TSSOP MASK ROM 158

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Part	Manufacturer	Memory IC Type	Temperature Grade	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Terminal Form	Parallel or Serial	Operating Mode	Maximum Supply Current	No. of Words	Nominal Supply Voltage / Vsup (V)	Power Supplies (V)	Memory Width	Package Style (Meter)	Package Equivalence Code	Alternate Memory Width	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Organization	No. of Words Code	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Supply Voltage (Vsup)	Maximum Seated Height	Width	Qualification	Memory Density	Minimum Supply Voltage (Vsup)	JESD-609 Code	Maximum Standby Current	Length	Maximum Access Time
UPD23C32000AGY-XXX-MKH	Renesas Electronics	MASK ROM	COMMERCIAL	48	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS	GULL WING			70 mA	2097152 words	5	5	16	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP48,.71,20	8	MASK ROMs	.5 mm	70 Cel	2MX16	2M	-10 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDSO-G48					Not Qualified	33554432 bit		e0	.0001 Amp		120 ns
UPD23C16303GZ-XXX-MJH	Renesas Electronics	MASK ROM	COMMERCIAL	48	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS	GULL WING			30 mA	1048576 words		1.8,3/3.3	16	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP48,.8,20		MASK ROMs	.5 mm	70 Cel	1MX16	1M	-10 Cel		DUAL	R-PDSO-G48					Not Qualified	16777216 bit			.00003 Amp		90 ns
UPD23C16040BLGY-XXX-MJH	Renesas Electronics	MASK ROM	COMMERCIAL	48	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS	GULL WING			40 mA	1048576 words		3/3.3	16	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP48,.71,20	8	MASK ROMs	.5 mm	70 Cel	1MX16	1M	-10 Cel		DUAL	R-PDSO-G48					Not Qualified	16777216 bit			.00003 Amp		90 ns
UPD23C32040LGY-XXX-MKH	Renesas Electronics	MASK ROM	COMMERCIAL	48	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS	GULL WING			60 mA	2097152 words	3.3	3.3	16	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP48,.71,20	8	MASK ROMs	.5 mm	70 Cel	2MX16	2M	-10 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDSO-G48					Not Qualified	33554432 bit		e0	.00003 Amp		140 ns
UPD23C128000LGY-MKH	Renesas Electronics	MASK ROM	COMMERCIAL	48	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS	GULL WING			45 mA	8388608 words		3/3.3	16	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP48,.71,20	8	MASK ROMs	.5 mm	70 Cel	8MX16	8M	-10 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDSO-G48					Not Qualified	134217728 bit		e0	.00003 Amp		120 ns
UPD23C64380GZ-XXX-MJH	Renesas Electronics	MASK ROM	COMMERCIAL	48	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	MOS	GULL WING	PARALLEL	ASYNCHRONOUS	75 mA	4194304 words	3	3/3.3	16	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP48,.8,20	8	MASK ROMs	.5 mm	70 Cel	4MX16	4M	-10 Cel	TIN LEAD	DUAL	R-PDSO-G48		3.6 V	1.2 mm	12 mm	Not Qualified	67108864 bit	2.7 V	e0	.00003 Amp	18.4 mm	120 ns
UPD23C16000BLGY-XXX-MKH-A	Renesas Electronics	MASK ROM	COMMERCIAL	48	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	MOS	GULL WING	PARALLEL	ASYNCHRONOUS	30 mA	1048576 words	3	3/3.3	16	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP48,.71,20	8	MASK ROMs	.5 mm	70 Cel	1MX16	1M	-10 Cel	MATTE TIN/TIN BISMUTH	DUAL	R-PDSO-G48		3.6 V	1.2 mm	12 mm	Not Qualified	16777216 bit	2.7 V	e3/e6	.00003 Amp	16.4 mm	90 ns
KM23V64005BTY	Samsung	MASK ROM	COMMERCIAL	48	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS	GULL WING			60 mA	4194304 words		3/3.3	16	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP48,.71,20	8	MASK ROMs	.5 mm	70 Cel	4MX16	4M	0 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDSO-G48					Not Qualified	67108864 bit		e0	.00003 Amp		120 ns
KM23V64000BTY	Samsung	MASK ROM	COMMERCIAL	48	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS	GULL WING			40 mA	4194304 words		3/3.3	16	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP48,.71,20	8	MASK ROMs	.5 mm	70 Cel	4MX16	4M	0 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDSO-G48					Not Qualified	67108864 bit		e0	.00005 Amp		120 ns
KM23V32000BTY	Samsung	MASK ROM	COMMERCIAL	48	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS	GULL WING			30 mA	2097152 words		3/3.3	16	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP48,.71,20	8	MASK ROMs	.5 mm	70 Cel	2MX16	2M	0 Cel	TIN LEAD	DUAL	R-PDSO-G48	3				Not Qualified	33554432 bit		e0	.00003 Amp		100 ns
K3P7C1000B-YC	Samsung	MASK ROM	COMMERCIAL	48	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS	GULL WING			150 mA	4194304 words	5	5	16	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP48,.8,20	8	MASK ROMs	.5 mm	70 Cel	4MX16	4M	0 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDSO-G48					Not Qualified	67108864 bit		e0	.0001 Amp		120 ns
KM23S32000BETY	Samsung	MASK ROM	OTHER	48	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS	GULL WING			20 mA	2097152 words	2.5	2.5	16	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP48,.71,20	8	MASK ROMs	.5 mm	85 Cel	2MX16	2M	-20 Cel	TIN LEAD	DUAL	R-PDSO-G48	3				Not Qualified	33554432 bit		e0	.000005 Amp		120 ns
KM23S32000BTY	Samsung	MASK ROM	COMMERCIAL	48	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS	GULL WING			20 mA	2097152 words	2.5	2.5	16	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP48,.71,20	8	MASK ROMs	.5 mm	70 Cel	2MX16	2M	0 Cel	TIN LEAD	DUAL	R-PDSO-G48	3				Not Qualified	33554432 bit		e0	.000005 Amp		120 ns
KM23V32000BETY	Samsung	MASK ROM	OTHER	48	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS	GULL WING			30 mA	2097152 words		3/3.3	16	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP48,.71,20	8	MASK ROMs	.5 mm	85 Cel	2MX16	2M	-20 Cel	TIN LEAD	DUAL	R-PDSO-G48	3				Not Qualified	33554432 bit		e0	.00003 Amp		100 ns

MASK ROM

Mask ROM, or Read-Only Memory, is a type of non-volatile computer memory that is programmed during the manufacturing process. Mask ROM is designed to permanently store data and cannot be reprogrammed after it has been manufactured.

Mask ROM is created by a process known as photolithography. This process involves using a mask, or template, to expose specific areas of a silicon wafer to ultraviolet light. The areas that are exposed to the light are then etched away, leaving behind the patterns that make up the memory cells. Once the memory cells have been created, they are permanently programmed with the data that they will store.

Mask ROM is commonly used in devices that require permanent storage of data, such as game consoles, calculators, and other electronic devices. Because the data is permanently programmed during manufacturing, mask ROM provides a reliable and secure way to store critical data, such as system settings, firmware, and other important information.

One of the advantages of using mask ROM is that it is a cost-effective way to produce large quantities of memory. Because the data is programmed during the manufacturing process, the cost per unit is relatively low compared to other types of non-volatile memory, such as EEPROM or flash memory.