Part | RoHS | Manufacturer | Memory IC Type | Temperature Grade | No. of Terminals | Package Code | Refresh Cycles | Package Shape | Total Dose (V) | Package Body Material | Access Mode | Surface Mount | No. of Functions | Technology | Screening Level | Terminal Form | Parallel or Serial | Operating Mode | Sector Size (Words) | Maximum Supply Current | No. of Words | Sequential Burst Length | Self Refresh | Input/Output Type | Nominal Supply Voltage / Vsup (V) | Mixed Memory Type | Toggle Bit | Power Supplies (V) | Memory Width | Package Style (Meter) | Package Equivalence Code | Sub-Category | Minimum Data Retention Time | Terminal Pitch | Maximum Operating Temperature | Reverse Pinout | Output Characteristics | Organization | No. of Words Code | Minimum Standby Voltage | Minimum Operating Temperature | No. of Sectors/Size | Command User Interface | Terminal Finish | I2C Control Byte | Terminal Position | No. of Ports | Write Protection | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Endurance | Maximum Clock Frequency (fCLK) | Width | Qualification | Serial Bus Type | Boot Block | Memory Density | Minimum Supply Voltage (Vsup) | Additional Features | Page Size (words) | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Type | Maximum Standby Current | Interleaved Burst Length | Length | Common Flash Interface | Maximum Access Time | Programming Voltage (V) | Data Polling |
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Texas Instruments |
MEMORY CIRCUIT |
COMMERCIAL |
28 |
ZIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
THROUGH-HOLE |
110 mA |
262144 words |
5 |
5 |
4 |
IN-LINE |
ZIP28,.1 |
Other Memory ICs |
1.27 mm |
70 Cel |
256KX4 |
256K |
0 Cel |
ZIG-ZAG |
R-PZIP-T28 |
Not Qualified |
1048576 bit |
NOT SPECIFIED |
NOT SPECIFIED |
.01 Amp |
100 ns |
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Texas Instruments |
MEMORY CIRCUIT |
COMMERCIAL |
20 |
ZIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
THROUGH-HOLE |
45 mA |
5 |
5 |
IN-LINE |
ZIP20,.1 |
Other Memory ICs |
1.27 mm |
70 Cel |
0 Cel |
ZIG-ZAG |
R-PZIP-T20 |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
.01 Amp |
30 ns |
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Texas Instruments |
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Texas Instruments |
COMMERCIAL |
168 |
DIMM |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
140 mA |
2097152 words |
COMMON |
3.3 |
3.3 |
72 |
MICROELECTRONIC ASSEMBLY |
DIMM168 |
Other Memory ICs |
1.27 mm |
70 Cel |
3-STATE |
2MX72 |
2M |
3 V |
0 Cel |
DUAL |
R-PDMA-N168 |
100 MHz |
Not Qualified |
150994944 bit |
.001 Amp |
7.5 ns |
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Texas Instruments |
COMMERCIAL |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
TTL |
THROUGH-HOLE |
IN-LINE |
DIP28,.6 |
Other Memory ICs |
2.54 mm |
70 Cel |
0 Cel |
DUAL |
R-PDIP-T28 |
Not Qualified |
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Texas Instruments |
MILITARY |
16 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
TTL |
MIL-STD-883 Class B (Modified) |
THROUGH-HOLE |
5 |
5 |
IN-LINE |
DIP16,.3 |
Other Memory ICs |
2.54 mm |
125 Cel |
-55 Cel |
DUAL |
R-XDIP-T16 |
Not Qualified |
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Texas Instruments |
MEMORY CIRCUIT |
COMMERCIAL |
20 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
TTL |
GULL WING |
ASYNCHRONOUS |
16384 words |
5 |
1 |
SMALL OUTLINE |
1.27 mm |
70 Cel |
16KX1 |
16K |
0 Cel |
DUAL |
R-PDSO-G20 |
5.25 V |
2.65 mm |
7.5 mm |
Not Qualified |
16384 bit |
4.75 V |
DRAM IS CONFIGURED AS 4 K X 1 |
NOT SPECIFIED |
NOT SPECIFIED |
12.8 mm |
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Texas Instruments |
MEMORY CIRCUIT |
COMMERCIAL |
28 |
SOJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
J BEND |
110 mA |
262144 words |
5 |
5 |
4 |
SMALL OUTLINE |
SOJ28,.44 |
Other Memory ICs |
1.27 mm |
70 Cel |
256KX4 |
256K |
0 Cel |
DUAL |
R-PDSO-J28 |
Not Qualified |
1048576 bit |
NOT SPECIFIED |
NOT SPECIFIED |
.01 Amp |
100 ns |
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Texas Instruments |
MEMORY CIRCUIT |
COMMERCIAL |
28 |
SOJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
J BEND |
85 mA |
262144 words |
5 |
5 |
4 |
SMALL OUTLINE |
SOJ28,.44 |
Other Memory ICs |
1.27 mm |
70 Cel |
256KX4 |
256K |
0 Cel |
DUAL |
R-PDSO-J28 |
Not Qualified |
1048576 bit |
NOT SPECIFIED |
NOT SPECIFIED |
.005 Amp |
150 ns |
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Texas Instruments |
MEMORY CIRCUIT |
COMMERCIAL |
20 |
SOJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
J BEND |
35 mA |
5 |
5 |
SMALL OUTLINE |
SOJ20/26,.34 |
Other Memory ICs |
1.27 mm |
70 Cel |
0 Cel |
DUAL |
R-PDSO-J20 |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
.01 Amp |
50 ns |
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Texas Instruments |
COMMERCIAL |
24 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
MOS |
THROUGH-HOLE |
1024 words |
COMMON |
8 |
IN-LINE |
DIP24,.6 |
Other Memory ICs |
2.54 mm |
70 Cel |
3-STATE |
1KX8 |
1K |
0 Cel |
DUAL |
R-XDIP-T24 |
Not Qualified |
8192 bit |
250 ns |
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Texas Instruments |
COMMERCIAL |
24 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
MOS |
THROUGH-HOLE |
1024 words |
COMMON |
8 |
IN-LINE |
DIP24,.6 |
Other Memory ICs |
2.54 mm |
70 Cel |
3-STATE |
1KX8 |
1K |
0 Cel |
DUAL |
R-XDIP-T24 |
Not Qualified |
8192 bit |
450 ns |
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Texas Instruments |
MEMORY CIRCUIT |
COMMERCIAL |
20 |
SOJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
J BEND |
50 mA |
5 |
5 |
SMALL OUTLINE |
SOJ20/26,.34 |
Other Memory ICs |
1.27 mm |
70 Cel |
0 Cel |
DUAL |
R-PDSO-J20 |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
.01 Amp |
25 ns |
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Texas Instruments |
MILITARY |
28 |
QCCN |
SQUARE |
CERAMIC |
YES |
TTL |
38535Q/M;38534H;883B |
NO LEAD |
CHIP CARRIER |
LCC28,.45SQ |
Other Memory ICs |
1.27 mm |
125 Cel |
-55 Cel |
QUAD |
S-XQCC-N28 |
Not Qualified |
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Texas Instruments |
OTP ROM |
MILITARY |
24 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
MOS |
38535Q/M;38534H;883B |
THROUGH-HOLE |
1024 words |
8 |
IN-LINE |
DIP24,.6 |
Other Memory ICs |
2.54 mm |
125 Cel |
3-STATE |
1KX8 |
1K |
-55 Cel |
DUAL |
R-XDIP-T24 |
Not Qualified |
8192 bit |
450 ns |
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Texas Instruments |
MEMORY CIRCUIT |
COMMERCIAL |
24 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
MOS |
GULL WING |
135 mA |
512 words |
5 |
5 |
9 |
SMALL OUTLINE |
SOP24,.4 |
SRAMs |
1.27 mm |
70 Cel |
512X9 |
512 |
0 Cel |
DUAL |
R-PDSO-G24 |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
.135 Amp |
55 ns |
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Texas Instruments |
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Texas Instruments |
MEMORY CIRCUIT |
COMMERCIAL |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
CMOS |
J BEND |
2048 words |
5 |
5 |
8 |
CHIP CARRIER |
LDCC28,.5SQ |
SRAMs |
1.27 mm |
70 Cel |
2KX8 |
2K |
0 Cel |
QUAD |
S-PQCC-J28 |
Not Qualified |
16384 bit |
NOT SPECIFIED |
NOT SPECIFIED |
25 ns |
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Texas Instruments |
COMMERCIAL |
24 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
TTL |
THROUGH-HOLE |
IN-LINE |
DIP24,.3 |
Other Memory ICs |
2.54 mm |
70 Cel |
0 Cel |
DUAL |
R-XDIP-T24 |
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Texas Instruments |
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Texas Instruments |
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Texas Instruments |
COMMERCIAL |
16 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
TTL |
THROUGH-HOLE |
5 |
5 |
IN-LINE |
DIP16,.3 |
Other Memory ICs |
2.54 mm |
70 Cel |
0 Cel |
DUAL |
R-XDIP-T16 |
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Texas Instruments |
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Texas Instruments |
MEMORY CIRCUIT |
COMMERCIAL |
20 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
TTL |
GULL WING |
ASYNCHRONOUS |
16384 words |
5 |
1 |
SMALL OUTLINE |
1.27 mm |
70 Cel |
16KX1 |
16K |
0 Cel |
DUAL |
R-PDSO-G20 |
5.25 V |
2.65 mm |
7.5 mm |
Not Qualified |
16384 bit |
4.75 V |
DRAM IS CONFIGURED AS 4 K X 1 |
12.8 mm |
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Texas Instruments |
COMMERCIAL |
24 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
MOS |
THROUGH-HOLE |
2048 words |
8 |
IN-LINE |
DIP24,.6 |
Other Memory ICs |
2.54 mm |
70 Cel |
3-STATE |
2KX8 |
2K |
0 Cel |
DUAL |
R-XDIP-T24 |
Not Qualified |
16384 bit |
300 ns |
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Texas Instruments |
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Texas Instruments |
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Texas Instruments |
MEMORY CIRCUIT |
COMMERCIAL |
20 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
TTL |
GULL WING |
ASYNCHRONOUS |
65536 words |
5 |
1 |
SMALL OUTLINE |
1.27 mm |
70 Cel |
64KX1 |
64K |
0 Cel |
DUAL |
R-PDSO-G20 |
5.25 V |
2.65 mm |
7.5 mm |
Not Qualified |
65536 bit |
4.75 V |
12.8 mm |
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Texas Instruments |
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Texas Instruments |
MEMORY CIRCUIT |
COMMERCIAL |
28 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
CMOS |
THROUGH-HOLE |
1024 words |
5 |
5 |
12 |
IN-LINE |
DIP28,.6 |
SRAMs |
2.54 mm |
70 Cel |
1KX12 |
1K |
0 Cel |
DUAL |
R-XDIP-T28 |
Not Qualified |
12288 bit |
NOT SPECIFIED |
NOT SPECIFIED |
25 ns |
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Texas Instruments |
Other function memory ICs are a group of integrated circuits that perform specialized functions in addition to storing data. These ICs are used in a wide range of digital devices, including computers, smartphones, and electronic devices.
One example of an other function memory IC is cache memory. Cache memory is a type of memory that stores frequently accessed data and instructions. Cache memory is used to improve the performance of the system by reducing the time it takes to access data from the main memory.
Another example of an other function memory IC is dynamic random-access memory (DRAM). DRAM is a type of memory that stores data as a charge in a capacitor. DRAM is commonly used as the main memory in computers and other digital devices.
Static random-access memory (SRAM) is another type of other function memory IC. SRAM is a type of memory that stores data as a flip-flop, which retains the data as long as power is supplied to the system. SRAM is commonly used as cache memory and in other applications where high-speed access to data is required.
Memory controller ICs are another type of other function memory IC. Memory controller ICs are used to manage the flow of data between the CPU and the memory subsystem. These ICs are commonly used in computer systems and other digital devices to ensure that data is transferred efficiently and reliably.