68 Other Function Memory ICs 21

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Part	Manufacturer	Memory IC Type	Temperature Grade	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	Terminal Form	Operating Mode	Maximum Supply Current	No. of Words	Nominal Supply Voltage / Vsup (V)	Power Supplies (V)	Memory Width	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Organization	No. of Words Code	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Supply Voltage (Vsup)	Maximum Seated Height	Width	Qualification	Memory Density	Minimum Supply Voltage (Vsup)	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Maximum Standby Current	Length	Maximum Access Time
WSF128K16-37G1UM	Microsemi	MEMORY CIRCUIT	MILITARY	68	QFP	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	1	CMOS		GULL WING	ASYNCHRONOUS		131072 words	5		16	FLATPACK			1.27 mm	125 Cel	128KX16	128K	-55 Cel		QUAD	S-CQFP-G68		5.5 V	3.56 mm	23.88 mm		2097152 bit	4.5 V	SRAM IS ORGANISED AS 128K X 32					23.88 mm
5962-9564302QXA	Texas Instruments	VIDEO DRAM	MILITARY	68	PGA	SQUARE	CERAMIC	NO		CMOS	38535Q/M;38534H;883B	PIN/PEG		225 mA	262144 words	5	5	16	GRID ARRAY	PGA68,9X9	Other Memory ICs	2.54 mm	125 Cel	256KX16	256K	-55 Cel		PERPENDICULAR	S-XPGA-P68					Not Qualified	4194304 bit						.012 Amp		70 ns
SAB-R3020-25-N	Infineon Technologies		COMMERCIAL	68	QCCJ	SQUARE	PLASTIC/EPOXY	YES		CMOS		J BEND		70 mA		5	5		CHIP CARRIER	LDCC68,1.0SQ	Other Memory ICs	1.27 mm	70 Cel			0 Cel	Tin/Lead (Sn/Pb)	QUAD	S-PQCC-J68					Not Qualified				e0
SAB-R2020-16-N	Infineon Technologies		COMMERCIAL	68	QCCJ	SQUARE	PLASTIC/EPOXY	YES		CMOS		J BEND		70 mA		5	5		CHIP CARRIER	LDCC68,1.0SQ	Other Memory ICs	1.27 mm	70 Cel			0 Cel	Tin/Lead (Sn/Pb)	QUAD	S-PQCC-J68					Not Qualified				e0
79R3020-40J	Renesas Electronics	MEMORY CIRCUIT	COMMERCIAL	68	QCCJ	SQUARE	PLASTIC/EPOXY	YES		CMOS		J BEND		90 mA		5	5		CHIP CARRIER	LDCC68,1.0SQ	Other Memory ICs	1.27 mm	70 Cel			0 Cel	TIN LEAD	QUAD	S-PQCC-J68	1				Not Qualified				e0	20	225
IDT79R3020-12G	Renesas Electronics	MEMORY CIRCUIT	COMMERCIAL	68	PGA	SQUARE	CERAMIC	NO		CMOS		PIN/PEG				5	5		GRID ARRAY	PGA68,11X11	Other Memory ICs	2.54 mm	70 Cel			0 Cel	TIN LEAD	PERPENDICULAR	S-XPGA-P68					Not Qualified				e0
79R3020-25G	Renesas Electronics	MEMORY CIRCUIT	COMMERCIAL	68	PGA	SQUARE	CERAMIC	NO		CMOS		PIN/PEG		70 mA		5	5		GRID ARRAY	PGA68,11X11	Other Memory ICs	2.54 mm	70 Cel			0 Cel	TIN LEAD	PERPENDICULAR	S-XPGA-P68					Not Qualified				e0
79R3020-33G	Renesas Electronics	MEMORY CIRCUIT	COMMERCIAL	68	PGA	SQUARE	CERAMIC	NO		CMOS		PIN/PEG		80 mA		5	5		GRID ARRAY	PGA68,11X11	Other Memory ICs	2.54 mm	70 Cel			0 Cel	TIN LEAD	PERPENDICULAR	S-XPGA-P68					Not Qualified				e0
79R3020-16J	Renesas Electronics		COMMERCIAL	68	QCCJ	SQUARE	PLASTIC/EPOXY	YES		CMOS		J BEND		50 mA		5	5		CHIP CARRIER	LDCC68,1.0SQ	Other Memory ICs	1.27 mm	70 Cel			0 Cel	TIN LEAD	QUAD	S-PQCC-J68	1				Not Qualified				e0	20	225
79R3020-25J	Renesas Electronics	MEMORY CIRCUIT	COMMERCIAL	68	QCCJ	SQUARE	PLASTIC/EPOXY	YES		CMOS		J BEND		70 mA		5	5		CHIP CARRIER	LDCC68,1.0SQ	Other Memory ICs	1.27 mm	70 Cel			0 Cel	TIN LEAD	QUAD	S-PQCC-J68	1				Not Qualified				e0	20	225
79R3020-40G	Renesas Electronics	MEMORY CIRCUIT	COMMERCIAL	68	PGA	SQUARE	CERAMIC	NO		CMOS		PIN/PEG		90 mA		5	5		GRID ARRAY	PGA68,11X11	Other Memory ICs	2.54 mm	70 Cel			0 Cel	TIN LEAD	PERPENDICULAR	S-XPGA-P68					Not Qualified				e0
79R3020-33GB	Renesas Electronics	MEMORY CIRCUIT	MILITARY	68	PGA	SQUARE	CERAMIC	NO		CMOS	38535Q/M;38534H;883B	PIN/PEG		80 mA		5	5		GRID ARRAY	PGA68,11X11	Other Memory ICs	2.54 mm	125 Cel			-55 Cel	TIN LEAD	PERPENDICULAR	S-XPGA-P68					Not Qualified				e0
79R3020-33J	Renesas Electronics	MEMORY CIRCUIT	COMMERCIAL	68	QCCJ	SQUARE	PLASTIC/EPOXY	YES		CMOS		J BEND		80 mA		5	5		CHIP CARRIER	LDCC68,1.0SQ	Other Memory ICs	1.27 mm	70 Cel			0 Cel	TIN LEAD	QUAD	S-PQCC-J68	1				Not Qualified				e0	20	225
79R3020-12GM	Renesas Electronics	MEMORY CIRCUIT	MILITARY	68	PGA	SQUARE	CERAMIC	NO		CMOS		PIN/PEG				5	5		GRID ARRAY	PGA68,11X11	Other Memory ICs	2.54 mm	125 Cel			-55 Cel	TIN LEAD	PERPENDICULAR	S-XPGA-P68					Not Qualified				e0
IDT79R3020-33GB	Renesas Electronics	MEMORY CIRCUIT	MILITARY	68	PGA	SQUARE	CERAMIC	NO		CMOS	38535Q/M;38534H;883B	PIN/PEG		80 mA		5	5		GRID ARRAY	PGA68,11X11	Other Memory ICs	2.54 mm	125 Cel			-55 Cel	TIN LEAD	PERPENDICULAR	S-XPGA-P68					Not Qualified				e0
79R3020-20J	Renesas Electronics	MEMORY CIRCUIT	COMMERCIAL	68	QCCJ	SQUARE	PLASTIC/EPOXY	YES		CMOS		J BEND		60 mA		5	5		CHIP CARRIER	LDCC68,1.0SQ	Other Memory ICs	1.27 mm	70 Cel			0 Cel	TIN LEAD	QUAD	S-PQCC-J68	1				Not Qualified				e0	20	225
79R3020-16G	Renesas Electronics		COMMERCIAL	68	PGA	SQUARE	CERAMIC	NO		CMOS		PIN/PEG		50 mA		5	5		GRID ARRAY	PGA68,11X11	Other Memory ICs	2.54 mm	70 Cel			0 Cel	Tin/Lead (Sn/Pb)	PERPENDICULAR	S-XPGA-P68					Not Qualified				e0
79R3020-20G	Renesas Electronics	MEMORY CIRCUIT	COMMERCIAL	68	PGA	SQUARE	CERAMIC	NO		CMOS		PIN/PEG		60 mA		5	5		GRID ARRAY	PGA68,11X11	Other Memory ICs	2.54 mm	70 Cel			0 Cel	TIN LEAD	PERPENDICULAR	S-XPGA-P68					Not Qualified				e0
79R3020-12G	Renesas Electronics	MEMORY CIRCUIT	COMMERCIAL	68	PGA	SQUARE	CERAMIC	NO		CMOS		PIN/PEG				5	5		GRID ARRAY	PGA68,11X11	Other Memory ICs	2.54 mm	70 Cel			0 Cel	TIN LEAD	PERPENDICULAR	S-XPGA-P68					Not Qualified				e0
IDT79R3020-12GM	Renesas Electronics	MEMORY CIRCUIT	MILITARY	68	PGA	SQUARE	CERAMIC	NO		CMOS		PIN/PEG				5	5		GRID ARRAY	PGA68,11X11	Other Memory ICs	2.54 mm	125 Cel			-55 Cel	TIN LEAD	PERPENDICULAR	S-XPGA-P68					Not Qualified				e0
MT28C64416W18AFY-F70P70TWT	Micron Technology	MEMORY CIRCUIT	OTHER	68	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		BALL	ASYNCHRONOUS		4194304 words			16	GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	85 Cel	4MX16	4M	-25 Cel	TIN SILVER COPPER	BOTTOM	R-PBGA-B68		1.95 V	1.3 mm	8 mm	Not Qualified	67108864 bit	1.7 V	CELLULARRAM IS ORGANIZED AS 1M X 16	e1				12 mm

Other Function Memory ICs

Other function memory ICs are a group of integrated circuits that perform specialized functions in addition to storing data. These ICs are used in a wide range of digital devices, including computers, smartphones, and electronic devices.

One example of an other function memory IC is cache memory. Cache memory is a type of memory that stores frequently accessed data and instructions. Cache memory is used to improve the performance of the system by reducing the time it takes to access data from the main memory.

Another example of an other function memory IC is dynamic random-access memory (DRAM). DRAM is a type of memory that stores data as a charge in a capacitor. DRAM is commonly used as the main memory in computers and other digital devices.

Static random-access memory (SRAM) is another type of other function memory IC. SRAM is a type of memory that stores data as a flip-flop, which retains the data as long as power is supplied to the system. SRAM is commonly used as cache memory and in other applications where high-speed access to data is required.

Memory controller ICs are another type of other function memory IC. Memory controller ICs are used to manage the flow of data between the CPU and the memory subsystem. These ICs are commonly used in computer systems and other digital devices to ensure that data is transferred efficiently and reliably.