OTP ROM Other Function Memory ICs 17

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Part	Manufacturer	Memory IC Type	Temperature Grade	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Technology	Screening Level	Terminal Form	Maximum Supply Current	No. of Words	Input/Output Type	Nominal Supply Voltage / Vsup (V)	Power Supplies (V)	Memory Width	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Output Characteristics	Organization	No. of Words Code	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Memory Density	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Maximum Standby Current	Maximum Access Time
DS2502X1+U	Analog Devices	OTP ROM	INDUSTRIAL	4			PLASTIC/EPOXY	YES					128 words	COMMON		3/5	8		BGA4,2X2,37/16	Other Memory ICs		85 Cel		128X8	128	-40 Cel	TIN SILVER COPPER NICKEL			1	Not Qualified	1024 bit	e2	30	260		15000 ns
D2758	Intel	OTP ROM	COMMERCIAL	24	DIP	RECTANGULAR	CERAMIC	NO	MOS		THROUGH-HOLE		1024 words	COMMON			8	IN-LINE	DIP24,.6	Other Memory ICs	2.54 mm	70 Cel	3-STATE	1KX8	1K	0 Cel	Tin/Lead (Sn/Pb)	DUAL	R-XDIP-T24		Not Qualified	8192 bit	e0				450 ns
NMC27C16Q-55	Texas Instruments	OTP ROM	COMMERCIAL	24	DIP	RECTANGULAR	CERAMIC	NO	CMOS		THROUGH-HOLE		2048 words	COMMON	5	5	8	IN-LINE	DIP24,.6	Other Memory ICs	2.54 mm	70 Cel	3-STATE	2KX8	2K	0 Cel	Tin/Lead (Sn/Pb)	DUAL	R-XDIP-T24		Not Qualified	16384 bit	e0				550 ns
SMJ27L08-45JM	Texas Instruments	OTP ROM	MILITARY	24	DIP	RECTANGULAR	CERAMIC	NO	MOS	38535Q/M;38534H;883B	THROUGH-HOLE		1024 words				8	IN-LINE	DIP24,.6	Other Memory ICs	2.54 mm	125 Cel	3-STATE	1KX8	1K	-55 Cel		DUAL	R-XDIP-T24		Not Qualified	8192 bit					450 ns
SMJ2708-45JM	Texas Instruments	OTP ROM	MILITARY	24	DIP	RECTANGULAR	CERAMIC	NO	MOS	38535Q/M;38534H;883B	THROUGH-HOLE		1024 words				8	IN-LINE	DIP24,.6	Other Memory ICs	2.54 mm	125 Cel	3-STATE	1KX8	1K	-55 Cel		DUAL	R-XDIP-T24		Not Qualified	8192 bit					450 ns
TMS2708JL	Texas Instruments	OTP ROM	COMMERCIAL	24	DIP	RECTANGULAR	CERAMIC	NO	MOS		THROUGH-HOLE		1024 words				8	IN-LINE	DIP24,.6	Other Memory ICs	2.54 mm	70 Cel	3-STATE	1KX8	1K	0 Cel		DUAL	R-XDIP-T24		Not Qualified	8192 bit					450 ns
TMS27L08-45JL	Texas Instruments	OTP ROM	COMMERCIAL	24	DIP	RECTANGULAR	CERAMIC	NO	MOS		THROUGH-HOLE		1024 words				8	IN-LINE	DIP24,.6	Other Memory ICs	2.54 mm	70 Cel	3-STATE	1KX8	1K	0 Cel		DUAL	R-XDIP-T24		Not Qualified	8192 bit					450 ns
NMC27C16QE-45	Texas Instruments	OTP ROM	INDUSTRIAL	24	DIP	RECTANGULAR	CERAMIC	NO	CMOS		THROUGH-HOLE		2048 words	COMMON	5	5	8	IN-LINE	DIP24,.6	Other Memory ICs	2.54 mm	85 Cel	3-STATE	2KX8	2K	-40 Cel	Tin/Lead (Sn/Pb)	DUAL	R-XDIP-T24		Not Qualified	16384 bit	e0				450 ns
TMS2708-45JL	Texas Instruments	OTP ROM	COMMERCIAL	24	DIP	RECTANGULAR	CERAMIC	NO	MOS		THROUGH-HOLE		1024 words				8	IN-LINE	DIP24,.6	Other Memory ICs	2.54 mm	70 Cel	3-STATE	1KX8	1K	0 Cel		DUAL	R-XDIP-T24		Not Qualified	8192 bit					450 ns
SMJ2564-45JM	Texas Instruments	OTP ROM	MILITARY	28	DIP	RECTANGULAR	CERAMIC	NO	MOS	38535Q/M;38534H;883B	THROUGH-HOLE		8192 words	COMMON			8	IN-LINE	DIP28,.6	Other Memory ICs	2.54 mm	125 Cel	3-STATE	8KX8	8K	-55 Cel		DUAL	R-XDIP-T28		Not Qualified	65536 bit					450 ns
TMS27L08JL	Texas Instruments	OTP ROM	COMMERCIAL	24	DIP	RECTANGULAR	CERAMIC	NO	MOS		THROUGH-HOLE		1024 words				8	IN-LINE	DIP24,.6	Other Memory ICs	2.54 mm	70 Cel	3-STATE	1KX8	1K	0 Cel		DUAL	R-XDIP-T24		Not Qualified	8192 bit					450 ns
SMJ2708-35JM	Texas Instruments	OTP ROM	MILITARY	24	DIP	RECTANGULAR	CERAMIC	NO	MOS	38535Q/M;38534H;883B	THROUGH-HOLE		1024 words				8	IN-LINE	DIP24,.6	Other Memory ICs	2.54 mm	125 Cel	3-STATE	1KX8	1K	-55 Cel		DUAL	R-XDIP-T24		Not Qualified	8192 bit					350 ns
ST1200W2	STMicroelectronics	OTP ROM	COMMERCIAL						MOS			10 mA	256 words	COMMON			1		WAFER	Other Memory ICs		70 Cel		256X1	256	-10 Cel					Not Qualified						500 ns
ST1200W1	STMicroelectronics	OTP ROM	COMMERCIAL						MOS			10 mA	256 words	COMMON			1		WAFER	Other Memory ICs		70 Cel		256X1	256	-10 Cel					Not Qualified						500 ns
ST1200M	STMicroelectronics	OTP ROM	COMMERCIAL	8					MOS			10 mA	256 words	COMMON			1	MICROELECTRONIC ASSEMBLY	MODULE,8LEAD,.46	Other Memory ICs		70 Cel		256X1	256	-10 Cel					Not Qualified						500 ns
IM6653MJG/HR	Renesas Electronics	OTP ROM	MILITARY	24	DIP	RECTANGULAR	CERAMIC	NO	CMOS	MIL-STD-883 Class B (Modified)	THROUGH-HOLE	6 mA	1024 words	COMMON			4	IN-LINE	DIP24,.6	Other Memory ICs	2.54 mm	125 Cel	3-STATE	1KX4	1K	-55 Cel	Tin/Lead (Sn/Pb)	DUAL	R-XDIP-T24		Not Qualified	4096 bit	e0			.00004 Amp	600 ns
IM6653AMJG/HR	Renesas Electronics	OTP ROM	MILITARY	24	DIP	RECTANGULAR	CERAMIC	NO	CMOS	MIL-STD-883 Class B (Modified)	THROUGH-HOLE	12 mA	1024 words	COMMON			4	IN-LINE	DIP24,.6	Other Memory ICs	2.54 mm	125 Cel	3-STATE	1KX4	1K	-55 Cel	Tin/Lead (Sn/Pb)	DUAL	R-XDIP-T24		Not Qualified	4096 bit	e0			.00004 Amp	350 ns

Other Function Memory ICs

Other function memory ICs are a group of integrated circuits that perform specialized functions in addition to storing data. These ICs are used in a wide range of digital devices, including computers, smartphones, and electronic devices.

One example of an other function memory IC is cache memory. Cache memory is a type of memory that stores frequently accessed data and instructions. Cache memory is used to improve the performance of the system by reducing the time it takes to access data from the main memory.

Another example of an other function memory IC is dynamic random-access memory (DRAM). DRAM is a type of memory that stores data as a charge in a capacitor. DRAM is commonly used as the main memory in computers and other digital devices.

Static random-access memory (SRAM) is another type of other function memory IC. SRAM is a type of memory that stores data as a flip-flop, which retains the data as long as power is supplied to the system. SRAM is commonly used as cache memory and in other applications where high-speed access to data is required.

Memory controller ICs are another type of other function memory IC. Memory controller ICs are used to manage the flow of data between the CPU and the memory subsystem. These ICs are commonly used in computer systems and other digital devices to ensure that data is transferred efficiently and reliably.