FBGA Other Function Memory ICs 1,784

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Part RoHS Manufacturer Memory IC Type Temperature Grade No. of Terminals Package Code Refresh Cycles Package Shape Total Dose (V) Package Body Material Access Mode Surface Mount No. of Functions Technology Screening Level Terminal Form Parallel or Serial Operating Mode Sector Size (Words) Maximum Supply Current No. of Words Sequential Burst Length Self Refresh Input/Output Type Nominal Supply Voltage / Vsup (V) Mixed Memory Type Toggle Bit Power Supplies (V) Memory Width Package Style (Meter) Package Equivalence Code Sub-Category Minimum Data Retention Time Terminal Pitch Maximum Operating Temperature Reverse Pinout Output Characteristics Organization No. of Words Code Minimum Standby Voltage Minimum Operating Temperature No. of Sectors/Size Command User Interface Terminal Finish I2C Control Byte Terminal Position No. of Ports Write Protection JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Supply Voltage (Vsup) Maximum Seated Height Endurance Maximum Clock Frequency (fCLK) Width Qualification Serial Bus Type Boot Block Memory Density Minimum Supply Voltage (Vsup) Additional Features Page Size (words) JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Type Maximum Standby Current Interleaved Burst Length Length Common Flash Interface Maximum Access Time Programming Voltage (V) Data Polling

NAND99W3M1AZBC5F

Micron Technology

MEMORY CIRCUIT

OTHER

137

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

BALL

3

FLASH+SDRAM

3

GRID ARRAY, FINE PITCH

BGA137,10X15,32

Other Memory ICs

.8 mm

85 Cel

-30 Cel

BOTTOM

R-PBGA-B137

Not Qualified

NANDD3R4N5CZCC5F

Micron Technology

MEMORY CIRCUIT

OTHER

137

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

BALL

1.8

FLASH+SDRAM

1.8

GRID ARRAY, FINE PITCH

BGA137,10X15,32

Other Memory ICs

.8 mm

85 Cel

-30 Cel

BOTTOM

R-PBGA-B137

Not Qualified

NANDA9R4N1BZBC5E

Micron Technology

MEMORY CIRCUIT

OTHER

137

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

BALL

1.8

FLASH+SDRAM

1.8

GRID ARRAY, FINE PITCH

BGA137,10X15,32

Other Memory ICs

.8 mm

85 Cel

-30 Cel

BOTTOM

R-PBGA-B137

Not Qualified

RD38F4060L0YTB0

Micron Technology

MEMORY CIRCUIT

103

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

BALL

80 mA

1.8

FLASH+SDRAM

1.8

GRID ARRAY, FINE PITCH

BGA103,9X12,32

Other Memory ICs

.8 mm

BOTTOM

R-PBGA-B103

Not Qualified

.00002 Amp

70 ns

NANDA9R3N3BZBC5E

Micron Technology

MEMORY CIRCUIT

OTHER

137

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

BALL

1.8

FLASH+SDRAM

1.8

GRID ARRAY, FINE PITCH

BGA137,10X15,32

Other Memory ICs

.8 mm

85 Cel

-30 Cel

BOTTOM

R-PBGA-B137

Not Qualified

RD38F3070L0YTB0

Micron Technology

MEMORY CIRCUIT

103

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

BALL

80 mA

1.8

FLASH+SDRAM

1.8

GRID ARRAY, FINE PITCH

BGA103,9X12,32

Other Memory ICs

.8 mm

BOTTOM

R-PBGA-B103

Not Qualified

.00002 Amp

70 ns

NAND08GAH0JZC5F

Micron Technology

OTHER

153

FBGA

SQUARE

PLASTIC/EPOXY

YES

CMOS

BALL

150 mA

1.8/3.3,3.3

GRID ARRAY, FINE PITCH

BGA153,14X14,20

Other Memory ICs

.5 mm

85 Cel

-25 Cel

BOTTOM

S-PBGA-B153

Not Qualified

8589934592 bit

NANDB9R3N0DZQA5F

Micron Technology

MEMORY CIRCUIT

OTHER

152

FBGA

SQUARE

PLASTIC/EPOXY

YES

BALL

1.8

FLASH+SDRAM

1.8

GRID ARRAY, FINE PITCH

BGA152,21X21,25

Other Memory ICs

.635 mm

85 Cel

-30 Cel

BOTTOM

S-PBGA-B152

Not Qualified

Other Function Memory ICs

Other function memory ICs are a group of integrated circuits that perform specialized functions in addition to storing data. These ICs are used in a wide range of digital devices, including computers, smartphones, and electronic devices.

One example of an other function memory IC is cache memory. Cache memory is a type of memory that stores frequently accessed data and instructions. Cache memory is used to improve the performance of the system by reducing the time it takes to access data from the main memory.

Another example of an other function memory IC is dynamic random-access memory (DRAM). DRAM is a type of memory that stores data as a charge in a capacitor. DRAM is commonly used as the main memory in computers and other digital devices.

Static random-access memory (SRAM) is another type of other function memory IC. SRAM is a type of memory that stores data as a flip-flop, which retains the data as long as power is supplied to the system. SRAM is commonly used as cache memory and in other applications where high-speed access to data is required.

Memory controller ICs are another type of other function memory IC. Memory controller ICs are used to manage the flow of data between the CPU and the memory subsystem. These ICs are commonly used in computer systems and other digital devices to ensure that data is transferred efficiently and reliably.