Samsung MASK ROM 1,964

Reset All

Part	Manufacturer	Memory IC Type	Temperature Grade	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Terminal Form	Parallel or Serial	Operating Mode	Maximum Supply Current	No. of Words	Nominal Supply Voltage / Vsup (V)	Power Supplies (V)	Memory Width	Package Style (Meter)	Package Equivalence Code	Alternate Memory Width	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Output Characteristics	Organization	No. of Words Code	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Supply Voltage (Vsup)	Maximum Seated Height	Width	Qualification	Memory Density	Minimum Supply Voltage (Vsup)	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Maximum Standby Current	Length	Maximum Access Time
K3N6C1000F-TC10	Samsung	MASK ROM	COMMERCIAL	44	TSOP2	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	50 mA	2097152 words	5	5	16	SMALL OUTLINE, THIN PROFILE	TSOP44,.46,32	8	MASK ROMs	.8 mm	70 Cel		2MX16	2M	0 Cel	TIN LEAD	DUAL	R-PDSO-G44		5.5 V	1.2 mm	10.16 mm	Not Qualified	33554432 bit	4.5 V		e0			.00005 Amp	18.41 mm	100 ns
K3P4C1000E-TC100	Samsung	MASK ROM	COMMERCIAL	44	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS		524288 words	5		16	SMALL OUTLINE		8			70 Cel		512KX16	512K	0 Cel		DUAL	R-PDSO-G44		5.5 V			Not Qualified	8388608 bit	4.5 V			30	240			100 ns
KM23128JI-20	Samsung	MASK ROM	INDUSTRIAL	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES		MOS	J BEND			75 mA	16384 words	5	5	8	CHIP CARRIER	LDCC28,.5SQ		MASK ROMs	1.27 mm	85 Cel		16KX8	16K	-40 Cel	TIN LEAD	QUAD	S-PQCC-J28	3				Not Qualified	131072 bit			e0					200 ns
KM23257SP-15	Samsung	MASK ROM	COMMERCIAL	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		MOS	THROUGH-HOLE			75 mA	32768 words			8	IN-LINE	DIP28,.6		MASK ROMs	2.54 mm	70 Cel		32KX8	32K	0 Cel	TIN LEAD	DUAL	R-PDIP-T28	3				Not Qualified	262144 bit			e0					150 ns
K3N3C3000D-GC12	Samsung	MASK ROM	COMMERCIAL	32	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	50 mA	524288 words	5	5	8	SMALL OUTLINE	SOP32,.56		MASK ROMs	1.27 mm	70 Cel		512KX8	512K	0 Cel	TIN LEAD	DUAL	R-PDSO-G32		5.5 V	3 mm	11.43 mm	Not Qualified	4194304 bit	4.5 V	TTL COMPATIBLE I/O	e0			.00005 Amp	20.47 mm	120 ns
KM23C512JI-20	Samsung	MASK ROM	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS	J BEND			40 mA	65536 words	5	5	8	CHIP CARRIER	LDCC32,.5X.6		MASK ROMs	1.27 mm	85 Cel		64KX8	64K	-40 Cel	TIN LEAD	QUAD	R-PQCC-J32	3				Not Qualified	524288 bit			e0			.00004 Amp		200 ns
KM23S32000BETY-12	Samsung	MASK ROM	OTHER	48	TSOP1	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS		4194304 words	2.5		8	SMALL OUTLINE, THIN PROFILE				.5 mm	85 Cel		4MX8	4M	-20 Cel		DUAL	R-PDSO-G48		2.7 V	1.2 mm	12 mm	Not Qualified	33554432 bit	2.3 V	TTL COMPATIBLE I/O; CONFIGURABLE AS 2M X 16					16.4 mm	120 ns
K3P7V1000B-FC100	Samsung	MASK ROM	COMMERCIAL	48	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	BALL	PARALLEL	ASYNCHRONOUS		4194304 words	3.3		16	GRID ARRAY, THIN PROFILE, FINE PITCH		8		.75 mm	70 Cel		4MX16	4M	0 Cel		BOTTOM	S-PBGA-B48		3.6 V	1.2 mm	9 mm	Not Qualified	67108864 bit	3 V			30	240		9 mm	100 ns
K3N6U1000D-YC10	Samsung	MASK ROM	COMMERCIAL	48	TSOP1	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	35 mA	4194304 words	3	3	8	SMALL OUTLINE, THIN PROFILE	TSSOP48,.71,20	8	MASK ROMs	.5 mm	70 Cel		4MX8	4M	0 Cel	TIN LEAD	DUAL	R-PDSO-G48		3.3 V	1.2 mm	12 mm	Not Qualified	33554432 bit	2.7 V	ALSO CONFIGURABLE AS 2M X 16	e0			.00003 Amp	16.4 mm	100 ns
K3N5V1000F-DC120	Samsung	MASK ROM	COMMERCIAL	42	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	THROUGH-HOLE	PARALLEL	ASYNCHRONOUS		1048576 words	3.3		16	IN-LINE		8		2.54 mm	70 Cel		1MX16	1M	0 Cel		DUAL	R-PDIP-T42		3.6 V	5.08 mm	15.24 mm	Not Qualified	16777216 bit	3 V			NOT SPECIFIED	NOT SPECIFIED		52.42 mm	120 ns
KM23C64000BTY-10	Samsung	MASK ROM	COMMERCIAL	48	TSOP1	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	70 mA	4194304 words	5	5	16	SMALL OUTLINE, THIN PROFILE	TSSOP48,.71,20	8	MASK ROMs	.5 mm	70 Cel		4MX16	4M	0 Cel	TIN LEAD	DUAL	R-PDSO-G48		5.5 V	1.2 mm	12 mm	Not Qualified	67108864 bit	4.5 V	CONFIGURABLE AS 4M X 16	e0			.0001 Amp	16.4 mm	100 ns
KM23V16005DG-12	Samsung	MASK ROM	COMMERCIAL	44	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS		1048576 words	3		16	SMALL OUTLINE		8		1.27 mm	70 Cel		1MX16	1M	0 Cel		DUAL	R-PDSO-G44		3.3 V	3.1 mm	12.6 mm	Not Qualified	16777216 bit	2.7 V	CAN ALSO BE OPERATED IN 3V TO 3.6V					28.5 mm	120 ns
KM23V16100A-20	Samsung	MASK ROM	COMMERCIAL	36	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	THROUGH-HOLE	PARALLEL	ASYNCHRONOUS	30 mA	2097152 words	3.3	3/3.3	8	IN-LINE	DIP36,.6		MASK ROMs	2.54 mm	70 Cel	3-STATE	2MX8	2M	0 Cel	TIN LEAD	DUAL	R-PDIP-T36		3.6 V	5.08 mm	15.24 mm	Not Qualified	16777216 bit	2.7 V		e0			.00005 Amp	45.72 mm	200 ns
KM23V64000ATY-12	Samsung	MASK ROM	COMMERCIAL	48	TSOP1	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS		4194304 words	3		16	SMALL OUTLINE, THIN PROFILE		8		.5 mm	70 Cel		4MX16	4M	0 Cel		DUAL	R-PDSO-G48		3.3 V	1.2 mm	12 mm	Not Qualified	67108864 bit	2.7 V						16.4 mm	120 ns
K3N3U1000D-TE	Samsung
KM23C2100A-15	Samsung	MASK ROM	COMMERCIAL	40	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	THROUGH-HOLE	PARALLEL	ASYNCHRONOUS	40 mA	262144 words	5	5	8	IN-LINE	DIP40,.6	16	MASK ROMs	2.54 mm	70 Cel	3-STATE	256KX8	256K	0 Cel	TIN LEAD	DUAL	R-PDIP-T40		5.5 V	5.08 mm	15.24 mm	Not Qualified	2097152 bit	4.5 V		e0			.00005 Amp	52.43 mm	150 ns
KM23V32000BETY-8	Samsung	MASK ROM	OTHER	48	TSOP1	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS		4194304 words	3.3		8	SMALL OUTLINE, THIN PROFILE				.5 mm	85 Cel		4MX8	4M	-20 Cel		DUAL	R-PDSO-G48		3.6 V	1.2 mm	12 mm	Not Qualified	33554432 bit	3 V	TTL COMPATIBLE I/O; CONFIGURABLE AS 2M X 16					16.4 mm	80 ns
K3P7V1000B-TC100	Samsung	MASK ROM	COMMERCIAL	44	TSOP2	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS		4194304 words	3.3		16	SMALL OUTLINE, THIN PROFILE		8		.8 mm	70 Cel		4MX16	4M	0 Cel		DUAL	R-PDSO-G44		3.6 V	1.2 mm	10.16 mm	Not Qualified	67108864 bit	3 V						18.41 mm	100 ns
K3N6V1000E-YC120	Samsung	MASK ROM	COMMERCIAL	48	TSOP1	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS		2097152 words	3.3		16	SMALL OUTLINE, THIN PROFILE		8		.5 mm	70 Cel		2MX16	2M	0 Cel		DUAL	R-PDSO-G48		3.6 V	1.2 mm	12 mm	Not Qualified	33554432 bit	3 V			30	240		16.4 mm	120 ns
K3P4C1000D-GC10	Samsung	MASK ROM	COMMERCIAL	44	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	80 mA	524288 words	5	5	16	SMALL OUTLINE	SOP44,.63	8	MASK ROMs	1.27 mm	70 Cel		512KX16	512K	0 Cel	TIN LEAD	DUAL	R-PDSO-G44		5.5 V	3.1 mm	12.6 mm	Not Qualified	8388608 bit	4.5 V	ALL INPUTS AND OUTPUTS TTL COMPATIBLE	e0			.00005 Amp	28.5 mm	100 ns
K3N7V1000C-GC10	Samsung	MASK ROM	COMMERCIAL	44	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	40 mA	4194304 words	3.3	3.3	16	SMALL OUTLINE	SOP44,.63	8	MASK ROMs	1.27 mm	70 Cel		4MX16	4M	0 Cel	TIN LEAD	DUAL	R-PDSO-G44		3.6 V	3.1 mm	12.6 mm	Not Qualified	67108864 bit	3 V		e0			.00003 Amp	28.5 mm	100 ns
K3P7C1000B-YC120	Samsung	MASK ROM	COMMERCIAL	48	TSOP1	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS		4194304 words	5		16	SMALL OUTLINE, THIN PROFILE		8		.5 mm	70 Cel		4MX16	4M	0 Cel		DUAL	R-PDSO-G48		5.5 V	1.2 mm	12 mm	Not Qualified	67108864 bit	4.5 V			30	240		16.4 mm	120 ns
KM23C16000CET-15	Samsung	MASK ROM	OTHER	44	TSOP2	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	50 mA	2097152 words	5	5	8	SMALL OUTLINE, THIN PROFILE	TSOP44,.46,32	8	MASK ROMs	.8 mm	85 Cel		2MX8	2M	-20 Cel	TIN LEAD	DUAL	R-PDSO-G44		5.5 V	1.2 mm	10.16 mm	Not Qualified	16777216 bit	4.5 V	CONFIGURABLE AS 1M X 16	e0			.00005 Amp	18.41 mm	150 ns
KM23C64005AG-15	Samsung	MASK ROM	COMMERCIAL	44	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS		8388608 words	5		8	SMALL OUTLINE				1.27 mm	70 Cel		8MX8	8M	0 Cel		DUAL	R-PDSO-G44		5.5 V	3.1 mm	12.6 mm	Not Qualified	67108864 bit	4.5 V	CONFIGURABLE AS 4M X 16; WITH PAGE MODE FUNCTION; PAGE ACCESS TIME 30NS					28.5 mm	150 ns
KM23256SP-25	Samsung	MASK ROM	COMMERCIAL	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		MOS	THROUGH-HOLE			75 mA	32768 words	5	5	8	IN-LINE	DIP28,.6		MASK ROMs	2.54 mm	70 Cel		32KX8	32K	0 Cel	TIN LEAD	DUAL	R-PDIP-T28	3				Not Qualified	262144 bit			e0					250 ns
K3N7C4000M-DC12	Samsung	MASK ROM	COMMERCIAL	42	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	THROUGH-HOLE	PARALLEL	ASYNCHRONOUS	70 mA	4194304 words	5	5	16	IN-LINE	DIP42,.6		MASK ROMs	2.54 mm	70 Cel		4MX16	4M	0 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDIP-T42		5.5 V	5.08 mm	15.24 mm	Not Qualified	67108864 bit	4.5 V		e0				52.42 mm	120 ns
K3N7C1000C-YC12	Samsung	MASK ROM	COMMERCIAL	48	TSOP1	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	70 mA	4194304 words	5	5	16	SMALL OUTLINE, THIN PROFILE	TSSOP48,.71,20	8	MASK ROMs	.5 mm	70 Cel		4MX16	4M	0 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDSO-G48		5.5 V	1.2 mm	12 mm	Not Qualified	67108864 bit	4.5 V		e0			.00005 Amp	16.4 mm	120 ns
KM23C4100CT-10	Samsung	MASK ROM	COMMERCIAL	44	TSOP	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS	GULL WING			60 mA	262144 words	5	5	16	SMALL OUTLINE, THIN PROFILE	TSOP44,.46,32	8	MASK ROMs	.8 mm	70 Cel		256KX16	256K	0 Cel	TIN LEAD	DUAL	R-PDSO-G44	3				Not Qualified	4194304 bit			e0			.00005 Amp		100 ns
K3N6U1000F-C	Samsung
KM23C2001G-15	Samsung	MASK ROM	COMMERCIAL	32	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	50 mA	262144 words	5	5	8	SMALL OUTLINE	SOP32,.56		MASK ROMs	1.27 mm	70 Cel		256KX8	256K	0 Cel	TIN LEAD	DUAL	R-PDSO-G32		5.5 V	3 mm	11.43 mm	Not Qualified	2097152 bit	4.5 V		e0			.05 Amp	20.47 mm	150 ns
KM23V64005BTY	Samsung	MASK ROM	COMMERCIAL	48	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS	GULL WING			60 mA	4194304 words		3/3.3	16	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP48,.71,20	8	MASK ROMs	.5 mm	70 Cel		4MX16	4M	0 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDSO-G48					Not Qualified	67108864 bit			e0			.00003 Amp		120 ns
K3P6C1000F-GC12	Samsung	MASK ROM	COMMERCIAL	44	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	150 mA	2097152 words	5	5	16	SMALL OUTLINE	SOP44,.63	8	MASK ROMs	1.27 mm	70 Cel		2MX16	2M	0 Cel	TIN LEAD	DUAL	R-PDSO-G44		5.5 V	3.1 mm	12.6 mm	Not Qualified	33554432 bit	4.5 V		e0			.00005 Amp	28.5 mm	120 ns
KM23V32000CG	Samsung	MASK ROM	COMMERCIAL	44	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	30 mA	4194304 words	3	3/3.3	8	SMALL OUTLINE	SOP44,.63	8	MASK ROMs	1.27 mm	70 Cel		4MX8	4M	0 Cel	TIN LEAD	DUAL	R-PDSO-G44		3.3 V	3.1 mm	12.6 mm	Not Qualified	33554432 bit	2.7 V	USER CONFIGURABLE AS 2M X 16; CAN ALSO OPERATE AT 3V TO 3.6V SUPPLY	e0			.00003 Amp	28.5 mm	150 ns
K3N3V1000D-TC100	Samsung	MASK ROM	COMMERCIAL	44	TSOP2	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS		262144 words	3.3		16	SMALL OUTLINE, THIN PROFILE		8		.8 mm	70 Cel		256KX16	256K	0 Cel		DUAL	R-PDSO-G44		3.6 V	1.2 mm	10.16 mm	Not Qualified	4194304 bit	3 V			30	240		18.41 mm	100 ns
K3N5C1000D-GC120	Samsung	MASK ROM	COMMERCIAL	44	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS		1048576 words	5		16	SMALL OUTLINE		8		1.27 mm	70 Cel		1MX16	1M	0 Cel		DUAL	R-PDSO-G44		5.5 V	3.1 mm	12.6 mm	Not Qualified	16777216 bit	4.5 V			30	225		28.5 mm	120 ns
K3N5U1000D-DC150	Samsung	MASK ROM	COMMERCIAL	42	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	THROUGH-HOLE	PARALLEL	ASYNCHRONOUS		1048576 words	3		16	IN-LINE		8		2.54 mm	70 Cel		1MX16	1M	0 Cel		DUAL	R-PDIP-T42		3.3 V	5.08 mm	15.24 mm	Not Qualified	16777216 bit	2.7 V			NOT SPECIFIED	NOT SPECIFIED		52.42 mm	150 ns
K3N7U1000C-YC120	Samsung	MASK ROM	COMMERCIAL	48	TSOP1	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS		4194304 words	3		16	SMALL OUTLINE, THIN PROFILE		8		.5 mm	70 Cel		4MX16	4M	0 Cel		DUAL	R-PDSO-G48		3.6 V	1.2 mm	12 mm	Not Qualified	67108864 bit	2.7 V			30	240		16.4 mm	120 ns
K3N5C1000E-GC10	Samsung	MASK ROM	COMMERCIAL	44	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	50 mA	1048576 words	5	5	16	SMALL OUTLINE	SOP44,.63	8	MASK ROMs	1.27 mm	70 Cel		1MX16	1M	0 Cel	TIN LEAD	DUAL	R-PDSO-G44		5.5 V	3.1 mm	12.6 mm	Not Qualified	16777216 bit	4.5 V		e0			.00005 Amp	28.5 mm	100 ns
K3N4CV1000E-W	Samsung
KM23V4000DETG	Samsung	MASK ROM	OTHER	32	TSOP1	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	25 mA	524288 words	3	3/3.3	8	SMALL OUTLINE, THIN PROFILE	TSSOP32,.56,20		MASK ROMs	.5 mm	85 Cel		512KX8	512K	-20 Cel	TIN LEAD	DUAL	R-PDSO-G32		3.3 V	1.2 mm	8 mm	Not Qualified	4194304 bit	2.7 V	CAN ALSO OPERATE AT 3V TO 3.6V SUPPLY	e0			.00003 Amp	11.8 mm	95 ns
KM23V16000CT	Samsung	MASK ROM	COMMERCIAL	44	TSOP2	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	30 mA	1048576 words	3	3/3.3	16	SMALL OUTLINE, THIN PROFILE	TSOP44,.46,32	8	MASK ROMs	.8 mm	70 Cel		1MX16	1M	0 Cel	TIN LEAD	DUAL	R-PDSO-G44		3.3 V	1.2 mm	10.16 mm	Not Qualified	16777216 bit	2.7 V	CAN ALSO BE OPERATED FROM 3.0 TO 3.6 VOLTS	e0			.00003 Amp	18.41 mm	150 ns
KM23C32005BT-10	Samsung	MASK ROM	COMMERCIAL	44	TSOP2	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	150 mA	2097152 words	5	5	16	SMALL OUTLINE, THIN PROFILE	TSOP44,.46,32	8	MASK ROMs	.8 mm	70 Cel		2MX16	2M	0 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDSO-G44		5.5 V	1.2 mm	10.16 mm	Not Qualified	33554432 bit	4.5 V	CONFIGURABLE AS 2M X 16	e0			.00005 Amp	18.41 mm	100 ns
KM23V16101A-25	Samsung	MASK ROM	COMMERCIAL	36	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	THROUGH-HOLE	PARALLEL	ASYNCHRONOUS	30 mA	2097152 words	3.3	3/3.3	8	IN-LINE	DIP36,.6		MASK ROMs	2.54 mm	70 Cel	3-STATE	2MX8	2M	0 Cel	TIN LEAD	DUAL	R-PDIP-T36		3.6 V	5.08 mm	15.24 mm	Not Qualified	16777216 bit	2.7 V		e0			.03 Amp	45.72 mm	250 ns
K3P7V1000B-TC120	Samsung	MASK ROM	COMMERCIAL	44	TSOP2	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS		4194304 words	3.3		16	SMALL OUTLINE, THIN PROFILE		8		.8 mm	70 Cel		4MX16	4M	0 Cel		DUAL	R-PDSO-G44		3.6 V	1.2 mm	10.16 mm	Not Qualified	67108864 bit	3 V						18.41 mm	120 ns
KM23V64005BF-12	Samsung	MASK ROM	COMMERCIAL	48	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	BALL	PARALLEL	ASYNCHRONOUS		4194304 words	3		16	GRID ARRAY, THIN PROFILE, FINE PITCH		8		.75 mm	70 Cel		4MX16	4M	0 Cel		BOTTOM	S-PBGA-B48		3.3 V	1.2 mm	9 mm	Not Qualified	67108864 bit	2.7 V						9 mm	120 ns
KM23C8000D-15	Samsung	MASK ROM	COMMERCIAL	32	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	THROUGH-HOLE	PARALLEL	ASYNCHRONOUS	50 mA	1048576 words	5	5	8	IN-LINE	DIP32,.6		MASK ROMs	2.54 mm	70 Cel		1MX8	1M	0 Cel	TIN LEAD	DUAL	R-PDIP-T32		5.5 V	5.08 mm	15.24 mm	Not Qualified	8388608 bit	4.5 V		e0			.00005 Amp	41.91 mm	150 ns
KM23C8100-15	Samsung	MASK ROM	COMMERCIAL	42	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	THROUGH-HOLE	PARALLEL	ASYNCHRONOUS	50 mA	1048576 words	5	5	8	IN-LINE	DIP42,.6	16	MASK ROMs	2.54 mm	70 Cel	3-STATE	1MX8	1M	0 Cel	TIN LEAD	DUAL	R-PDIP-T42		5.5 V	5.08 mm	15.24 mm	Not Qualified	8388608 bit	4.5 V		e0			.00005 Amp	52.43 mm	150 ns
KM23C8100B-12	Samsung	MASK ROM	COMMERCIAL	42	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	THROUGH-HOLE	PARALLEL	ASYNCHRONOUS	60 mA	1048576 words	5	5	8	IN-LINE	DIP42,.6	16	MASK ROMs	2.54 mm	70 Cel	3-STATE	1MX8	1M	0 Cel	TIN LEAD	DUAL	R-PDIP-T42		5.5 V	5.08 mm	15.24 mm	Not Qualified	8388608 bit	4.5 V		e0			.00005 Amp	52.43 mm	120 ns

MASK ROM

Mask ROM, or Read-Only Memory, is a type of non-volatile computer memory that is programmed during the manufacturing process. Mask ROM is designed to permanently store data and cannot be reprogrammed after it has been manufactured.

Mask ROM is created by a process known as photolithography. This process involves using a mask, or template, to expose specific areas of a silicon wafer to ultraviolet light. The areas that are exposed to the light are then etched away, leaving behind the patterns that make up the memory cells. Once the memory cells have been created, they are permanently programmed with the data that they will store.

Mask ROM is commonly used in devices that require permanent storage of data, such as game consoles, calculators, and other electronic devices. Because the data is permanently programmed during manufacturing, mask ROM provides a reliable and secure way to store critical data, such as system settings, firmware, and other important information.

One of the advantages of using mask ROM is that it is a cost-effective way to produce large quantities of memory. Because the data is programmed during the manufacturing process, the cost per unit is relatively low compared to other types of non-volatile memory, such as EEPROM or flash memory.