMs

2.54 mm

85 Cel

8KX8

8K

-40 Cel

TIN LEAD

DUAL

R-PDIP-T28

3

Not Qualified

65536 bit

e0

250 ns

KM23C4000-20

Samsung

MASK ROM

COMMERCIAL

32

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

CMOS

THROUGH-HOLE

PARALLEL

ASYNCHRONOUS

40 mA

524288 words

5

5

8

IN-LINE

DIP32,.6

MASK ROMs

2.54 mm

70 Cel

3-STATE

512KX8

512K

0 Cel

TIN LEAD

DUAL

R-PDIP-T32

5.5 V

5.08 mm

15.24 mm

Not Qualified

4194304 bit

4.5 V

e0

.0001 Amp

41.91 mm

200 ns

K3N6C4000E-DC10

Samsung

MASK ROM

COMMERCIAL

42

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

CMOS

THROUGH-HOLE

PARALLEL

ASYNCHRONOUS

50 mA

2097152 words

5

5

16

IN-LINE

DIP42,.6

MASK ROMs

2.54 mm

70 Cel

2MX16

2M

0 Cel

TIN LEAD

DUAL

R-PDIP-T42

5.5 V

5.08 mm

15.24 mm

Not Qualified

33554432 bit

4.5 V

e0

.00005 Amp

52.42 mm

100 ns

KM23C2100H-12

Samsung

MASK ROM

COMMERCIAL

40

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

CMOS

THROUGH-HOLE

PARALLEL

ASYNCHRONOUS

50 mA

262144 words

5

5

8

IN-LINE

DIP40,.6

16

MASK ROMs

2.54 mm

70 Cel

3-STATE

256KX8

256K

0 Cel

TIN LEAD

DUAL

R-PDIP-T40

5.5 V

5.08 mm

15.24 mm

Not Qualified

2097152 bit

4.5 V

e0

.00005 Amp

52.43 mm

120 ns

K3P4C1000D-DC150

Samsung

MASK ROM

COMMERCIAL

42

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

CMOS

THROUGH-HOLE

PARALLEL

ASYNCHRONOUS

524288 words

5

16

IN-LINE

8

2.54 mm

70 Cel

512KX16

512K

0 Cel

DUAL

R-PDIP-T42

5.5 V

5.08 mm

15.24 mm

Not Qualified

8388608 bit

4.5 V

NOT SPECIFIED

NOT SPECIFIED

52.42 mm

150 ns

KM23V4001B-25

Samsung

MASK ROM

COMMERCIAL

32

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

CMOS

THROUGH-HOLE

PARALLEL

ASYNCHRONOUS

30 mA

524288 words

3.3

3/3.3

8

IN-LINE

DIP32,.6

MASK ROMs

2.54 mm

70 Cel

3-STATE

512KX8

512K

0 Cel

TIN LEAD

DUAL

R-PDIP-T32

3.6 V

5.08 mm

15.24 mm

Not Qualified

4194304 bit

2.7 V

e0

.03 Amp

41.91 mm

250 ns

KM23V4200D-10

Samsung

MASK ROM

COMMERCIAL

40

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

CMOS

THROUGH-HOLE

PARALLEL

ASYNCHRONOUS

25 mA

262144 words

3.3

3.3

16

IN-LINE

DIP40,.6

MASK ROMs

2.54 mm

70 Cel

256KX16

256K

0 Cel

TIN LEAD

DUAL

R-PDIP-T40

3.6 V

5.08 mm

15.24 mm

Not Qualified

4194304 bit

3 V

TTL COMPATIBLE I/O

e0

.00003 Amp

52.42 mm

100 ns

KM23C16005A-12

Samsung

MASK ROM

COMMERCIAL

42

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

CMOS

THROUGH-HOLE

PARALLEL

ASYNCHRONOUS

100 mA

2097152 words

5

5

8

IN-LINE

DIP42,.6

16

MASK ROMs

2.54 mm

70 Cel

3-STATE

2MX8

2M

0 Cel

TIN LEAD

DUAL

R-PDIP-T42

5.5 V

5.08 mm

15.24 mm

Not Qualified

16777216 bit

4.5 V

e0

.00005 Amp

52.43 mm

120 ns

KM23C32120A-15

Samsung

MASK ROM

COMMERCIAL

42

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

CMOS

THROUGH-HOLE

PARALLEL

60 mA

4194304 words

5

5

8

IN-LINE

DIP42,.6

MASK ROMs

2.54 mm

70 Cel

4MX8

4M

0 Cel

Tin/Lead (Sn/Pb)

DUAL

R-PDIP-T42

5.5 V

5.08 mm

15.24 mm

Not Qualified

33554432 bit

4.5 V

e0

.00005 Amp

52.25 mm

150 ns

KM23C1011-20

Samsung

MASK ROM

COMMERCIAL

32

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

CMOS

THROUGH-HOLE

PARALLEL

ASYNCHRONOUS

40 mA

131072 words

5

5

8

IN-LINE

DIP32,.6

MASK ROMs

2.54 mm

70 Cel

3-STATE

128KX8

128K

0 Cel

TIN LEAD

DUAL

R-PDIP-T32

5.5 V

5.08 mm

15.24 mm

Not Qualified

1048576 bit

4.5 V

e0

.04 Amp

41.91 mm

200 ns

KM23257PI-20

Samsung

MASK ROM

INDUSTRIAL

28

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

MOS

THROUGH-HOLE

75 mA

32768 words

8

IN-LINE

DIP28,.6

MASK ROMs

2.54 mm

85 Cel

32KX8

32K

-40 Cel

TIN LEAD

DUAL

R-PDIP-T28

3

Not Qualified

262144 bit

e0

200 ns

KM23V4200D

Samsung

MASK ROM

COMMERCIAL

40

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

CMOS

THROUGH-HOLE

25 mA

262144 words

3/3.3

16

IN-LINE

DIP40,.6

MASK ROMs

2.54 mm

70 Cel

256KX16

256K

0 Cel

Tin/Lead (Sn/Pb)

DUAL

R-PDIP-T40

Not Qualified

4194304 bit

e0

.00003 Amp

120 ns

KM23V8000B-25

Samsung

MASK ROM

COMMERCIAL

32

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

CMOS

THROUGH-HOLE

PARALLEL

ASYNCHRONOUS

30 mA

1048576 words

3.3

3/3.3

8

IN-LINE

DIP32,.6

MASK ROMs

2.54 mm

70 Cel

3-STATE

1MX8

1M

0 Cel

TIN LEAD

DUAL

R-PDIP-T32

3.6 V

5.08 mm

15.24 mm

Not Qualified

8388608 bit

2.7 V

e0

.00005 Amp

41.91 mm

250 ns

K3P4C1000E-DC10

Samsung

MASK ROM

COMMERCIAL

42

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

CMOS

THROUGH-HOLE

80 mA

524288 words

5

5

16

IN-LINE

DIP42,.6

8

MASK ROMs

2.54 mm

70 Cel

512KX16

512K

0 Cel

TIN LEAD

DUAL

R-PDIP-T42

3

Not Qualified

8388608 bit

e0

.00005 Amp

100 ns

K3N6U4000C-DC15

Samsung

MASK ROM

COMMERCIAL

42

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

CMOS

THROUGH-HOLE

PARALLEL

ASYNCHRONOUS

35 mA

2097152 words

3

3

16

IN-LINE

DIP42,.6

MASK ROMs

2.54 mm

70 Cel

2MX16

2M

0 Cel

TIN LEAD

DUAL

R-PDIP-T42

3.3 V

5.08 mm

15.24 mm

Not Qualified

33554432 bit

2.7 V

e0

.00003 Amp

52.42 mm

150 ns

KM23257SPI-15

Samsung

MASK ROM

AUTOMOTIVE

28

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

MOS

THROUGH-HOLE

75 mA

32768 words

8

IN-LINE

DIP28,.6

MASK ROMs

2.54 mm

125 Cel

32KX8

32K

-40 Cel

TIN LEAD

DUAL

R-PDIP-T28

3

Not Qualified

262144 bit

e0

150 ns

K3P5C1000F-DC15

Samsung

MASK ROM

COMMERCIAL

42

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

CMOS

THROUGH-HOLE

PARALLEL

ASYNCHRONOUS

150 mA

1048576 words

5

5

16

IN-LINE

DIP42,.6

8

MASK ROMs

2.54 mm

70 Cel

1MX16

1M

0 Cel

TIN LEAD

DUAL

R-PDIP-T42

5.5 V

5.08 mm

15.24 mm

Not Qualified

16777216 bit

4.5 V

ALL INPUTS AND OUTPUTS TTL COMPATIBLE

e0

.00005 Amp

52.42 mm

150 ns

KM23C1011-12

Samsung

MASK ROM

COMMERCIAL

32

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

CMOS

THROUGH-HOLE

PARALLEL

ASYNCHRONOUS

40 mA

131072 words

5

5

8

IN-LINE

DIP32,.6

MASK ROMs

2.54 mm

70 Cel

3-STATE

128KX8

128K

0 Cel

TIN LEAD

DUAL

R-PDIP-T32

5.5 V

5.08 mm

15.24 mm

Not Qualified

1048576 bit

4.5 V

e0

.04 Amp

41.91 mm

120 ns

KM23C4100B-12

Samsung

MASK ROM

COMMERCIAL

40

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

CMOS

THROUGH-HOLE

PARALLEL

ASYNCHRONOUS

60 mA

524288 words

5

5

8

IN-LINE

DIP40,.6

16

MASK ROMs

2.54 mm

70 Cel

3-STATE

512KX8

512K

0 Cel

TIN LEAD

DUAL

R-PDIP-T40

5.5 V

5.08 mm

15.24 mm

Not Qualified

4194304 bit

4.5 V

e0

.00005 Amp

52.43 mm

120 ns

KM23C32101C-10

Samsung

MASK ROM

COMMERCIAL

36

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

CMOS

THROUGH-HOLE

PARALLEL

ASYNCHRONOUS

50 mA

4194304 words

5

5

8

IN-LINE

DIP36,.6

MASK ROMs

2.54 mm

70 Cel

4MX8

4M

0 Cel

TIN LEAD

DUAL

R-PDIP-T36

5.5 V

5.08 mm

15.24 mm

Not Qualified

33554432 bit

4.5 V

e0

.05 Amp

45.72 mm

100 ns

KM23256PI-25

Samsung

MASK ROM

INDUSTRIAL

28

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

MOS

THROUGH-HOLE

75 mA

32768 words

5

5

8

IN-LINE

DIP28,.6

MASK ROMs

2.54 mm

85 Cel

32KX8

32K

-40 Cel

TIN LEAD

DUAL

R-PDIP-T28

3

Not Qualified

262144 bit

e0

250 ns

K3P5C1000D-DC10

Samsung

MASK ROM

COMMERCIAL

42

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

CMOS

THROUGH-HOLE

PARALLEL

ASYNCHRONOUS

150 mA

1048576 words

5

5

16

IN-LINE

DIP42,.6

8

MASK ROMs

2.54 mm

70 Cel

1MX16

1M

0 Cel

TIN LEAD

DUAL

R-PDIP-T42

5.5 V

5.08 mm

15.24 mm

Not Qualified

16777216 bit

4.5 V

ALL INPUTS AND OUTPUTS TTL COMPATIBLE

e0

.00005 Amp

52.42 mm

100 ns

KM23V4100B-25

Samsung

MASK ROM

COMMERCIAL

40

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

CMOS

THROUGH-HOLE

PARALLEL

ASYNCHRONOUS

30 mA

524288 words

3.3

3/3.3

8

IN-LINE

DIP40,.6

16

MASK ROMs

2.54 mm

70 Cel

3-STATE

512KX8

512K

0 Cel

TIN LEAD

DUAL

R-PDIP-T40

3.6 V

5.08 mm

15.24 mm

Not Qualified

4194304 bit

2.7 V

e0

.00005 Amp

52.43 mm

250 ns

KM23C8100A-15

Samsung

MASK ROM

COMMERCIAL

42

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

CMOS

THROUGH-HOLE

PARALLEL

ASYNCHRONOUS

50 mA

1048576 words

5

5

8

IN-LINE

DIP42,.6

8

MASK ROMs

2.54 mm

70 Cel

3-STATE

1MX8

1M

0 Cel

TIN LEAD

DUAL

R-PDIP-T42

5.5 V

5.08 mm

15.24 mm

Not Qualified

8388608 bit

4.5 V

e0

.00005 Amp

52.43 mm

150 ns

KM23V16000A-25

Samsung

MASK ROM

COMMERCIAL

42

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

CMOS

THROUGH-HOLE

PARALLEL

ASYNCHRONOUS

30 mA

2097152 words

3.3

3/3.3

8

IN-LINE

DIP42,.6

16

MASK ROMs

2.54 mm

70 Cel

3-STATE

2MX8

2M

0 Cel

TIN LEAD

DUAL

R-PDIP-T42

3.6 V

5.08 mm

15.24 mm

Not Qualified

16777216 bit

2.7 V

e0

.00005 Amp

52.43 mm

250 ns

KM23C4001H-15

Samsung

MASK ROM

COMMERCIAL

32

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

CMOS

THROUGH-HOLE

PARALLEL

ASYNCHRONOUS

50 mA

524288 words

5

5

8

IN-LINE

DIP32,.6

MASK ROMs

2.54 mm

70 Cel

3-STATE

512KX8

512K

0 Cel

TIN LEAD

DUAL

R-PDIP-T32

5.5 V

5.08 mm

15.24 mm

Not Qualified

4194304 bit

4.5 V

e0

.05 Amp

41.91 mm

150 ns

KM23128P-25

Samsung

MASK ROM

COMMERCIAL

28

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

MOS

THROUGH-HOLE

75 mA

16384 words

5

5

8

IN-LINE

DIP28,.6

MASK ROMs

2.54 mm

70 Cel

16KX8

16K

0 Cel

TIN LEAD

DUAL

R-PDIP-T28

3

Not Qualified

131072 bit

e0

250 ns

KM23C8100C-15

Samsung

MASK ROM

COMMERCIAL

42

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

CMOS

THROUGH-HOLE

60 mA

524288 words

5

5

16

IN-LINE

DIP42,.6

8

MASK ROMs

2.54 mm

70 Cel

512KX16

512K

0 Cel

TIN LEAD

DUAL

R-PDIP-T42

3

Not Qualified

8388608 bit

e0

.00005 Amp

150 ns

KM23C8001B-12

Samsung

MASK ROM

COMMERCIAL

32

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

CMOS

THROUGH-HOLE

PARALLEL

ASYNCHRONOUS

60 mA

1048576 words

5

5

8

IN-LINE

DIP32,.6

MASK ROMs

2.54 mm

70 Cel

3-STATE

1MX8

1M

0 Cel

TIN LEAD

DUAL

R-PDIP-T32

5.5 V

5.08 mm

15.24 mm

Not Qualified

8388608 bit

4.5 V

e0

.06 Amp

41.91 mm

120 ns

K3N3V3000D-DC100

Samsung

MASK ROM

COMMERCIAL

32

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

CMOS

THROUGH-HOLE

PARALLEL

ASYNCHRONOUS

524288 words

3.3

8

IN-LINE

2.54 mm

70 Cel

512KX8

512K

0 Cel

DUAL

R-PDIP-T32

3.6 V

5.08 mm

15.24 mm

Not Qualified

4194304 bit

3 V

NOT SPECIFIED

NOT SPECIFIED

41.91 mm

100 ns

K3N5V1000E-DC10

Samsung

MASK ROM

COMMERCIAL

42

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

CMOS

THROUGH-HOLE

PARALLEL

ASYNCHRONOUS

40 mA

1048576 words

3.3

3.3

16

IN-LINE

DIP42,.6

8

MASK ROMs

2.54 mm

70 Cel

1MX16

1M

0 Cel

Tin/Lead (Sn/Pb)

DUAL

R-PDIP-T42

3.6 V

5.08 mm

15.24 mm

Not Qualified

16777216 bit

3 V

e0

.00003 Amp

52.42 mm

100 ns

KM23C2000A-12

Samsung

MASK ROM

COMMERCIAL

32

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

CMOS

THROUGH-HOLE

PARALLEL

ASYNCHRONOUS

40 mA

262144 words

5

5

8

IN-LINE

DIP32,.6

MASK ROMs

2.54 mm

70 Cel

3-STATE

256KX8

256K

0 Cel

TIN LEAD

DUAL

R-PDIP-T32

5.5 V

5.08 mm

15.24 mm

Not Qualified

2097152 bit

4.5 V

e0

.00005 Amp

41.91 mm

120 ns

K3P4V1000E-DC12

Samsung

MASK ROM

COMMERCIAL

42

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

CMOS

THROUGH-HOLE

PARALLEL

ASYNCHRONOUS

40 mA

524288 words

3.3

3.3

16

IN-LINE

DIP42,.6

8

MASK ROMs

2.54 mm

70 Cel

512KX16

512K

0 Cel

TIN LEAD

DUAL

R-PDIP-T42

3.6 V

5.08 mm

15.24 mm

Not Qualified

8388608 bit

3 V

e0

.00003 Amp

52.42 mm

120 ns

KM23C1010-12

Samsung

MASK ROM

COMMERCIAL

32

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

CMOS

THROUGH-HOLE

PARALLEL

ASYNCHRONOUS

30 mA

131072 words

5

5

8

IN-LINE

DIP32,.6

MASK ROMs

2.54 mm

70 Cel

3-STATE

128KX8

128K

0 Cel

TIN LEAD

DUAL

R-PDIP-T32

5.5 V

5.08 mm

15.24 mm

Not Qualified

1048576 bit

4.5 V

e0

.0001 Amp

41.91 mm

120 ns

KM23C1000-25

Samsung

MASK ROM

COMMERCIAL

28

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

CMOS

THROUGH-HOLE

30 mA

131072 words

5

5

8

IN-LINE

DIP28,.6

MASK ROMs

2.54 mm

70 Cel

128KX8

128K

0 Cel

Tin/Lead (Sn/Pb)

DUAL

R-PDIP-T28

Not Qualified

1048576 bit

e0

.0001 Amp

250 ns

K3N3C3000D-DC080

Samsung

MASK ROM

COMMERCIAL

32

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

CMOS

THROUGH-HOLE

PARALLEL

ASYNCHRONOUS

524288 words

5

8

IN-LINE

2.54 mm

70 Cel

512KX8

512K

0 Cel

DUAL

R-PDIP-T32

5.5 V

5.08 mm

15.24 mm

Not Qualified

4194304 bit

4.5 V

NOT SPECIFIED

NOT SPECIFIED

41.91 mm

80 ns

KM23C4001-20

Samsung

MASK ROM

COMMERCIAL

32

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

CMOS

THROUGH-HOLE

PARALLEL

ASYNCHRONOUS

40 mA

524288 words

5

5

8

IN-LINE

DIP32,.6

MASK ROMs

2.54 mm

70 Cel

3-STATE

512KX8

512K

0 Cel

TIN LEAD

DUAL

R-PDIP-T32

5.5 V

5.08 mm

15.24 mm

Not Qualified

4194304 bit

4.5 V

e0

.04 Amp

41.91 mm

200 ns

KM23256SPI-15

Samsung

MASK ROM

INDUSTRIAL

28

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

MOS

THROUGH-HOLE

75 mA

32768 words

5

5

8

IN-LINE

DIP28,.6

MASK ROMs

2.54 mm

85 Cel

32KX8

32K

-40 Cel

TIN LEAD

DUAL

R-PDIP-T28

3

Not Qualified

262144 bit

e0

150 ns

KM23C4200B-25

Samsung

MASK ROM

COMMERCIAL

32

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

CMOS

THROUGH-HOLE

50 mA

262144 words

5

5

16

IN-LINE

DIP32,.6

8

MASK ROMs

2.54 mm

70 Cel

256KX16

256K

0 Cel

TIN LEAD

DUAL

R-PDIP-T32

3

Not Qualified

4194304 bit

e0

.00005 Amp

250 ns

KM23C16005D-15

Samsung

MASK ROM

COMMERCIAL

42

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

CMOS

THROUGH-HOLE

PARALLEL

ASYNCHRONOUS

1048576 words

5

16

IN-LINE

8

2.54 mm

70 Cel

1MX16

1M

0 Cel

DUAL

R-PDIP-T42

5.5 V

5.08 mm

15.24 mm

Not Qualified

16777216 bit

4.5 V

CONFIGURABLE AS 1M X 16

52.42 mm

150 ns

K3N4U1000D-DC120

Samsung

MASK ROM

COMMERCIAL

42

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

CMOS

THROUGH-HOLE

PARALLEL

ASYNCHRONOUS

524288 words

3

16

IN-LINE

8

2.54 mm

70 Cel

512KX16

512K

0 Cel

DUAL

R-PDIP-T42

3.3 V

5.08 mm

15.24 mm

Not Qualified

8388608 bit

2.7 V

NOT SPECIFIED

NOT SPECIFIED

52.42 mm

120 ns

KM2365HR-25

Samsung

MASK ROM

MILITARY

28

DIP

RECTANGULAR

CERAMIC

NO

MOS

THROUGH-HOLE

60 mA

8192 words

5

5

8

IN-LINE

DIP28,.6

MASK ROMs

2.54 mm

125 Cel

8KX8

8K

-55 Cel

TIN LEAD

DUAL

R-XDIP-T28

3

Not Qualified

65536 bit

e0

250 ns

KM23C16000B-20

Samsung

MASK ROM

COMMERCIAL

42

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

CMOS

THROUGH-HOLE

60 mA

1048576 words

5

5

16

IN-LINE

DIP42,.6

8

MASK ROMs

2.54 mm

70 Cel

1MX16

1M

0 Cel

TIN LEAD

DUAL

R-PDIP-T42

3

Not Qualified

16777216 bit

e0

.00005 Amp

200 ns

K3P5C1000F-DC12

Samsung

MASK ROM

COMMERCIAL

42

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

CMOS

THROUGH-HOLE

PARALLEL

ASYNCHRONOUS

150 mA

1048576 words

5

5

16

IN-LINE

DIP42,.6

8

MASK ROMs

2.54 mm

70 Cel

1MX16

1M

0 Cel

TIN LEAD

DUAL

R-PDIP-T42

5.5 V

5.08 mm

15.24 mm

Not Qualified

16777216 bit

4.5 V

ALL INPUTS AND OUTPUTS TTL COMPATIBLE

e0

.00005 Amp

52.42 mm

120 ns

KM23C32005-20

Samsung

MASK ROM

COMMERCIAL

42

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

CMOS

THROUGH-HOLE

PARALLEL

ASYNCHRONOUS

100 mA

2097152 words

5

5

16

IN-LINE

DIP42,.6

MASK ROMs

2.54 mm

70 Cel

3-STATE

2MX16

2M

0 Cel

TIN LEAD

DUAL

R-PDIP-T42

5.5 V

5.08 mm

15.24 mm

Not Qualified

33554432 bit

4.5 V

e0

.00005 Amp

52.43 mm

200 ns

K3P5U1000D-DC10

Samsung

MASK ROM

COMMERCIAL

42

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

CMOS

THROUGH-HOLE

PARALLEL

ASYNCHRONOUS

50 mA

1048576 words

3

3

16

IN-LINE

DIP42,.6

8

MASK ROMs

2.54 mm

70 Cel

1MX16

1M

0 Cel

TIN LEAD

DUAL

R-PDIP-T42

3.3 V

5.08 mm

15.24 mm

Not Qualified

16777216 bit

2.7 V

e0

.00003 Amp

52.42 mm

100 ns

MASK ROM

Mask ROM, or Read-Only Memory, is a type of non-volatile computer memory that is programmed during the manufacturing process. Mask ROM is designed to permanently store data and cannot be reprogrammed after it has been manufactured.

Mask ROM is created by a process known as photolithography. This process involves using a mask, or template, to expose specific areas of a silicon wafer to ultraviolet light. The areas that are exposed to the light are then etched away, leaving behind the patterns that make up the memory cells. Once the memory cells have been created, they are permanently programmed with the data that they will store.

Mask ROM is commonly used in devices that require permanent storage of data, such as game consoles, calculators, and other electronic devices. Because the data is permanently programmed during manufacturing, mask ROM provides a reliable and secure way to store critical data, such as system settings, firmware, and other important information.

One of the advantages of using mask ROM is that it is a cost-effective way to produce large quantities of memory. Because the data is programmed during the manufacturing process, the cost per unit is relatively low compared to other types of non-volatile memory, such as EEPROM or flash memory.