1024 Other Function Memory ICs 12

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Part	Manufacturer	Temperature Grade	No. of Terminals	Package Code	Refresh Cycles	Package Shape	Package Body Material	Surface Mount	Technology	Terminal Form	Maximum Supply Current	No. of Words	Self Refresh	Input/Output Type	Nominal Supply Voltage / Vsup (V)	Power Supplies (V)	Memory Width	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Output Characteristics	Organization	No. of Words Code	Minimum Operating Temperature	Terminal Position	JESD-30 Code	Maximum Seated Height	Qualification	Memory Density	Maximum Standby Current	Maximum Access Time
TMS4025NC	Texas Instruments	OTHER	24	DIP	1024	RECTANGULAR	PLASTIC/EPOXY	NO	MOS	THROUGH-HOLE		1024 words		SEPARATE			2	IN-LINE	DIP24,.6	Other Memory ICs	2.54 mm	70 Cel	OPEN-DRAIN	1KX2	1K	-25 Cel	DUAL	R-PDIP-T24		Not Qualified	2048 bit
TMS4020NC	Texas Instruments	OTHER	24	DIP	1024	RECTANGULAR	PLASTIC/EPOXY	NO	MOS	THROUGH-HOLE		1024 words		SEPARATE			2	IN-LINE	DIP24,.6	Other Memory ICs	2.54 mm	70 Cel	OPEN-DRAIN	1KX2	1K	-25 Cel	DUAL	R-PDIP-T24		Not Qualified	2048 bit
HYM721000GS-60	Infineon Technologies	COMMERCIAL	168	DIMM	1024	RECTANGULAR	PLASTIC/EPOXY	NO	CMOS	NO LEAD	1980 mA	1048576 words	NO	COMMON	5	5	72	MICROELECTRONIC ASSEMBLY	DIMM168	Other Memory ICs	1.27 mm	70 Cel	3-STATE	1MX72	1M	0 Cel	DUAL	R-PDMA-N168	25.4 mm	Not Qualified	75497472 bit	.03 Amp	60 ns
HYM721000GS-70	Infineon Technologies	COMMERCIAL	168	DIMM	1024	RECTANGULAR	PLASTIC/EPOXY	NO	CMOS	NO LEAD	1800 mA	1048576 words	NO	COMMON	5	5	72	MICROELECTRONIC ASSEMBLY	DIMM168	Other Memory ICs	1.27 mm	70 Cel	3-STATE	1MX72	1M	0 Cel	DUAL	R-PDMA-N168	25.4 mm	Not Qualified	75497472 bit	.03 Amp	70 ns
THM362060ASG70	Toshiba	COMMERCIAL	72	SIMM	1024	RECTANGULAR	PLASTIC/EPOXY	NO	CMOS	NO LEAD	918 mA	2097152 words		COMMON	5	5	36	MICROELECTRONIC ASSEMBLY	SSIM72	Other Memory ICs	1.27 mm	70 Cel	3-STATE	2MX36	2M	0 Cel	SINGLE	R-PSMA-N72	25.4 mm	Not Qualified	75497472 bit	.018 Amp	70 ns
MC-421000AD72F-80	Renesas Electronics	COMMERCIAL	168	DIMM	1024	RECTANGULAR	PLASTIC/EPOXY	NO	CMOS	NO LEAD	800 mA	1048576 words	NO	COMMON	5	5	72	MICROELECTRONIC ASSEMBLY	DIMM168	Other Memory ICs	1.27 mm	70 Cel	3-STATE	1MX72	1M	0 Cel	DUAL	R-PDMA-N168	25.4 mm	Not Qualified	75497472 bit	.066 Amp	80 ns
MC-421000AD72F-60	Renesas Electronics	COMMERCIAL	168	DIMM	1024	RECTANGULAR	PLASTIC/EPOXY	NO	CMOS	NO LEAD	940 mA	1048576 words	NO	COMMON	5	5	72	MICROELECTRONIC ASSEMBLY	DIMM168	Other Memory ICs	1.27 mm	70 Cel	3-STATE	1MX72	1M	0 Cel	DUAL	R-PDMA-N168	25.4 mm	Not Qualified	75497472 bit	.066 Amp	60 ns
MC-421000AD72F-70	Renesas Electronics	COMMERCIAL	168	DIMM	1024	RECTANGULAR	PLASTIC/EPOXY	NO	CMOS	NO LEAD	860 mA	1048576 words	NO	COMMON	5	5	72	MICROELECTRONIC ASSEMBLY	DIMM168	Other Memory ICs	1.27 mm	70 Cel	3-STATE	1MX72	1M	0 Cel	DUAL	R-PDMA-N168	25.4 mm	Not Qualified	75497472 bit	.066 Amp	70 ns
KMM372F124BJ7	Samsung	COMMERCIAL	168	DIMM	1024	RECTANGULAR	PLASTIC/EPOXY	NO	CMOS	NO LEAD	670 mA	1048576 words		COMMON	3.3	3.3	72	MICROELECTRONIC ASSEMBLY	DIMM168	Other Memory ICs	1.27 mm	70 Cel	3-STATE	1MX72	1M	0 Cel	DUAL	R-PDMA-N168		Not Qualified	75497472 bit	.03 Amp	70 ns
KMM372F124BT7	Samsung	COMMERCIAL	168	DIMM	1024	RECTANGULAR	PLASTIC/EPOXY	NO	CMOS	NO LEAD	670 mA	1048576 words		COMMON	3.3	3.3	72	MICROELECTRONIC ASSEMBLY	DIMM168	Other Memory ICs	1.27 mm	70 Cel	3-STATE	1MX72	1M	0 Cel	DUAL	R-PDMA-N168		Not Qualified	75497472 bit	.03 Amp	70 ns
KMM372F124BT-6	Samsung	COMMERCIAL	168	DIMM	1024	RECTANGULAR	PLASTIC/EPOXY	NO	CMOS	NO LEAD	720 mA	1048576 words		COMMON	3.3	3.3	72	MICROELECTRONIC ASSEMBLY	DIMM168	Other Memory ICs	1.27 mm	70 Cel	3-STATE	1MX72	1M	0 Cel	DUAL	R-PDMA-N168		Not Qualified	75497472 bit	.03 Amp	60 ns
KMM372F124BJ-6	Samsung	COMMERCIAL	168	DIMM	1024	RECTANGULAR	PLASTIC/EPOXY	NO	CMOS	NO LEAD	720 mA	1048576 words		COMMON	3.3	3.3	72	MICROELECTRONIC ASSEMBLY	DIMM168	Other Memory ICs	1.27 mm	70 Cel	3-STATE	1MX72	1M	0 Cel	DUAL	R-PDMA-N168		Not Qualified	75497472 bit	.03 Amp	60 ns

Other Function Memory ICs

Other function memory ICs are a group of integrated circuits that perform specialized functions in addition to storing data. These ICs are used in a wide range of digital devices, including computers, smartphones, and electronic devices.

One example of an other function memory IC is cache memory. Cache memory is a type of memory that stores frequently accessed data and instructions. Cache memory is used to improve the performance of the system by reducing the time it takes to access data from the main memory.

Another example of an other function memory IC is dynamic random-access memory (DRAM). DRAM is a type of memory that stores data as a charge in a capacitor. DRAM is commonly used as the main memory in computers and other digital devices.

Static random-access memory (SRAM) is another type of other function memory IC. SRAM is a type of memory that stores data as a flip-flop, which retains the data as long as power is supplied to the system. SRAM is commonly used as cache memory and in other applications where high-speed access to data is required.

Memory controller ICs are another type of other function memory IC. Memory controller ICs are used to manage the flow of data between the CPU and the memory subsystem. These ICs are commonly used in computer systems and other digital devices to ensure that data is transferred efficiently and reliably.