168 Other Function Memory ICs 280

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Part	Manufacturer	Temperature Grade	No. of Terminals	Package Code	Refresh Cycles	Package Shape	Package Body Material	Surface Mount	Technology	Terminal Form	Maximum Supply Current	No. of Words	Self Refresh	Input/Output Type	Nominal Supply Voltage / Vsup (V)	Power Supplies (V)	Memory Width	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Output Characteristics	Organization	No. of Words Code	Minimum Standby Voltage	Terminal Position	JESD-30 Code	Maximum Seated Height	Maximum Clock Frequency (fCLK)	Qualification	Memory Density	Maximum Standby Current	Maximum Access Time
M372F0400CW0-60	Samsung	COMMERCIAL	168	DIMM	4096	RECTANGULAR	PLASTIC/EPOXY	NO	CMOS	NO LEAD	1440 mA	4194304 words	NO	COMMON	3.3	3.3	72	MICROELECTRONIC ASSEMBLY	DIMM168	Other Memory ICs	1.27 mm	70 Cel	3-STATE	4MX72	4M		DUAL	R-PDMA-N168			Not Qualified	301989888 bit	.03 Amp	60 ns
KMM372V3200AK2-7	Samsung	COMMERCIAL	168	DIMM	4096	RECTANGULAR	PLASTIC/EPOXY	NO	CMOS	NO LEAD	2440 mA	33554432 words		COMMON	3.3	3.3	72	MICROELECTRONIC ASSEMBLY	DIMM168	Other Memory ICs	1.27 mm	70 Cel	3-STATE	32MX72	32M		DUAL	R-PDMA-N168	50.8 mm		Not Qualified	2415919104 bit	.03 Amp	70 ns
M372E0803BT0-C6	Samsung	COMMERCIAL	168	DIMM	4096	RECTANGULAR	PLASTIC/EPOXY	NO	CMOS	NO LEAD	990 mA	8388608 words		COMMON	5	5	72	MICROELECTRONIC ASSEMBLY	DIMM168	Other Memory ICs	1.27 mm	70 Cel	3-STATE	8MX72	8M		DUAL	R-PDMA-N168			Not Qualified	603979776 bit	.03 Amp	60 ns
M372V3280AF0-C600	Samsung	COMMERCIAL	168	DIMM	8192	RECTANGULAR	PLASTIC/EPOXY	NO	CMOS	NO LEAD	2620 mA	33554432 words		COMMON	3.3	3.3	72	MICROELECTRONIC ASSEMBLY	DIMM168	Other Memory ICs	1.27 mm	70 Cel	3-STATE	32MX72	32M		DUAL	R-PDMA-N168	59.69 mm		Not Qualified	2415919104 bit	.03 Amp	60 ns
KMM372V3280AS3-5	Samsung	COMMERCIAL	168	DIMM	8192	RECTANGULAR	PLASTIC/EPOXY	NO	CMOS	NO LEAD	2800 mA	33554432 words		COMMON	3.3	3.3	72	MICROELECTRONIC ASSEMBLY	DIMM168	Other Memory ICs	1.27 mm	70 Cel	3-STATE	32MX72	32M		DUAL	R-PDMA-N168	41.91 mm		Not Qualified	2415919104 bit	.03 Amp	50 ns
M372F0410CZ0-50	Samsung	COMMERCIAL	168	DIMM	2048	RECTANGULAR	PLASTIC/EPOXY	NO	CMOS	NO LEAD	1980 mA	4194304 words	NO	COMMON	3.3	3.3	72	MICROELECTRONIC ASSEMBLY	DIMM168	Other Memory ICs	1.27 mm	70 Cel	3-STATE	4MX72	4M		DUAL	R-PDMA-N168	25.4 mm		Not Qualified	301989888 bit	.03 Amp	50 ns
KMM374S1600AT-G2	Samsung	COMMERCIAL	168	DIMM	4096	RECTANGULAR	PLASTIC/EPOXY	NO	CMOS	NO LEAD	1980 mA	16777216 words		COMMON	3.3	3.3	72	MICROELECTRONIC ASSEMBLY	DIMM168	Other Memory ICs	1.27 mm	70 Cel	3-STATE	16MX72	16M		DUAL	R-PDMA-N168		83 MHz	Not Qualified	1207959552 bit	.036 Amp	8 ns
KMM372F3200AK2-5	Samsung	COMMERCIAL	168	DIMM	4096	RECTANGULAR	PLASTIC/EPOXY	NO	CMOS	NO LEAD	2800 mA	33554432 words		COMMON	3.3	3.3	72	MICROELECTRONIC ASSEMBLY	DIMM168	Other Memory ICs	1.27 mm	70 Cel	3-STATE	32MX72	32M		DUAL	R-PDMA-N168	50.8 mm		Not Qualified	2415919104 bit	.03 Amp	50 ns
KMM372F3280AK3-5	Samsung	COMMERCIAL	168	DIMM	8192	RECTANGULAR	PLASTIC/EPOXY	NO	CMOS	NO LEAD	2800 mA	33554432 words		COMMON	3.3	3.3	72	MICROELECTRONIC ASSEMBLY	DIMM168	Other Memory ICs	1.27 mm	70 Cel	3-STATE	32MX72	32M		DUAL	R-PDMA-N168	41.91 mm		Not Qualified	2415919104 bit	.03 Amp	50 ns
M372V0803CJT-C50	Samsung	COMMERCIAL	168	DIMM	4096	RECTANGULAR	PLASTIC/EPOXY	NO	CMOS	NO LEAD	990 mA	8388608 words		COMMON	3.3	3.3	72	MICROELECTRONIC ASSEMBLY	DIMM168	Other Memory ICs	1.27 mm	70 Cel	3-STATE	8MX72	8M		DUAL	R-PDMA-N168	31.75 mm		Not Qualified	603979776 bit	.03 Amp	50 ns
KMM374S823AT-G2	Samsung	COMMERCIAL	168	DIMM	4096	RECTANGULAR	PLASTIC/EPOXY	NO	CMOS	NO LEAD	1035 mA	8388608 words		COMMON	3.3	3.3	72	MICROELECTRONIC ASSEMBLY	DIMM168	Other Memory ICs	1.27 mm	70 Cel	3-STATE	8MX72	8M		DUAL	R-PDMA-N168		83 MHz	Not Qualified	603979776 bit	.018 Amp	8 ns
KMM374S1623AT-G2	Samsung	COMMERCIAL	168	DIMM	4096	RECTANGULAR	PLASTIC/EPOXY	NO	CMOS	NO LEAD	1305 mA	16777216 words		COMMON	3.3	3.3	72	MICROELECTRONIC ASSEMBLY	DIMM168	Other Memory ICs	1.27 mm	70 Cel	3-STATE	16MX72	16M		DUAL	R-PDMA-N168		83 MHz	Not Qualified	1207959552 bit	.036 Amp	8 ns
KMM372V3200AK3-7	Samsung	COMMERCIAL	168	DIMM	4096	RECTANGULAR	PLASTIC/EPOXY	NO	CMOS	NO LEAD	2440 mA	33554432 words		COMMON	3.3	3.3	72	MICROELECTRONIC ASSEMBLY	DIMM168	Other Memory ICs	1.27 mm	70 Cel	3-STATE	32MX72	32M		DUAL	R-PDMA-N168	41.91 mm		Not Qualified	2415919104 bit	.03 Amp	70 ns
KMM372F3200AS3-5	Samsung	COMMERCIAL	168	DIMM	4096	RECTANGULAR	PLASTIC/EPOXY	NO	CMOS	NO LEAD	2800 mA	33554432 words		COMMON	3.3	3.3	72	MICROELECTRONIC ASSEMBLY	DIMM168	Other Memory ICs	1.27 mm	70 Cel	3-STATE	32MX72	32M		DUAL	R-PDMA-N168	41.91 mm		Not Qualified	2415919104 bit	.03 Amp	50 ns
KMM374S1620AT-G8	Samsung	COMMERCIAL	168	DIMM	4096	RECTANGULAR	PLASTIC/EPOXY	NO	CMOS	NO LEAD	2880 mA	16777216 words		COMMON	3.3	3.3	72	MICROELECTRONIC ASSEMBLY	DIMM168	Other Memory ICs	1.27 mm	70 Cel	3-STATE	16MX72	16M		DUAL	R-PDMA-N168		125 MHz	Not Qualified	1207959552 bit	.036 Amp	6 ns
M372V0804BF0-C600	Samsung	COMMERCIAL	168	DIMM	4096	RECTANGULAR	PLASTIC/EPOXY	NO	CMOS	NO LEAD	700 mA	8388608 words		COMMON	3.3	3.3	72	MICROELECTRONIC ASSEMBLY	DIMM168	Other Memory ICs	1.27 mm	70 Cel	3-STATE	8MX72	8M		DUAL	R-PDMA-N168	25.4 mm		Not Qualified	603979776 bit	.03 Amp	60 ns
M374S1600AT0-C100	Samsung	COMMERCIAL	168	DIMM	4096	RECTANGULAR	PLASTIC/EPOXY	NO	CMOS	NO LEAD	2250 mA	16777216 words		COMMON	3.3	3.3	72	MICROELECTRONIC ASSEMBLY	DIMM168	Other Memory ICs	1.27 mm	70 Cel	3-STATE	16MX72	16M		DUAL	R-PDMA-N168		100 MHz	Not Qualified	1207959552 bit	.036 Amp	7 ns
KMM372V3280AK2-7	Samsung	COMMERCIAL	168	DIMM	8192	RECTANGULAR	PLASTIC/EPOXY	NO	CMOS	NO LEAD	2440 mA	33554432 words		COMMON	3.3	3.3	72	MICROELECTRONIC ASSEMBLY	DIMM168	Other Memory ICs	1.27 mm	70 Cel	3-STATE	32MX72	32M		DUAL	R-PDMA-N168	50.8 mm		Not Qualified	2415919104 bit	.03 Amp	70 ns
KMM374S803AT-G8	Samsung	COMMERCIAL	168	DIMM	4096	RECTANGULAR	PLASTIC/EPOXY	NO	CMOS	NO LEAD	1530 mA	8388608 words		COMMON	3.3	3.3	72	MICROELECTRONIC ASSEMBLY	DIMM168	Other Memory ICs	1.27 mm	70 Cel	3-STATE	8MX72	8M		DUAL	R-PDMA-N168		125 MHz	Not Qualified	603979776 bit	.018 Amp	6 ns
KMM372V3280AS2-7	Samsung	COMMERCIAL	168	DIMM	8192	RECTANGULAR	PLASTIC/EPOXY	NO	CMOS	NO LEAD	2440 mA	33554432 words		COMMON	3.3	3.3	72	MICROELECTRONIC ASSEMBLY	DIMM168	Other Memory ICs	1.27 mm	70 Cel	3-STATE	32MX72	32M		DUAL	R-PDMA-N168	50.8 mm		Not Qualified	2415919104 bit	.03 Amp	70 ns
KMM372V3200AK3-5	Samsung	COMMERCIAL	168	DIMM	4096	RECTANGULAR	PLASTIC/EPOXY	NO	CMOS	NO LEAD	2800 mA	33554432 words		COMMON	3.3	3.3	72	MICROELECTRONIC ASSEMBLY	DIMM168	Other Memory ICs	1.27 mm	70 Cel	3-STATE	32MX72	32M		DUAL	R-PDMA-N168	41.91 mm		Not Qualified	2415919104 bit	.03 Amp	50 ns
M372E0803BJ0-C6	Samsung	COMMERCIAL	168	DIMM	4096	RECTANGULAR	PLASTIC/EPOXY	NO	CMOS	NO LEAD	990 mA	8388608 words		COMMON	5	5	72	MICROELECTRONIC ASSEMBLY	DIMM168	Other Memory ICs	1.27 mm	70 Cel	3-STATE	8MX72	8M		DUAL	R-PDMA-N168			Not Qualified	603979776 bit	.03 Amp	60 ns
KMM372F3200AS2-7	Samsung	COMMERCIAL	168	DIMM	4096	RECTANGULAR	PLASTIC/EPOXY	NO	CMOS	NO LEAD	2440 mA	33554432 words		COMMON	3.3	3.3	72	MICROELECTRONIC ASSEMBLY	DIMM168	Other Memory ICs	1.27 mm	70 Cel	3-STATE	32MX72	32M		DUAL	R-PDMA-N168	50.8 mm		Not Qualified	2415919104 bit	.03 Amp	70 ns
KMM374S403BTN-G8	Samsung	COMMERCIAL	168	DIMM	4096	RECTANGULAR	PLASTIC/EPOXY	NO	CMOS	NO LEAD	1800 mA	4194304 words		COMMON	3.3	3.3	72	MICROELECTRONIC ASSEMBLY	DIMM168	Other Memory ICs	1.27 mm	70 Cel	3-STATE	4MX72	4M	3 V	DUAL	R-PDMA-N168		125 MHz	Not Qualified	301989888 bit	.009 Amp	6 ns
KMM372F3200AS3-7	Samsung	COMMERCIAL	168	DIMM	4096	RECTANGULAR	PLASTIC/EPOXY	NO	CMOS	NO LEAD	2440 mA	33554432 words		COMMON	3.3	3.3	72	MICROELECTRONIC ASSEMBLY	DIMM168	Other Memory ICs	1.27 mm	70 Cel	3-STATE	32MX72	32M		DUAL	R-PDMA-N168	41.91 mm		Not Qualified	2415919104 bit	.03 Amp	70 ns
KMM374S1603BTL-GH	Samsung	COMMERCIAL	168	DIMM	4096	RECTANGULAR	PLASTIC/EPOXY	NO	CMOS	NO LEAD	1170 mA	16777216 words		COMMON	3.3	3.3	72	MICROELECTRONIC ASSEMBLY	DIMM168	Other Memory ICs	1.27 mm	70 Cel	3-STATE	16MX72	16M		DUAL	R-PDMA-N168		100 MHz	Not Qualified	1207959552 bit	.018 Amp	6 ns
M372F0804BF0-C500	Samsung	COMMERCIAL	168	DIMM	4096	RECTANGULAR	PLASTIC/EPOXY	NO	CMOS	NO LEAD	760 mA	8388608 words		COMMON	3.3	3.3	72	MICROELECTRONIC ASSEMBLY	DIMM168	Other Memory ICs	1.27 mm	70 Cel	3-STATE	8MX72	8M		DUAL	R-PDMA-N168	25.4 mm		Not Qualified	603979776 bit	.03 Amp	50 ns
M372F0400CW0-50	Samsung	COMMERCIAL	168	DIMM	4096	RECTANGULAR	PLASTIC/EPOXY	NO	CMOS	NO LEAD	1620 mA	4194304 words	NO	COMMON	3.3	3.3	72	MICROELECTRONIC ASSEMBLY	DIMM168	Other Memory ICs	1.27 mm	70 Cel	3-STATE	4MX72	4M		DUAL	R-PDMA-N168			Not Qualified	301989888 bit	.03 Amp	50 ns
M372F0404BF0-C600	Samsung	COMMERCIAL	168	DIMM	4096	RECTANGULAR	PLASTIC/EPOXY	NO	CMOS	NO LEAD	600 mA	4194304 words	NO	COMMON	3.3	3.3	72	MICROELECTRONIC ASSEMBLY	DIMM168	Other Memory ICs	1.27 mm	70 Cel	3-STATE	4MX72	4M		DUAL	R-PDMA-N168			Not Qualified	301989888 bit	.03 Amp	60 ns
M372F0400CZ0-50	Samsung	COMMERCIAL	168	DIMM	4096	RECTANGULAR	PLASTIC/EPOXY	NO	CMOS	NO LEAD	1620 mA	4194304 words	NO	COMMON	3.3	3.3	72	MICROELECTRONIC ASSEMBLY	DIMM168	Other Memory ICs	1.27 mm	70 Cel	3-STATE	4MX72	4M		DUAL	R-PDMA-N168			Not Qualified	301989888 bit	.03 Amp	50 ns
KMM372F3280AS3-7	Samsung	COMMERCIAL	168	DIMM	8192	RECTANGULAR	PLASTIC/EPOXY	NO	CMOS	NO LEAD	2440 mA	33554432 words		COMMON	3.3	3.3	72	MICROELECTRONIC ASSEMBLY	DIMM168	Other Memory ICs	1.27 mm	70 Cel	3-STATE	32MX72	32M		DUAL	R-PDMA-N168	41.91 mm		Not Qualified	2415919104 bit	.03 Amp	70 ns
KMM374S823AT-G8	Samsung	COMMERCIAL	168	DIMM	4096	RECTANGULAR	PLASTIC/EPOXY	NO	CMOS	NO LEAD	1530 mA	8388608 words		COMMON	3.3	3.3	72	MICROELECTRONIC ASSEMBLY	DIMM168	Other Memory ICs	1.27 mm	70 Cel	3-STATE	8MX72	8M		DUAL	R-PDMA-N168		125 MHz	Not Qualified	603979776 bit	.018 Amp	6 ns
M372E0803BT0-C5	Samsung	COMMERCIAL	168	DIMM	4096	RECTANGULAR	PLASTIC/EPOXY	NO	CMOS	NO LEAD	1080 mA	8388608 words		COMMON	5	5	72	MICROELECTRONIC ASSEMBLY	DIMM168	Other Memory ICs	1.27 mm	70 Cel	3-STATE	8MX72	8M		DUAL	R-PDMA-N168			Not Qualified	603979776 bit	.03 Amp	50 ns
KMM372F3200AK2-7	Samsung	COMMERCIAL	168	DIMM	4096	RECTANGULAR	PLASTIC/EPOXY	NO	CMOS	NO LEAD	2440 mA	33554432 words		COMMON	3.3	3.3	72	MICROELECTRONIC ASSEMBLY	DIMM168	Other Memory ICs	1.27 mm	70 Cel	3-STATE	32MX72	32M		DUAL	R-PDMA-N168	50.8 mm		Not Qualified	2415919104 bit	.03 Amp	70 ns
KMM374S1620AT-G0	Samsung	COMMERCIAL	168	DIMM	4096	RECTANGULAR	PLASTIC/EPOXY	NO	CMOS	NO LEAD	2250 mA	16777216 words		COMMON	3.3	3.3	72	MICROELECTRONIC ASSEMBLY	DIMM168	Other Memory ICs	1.27 mm	70 Cel	3-STATE	16MX72	16M		DUAL	R-PDMA-N168		100 MHz	Not Qualified	1207959552 bit	.036 Amp	7 ns
M372V3200BB4-C500	Samsung	COMMERCIAL	168	DIMM	4096	RECTANGULAR	PLASTIC/EPOXY	NO	CMOS	NO LEAD	2260 mA	33554432 words		COMMON	3.3	3.3	72	MICROELECTRONIC ASSEMBLY	DIMM168	Other Memory ICs	1.27 mm	70 Cel	3-STATE	32MX72	32M		DUAL	R-PDMA-N168	50.8 mm		Not Qualified	2415919104 bit	.03 Amp	50 ns
KMM372F3280AS2-5	Samsung	COMMERCIAL	168	DIMM	8192	RECTANGULAR	PLASTIC/EPOXY	NO	CMOS	NO LEAD	2800 mA	33554432 words		COMMON	3.3	3.3	72	MICROELECTRONIC ASSEMBLY	DIMM168	Other Memory ICs	1.27 mm	70 Cel	3-STATE	32MX72	32M		DUAL	R-PDMA-N168	50.8 mm		Not Qualified	2415919104 bit	.03 Amp	50 ns
KMM374S1623AT-G0	Samsung	COMMERCIAL	168	DIMM	4096	RECTANGULAR	PLASTIC/EPOXY	NO	CMOS	NO LEAD	1485 mA	16777216 words		COMMON	3.3	3.3	72	MICROELECTRONIC ASSEMBLY	DIMM168	Other Memory ICs	1.27 mm	70 Cel	3-STATE	16MX72	16M		DUAL	R-PDMA-N168		100 MHz	Not Qualified	1207959552 bit	.036 Amp	7 ns
M372F0400CZ0-60	Samsung	COMMERCIAL	168	DIMM	4096	RECTANGULAR	PLASTIC/EPOXY	NO	CMOS	NO LEAD	1440 mA	4194304 words	NO	COMMON	3.3	3.3	72	MICROELECTRONIC ASSEMBLY	DIMM168	Other Memory ICs	1.27 mm	70 Cel	3-STATE	4MX72	4M		DUAL	R-PDMA-N168			Not Qualified	301989888 bit	.03 Amp	60 ns
KMM372V213AK-6	Samsung	COMMERCIAL	168	DIMM	2048	RECTANGULAR	PLASTIC/EPOXY	NO	CMOS	NO LEAD	900 mA	2097152 words	NO	COMMON	3.3	3.3	72	MICROELECTRONIC ASSEMBLY	DIMM168	Other Memory ICs	1.27 mm	70 Cel	3-STATE	2MX72	2M		DUAL	R-PDMA-N168	25.4 mm		Not Qualified	150994944 bit	.05 Amp	60 ns
M372E0803BJ0-C5	Samsung	COMMERCIAL	168	DIMM	4096	RECTANGULAR	PLASTIC/EPOXY	NO	CMOS	NO LEAD	1080 mA	8388608 words		COMMON	5	5	72	MICROELECTRONIC ASSEMBLY	DIMM168	Other Memory ICs	1.27 mm	70 Cel	3-STATE	8MX72	8M		DUAL	R-PDMA-N168			Not Qualified	603979776 bit	.03 Amp	50 ns
KMM372F3200AS3-6	Samsung	COMMERCIAL	168	DIMM	4096	RECTANGULAR	PLASTIC/EPOXY	NO	CMOS	NO LEAD	2620 mA	33554432 words		COMMON	3.3	3.3	72	MICROELECTRONIC ASSEMBLY	DIMM168	Other Memory ICs	1.27 mm	70 Cel	3-STATE	32MX72	32M		DUAL	R-PDMA-N168	41.91 mm		Not Qualified	2415919104 bit	.03 Amp	60 ns
KMM372V3200AS3-5	Samsung	COMMERCIAL	168	DIMM	4096	RECTANGULAR	PLASTIC/EPOXY	NO	CMOS	NO LEAD	2800 mA	33554432 words		COMMON	3.3	3.3	72	MICROELECTRONIC ASSEMBLY	DIMM168	Other Memory ICs	1.27 mm	70 Cel	3-STATE	32MX72	32M		DUAL	R-PDMA-N168	41.91 mm		Not Qualified	2415919104 bit	.03 Amp	50 ns
M372E0883BT0-C5	Samsung	COMMERCIAL	168	DIMM	8192	RECTANGULAR	PLASTIC/EPOXY	NO	CMOS	NO LEAD	900 mA	8388608 words		COMMON	5	5	72	MICROELECTRONIC ASSEMBLY	DIMM168	Other Memory ICs	1.27 mm	70 Cel	3-STATE	8MX72	8M		DUAL	R-PDMA-N168			Not Qualified	603979776 bit	.03 Amp	50 ns
KMM372V3200AK2-6	Samsung	COMMERCIAL	168	DIMM	4096	RECTANGULAR	PLASTIC/EPOXY	NO	CMOS	NO LEAD	2620 mA	33554432 words		COMMON	3.3	3.3	72	MICROELECTRONIC ASSEMBLY	DIMM168	Other Memory ICs	1.27 mm	70 Cel	3-STATE	32MX72	32M		DUAL	R-PDMA-N168	50.8 mm		Not Qualified	2415919104 bit	.03 Amp	60 ns
KMM372F3280AK2-6	Samsung	COMMERCIAL	168	DIMM	8192	RECTANGULAR	PLASTIC/EPOXY	NO	CMOS	NO LEAD	2620 mA	33554432 words		COMMON	3.3	3.3	72	MICROELECTRONIC ASSEMBLY	DIMM168	Other Memory ICs	1.27 mm	70 Cel	3-STATE	32MX72	32M		DUAL	R-PDMA-N168	50.8 mm		Not Qualified	2415919104 bit	.03 Amp	60 ns
MT9LSDT872AY-10E	Micron Technology	COMMERCIAL	168	DIMM	4096	RECTANGULAR	PLASTIC/EPOXY	NO	CMOS	NO LEAD	1710 mA	8388608 words		COMMON	3.3	3.3	72	MICROELECTRONIC ASSEMBLY	DIMM168	Other Memory ICs	1.27 mm	70 Cel	3-STATE	8MX72	8M		DUAL	R-PDMA-N168		125 MHz	Not Qualified	603979776 bit	.018 Amp	6 ns
MT9LSDT872AY-13E	Micron Technology	COMMERCIAL	168	DIMM	4096	RECTANGULAR	PLASTIC/EPOXY	NO	CMOS	NO LEAD	2070 mA	8388608 words		COMMON	3.3	3.3	72	MICROELECTRONIC ASSEMBLY	DIMM168	Other Memory ICs	1.27 mm	70 Cel	3-STATE	8MX72	8M		DUAL	R-PDMA-N168		143 MHz	Not Qualified	603979776 bit	.018 Amp	5.4 ns

Other Function Memory ICs

Other function memory ICs are a group of integrated circuits that perform specialized functions in addition to storing data. These ICs are used in a wide range of digital devices, including computers, smartphones, and electronic devices.

One example of an other function memory IC is cache memory. Cache memory is a type of memory that stores frequently accessed data and instructions. Cache memory is used to improve the performance of the system by reducing the time it takes to access data from the main memory.

Another example of an other function memory IC is dynamic random-access memory (DRAM). DRAM is a type of memory that stores data as a charge in a capacitor. DRAM is commonly used as the main memory in computers and other digital devices.

Static random-access memory (SRAM) is another type of other function memory IC. SRAM is a type of memory that stores data as a flip-flop, which retains the data as long as power is supplied to the system. SRAM is commonly used as cache memory and in other applications where high-speed access to data is required.

Memory controller ICs are another type of other function memory IC. Memory controller ICs are used to manage the flow of data between the CPU and the memory subsystem. These ICs are commonly used in computer systems and other digital devices to ensure that data is transferred efficiently and reliably.