32 Other Function Memory ICs 63

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Part	Manufacturer	Memory IC Type	Temperature Grade	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Terminal Form	Operating Mode	Maximum Supply Current	No. of Words	Self Refresh	Input/Output Type	Nominal Supply Voltage / Vsup (V)	Mixed Memory Type	Power Supplies (V)	Memory Width	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Output Characteristics	Organization	No. of Words Code	Minimum Standby Voltage	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Maximum Supply Voltage (Vsup)	Maximum Seated Height	Width	Qualification	Memory Density	Minimum Supply Voltage (Vsup)	JESD-609 Code	Maximum Standby Current	Length	Maximum Access Time
UPD26411GZ-XXX-KKH	Renesas Electronics	MEMORY CIRCUIT	COMMERCIAL	32	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS	GULL WING		10 mA					ROM+SRAM	1.8/3.3		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP32,.8,20	Other Memory ICs	.5 mm	70 Cel					-10 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDSO-G32				Not Qualified			e0	.0000065 Amp
M66307SP	Renesas Electronics	MEMORY CIRCUIT	COMMERCIAL	32	SDIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	THROUGH-HOLE	SYNCHRONOUS	110 mA	320 words			5		5	16	IN-LINE, SHRINK PITCH	SDIP32,.4	Other Memory ICs	1.778 mm	70 Cel		320X16	320		0 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDIP-T32	5.5 V	5.08 mm	10.16 mm	Not Qualified	5120 bit	4.5 V	e0		28 mm	120 ns
UPD26401GU-XXX-9KH	Renesas Electronics	MEMORY CIRCUIT	COMMERCIAL	32	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS	GULL WING		7.5 mA					ROM+SRAM	1.8/3.3		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP32,.56,20	Other Memory ICs	.5 mm	70 Cel					-10 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDSO-G32				Not Qualified			e0	.00001 Amp
M66307FP	Renesas Electronics	MEMORY CIRCUIT	COMMERCIAL	32	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	SYNCHRONOUS	110 mA	320 words			5		5	16	SMALL OUTLINE	SOP32,.5	Other Memory ICs	1.27 mm	70 Cel		320X16	320		0 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDSO-G32	5.5 V	2.4 mm	8.4 mm	Not Qualified	5120 bit	4.5 V	e0		20 mm	120 ns
UPD26411GZ-XXX-KJH	Renesas Electronics	MEMORY CIRCUIT	COMMERCIAL	32	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS	GULL WING		10 mA					ROM+SRAM	1.8/3.3		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP32,.8,20	Other Memory ICs	.5 mm	70 Cel					-10 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDSO-G32				Not Qualified			e0	.0000065 Amp
UPD26401GU-XXX-9JH	Renesas Electronics	MEMORY CIRCUIT	COMMERCIAL	32	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS	GULL WING		7.5 mA					ROM+SRAM	1.8/3.3		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP32,.56,20	Other Memory ICs	.5 mm	70 Cel					-10 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDSO-G32				Not Qualified			e0	.00001 Amp
KM658128ASG-8	Samsung		COMMERCIAL	32	SOP	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS	GULL WING		70 mA	131072 words		COMMON	5		5	8	SMALL OUTLINE	SOP32,.5	Other Memory ICs	1.27 mm	70 Cel	3-STATE	128KX8	128K	4.5 V	0 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDSO-G32				Not Qualified	1048576 bit		e0	.001 Amp		80 ns
KM658512T-12	Samsung			32	TSOP	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS	GULL WING			524288 words	YES	COMMON	5		5	8	SMALL OUTLINE, THIN PROFILE	TSOP32,.46	Other Memory ICs	1.27 mm		3-STATE	512KX8	512K	4.5 V		Tin/Lead (Sn/Pb)	DUAL	R-PDSO-G32				Not Qualified	4194304 bit		e0			120 ns
KM658512T-8	Samsung			32	TSOP	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS	GULL WING			524288 words	YES	COMMON	5		5	8	SMALL OUTLINE, THIN PROFILE	TSOP32,.46	Other Memory ICs	1.27 mm		3-STATE	512KX8	512K	4.5 V		Tin/Lead (Sn/Pb)	DUAL	R-PDSO-G32				Not Qualified	4194304 bit		e0			80 ns
KM658512T-10	Samsung			32	TSOP	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS	GULL WING			524288 words	YES	COMMON	5		5	8	SMALL OUTLINE, THIN PROFILE	TSOP32,.46	Other Memory ICs	1.27 mm		3-STATE	512KX8	512K	4.5 V		Tin/Lead (Sn/Pb)	DUAL	R-PDSO-G32				Not Qualified	4194304 bit		e0			100 ns
KM658128SP-8	Samsung		COMMERCIAL	32	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		CMOS	THROUGH-HOLE			131072 words		COMMON	5		5	8	IN-LINE	DIP32(UNSPEC)	Other Memory ICs		70 Cel	3-STATE	128KX8	128K	4.5 V	0 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDIP-T32				Not Qualified	1048576 bit		e0			80 ns
KM658128SP-10	Samsung		COMMERCIAL	32	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		CMOS	THROUGH-HOLE			131072 words		COMMON	5		5	8	IN-LINE	DIP32(UNSPEC)	Other Memory ICs		70 Cel	3-STATE	128KX8	128K	4.5 V	0 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDIP-T32				Not Qualified	1048576 bit		e0			100 ns
KM658128ASG-12	Samsung		COMMERCIAL	32	SOP	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS	GULL WING		50 mA	131072 words		COMMON	5		5	8	SMALL OUTLINE	SOP32,.5	Other Memory ICs	1.27 mm	70 Cel	3-STATE	128KX8	128K	4.5 V	0 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDSO-G32				Not Qualified	1048576 bit		e0	.001 Amp		120 ns
KM658128ASG-10	Samsung		COMMERCIAL	32	SOP	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS	GULL WING		60 mA	131072 words		COMMON	5		5	8	SMALL OUTLINE	SOP32,.5	Other Memory ICs	1.27 mm	70 Cel	3-STATE	128KX8	128K	4.5 V	0 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDSO-G32				Not Qualified	1048576 bit		e0	.001 Amp		100 ns
KM658128SP-12	Samsung		COMMERCIAL	32	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		CMOS	THROUGH-HOLE			131072 words		COMMON	5		5	8	IN-LINE	DIP32(UNSPEC)	Other Memory ICs		70 Cel	3-STATE	128KX8	128K	4.5 V	0 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDIP-T32				Not Qualified	1048576 bit		e0			120 ns

Other Function Memory ICs

Other function memory ICs are a group of integrated circuits that perform specialized functions in addition to storing data. These ICs are used in a wide range of digital devices, including computers, smartphones, and electronic devices.

One example of an other function memory IC is cache memory. Cache memory is a type of memory that stores frequently accessed data and instructions. Cache memory is used to improve the performance of the system by reducing the time it takes to access data from the main memory.

Another example of an other function memory IC is dynamic random-access memory (DRAM). DRAM is a type of memory that stores data as a charge in a capacitor. DRAM is commonly used as the main memory in computers and other digital devices.

Static random-access memory (SRAM) is another type of other function memory IC. SRAM is a type of memory that stores data as a flip-flop, which retains the data as long as power is supplied to the system. SRAM is commonly used as cache memory and in other applications where high-speed access to data is required.

Memory controller ICs are another type of other function memory IC. Memory controller ICs are used to manage the flow of data between the CPU and the memory subsystem. These ICs are commonly used in computer systems and other digital devices to ensure that data is transferred efficiently and reliably.