OTP ROM OTP ROM 2,400+

Reset All

Part	Manufacturer	Memory IC Type	Temperature Grade	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	Terminal Form	Parallel or Serial	Operating Mode	Maximum Supply Current	No. of Words	Input/Output Type	Nominal Supply Voltage / Vsup (V)	Power Supplies (V)	Memory Width	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Output Characteristics	Organization	No. of Words Code	Minimum Operating Temperature	Terminal Finish	Terminal Position	No. of Ports	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Supply Voltage (Vsup)	Maximum Seated Height	Maximum Clock Frequency (fCLK)	Width	Qualification	Memory Density	Minimum Supply Voltage (Vsup)	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Maximum Standby Current	Length	Maximum Access Time	Programming Voltage (V)
AT27C256R-12PI	Atmel	OTP ROM	INDUSTRIAL	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS		THROUGH-HOLE	PARALLEL	ASYNCHRONOUS	20 mA	32768 words	COMMON	5	5	8	IN-LINE	DIP28,.6	OTP ROMs	2.54 mm	85 Cel	3-STATE	32KX8	32K	-40 Cel	TIN LEAD	DUAL		R-PDIP-T28	1	5.5 V	5.59 mm		15.24 mm	Not Qualified	262144 bit	4.5 V		e0			.0001 Amp	36.95 mm	120 ns	13
M27C2001-10B1	STMicroelectronics	OTP ROM	COMMERCIAL	32	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS		THROUGH-HOLE	PARALLEL	ASYNCHRONOUS	35 mA	262144 words	COMMON	5	5	8	IN-LINE	DIP32,.6	OTP ROMs	2.54 mm	70 Cel	3-STATE	256KX8	256K	0 Cel	MATTE TIN	DUAL		R-PDIP-T32		5.5 V	5.08 mm		15.24 mm	Not Qualified	2097152 bit	4.5 V		e3			.0001 Amp	41.91 mm	100 ns
AT27C020-55JU-T	Microchip Technology	OTP ROM	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		J BEND	PARALLEL	ASYNCHRONOUS	25 mA	262144 words	COMMON	5		8	CHIP CARRIER	LCC32,.45X.55		1.27 mm	85 Cel	3-STATE	256KX8	256K	-40 Cel	MATTE TIN	QUAD	1	R-PQCC-J32	3	5.5 V	3.556 mm		11.43 mm		2097152 bit	4.5 V		e3		245	.0001 Amp	13.97 mm	55 ns	13
DS2506S	Maxim Integrated	OTP ROM	INDUSTRIAL	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	MOS		GULL WING	SERIAL	ASYNCHRONOUS		65536 words	COMMON	5	3/5	1	SMALL OUTLINE	SOP8,.3	Other Memory ICs	1.27 mm	85 Cel		64KX1	64K	-40 Cel	TIN LEAD	DUAL		R-PDSO-G8		6 V	2.13 mm		5.285 mm	Not Qualified	65536 bit	2.8 V		e0				5.31 mm
DS2506S+	Analog Devices	OTP ROM	INDUSTRIAL	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	MOS		GULL WING	SERIAL	ASYNCHRONOUS		65536 words	COMMON	5	3/5	1	SMALL OUTLINE	SOP8,.3	Other Memory ICs	1.27 mm	85 Cel		64KX1	64K	-40 Cel	MATTE TIN	DUAL		R-PDSO-G8	1	6 V	2.13 mm		5.285 mm	Not Qualified	65536 bit	2.8 V		e3	30	260		5.31 mm
5962-8873503LA	STMicroelectronics	OTP ROM	MILITARY	24	DIP	RECTANGULAR	CERAMIC, GLASS-SEALED	NO	1	CMOS	MIL-STD-883	THROUGH-HOLE	PARALLEL	SYNCHRONOUS		2048 words		5		8	IN-LINE			2.54 mm	125 Cel		2KX8	2K	-55 Cel	TIN LEAD	DUAL		R-GDIP-T24		5.5 V	5.08 mm		7.62 mm	Not Qualified	16384 bit	4.5 V		e0				31.877 mm	15 ns
AT27C512R-70JI	Atmel	OTP ROM	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		J BEND	PARALLEL	ASYNCHRONOUS	20 mA	65536 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6	OTP ROMs	1.27 mm	85 Cel	3-STATE	64KX8	64K	-40 Cel	Tin/Lead (Sn/Pb)	QUAD		R-PQCC-J32	2	5.5 V	3.556 mm		11.43 mm	Not Qualified	524288 bit	4.5 V		e0	30	225	.0001 Amp	13.97 mm	70 ns
AT27C020-90JU-T	Microchip Technology	OTP ROM	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		J BEND	PARALLEL	ASYNCHRONOUS	25 mA	262144 words	COMMON	5		8	CHIP CARRIER	LCC32,.45X.55		1.27 mm	85 Cel	3-STATE	256KX8	256K	-40 Cel	MATTE TIN	QUAD	1	R-PQCC-J32		5.5 V	3.556 mm		11.43 mm		2097152 bit	4.5 V		e3			.0001 Amp	13.97 mm	90 ns	13
AT27C2048-90JU	Microchip Technology	OTP ROM	INDUSTRIAL	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		J BEND	PARALLEL	ASYNCHRONOUS	35 mA	131072 words	COMMON	5	5	16	CHIP CARRIER	LDCC44,.7SQ	OTP ROMs	1.27 mm	85 Cel	3-STATE	128KX16	128K	-40 Cel	MATTE TIN	QUAD	1	S-PQCC-J44	3	5.5 V	4.572 mm		16.586 mm	Not Qualified	2097152 bit	4.5 V		e3	40	245	.0001 Amp	16.586 mm	90 ns	13
DS2505P	Maxim Integrated	OTP ROM	INDUSTRIAL	6	SOC	RECTANGULAR	PLASTIC/EPOXY	YES	1	MOS		C BEND	SERIAL	ASYNCHRONOUS		16384 words	COMMON	5	3/5	1	SMALL OUTLINE	SOC6,.17	Other Memory ICs	1.27 mm	85 Cel		16KX1	16K	-40 Cel	TIN LEAD	DUAL		R-PDSO-C6	1	6 V	1.5 mm		3.76 mm	Not Qualified	16384 bit	2.8 V	MICROLAN COMPATIBLE	e0		245		3.94 mm	15000 ns
DS2505P+	Analog Devices	OTP ROM	INDUSTRIAL	6	SOC	RECTANGULAR	PLASTIC/EPOXY	YES	1	MOS		C BEND	SERIAL	ASYNCHRONOUS		16384 words	COMMON	5	3/5	1	SMALL OUTLINE	SOC6,.17	Other Memory ICs	1.27 mm	85 Cel		16KX1	16K	-40 Cel	Matte Tin (Sn) - annealed	DUAL		R-PDSO-C6	1	6 V	1.5 mm		3.76 mm	Not Qualified	16384 bit	2.8 V	MICROLAN COMPATIBLE	e3	30	260		3.94 mm	15000 ns
M27C256B-12C6	STMicroelectronics	OTP ROM	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		J BEND	PARALLEL	ASYNCHRONOUS	30 mA	32768 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6	OTP ROMs	1.27 mm	85 Cel	3-STATE	32KX8	32K	-40 Cel	MATTE TIN	QUAD		R-PQCC-J32		5.5 V	3.56 mm		11.43 mm	Not Qualified	262144 bit	4.5 V		e3			.0001 Amp	13.97 mm	120 ns	12.75
DS2406P	Maxim Integrated	OTP ROM	INDUSTRIAL	6	SOC	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		C BEND	SERIAL	ASYNCHRONOUS		1024 words		3	3/5	1	SMALL OUTLINE	SOC6,.17	SRAMs	1.27 mm	85 Cel		1KX1	1K	-40 Cel	Tin/Lead (Sn/Pb)	DUAL		R-PDSO-C6	1	6 V	1.5 mm		3.76 mm	Not Qualified	1024 bit	2.8 V		e0	20	240		3.94 mm
DS2406P+	Analog Devices	OTP ROM	INDUSTRIAL	6	SOC	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		C BEND	SERIAL	ASYNCHRONOUS		1024 words		4	3/5	1	SMALL OUTLINE	SOC6,.17	SRAMs	1.27 mm	85 Cel		1KX1	1K	-40 Cel	Matte Tin (Sn) - annealed	DUAL		R-PDSO-C6	1	6 V	1.5 mm		3.76 mm	Not Qualified	1024 bit	2.8 V		e3	30	260		3.94 mm
BQ2022ALPR	Texas Instruments	OTP ROM	COMMERCIAL	3	TO-92	ROUND	UNSPECIFIED	NO	1	CMOS		WIRE	SERIAL	ASYNCHRONOUS	.02 mA	1024 words	COMMON	2.7	3/5	1	CYLINDRICAL	SIP3,.1,50	OTP ROMs	1.27 mm	70 Cel	OPEN-DRAIN	1KX1	1K	0 Cel	Matte Tin (Sn)	BOTTOM		O-XBCY-W3		5.5 V	5.34 mm	.01667 MHz	4.3 mm	Not Qualified	1024 bit	2.65 V	ORGANIZED AS 4 PAGES OF 32 BYTES EACH	e3	NOT SPECIFIED	NOT SPECIFIED		4.3 mm
HM1-7611A-5	Intersil	OTP ROM	COMMERCIAL	16	DIP	RECTANGULAR	CERAMIC	NO		TTL		THROUGH-HOLE			130 mA	256 words		5	5	4	IN-LINE	DIP16,.3	OTP ROMs	2.54 mm	70 Cel		256X4	256	0 Cel	Tin/Lead (Sn/Pb)	DUAL		R-XDIP-T16						Not Qualified	1024 bit			e0					45 ns
HM1-7611A5	Harris Semiconductor	OTP ROM	COMMERCIAL	16	DIP	RECTANGULAR	CERAMIC	NO		TTL		THROUGH-HOLE			130 mA	256 words		5	5	4	IN-LINE	DIP16,.3	OTP ROMs	2.54 mm	70 Cel		256X4	256	0 Cel	Tin/Lead (Sn/Pb)	DUAL		R-XDIP-T16						Not Qualified	1024 bit			e0					45 ns
AT27LV256R-25PI	Atmel	OTP ROM	INDUSTRIAL	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS		THROUGH-HOLE	PARALLEL	ASYNCHRONOUS	25 mA	32768 words	COMMON	5	3.3/5	8	IN-LINE	DIP28,.6	OTP ROMs	2.54 mm	85 Cel	3-STATE	32KX8	32K	-40 Cel	TIN LEAD	DUAL		R-PDIP-T28		5.5 V	5.59 mm		15.24 mm	Not Qualified	262144 bit	3 V		e0			.00002 Amp	36.95 mm	250 ns	13
BQ2022ADBZR	Texas Instruments	OTP ROM	OTHER	3	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		GULL WING	SERIAL	ASYNCHRONOUS	.02 mA	1024 words	COMMON	2.7	3/5	1	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TO-236	OTP ROMs	.95 mm	70 Cel	OPEN-DRAIN	1KX1	1K	-20 Cel	Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)	DUAL		R-PDSO-G3	1	5.5 V	1.12 mm	.01667 MHz	1.3 mm	Not Qualified	1024 bit	2.65 V	ORGANIZED AS 4 PAGES OF 32 BYTES EACH	e4	NOT SPECIFIED	260		2.92 mm
M27C256B-12C1	STMicroelectronics	OTP ROM	COMMERCIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		J BEND	PARALLEL	ASYNCHRONOUS	30 mA	32768 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6	OTP ROMs	1.27 mm	70 Cel	3-STATE	32KX8	32K	0 Cel	MATTE TIN	QUAD		R-PQCC-J32		5.5 V	3.56 mm		11.43 mm	Not Qualified	262144 bit	4.5 V		e3			.0001 Amp	13.97 mm	120 ns	12.75
AT27C1024-45JC	Atmel	OTP ROM	COMMERCIAL	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		J BEND	PARALLEL	ASYNCHRONOUS	30 mA	65536 words	COMMON	5	5	16	CHIP CARRIER	LDCC44,.7SQ	OTP ROMs	1.27 mm	70 Cel	3-STATE	64KX16	64K	0 Cel	TIN LEAD	QUAD		S-PQCC-J44	2	5.5 V	4.57 mm		16.5862 mm	Not Qualified	1048576 bit	4.5 V		e0		225	.0001 Amp	16.5862 mm	45 ns
BQ2022ADBZRG4	Texas Instruments	OTP ROM	OTHER	3	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		GULL WING	SERIAL	ASYNCHRONOUS	.02 mA	1024 words	COMMON	2.7	3/5	1	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TO-236	OTP ROMs	.95 mm	70 Cel	OPEN-DRAIN	1KX1	1K	-20 Cel	Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)	DUAL		R-PDSO-G3	1	5.5 V	1.12 mm	.01667 MHz	1.3 mm	Not Qualified	1024 bit	2.65 V	ORGANIZED AS 4 PAGES OF 32 BYTES EACH	e4	NOT SPECIFIED	260		2.92 mm
AM27S29APC	Rochester Electronics	OTP ROM	COMMERCIAL EXTENDED	20	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	BIPOLAR		THROUGH-HOLE	PARALLEL	ASYNCHRONOUS		512 words		5		8	IN-LINE			2.54 mm	75 Cel		512X8	512	0 Cel		DUAL		R-PDIP-T20		5.25 V	5.08 mm		7.62 mm		4096 bit	4.75 V			NOT SPECIFIED	NOT SPECIFIED		26.035 mm	35 ns
M27C512-90B1	STMicroelectronics	OTP ROM	COMMERCIAL	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS		THROUGH-HOLE	PARALLEL	ASYNCHRONOUS	30 mA	65536 words	COMMON	5	5	8	IN-LINE	DIP28,.6	OTP ROMs	2.54 mm	70 Cel	3-STATE	64KX8	64K	0 Cel	TIN LEAD	DUAL		R-PDIP-T28		5.5 V	5.08 mm		15.24 mm	Not Qualified	524288 bit	4.5 V		e0			.0001 Amp	36.83 mm	90 ns
AT27C256R-45JC	Atmel	OTP ROM	COMMERCIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		J BEND	PARALLEL	ASYNCHRONOUS	20 mA	32768 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6	OTP ROMs	1.27 mm	70 Cel	3-STATE	32KX8	32K	0 Cel	TIN LEAD	QUAD		R-PQCC-J32	2	5.5 V	3.55 mm		11.43 mm	Not Qualified	262144 bit	4.5 V		e0		225	.0001 Amp	13.97 mm	45 ns	13
27LV256-25/P	Microchip Technology	OTP ROM	COMMERCIAL	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS		THROUGH-HOLE	PARALLEL	ASYNCHRONOUS	20 mA	32768 words	COMMON	5	3.3/5	8	IN-LINE	DIP28,.6	OTP ROMs	2.54 mm	70 Cel	3-STATE	32KX8	32K	0 Cel	TIN LEAD	DUAL		R-PDIP-T28		5.5 V	4.83 mm		15.24 mm	Not Qualified	262144 bit	3 V	DATA RETENTION >200 YEARS	e0			.0001 Amp	36.32 mm	250 ns	13
AT27LV256A-90JU-T	Microchip Technology	OTP ROM	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		J BEND	PARALLEL	ASYNCHRONOUS	8 mA	32768 words	COMMON	3.3		8	CHIP CARRIER	LCC32,.45X.55		1.27 mm	85 Cel	3-STATE	32KX8	32K	-40 Cel	MATTE TIN	QUAD	1	R-PQCC-J32		3.6 V	3.556 mm		11.43 mm		262144 bit	3 V	ALSO OPERATES AT 5V NOMINAL SUPPLY VOLTAGE	e3			.00002 Amp	13.97 mm	90 ns	13
M27C512-45C1	STMicroelectronics	OTP ROM	COMMERCIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		J BEND	PARALLEL	ASYNCHRONOUS	30 mA	65536 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6	OTP ROMs	1.27 mm	70 Cel	3-STATE	64KX8	64K	0 Cel	TIN LEAD	QUAD		R-PQCC-J32		5.5 V	3.56 mm		11.43 mm	Not Qualified	524288 bit	4.5 V		e0			.0001 Amp	13.97 mm	45 ns
M27C512-90C6	STMicroelectronics	OTP ROM	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		J BEND	PARALLEL	ASYNCHRONOUS	30 mA	65536 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6	OTP ROMs	1.27 mm	85 Cel	3-STATE	64KX8	64K	-40 Cel	TIN LEAD	QUAD		R-PQCC-J32		5.5 V	3.56 mm		11.43 mm	Not Qualified	524288 bit	4.5 V		e0			.0001 Amp	13.97 mm	90 ns
DS2505	Maxim Integrated	OTP ROM	INDUSTRIAL	3	TO-92	ROUND	PLASTIC/EPOXY	NO	1	MOS		THROUGH-HOLE	SERIAL	ASYNCHRONOUS		16384 words	COMMON	5	3/5	1	CYLINDRICAL	SIP3,.1	Other Memory ICs	2.54 mm	85 Cel		16KX1	16K	-40 Cel	Tin/Lead (Sn85Pb15)	BOTTOM		O-PBCY-T3		6 V				Not Qualified	16384 bit	2.8 V	MICROLAN COMPATIBLE	e0	20	240			15000 ns
DS2505+	Analog Devices	OTP ROM	INDUSTRIAL	3	TO-92	ROUND	PLASTIC/EPOXY	NO	1	MOS		THROUGH-HOLE	SERIAL	ASYNCHRONOUS		16384 words	COMMON	5	3/5	1	CYLINDRICAL	SIP3,.1	Other Memory ICs	2.54 mm	85 Cel		16KX1	16K	-40 Cel	Matte Tin (Sn) - annealed	BOTTOM		O-PBCY-T3		6 V				Not Qualified	16384 bit	2.8 V	MICROLAN COMPATIBLE	e3	30	250			15000 ns
AT27C1024-70PC	Atmel	OTP ROM	COMMERCIAL	40	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS		THROUGH-HOLE	PARALLEL	ASYNCHRONOUS	30 mA	65536 words	COMMON	5	5	16	IN-LINE	DIP40,.6	OTP ROMs	2.54 mm	70 Cel	3-STATE	64KX16	64K	0 Cel	TIN LEAD	DUAL		R-PDIP-T40	1	5.5 V	5.59 mm		15.24 mm	Not Qualified	1048576 bit	4.5 V		e0			.0001 Amp	52.2 mm	70 ns
AT27C1024-70PI	Atmel	OTP ROM	INDUSTRIAL	40	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS		THROUGH-HOLE	PARALLEL	ASYNCHRONOUS	30 mA	65536 words	COMMON	5	5	16	IN-LINE	DIP40,.6	OTP ROMs	2.54 mm	85 Cel	3-STATE	64KX16	64K	-40 Cel	TIN LEAD	DUAL		R-PDIP-T40	1	5.5 V	4.826 mm		15.24 mm	Not Qualified	1048576 bit	4.5 V		e0	30	225	.0001 Amp	52.324 mm	70 ns
BQ2022ALPRE3	Texas Instruments	OTP ROM	OTHER	3	TO-92	ROUND	UNSPECIFIED	NO	1	CMOS		WIRE	SERIAL	ASYNCHRONOUS	.02 mA	1024 words	COMMON	2.7	3/5	1	CYLINDRICAL	SIP3,.1,50	OTP ROMs	1.27 mm	70 Cel	OPEN-DRAIN	1KX1	1K	-20 Cel	MATTE TIN	BOTTOM		O-XBCY-W3		5.5 V		.01667 MHz		Not Qualified	1024 bit	2.65 V	ORGANIZED AS 4 PAGES OF 32 BYTES EACH	e3
AT27C1024-12JC	Atmel	OTP ROM	COMMERCIAL	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		J BEND	PARALLEL	ASYNCHRONOUS	30 mA	65536 words	COMMON	5	5	16	CHIP CARRIER	LDCC44,.7SQ	OTP ROMs	1.27 mm	70 Cel	3-STATE	64KX16	64K	0 Cel	TIN LEAD	QUAD		S-PQCC-J44	2	5.5 V	4.57 mm		16.5862 mm	Not Qualified	1048576 bit	4.5 V		e0		225	.0001 Amp	16.5862 mm	120 ns
DS2502S/T&R	Maxim Integrated	OTP ROM	INDUSTRIAL	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		GULL WING	SERIAL	ASYNCHRONOUS		128 words	COMMON	5	3/5	8	SMALL OUTLINE	SOP8,.25	Other Memory ICs	1.27 mm	85 Cel		128X8	128	-40 Cel	TIN LEAD	DUAL		R-PDSO-G8		6 V	1.75 mm		3.9 mm	Not Qualified	1024 bit	2.8 V	MICROLAN COMPATIBLE	e0				4.9 mm	15000 ns
DS2502S+T&R	Analog Devices	OTP ROM	INDUSTRIAL	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		GULL WING	SERIAL	ASYNCHRONOUS		128 words	COMMON	5	3/5	8	SMALL OUTLINE	SOP8,.25	Other Memory ICs	1.27 mm	85 Cel		128X8	128	-40 Cel	Matte Tin (Sn) - annealed	DUAL		R-PDSO-G8	1	6 V	1.75 mm		3.9 mm	Not Qualified	1024 bit	2.8 V	MICROLAN COMPATIBLE	e3	30	260		4.9 mm	15000 ns
AT27C1024-45PI	Atmel	OTP ROM	INDUSTRIAL	40	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS		THROUGH-HOLE	PARALLEL	ASYNCHRONOUS	30 mA	65536 words	COMMON	5	5	16	IN-LINE	DIP40,.6	OTP ROMs	2.54 mm	85 Cel	3-STATE	64KX16	64K	-40 Cel	Tin/Lead (Sn/Pb)	DUAL		R-PDIP-T40	1	5.5 V	4.826 mm		15.24 mm	Not Qualified	1048576 bit	4.5 V		e0	30	225	.0001 Amp	52.324 mm	45 ns
AT27C1024-70VI	Atmel	OTP ROM	INDUSTRIAL	40	TSOP1	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		GULL WING	PARALLEL	ASYNCHRONOUS	30 mA	65536 words	COMMON	5	5	16	SMALL OUTLINE, THIN PROFILE	TSSOP40,.56,20	OTP ROMs	.5 mm	85 Cel	3-STATE	64KX16	64K	-40 Cel	TIN LEAD	DUAL		R-PDSO-G40	3	5.5 V	1.2 mm		10 mm	Not Qualified	1048576 bit	4.5 V		e0			.0001 Amp	12.4 mm	70 ns
AT27C2048-90JU-T	Microchip Technology	OTP ROM	INDUSTRIAL	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		J BEND	PARALLEL	ASYNCHRONOUS	35 mA	131072 words	COMMON	5		16	CHIP CARRIER	LDCC44,.7SQ		1.27 mm	85 Cel	3-STATE	128KX16	128K	-40 Cel	MATTE TIN	QUAD	1	S-PQCC-J44		5.5 V	4.572 mm		16.586 mm		2097152 bit	4.5 V		e3			.0001 Amp	16.586 mm	90 ns	13
AT27C4096-55PU	Microchip Technology	OTP ROM	INDUSTRIAL	40	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS		THROUGH-HOLE	PARALLEL	ASYNCHRONOUS	40 mA	262144 words	COMMON	5	5	16	IN-LINE	DIP40,.6	OTP ROMs	2.54 mm	85 Cel	3-STATE	256KX16	256K	-40 Cel		DUAL	1	R-PDIP-T40		5.5 V	4.826 mm		15.24 mm	Not Qualified	4194304 bit	4.5 V		e0			.0001 Amp	52.324 mm	55 ns	13
BQ2026DBZR	Texas Instruments	OTP ROM	OTHER	3	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		GULL WING	SERIAL	ASYNCHRONOUS	.02 mA	1536 words	COMMON		3/5	1	SMALL OUTLINE	TO-236	OTP ROMs	.95 mm	70 Cel	OPEN-DRAIN	1.5KX1	1.5K	-20 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL		R-PDSO-G3	1	5.5 V	1.12 mm	.01667 MHz	1.3 mm	Not Qualified	1536 bit	2.65 V		e4	NOT SPECIFIED	260		2.92 mm
M27C512-70C6TR	STMicroelectronics	OTP ROM	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		J BEND	PARALLEL	ASYNCHRONOUS	30 mA	65536 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6	OTP ROMs	1.27 mm	85 Cel	3-STATE	64KX8	64K	-40 Cel	TIN	QUAD		R-PQCC-J32		5.5 V	3.56 mm		11.43 mm	Not Qualified	524288 bit	4.5 V		e3			.0001 Amp	13.97 mm	70 ns
AT27C256R-55PC	Atmel	OTP ROM	COMMERCIAL	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS		THROUGH-HOLE	PARALLEL	ASYNCHRONOUS	20 mA	32768 words	COMMON	5	5	8	IN-LINE	DIP28,.6	OTP ROMs	2.54 mm	70 Cel	3-STATE	32KX8	32K	0 Cel	TIN LEAD	DUAL		R-PDIP-T28	1	5.5 V	5.59 mm		15.24 mm	Not Qualified	262144 bit	4.5 V		e0			.0001 Amp	36.95 mm	55 ns	13
AT27C256R-12JC	Atmel	OTP ROM	COMMERCIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		J BEND	PARALLEL	ASYNCHRONOUS	20 mA	32768 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6	OTP ROMs	1.27 mm	70 Cel	3-STATE	32KX8	32K	0 Cel	TIN LEAD	QUAD		R-PQCC-J32	2	5.5 V	3.55 mm		11.43 mm	Not Qualified	262144 bit	4.5 V		e0		225	.0001 Amp	13.97 mm	120 ns	13
AT27C256R-20JC	Atmel	OTP ROM	COMMERCIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		J BEND	PARALLEL	ASYNCHRONOUS	20 mA	32768 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6	OTP ROMs	1.27 mm	70 Cel	3-STATE	32KX8	32K	0 Cel	TIN LEAD	QUAD		R-PQCC-J32	2	5.5 V	3.55 mm		11.43 mm	Not Qualified	262144 bit	4.5 V		e0		225	.0001 Amp	13.97 mm	200 ns	13
AT27C256R-70PC	Atmel	OTP ROM	COMMERCIAL	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS		THROUGH-HOLE	PARALLEL	ASYNCHRONOUS	20 mA	32768 words	COMMON	5	5	8	IN-LINE	DIP28,.6	OTP ROMs	2.54 mm	70 Cel	3-STATE	32KX8	32K	0 Cel	TIN LEAD	DUAL		R-PDIP-T28	1	5.5 V	5.59 mm		15.24 mm	Not Qualified	262144 bit	4.5 V		e0			.0001 Amp	36.95 mm	70 ns	13
M27C1001-35C6	STMicroelectronics	OTP ROM	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		J BEND	PARALLEL	ASYNCHRONOUS	30 mA	131072 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6	OTP ROMs	1.27 mm	85 Cel	3-STATE	128KX8	128K	-40 Cel	MATTE TIN	QUAD		R-PQCC-J32		5.5 V	3.56 mm		11.43 mm	Not Qualified	1048576 bit	4.5 V		e3			.0001 Amp	13.97 mm	35 ns

OTP ROM

OTP ROM, or One-Time Programmable Read-Only Memory, is a type of non-volatile computer memory that is programmed once and cannot be reprogrammed. OTP ROM is used to store data that needs to be permanently stored and cannot be changed or updated in the future.

OTP ROM is created using a process similar to that used to manufacture Mask ROM. However, instead of programming the memory during the manufacturing process, OTP ROM is programmed after the manufacturing process, but before it is delivered to the customer. This allows the customer to program the memory with the data that they need to store permanently.

OTP ROM is commonly used in devices such as microcontrollers, smart cards, and other electronic devices that require permanent storage of data. It is ideal for storing critical data, such as system settings, encryption keys, and other sensitive information that needs to be permanently stored and cannot be changed or updated in the future.