QCCJ MASK ROM 82

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Part	Manufacturer	Memory IC Type	Temperature Grade	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	Terminal Form	Parallel or Serial	Operating Mode	Maximum Supply Current	No. of Words	Nominal Supply Voltage / Vsup (V)	Power Supplies (V)	Memory Width	Package Style (Meter)	Package Equivalence Code	Alternate Memory Width	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Output Characteristics	Organization	No. of Words Code	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Supply Voltage (Vsup)	Maximum Seated Height	Width	Qualification	Memory Density	Minimum Supply Voltage (Vsup)	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Maximum Standby Current	Length	Maximum Access Time
TMS47256-25FML	Texas Instruments	MASK ROM	COMMERCIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	NMOS		J BEND	PARALLEL	ASYNCHRONOUS	60 mA	32768 words	5	5	8	CHIP CARRIER	LDCC32,.5X.6		MASK ROMs	1.27 mm	70 Cel	3-STATE	32KX8	32K	0 Cel		QUAD	R-PQCC-J32		5.5 V	3.56 mm	11.43 mm	Not Qualified	262144 bit	4.5 V		NOT SPECIFIED	NOT SPECIFIED		13.97 mm	250 ns
TMS47C256-25FML	Texas Instruments	MASK ROM	COMMERCIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		J BEND	PARALLEL	ASYNCHRONOUS	50 mA	32768 words	5	5	8	CHIP CARRIER	LDCC32,.5X.6		MASK ROMs	1.27 mm	70 Cel	3-STATE	32KX8	32K	0 Cel		QUAD	R-PQCC-J32		5.5 V	3.56 mm	11.43 mm	Not Qualified	262144 bit	4.5 V		NOT SPECIFIED	NOT SPECIFIED		13.97 mm	250 ns
TMS47C1024-20FML	Texas Instruments	MASK ROM	COMMERCIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		J BEND	PARALLEL	ASYNCHRONOUS		131072 words	5	5	8	CHIP CARRIER	LDCC32,.5X.6		MASK ROMs	1.27 mm	70 Cel	3-STATE	128KX8	128K	0 Cel		QUAD	R-PQCC-J32		5.5 V	3.56 mm	11.43 mm	Not Qualified	1048576 bit	4.5 V		NOT SPECIFIED	NOT SPECIFIED		13.97 mm	200 ns
TMS47C512-20FML	Texas Instruments	MASK ROM	COMMERCIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		J BEND	PARALLEL	ASYNCHRONOUS		65536 words	5	5	8	CHIP CARRIER	LDCC32,.5X.6		MASK ROMs	1.27 mm	70 Cel	3-STATE	64KX8	64K	0 Cel		QUAD	R-PQCC-J32		5.5 V	3.56 mm	11.43 mm	Not Qualified	524288 bit	4.5 V		NOT SPECIFIED	NOT SPECIFIED		13.97 mm	200 ns
TMS47C1024-25FML	Texas Instruments	MASK ROM	COMMERCIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		J BEND	PARALLEL	ASYNCHRONOUS		131072 words	5	5	8	CHIP CARRIER	LDCC32,.5X.6		MASK ROMs	1.27 mm	70 Cel	3-STATE	128KX8	128K	0 Cel		QUAD	R-PQCC-J32		5.5 V	3.56 mm	11.43 mm	Not Qualified	1048576 bit	4.5 V		NOT SPECIFIED	NOT SPECIFIED		13.97 mm	250 ns
TMS47C1024-30FML	Texas Instruments	MASK ROM	COMMERCIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		J BEND	PARALLEL	ASYNCHRONOUS		131072 words	5	5	8	CHIP CARRIER	LDCC32,.5X.6		MASK ROMs	1.27 mm	70 Cel	3-STATE	128KX8	128K	0 Cel		QUAD	R-PQCC-J32		5.5 V	3.56 mm	11.43 mm	Not Qualified	1048576 bit	4.5 V		NOT SPECIFIED	NOT SPECIFIED		13.97 mm	300 ns
TMS47C256-20FML	Texas Instruments	MASK ROM	COMMERCIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		J BEND	PARALLEL	ASYNCHRONOUS	50 mA	32768 words	5	5	8	CHIP CARRIER	LDCC32,.5X.6		MASK ROMs	1.27 mm	70 Cel	3-STATE	32KX8	32K	0 Cel		QUAD	R-PQCC-J32		5.5 V	3.56 mm	11.43 mm	Not Qualified	262144 bit	4.5 V		NOT SPECIFIED	NOT SPECIFIED		13.97 mm	200 ns
TMS47C512-30FML	Texas Instruments	MASK ROM	COMMERCIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		J BEND	PARALLEL	ASYNCHRONOUS		65536 words	5	5	8	CHIP CARRIER	LDCC32,.5X.6		MASK ROMs	1.27 mm	70 Cel	3-STATE	64KX8	64K	0 Cel		QUAD	R-PQCC-J32		5.5 V	3.56 mm	11.43 mm	Not Qualified	524288 bit	4.5 V		NOT SPECIFIED	NOT SPECIFIED		13.97 mm	300 ns
TMS47256-20FML	Texas Instruments	MASK ROM	COMMERCIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	NMOS		J BEND	PARALLEL	ASYNCHRONOUS	60 mA	32768 words	5	5	8	CHIP CARRIER	LDCC32,.5X.6		MASK ROMs	1.27 mm	70 Cel	3-STATE	32KX8	32K	0 Cel		QUAD	R-PQCC-J32		5.5 V	3.56 mm	11.43 mm	Not Qualified	262144 bit	4.5 V		NOT SPECIFIED	NOT SPECIFIED		13.97 mm	200 ns
TMS47C256-15FML	Texas Instruments	MASK ROM	COMMERCIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		J BEND	PARALLEL	ASYNCHRONOUS	50 mA	32768 words	5	5	8	CHIP CARRIER	LDCC32,.5X.6		MASK ROMs	1.27 mm	70 Cel	3-STATE	32KX8	32K	0 Cel		QUAD	R-PQCC-J32		5.5 V	3.56 mm	11.43 mm	Not Qualified	262144 bit	4.5 V		NOT SPECIFIED	NOT SPECIFIED		13.97 mm	150 ns
TMS47C512-25FML	Texas Instruments	MASK ROM	COMMERCIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		J BEND	PARALLEL	ASYNCHRONOUS		65536 words	5	5	8	CHIP CARRIER	LDCC32,.5X.6		MASK ROMs	1.27 mm	70 Cel	3-STATE	64KX8	64K	0 Cel		QUAD	R-PQCC-J32		5.5 V	3.56 mm	11.43 mm	Not Qualified	524288 bit	4.5 V		NOT SPECIFIED	NOT SPECIFIED		13.97 mm	250 ns
TMS47256-30FML	Texas Instruments	MASK ROM	COMMERCIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	NMOS		J BEND	PARALLEL	ASYNCHRONOUS	60 mA	32768 words	5	5	8	CHIP CARRIER	LDCC32,.5X.6		MASK ROMs	1.27 mm	70 Cel	3-STATE	32KX8	32K	0 Cel		QUAD	R-PQCC-J32		5.5 V	3.56 mm	11.43 mm	Not Qualified	262144 bit	4.5 V		NOT SPECIFIED	NOT SPECIFIED		13.97 mm	300 ns
AM27X512-70JC	Infineon Technologies	MASK ROM	COMMERCIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		J BEND	PARALLEL	ASYNCHRONOUS	30 mA	65536 words	5	5	8	CHIP CARRIER	LDCC32,.5X.6		MASK ROMs	1.27 mm	70 Cel	3-STATE	64KX8	64K	0 Cel	TIN LEAD	QUAD	R-PQCC-J32		5.5 V			Not Qualified	524288 bit	4.5 V	e0			.0001 Amp		70 ns
AM27X512-70JI	Infineon Technologies	MASK ROM	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		J BEND	PARALLEL	ASYNCHRONOUS	30 mA	65536 words	5	5	8	CHIP CARRIER	LDCC32,.5X.6		MASK ROMs	1.27 mm	85 Cel	3-STATE	64KX8	64K	-40 Cel	TIN LEAD	QUAD	R-PQCC-J32		5.5 V			Not Qualified	524288 bit	4.5 V	e0			.0001 Amp		70 ns
HN62444BNCP-12	Renesas Electronics	MASK ROM	COMMERCIAL	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		J BEND	PARALLEL	ASYNCHRONOUS		262144 words	5		16	CHIP CARRIER				1.27 mm	70 Cel		256KX16	256K	0 Cel		QUAD	S-PQCC-J44		5.25 V	4.6 mm	16.5862 mm	Not Qualified	4194304 bit	4.75 V					16.5862 mm	120 ns
HN62444BCPN-12	Renesas Electronics	MASK ROM	COMMERCIAL	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		J BEND	PARALLEL	ASYNCHRONOUS		262144 words	5		16	CHIP CARRIER				1.27 mm	70 Cel		256KX16	256K	0 Cel		QUAD	S-PQCC-J44		5.25 V	4.6 mm	16.5862 mm	Not Qualified	4194304 bit	4.75 V					16.5862 mm	120 ns
HN62444BCP	Renesas Electronics	MASK ROM	COMMERCIAL	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		J BEND	PARALLEL	ASYNCHRONOUS		262144 words	5		16	CHIP CARRIER				1.27 mm	70 Cel		256KX16	256K	0 Cel		QUAD	S-PQCC-J44		5.25 V	4.57 mm	16.5862 mm	Not Qualified	4194304 bit	4.75 V					16.5862 mm	100 ns
HN62442BCP	Renesas Electronics	MASK ROM	COMMERCIAL	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		J BEND	PARALLEL	ASYNCHRONOUS		131072 words	5		16	CHIP CARRIER				1.27 mm	70 Cel		128KX16	128K	0 Cel		QUAD	S-PQCC-J44		5.5 V	4.57 mm	16.5862 mm	Not Qualified	2097152 bit	4.5 V					16.5862 mm	100 ns
HN62442BCP-10	Renesas Electronics	MASK ROM	COMMERCIAL	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		J BEND	PARALLEL	ASYNCHRONOUS		131072 words	5		16	CHIP CARRIER				1.27 mm	70 Cel		128KX16	128K	0 Cel		QUAD	S-PQCC-J44		5.5 V	4.6 mm	16.5862 mm	Not Qualified	2097152 bit	4.5 V					16.5862 mm	100 ns
HN62444BCP-10	Renesas Electronics	MASK ROM	COMMERCIAL	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		J BEND	PARALLEL	ASYNCHRONOUS		262144 words	5		16	CHIP CARRIER				1.27 mm	70 Cel		256KX16	256K	0 Cel		QUAD	S-PQCC-J44		5.25 V	4.6 mm	16.5862 mm	Not Qualified	4194304 bit	4.75 V					16.5862 mm	100 ns
KM23128JI-20	Samsung	MASK ROM	INDUSTRIAL	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES		MOS		J BEND			75 mA	16384 words	5	5	8	CHIP CARRIER	LDCC28,.5SQ		MASK ROMs	1.27 mm	85 Cel		16KX8	16K	-40 Cel	TIN LEAD	QUAD	S-PQCC-J28	3				Not Qualified	131072 bit		e0					200 ns
KM23C512JI-20	Samsung	MASK ROM	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS		J BEND			40 mA	65536 words	5	5	8	CHIP CARRIER	LDCC32,.5X.6		MASK ROMs	1.27 mm	85 Cel		64KX8	64K	-40 Cel	TIN LEAD	QUAD	R-PQCC-J32	3				Not Qualified	524288 bit		e0			.00004 Amp		200 ns
KM23C512JI-15	Samsung	MASK ROM	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS		J BEND			40 mA	65536 words	5	5	8	CHIP CARRIER	LDCC32,.5X.6		MASK ROMs	1.27 mm	85 Cel		64KX8	64K	-40 Cel	TIN LEAD	QUAD	R-PQCC-J32	3				Not Qualified	524288 bit		e0			.00004 Amp		150 ns
KM23256SJI-25	Samsung	MASK ROM	INDUSTRIAL	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES		MOS		J BEND			75 mA	32768 words	5	5	8	CHIP CARRIER	LDCC28,.5SQ		MASK ROMs	1.27 mm	85 Cel		32KX8	32K	-40 Cel	TIN LEAD	QUAD	S-PQCC-J28	3				Not Qualified	262144 bit		e0					250 ns
KM23C4200BJ-20	Samsung	MASK ROM	COMMERCIAL	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		J BEND	PARALLEL	ASYNCHRONOUS	60 mA	524288 words	5	5	8	CHIP CARRIER	LDCC44,.7SQ	16	MASK ROMs	1.27 mm	70 Cel	3-STATE	512KX8	512K	0 Cel	TIN LEAD	QUAD	S-PQCC-J44		5.5 V	4.57 mm	16.5862 mm	Not Qualified	4194304 bit	4.5 V	e0			.00005 Amp	16.5862 mm	200 ns
KM2365JI-20	Samsung	MASK ROM	INDUSTRIAL	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES		MOS		J BEND			60 mA	8192 words	5	5	8	CHIP CARRIER	LDCC28,.5SQ		MASK ROMs	1.27 mm	85 Cel		8KX8	8K	-40 Cel	TIN LEAD	QUAD	S-PQCC-J28	3				Not Qualified	65536 bit		e0					200 ns
KM23128JI-25	Samsung	MASK ROM	INDUSTRIAL	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES		MOS		J BEND			75 mA	16384 words	5	5	8	CHIP CARRIER	LDCC28,.5SQ		MASK ROMs	1.27 mm	85 Cel		16KX8	16K	-40 Cel	TIN LEAD	QUAD	S-PQCC-J28	3				Not Qualified	131072 bit		e0					250 ns
KM2365SJ-20	Samsung	MASK ROM	COMMERCIAL	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES		MOS		J BEND			60 mA	8192 words	5	5	8	CHIP CARRIER	LDCC28,.5SQ		MASK ROMs	1.27 mm	70 Cel		8KX8	8K	0 Cel	TIN LEAD	QUAD	S-PQCC-J28	3				Not Qualified	65536 bit		e0					200 ns
KM23257SJI-25	Samsung	MASK ROM	INDUSTRIAL	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES		MOS		J BEND			75 mA	32768 words			8	CHIP CARRIER	LDCC28,.5SQ		MASK ROMs	1.27 mm	85 Cel		32KX8	32K	-40 Cel	TIN LEAD	QUAD	S-PQCC-J28	3				Not Qualified	262144 bit		e0					250 ns
KM2365JI-30	Samsung	MASK ROM	INDUSTRIAL	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES		MOS		J BEND			60 mA	8192 words	5	5	8	CHIP CARRIER	LDCC28,.5SQ		MASK ROMs	1.27 mm	85 Cel		8KX8	8K	-40 Cel	TIN LEAD	QUAD	S-PQCC-J28	3				Not Qualified	65536 bit		e0					300 ns
KM23128SJ-20	Samsung	MASK ROM	COMMERCIAL	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES		MOS		J BEND			75 mA	16384 words	5	5	8	CHIP CARRIER	LDCC28,.5SQ		MASK ROMs	1.27 mm	70 Cel		16KX8	16K	0 Cel	TIN LEAD	QUAD	S-PQCC-J28	3				Not Qualified	131072 bit		e0					200 ns
KM23128SJI-15	Samsung	MASK ROM	INDUSTRIAL	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES		MOS		J BEND			75 mA	16384 words	5	5	8	CHIP CARRIER	LDCC28,.5SQ		MASK ROMs	1.27 mm	85 Cel		16KX8	16K	-40 Cel	TIN LEAD	QUAD	S-PQCC-J28	3				Not Qualified	131072 bit		e0					150 ns
KM23C1010J-15	Samsung	MASK ROM	COMMERCIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		J BEND	PARALLEL	ASYNCHRONOUS	30 mA	131072 words	5	5	8	CHIP CARRIER	LDCC32,.5X.6		MASK ROMs	1.27 mm	70 Cel	3-STATE	128KX8	128K	0 Cel	TIN LEAD	QUAD	R-PQCC-J32		5.5 V	3.55 mm	11.43 mm	Not Qualified	1048576 bit	4.5 V	e0			.0001 Amp	13.97 mm	150 ns
KM23256JI-25	Samsung	MASK ROM	INDUSTRIAL	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES		MOS		J BEND			75 mA	32768 words	5	5	8	CHIP CARRIER	LDCC28,.5SQ		MASK ROMs	1.27 mm	85 Cel		32KX8	32K	-40 Cel	TIN LEAD	QUAD	S-PQCC-J28	3				Not Qualified	262144 bit		e0					250 ns
KM23128JI-15	Samsung	MASK ROM	INDUSTRIAL	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES		MOS		J BEND			75 mA	16384 words	5	5	8	CHIP CARRIER	LDCC28,.5SQ		MASK ROMs	1.27 mm	85 Cel		16KX8	16K	-40 Cel	TIN LEAD	QUAD	S-PQCC-J28	3				Not Qualified	131072 bit		e0					150 ns
KM23257J-20	Samsung	MASK ROM	COMMERCIAL	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES		MOS		J BEND			75 mA	32768 words			8	CHIP CARRIER	LDCC28,.5SQ		MASK ROMs	1.27 mm	70 Cel		32KX8	32K	0 Cel	TIN LEAD	QUAD	S-PQCC-J28	3				Not Qualified	262144 bit		e0					200 ns
KM23C512JI-25	Samsung	MASK ROM	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS		J BEND			40 mA	65536 words	5	5	8	CHIP CARRIER	LDCC32,.5X.6		MASK ROMs	1.27 mm	85 Cel		64KX8	64K	-40 Cel	TIN LEAD	QUAD	R-PQCC-J32	3				Not Qualified	524288 bit		e0			.00004 Amp		250 ns
KM23256JI-20	Samsung	MASK ROM	INDUSTRIAL	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES		MOS		J BEND			75 mA	32768 words	5	5	8	CHIP CARRIER	LDCC28,.5SQ		MASK ROMs	1.27 mm	85 Cel		32KX8	32K	-40 Cel	TIN LEAD	QUAD	S-PQCC-J28	3				Not Qualified	262144 bit		e0					200 ns
KM23257SJHR-27	Samsung	MASK ROM	MILITARY	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES		MOS	38535Q/M;38534H;883B	J BEND			75 mA	32768 words			8	CHIP CARRIER	LDCC28,.5SQ		MASK ROMs	1.27 mm	125 Cel		32KX8	32K	-55 Cel	TIN LEAD	QUAD	S-PQCC-J28	3				Not Qualified	262144 bit		e0					270 ns
KM23257SJ-20	Samsung	MASK ROM	COMMERCIAL	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES		MOS		J BEND			75 mA	32768 words			8	CHIP CARRIER	LDCC28,.5SQ		MASK ROMs	1.27 mm	70 Cel		32KX8	32K	0 Cel	TIN LEAD	QUAD	S-PQCC-J28	3				Not Qualified	262144 bit		e0					200 ns
KM23256SJ-20	Samsung	MASK ROM	COMMERCIAL	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES		MOS		J BEND			75 mA	32768 words	5	5	8	CHIP CARRIER	LDCC28,.5SQ		MASK ROMs	1.27 mm	70 Cel		32KX8	32K	0 Cel	TIN LEAD	QUAD	S-PQCC-J28	3				Not Qualified	262144 bit		e0					200 ns
KM23256JI-15	Samsung	MASK ROM	INDUSTRIAL	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES		MOS		J BEND			75 mA	32768 words	5	5	8	CHIP CARRIER	LDCC28,.5SQ		MASK ROMs	1.27 mm	85 Cel		32KX8	32K	-40 Cel	TIN LEAD	QUAD	S-PQCC-J28	3				Not Qualified	262144 bit		e0					150 ns
KM23256SJ-25	Samsung	MASK ROM	COMMERCIAL	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES		MOS		J BEND			75 mA	32768 words	5	5	8	CHIP CARRIER	LDCC28,.5SQ		MASK ROMs	1.27 mm	70 Cel		32KX8	32K	0 Cel	TIN LEAD	QUAD	S-PQCC-J28	3				Not Qualified	262144 bit		e0					250 ns
KM23256SJI-20	Samsung	MASK ROM	INDUSTRIAL	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES		MOS		J BEND			75 mA	32768 words	5	5	8	CHIP CARRIER	LDCC28,.5SQ		MASK ROMs	1.27 mm	85 Cel		32KX8	32K	-40 Cel	TIN LEAD	QUAD	S-PQCC-J28	3				Not Qualified	262144 bit		e0					200 ns
KM23257JI-20	Samsung	MASK ROM	INDUSTRIAL	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES		MOS		J BEND			75 mA	32768 words			8	CHIP CARRIER	LDCC28,.5SQ		MASK ROMs	1.27 mm	85 Cel		32KX8	32K	-40 Cel	TIN LEAD	QUAD	S-PQCC-J28	3				Not Qualified	262144 bit		e0					200 ns
KM23257JHR-27	Samsung	MASK ROM	MILITARY	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES		MOS	38535Q/M;38534H;883B	J BEND			75 mA	32768 words			8	CHIP CARRIER	LDCC28,.5SQ		MASK ROMs	1.27 mm	125 Cel		32KX8	32K	-55 Cel	TIN LEAD	QUAD	S-PQCC-J28	3				Not Qualified	262144 bit		e0					270 ns
KM2365J-25	Samsung	MASK ROM	COMMERCIAL	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES		MOS		J BEND			60 mA	8192 words	5	5	8	CHIP CARRIER	LDCC28,.5SQ		MASK ROMs	1.27 mm	70 Cel		8KX8	8K	0 Cel	TIN LEAD	QUAD	S-PQCC-J28	3				Not Qualified	65536 bit		e0					250 ns
KM23257SJI-15	Samsung	MASK ROM	INDUSTRIAL	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES		MOS		J BEND			75 mA	32768 words			8	CHIP CARRIER	LDCC28,.5SQ		MASK ROMs	1.27 mm	85 Cel		32KX8	32K	-40 Cel	TIN LEAD	QUAD	S-PQCC-J28	3				Not Qualified	262144 bit		e0					150 ns

MASK ROM

Mask ROM, or Read-Only Memory, is a type of non-volatile computer memory that is programmed during the manufacturing process. Mask ROM is designed to permanently store data and cannot be reprogrammed after it has been manufactured.

Mask ROM is created by a process known as photolithography. This process involves using a mask, or template, to expose specific areas of a silicon wafer to ultraviolet light. The areas that are exposed to the light are then etched away, leaving behind the patterns that make up the memory cells. Once the memory cells have been created, they are permanently programmed with the data that they will store.

Mask ROM is commonly used in devices that require permanent storage of data, such as game consoles, calculators, and other electronic devices. Because the data is permanently programmed during manufacturing, mask ROM provides a reliable and secure way to store critical data, such as system settings, firmware, and other important information.

One of the advantages of using mask ROM is that it is a cost-effective way to produce large quantities of memory. Because the data is programmed during the manufacturing process, the cost per unit is relatively low compared to other types of non-volatile memory, such as EEPROM or flash memory.