NXP Semiconductors Other Function Memory ICs 50

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Part	Manufacturer	Memory IC Type	Temperature Grade	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Terminal Form	Operating Mode	Maximum Supply Current	No. of Words	Nominal Supply Voltage / Vsup (V)	Power Supplies (V)	Memory Width	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Organization	No. of Words Code	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Supply Voltage (Vsup)	Maximum Seated Height	Width	Qualification	Memory Density	Minimum Supply Voltage (Vsup)	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Maximum Standby Current	Length	Maximum Access Time
MR2A16AVYS35	NXP Semiconductors	MEMORY CIRCUIT	INDUSTRIAL	44	TSOP2	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	ASYNCHRONOUS		262144 words	3.3		16	SMALL OUTLINE, THIN PROFILE			.8 mm	105 Cel	256KX16	256K	-40 Cel		DUAL	R-PDSO-G44		3.6 V	1.2 mm	10.16 mm		4194304 bit	3 V						18.41 mm
SAA4955HL	NXP Semiconductors	MEMORY CIRCUIT	COMMERCIAL	44	QFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	SYNCHRONOUS	70 mA	245772 words	3.3	3.3	12	FLATPACK	QFP44,.47SQ,32	Other Memory ICs	.8 mm	70 Cel	245772X12	245772	0 Cel	Tin (Sn)	QUAD	S-PQFP-G44		3.6 V			Not Qualified	2949264 bit	3 V	IT ALSO REQUIRES 3 TO 5.5V SUPPLY	e3			.01 Amp		21 ns
SAA4955TJ	NXP Semiconductors	MEMORY CIRCUIT	COMMERCIAL	40	SOJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	SYNCHRONOUS	70 mA	245772 words	3.3	3.3	12	SMALL OUTLINE	SOJ40,.44	Other Memory ICs	1.27 mm	70 Cel	245772X12	245772	0 Cel	TIN	DUAL	R-PDSO-J40		3.6 V			Not Qualified	2949264 bit	3 V	IT ALSO REQUIRES 3 TO 5.5V SUPPLY	e3			.01 Amp		21 ns
SAA4955TJ/V1	NXP Semiconductors	MEMORY CIRCUIT	COMMERCIAL	40	SOJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	SYNCHRONOUS		245772 words	3.3		12	SMALL OUTLINE				70 Cel	245772X12	245772	0 Cel		DUAL	R-PDSO-J40		3.6 V			Not Qualified	2949264 bit	3 V
PTN3500DH	NXP Semiconductors	MEMORY CIRCUIT	INDUSTRIAL	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	ASYNCHRONOUS		256 words	3.3		8	SMALL OUTLINE				85 Cel	256X8	256	-40 Cel		DUAL	R-PDSO-G16		3.6 V			Not Qualified	2048 bit	2.5 V
PTN3500DH-T	NXP Semiconductors	MEMORY CIRCUIT	INDUSTRIAL	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	ASYNCHRONOUS		256 words	3.3		8	SMALL OUTLINE				85 Cel	256X8	256	-40 Cel		DUAL	R-PDSO-G16		3.6 V			Not Qualified	2048 bit	2.5 V
PTN3501DH-T	NXP Semiconductors	MEMORY CIRCUIT	INDUSTRIAL	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	ASYNCHRONOUS		256 words	3.3		8	SMALL OUTLINE				85 Cel	256X8	256	-40 Cel		DUAL	R-PDSO-G20		3.6 V			Not Qualified	2048 bit	2.5 V
PTN3501DH	NXP Semiconductors	MEMORY CIRCUIT	INDUSTRIAL	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	ASYNCHRONOUS		256 words	3.3		8	SMALL OUTLINE				85 Cel	256X8	256	-40 Cel		DUAL	R-PDSO-G20		3.6 V			Not Qualified	2048 bit	2.5 V
N82S123AA	NXP Semiconductors																									TIN LEAD											e0
PTN3500D	NXP Semiconductors	MEMORY CIRCUIT	INDUSTRIAL	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	ASYNCHRONOUS		256 words	3.3		8	SMALL OUTLINE				85 Cel	256X8	256	-40 Cel		DUAL	R-PDSO-G16		3.6 V			Not Qualified	2048 bit	2.5 V
S82S181F/883B	NXP Semiconductors																									TIN LEAD											e0
N82S137AF	NXP Semiconductors																									TIN LEAD											e0
S82S191BF3/883C	NXP Semiconductors																									TIN LEAD											e0
8200803KX	NXP Semiconductors																																Not Qualified
N82S191I	NXP Semiconductors																									TIN LEAD											e0
935249800512	NXP Semiconductors	MEMORY CIRCUIT	COMMERCIAL	40	SOJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	SYNCHRONOUS		245772 words	3.3		12	SMALL OUTLINE				70 Cel	245772X12	245772	0 Cel		DUAL	R-PDSO-J40		3.6 V			Not Qualified	2949264 bit	3 V			NOT SPECIFIED	NOT SPECIFIED
N82S129NA	NXP Semiconductors																									TIN LEAD											e0
MR1A16AVYS35	NXP Semiconductors	MEMORY CIRCUIT	INDUSTRIAL	44	TSOP2	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	ASYNCHRONOUS	165 mA	131072 words	3.3	3.3	16	SMALL OUTLINE, THIN PROFILE	TSOP44,.46,32	SRAMs	.8 mm	105 Cel	128KX16	128K	-40 Cel	MATTE TIN	DUAL	R-PDSO-G44	3	3.6 V	1.2 mm	10.16 mm	Not Qualified	2097152 bit	3 V		e3	40	260	.028 Amp	18.41 mm	35 ns
PTN3500D-T	NXP Semiconductors	MEMORY CIRCUIT	INDUSTRIAL	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	ASYNCHRONOUS		256 words	3.3		8	SMALL OUTLINE				85 Cel	256X8	256	-40 Cel		DUAL	R-PDSO-G16		3.6 V			Not Qualified	2048 bit	2.5 V
N82S141N	NXP Semiconductors																									TIN LEAD											e0
82HS641A/B3C	NXP Semiconductors																									TIN LEAD											e0
935249800518	NXP Semiconductors	MEMORY CIRCUIT	COMMERCIAL	40	SOJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	SYNCHRONOUS		245772 words	3.3		12	SMALL OUTLINE				70 Cel	245772X12	245772	0 Cel		DUAL	R-PDSO-J40		3.6 V			Not Qualified	2949264 bit	3 V			NOT SPECIFIED	NOT SPECIFIED
NT2H2331G0DUD	NXP Semiconductors	NFC/RFID TAGS AND TRANSPONDERS
NT2H2421G0DUF	NXP Semiconductors	NFC/RFID TAGS AND TRANSPONDERS
NT2H2421G0DUD	NXP Semiconductors	NFC/RFID TAGS AND TRANSPONDERS
NT2H2421S0DUD	NXP Semiconductors	NFC/RFID TAGS AND TRANSPONDERS
NT2H2331G0DUF	NXP Semiconductors	NFC/RFID TAGS AND TRANSPONDERS
MF0AESH2001DUD	NXP Semiconductors	CRYPTO MEMORY
MF0AESH2000DA8	NXP Semiconductors	CRYPTO MEMORY
MF0AES2001DUD	NXP Semiconductors	CRYPTO MEMORY
MF0AES2000DA8	NXP Semiconductors	CRYPTO MEMORY
MF0AES2001DUF	NXP Semiconductors	CRYPTO MEMORY
MF0AESH2001DUF	NXP Semiconductors	CRYPTO MEMORY
MF1SEPH1031DUD/03	NXP Semiconductors	NFC/RFID TAGS AND TRANSPONDERS			DIE	UNSPECIFIED	UNSPECIFIED	YES	1	CMOS	NO LEAD	ASYNCHRONOUS		1024 words			8	UNCASED CHIP				70 Cel	1KX8	1K	-25 Cel		UPPER	X-XUUC-N						8192 bit
MF1SEP1001DA4/03	NXP Semiconductors	NFC/RFID TAGS AND TRANSPONDERS			XMA	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	NO LEAD	ASYNCHRONOUS		1024 words			8	MICROELECTRONIC ASSEMBLY				70 Cel	1KX8	1K	-25 Cel		UNSPECIFIED	R-PXMA-N						8192 bit
MF1SEP1031DUD/03	NXP Semiconductors	NFC/RFID TAGS AND TRANSPONDERS			DIE	UNSPECIFIED	UNSPECIFIED	YES	1	CMOS	NO LEAD	ASYNCHRONOUS		1024 words			8	UNCASED CHIP				70 Cel	1KX8	1K	-25 Cel		UPPER	X-XUUC-N						8192 bit
MF1SEPH1001DUD/03	NXP Semiconductors	NFC/RFID TAGS AND TRANSPONDERS			DIE	UNSPECIFIED	UNSPECIFIED	YES	1	CMOS	NO LEAD	ASYNCHRONOUS		1024 words			8	UNCASED CHIP				70 Cel	1KX8	1K	-25 Cel		UPPER	X-XUUC-N						8192 bit
MF1SEPH1031DA4/03	NXP Semiconductors	NFC/RFID TAGS AND TRANSPONDERS			XMA	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	NO LEAD	ASYNCHRONOUS		1024 words			8	MICROELECTRONIC ASSEMBLY				70 Cel	1KX8	1K	-25 Cel		UNSPECIFIED	R-PXMA-N						8192 bit
MF1SEP1031DA4/03	NXP Semiconductors	NFC/RFID TAGS AND TRANSPONDERS			XMA	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	NO LEAD	ASYNCHRONOUS		1024 words			8	MICROELECTRONIC ASSEMBLY				70 Cel	1KX8	1K	-25 Cel		UNSPECIFIED	R-PXMA-N						8192 bit
MF1SEPH1031DA8/03	NXP Semiconductors	NFC/RFID TAGS AND TRANSPONDERS			XMA	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	NO LEAD	ASYNCHRONOUS		1024 words			8	MICROELECTRONIC ASSEMBLY				70 Cel	1KX8	1K	-25 Cel		UNSPECIFIED	R-PXMA-N						8192 bit
MF1SEP1001DUD/03	NXP Semiconductors	NFC/RFID TAGS AND TRANSPONDERS			DIE	UNSPECIFIED	UNSPECIFIED	YES	1	CMOS	NO LEAD	ASYNCHRONOUS		1024 words			8	UNCASED CHIP				70 Cel	1KX8	1K	-25 Cel		UPPER	X-XUUC-N						8192 bit
MF1SEP1001DA4/03J	NXP Semiconductors	NFC/RFID TAGS AND TRANSPONDERS			XMA	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	NO LEAD	ASYNCHRONOUS		1024 words			8	MICROELECTRONIC ASSEMBLY				70 Cel	1KX8	1K	-25 Cel		UNSPECIFIED	R-PXMA-N						8192 bit
MF1SEPH1001DA4/03	NXP Semiconductors	NFC/RFID TAGS AND TRANSPONDERS			XMA	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	NO LEAD	ASYNCHRONOUS		1024 words			8	MICROELECTRONIC ASSEMBLY				70 Cel	1KX8	1K	-25 Cel		UNSPECIFIED	R-PXMA-N						8192 bit
MF1SEP1001DA8/03	NXP Semiconductors	NFC/RFID TAGS AND TRANSPONDERS			XMA	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	NO LEAD	ASYNCHRONOUS		1024 words			8	MICROELECTRONIC ASSEMBLY				70 Cel	1KX8	1K	-25 Cel		UNSPECIFIED	R-PXMA-N						8192 bit
MF1SEP1031DA8/03	NXP Semiconductors	NFC/RFID TAGS AND TRANSPONDERS			XMA	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	NO LEAD	ASYNCHRONOUS		1024 words			8	MICROELECTRONIC ASSEMBLY				70 Cel	1KX8	1K	-25 Cel		UNSPECIFIED	R-PXMA-N						8192 bit
MF1SEPH1001DA8/03	NXP Semiconductors	NFC/RFID TAGS AND TRANSPONDERS			XMA	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	NO LEAD	ASYNCHRONOUS		1024 words			8	MICROELECTRONIC ASSEMBLY				70 Cel	1KX8	1K	-25 Cel		UNSPECIFIED	R-PXMA-N						8192 bit
SAA4955TJDP-T	NXP Semiconductors	MEMORY CIRCUIT	COMMERCIAL	40	SOJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	SYNCHRONOUS		245772 words	3.3		12	SMALL OUTLINE				70 Cel	245772X12	245772	0 Cel		DUAL	R-PDSO-J40		3.6 V			Not Qualified	2949264 bit	3 V
MR0A16AVYS35	NXP Semiconductors	MEMORY CIRCUIT	INDUSTRIAL	44	TSOP2	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	ASYNCHRONOUS	165 mA	131072 words	3.3	3.3	16	SMALL OUTLINE, THIN PROFILE	TSOP44,.46,32	SRAMs	.8 mm	105 Cel	128KX16	128K	-40 Cel	MATTE TIN	DUAL	R-PDSO-G44	3	3.6 V	1.2 mm	10.16 mm	Not Qualified	2097152 bit	3 V		e3	40	260	.028 Amp	18.41 mm	35 ns

Other Function Memory ICs

Other function memory ICs are a group of integrated circuits that perform specialized functions in addition to storing data. These ICs are used in a wide range of digital devices, including computers, smartphones, and electronic devices.

One example of an other function memory IC is cache memory. Cache memory is a type of memory that stores frequently accessed data and instructions. Cache memory is used to improve the performance of the system by reducing the time it takes to access data from the main memory.

Another example of an other function memory IC is dynamic random-access memory (DRAM). DRAM is a type of memory that stores data as a charge in a capacitor. DRAM is commonly used as the main memory in computers and other digital devices.

Static random-access memory (SRAM) is another type of other function memory IC. SRAM is a type of memory that stores data as a flip-flop, which retains the data as long as power is supplied to the system. SRAM is commonly used as cache memory and in other applications where high-speed access to data is required.

Memory controller ICs are another type of other function memory IC. Memory controller ICs are used to manage the flow of data between the CPU and the memory subsystem. These ICs are commonly used in computer systems and other digital devices to ensure that data is transferred efficiently and reliably.