OTP ROM OTP ROM 2,400+

Reset All

Part	Manufacturer	Memory IC Type	Temperature Grade	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	Terminal Form	Parallel or Serial	Operating Mode	Maximum Supply Current	No. of Words	Input/Output Type	Nominal Supply Voltage / Vsup (V)	Power Supplies (V)	Memory Width	Package Style (Meter)	Package Equivalence Code	Alternate Memory Width	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Output Characteristics	Organization	No. of Words Code	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Supply Voltage (Vsup)	Maximum Seated Height	Width	Qualification	Memory Density	Minimum Supply Voltage (Vsup)	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Maximum Standby Current	Length	Maximum Access Time
DS1982-F5W+	Analog Devices	OTP ROM
DS2502PU-1176+	Analog Devices	OTP ROM		6		RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		C BEND				1024 words				1						85 Cel		1KX1	1K	-40 Cel		DUAL	R-PDSO-C6		6 V				1024 bit	2.8 V
DS2502-E64+	Analog Devices	OTP ROM	INDUSTRIAL	3	TO-92	ROUND	PLASTIC/EPOXY	NO	1	MOS		THROUGH-HOLE	SERIAL	SYNCHRONOUS		1024 words		5		1	CYLINDRICAL					85 Cel		1KX1	1K	-40 Cel	Matte Tin (Sn) - annealed	BOTTOM	O-PBCY-T3		6 V			Not Qualified	1024 bit	2.8 V		e3		250
DS2506-UNW	Analog Devices	OTP ROM	INDUSTRIAL	3	TO-92	ROUND	PLASTIC/EPOXY	NO	1	CMOS		THROUGH-HOLE	SERIAL	SYNCHRONOUS		8192 words	COMMON		3/5	8	CYLINDRICAL	SIP3,.1,50		Other Memory ICs	1.27 mm	85 Cel		8KX8	8K	-40 Cel	TIN LEAD	BOTTOM	O-PBCY-T3		6 V			Not Qualified	65536 bit	2.8 V	MICROLAN COMPATIBLE	e0
DS2406+T&R	Analog Devices	OTP ROM	INDUSTRIAL	3	TO-92	ROUND	PLASTIC/EPOXY	NO	1	CMOS		THROUGH-HOLE	SERIAL	ASYNCHRONOUS		1024 words		4	3/5	1	CYLINDRICAL	SIP3,.1,50		SRAMs	1.27 mm	85 Cel		1KX1	1K	-40 Cel	Matte Tin (Sn) - annealed	BOTTOM	O-PBCY-T3		6 V			Not Qualified	1024 bit	2.8 V		e3		250
DS25051AT	Analog Devices	OTP ROM	INDUSTRIAL	3	TO-92	ROUND	PLASTIC/EPOXY	NO	1	CMOS		THROUGH-HOLE	SERIAL	ASYNCHRONOUS		16384 words				1	CYLINDRICAL					85 Cel		16KX1	16K	-40 Cel	TIN LEAD	BOTTOM	O-PBCY-T3		6 V			Not Qualified	16384 bit	2.8 V		e0
DS25051A	Analog Devices	OTP ROM	INDUSTRIAL	3	TO-92	ROUND	PLASTIC/EPOXY	NO	1	CMOS		THROUGH-HOLE	SERIAL	ASYNCHRONOUS		16384 words				1	CYLINDRICAL					85 Cel		16KX1	16K	-40 Cel	TIN LEAD	BOTTOM	O-PBCY-T3		6 V			Not Qualified	16384 bit	2.8 V		e0
DS25021AT	Analog Devices	OTP ROM	INDUSTRIAL	3	TO-92	ROUND	PLASTIC/EPOXY	NO	1	CMOS		THROUGH-HOLE	SERIAL	ASYNCHRONOUS		1024 words				1	CYLINDRICAL					85 Cel		1KX1	1K	-40 Cel	TIN LEAD	BOTTOM	O-PBCY-T3		6 V			Not Qualified	1024 bit	2.8 V		e0
DS25021A	Analog Devices	OTP ROM	INDUSTRIAL	3	TO-92	ROUND	PLASTIC/EPOXY	NO	1	CMOS		THROUGH-HOLE	SERIAL	ASYNCHRONOUS		1024 words				1	CYLINDRICAL					85 Cel		1KX1	1K	-40 Cel	TIN LEAD	BOTTOM	O-PBCY-T3		6 V			Not Qualified	1024 bit	2.8 V		e0
DS2502SY	Analog Devices	OTP ROM	INDUSTRIAL	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		GULL WING	SERIAL	ASYNCHRONOUS		1024 words				1	SMALL OUTLINE				1.27 mm	85 Cel		1KX1	1K	-40 Cel	TIN LEAD	DUAL	R-PDSO-G8	1	6 V	1.75 mm	3.9 mm	Not Qualified	1024 bit	2.8 V		e0				4.9 mm
DS2406+	Analog Devices	OTP ROM	INDUSTRIAL	3	TO-92	ROUND	PLASTIC/EPOXY	NO	1	CMOS		THROUGH-HOLE	SERIAL	ASYNCHRONOUS		1024 words		4	3/5	1	CYLINDRICAL	SIP3,.1,50		SRAMs	1.27 mm	85 Cel		1KX1	1K	-40 Cel	Matte Tin (Sn) - annealed	BOTTOM	O-PBCY-T3		6 V			Not Qualified	1024 bit	2.8 V		e3		250
DS2506P-UNW	Analog Devices	OTP ROM	INDUSTRIAL	6	LSOC	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		C BEND	SERIAL	SYNCHRONOUS		8192 words				8	SMALL OUTLINE, LOW PROFILE				1.27 mm	85 Cel		8KX8	8K	-40 Cel	TIN LEAD	DUAL	R-PDSO-C6		6 V	1.5 mm	3.76 mm	Not Qualified	65536 bit	2.8 V	MICROLAN COMPATIBLE	e0				3.94 mm
DS2506S-UNW	Analog Devices	OTP ROM	INDUSTRIAL	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		GULL WING	SERIAL	ASYNCHRONOUS		65536 words	COMMON		3/5	1	SMALL OUTLINE	SOP8,.3		Other Memory ICs	1.27 mm	85 Cel		64KX1	64K	-40 Cel	TIN LEAD	DUAL	R-PDSO-G8	1	6 V	1.75 mm	3.9 mm	Not Qualified	65536 bit	2.8 V		e0				4.9 mm
R29771DM/883B	Onsemi	OTP ROM	MILITARY	24	DIP	RECTANGULAR	CERAMIC, METAL-SEALED COFIRED	NO	1	CMOS	MIL-STD-883 Class B	THROUGH-HOLE	PARALLEL	ASYNCHRONOUS	190 mA	4096 words		5	5	8	IN-LINE	DIP24,.6		OTP ROMs	2.54 mm	125 Cel		4KX8	4K	-55 Cel		DUAL	R-CDIP-T24		5.5 V	5.72 mm	15.24 mm	Not Qualified	32768 bit	4.5 V	LG-MAX					32.77 mm	85 ns
M27V801-120N6	STMicroelectronics	OTP ROM	INDUSTRIAL	32	TSOP1	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		GULL WING	PARALLEL	ASYNCHRONOUS	15 mA	1048576 words	COMMON	3.3	3.3	8	SMALL OUTLINE, THIN PROFILE	TSSOP32,.8,20		OTP ROMs	.5 mm	85 Cel	3-STATE	1MX8	1M	-40 Cel	TIN LEAD	DUAL	R-PDSO-G32		3.63 V	1.2 mm	8 mm	Not Qualified	8388608 bit	2.97 V		e0			.00002 Amp	18.4 mm	120 ns
M27V322-100P6	STMicroelectronics	OTP ROM	INDUSTRIAL	42	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS		THROUGH-HOLE	PARALLEL	ASYNCHRONOUS	30 mA	2097152 words	COMMON	3.3	3.3	16	IN-LINE	DIP42,.6		OTP ROMs	2.54 mm	85 Cel	3-STATE	2MX16	2M	-40 Cel	MATTE TIN	DUAL	R-PDIP-T42		3.6 V	5.08 mm	15.24 mm	Not Qualified	33554432 bit	3 V		e3			.00006 Amp	52.455 mm	100 ns
M27V405-200K6TR	STMicroelectronics	OTP ROM	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		J BEND	PARALLEL	ASYNCHRONOUS	15 mA	524288 words	COMMON	3.3	3.3	8	CHIP CARRIER	LDCC32,.5X.6		Other Memory ICs	1.27 mm	85 Cel	3-STATE	512KX8	512K	-40 Cel	TIN LEAD	QUAD	R-PQCC-J32		3.63 V	3.56 mm	11.455 mm	Not Qualified	4194304 bit	2.97 V		e0			.00002 Amp	13.995 mm	200 ns
M27W512-100K6	STMicroelectronics	OTP ROM	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		J BEND	PARALLEL	ASYNCHRONOUS	15 mA	65536 words	COMMON	3	3/3.3	8	CHIP CARRIER	LDCC32,.5X.6		OTP ROMs	1.27 mm	85 Cel	3-STATE	64KX8	64K	-40 Cel	TIN	QUAD	R-PQCC-J32		3.6 V	3.556 mm	11.43 mm	Not Qualified	524288 bit	2.7 V		e3			.000015 Amp	13.97 mm	100 ns
M27W512-200N6E	STMicroelectronics	OTP ROM	INDUSTRIAL	28	TSOP1	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		GULL WING	PARALLEL	ASYNCHRONOUS		65536 words		3		8	SMALL OUTLINE, THIN PROFILE				.55 mm	85 Cel		64KX8	64K	-40 Cel	TIN/TIN BISMUTH	DUAL	R-PDSO-G28		3.6 V	1.25 mm	8 mm	Not Qualified	524288 bit	2.7 V		e3/e6	NOT SPECIFIED	260		11.8 mm	100 ns
M87C257-20C7TR	STMicroelectronics	OTP ROM	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS		J BEND			30 mA	32768 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6		OTP ROMs	1.27 mm	105 Cel	3-STATE	32KX8	32K	-40 Cel	MATTE TIN	QUAD	R-PQCC-J32					Not Qualified	262144 bit			e3			.0001 Amp		200 ns
M87C257-90XC6XTR	STMicroelectronics	OTP ROM	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		J BEND	PARALLEL	ASYNCHRONOUS	30 mA	32768 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6		OTP ROMs	1.27 mm	85 Cel	3-STATE	32KX8	32K	-40 Cel	MATTE TIN	QUAD	R-PQCC-J32				11.455 mm		262144 bit			e3			.0001 Amp	13.995 mm	90 ns
M27W402-100N6TR	STMicroelectronics	OTP ROM	INDUSTRIAL	40	TSOP1	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		GULL WING	PARALLEL	ASYNCHRONOUS		262144 words		3		16	SMALL OUTLINE, THIN PROFILE				.5 mm	85 Cel		256KX16	256K	-40 Cel	TIN	DUAL	R-PDSO-G40		3.6 V	1.2 mm	10 mm	Not Qualified	4194304 bit	2.7 V	THIS SPEED ALSO GUARANTEES 80NS ACCESS TIME AT VCC = 3.0V TO 3.6V	e3				18.4 mm	100 ns
M87C257-20C6	STMicroelectronics	OTP ROM	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		J BEND	PARALLEL	ASYNCHRONOUS	30 mA	32768 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6		OTP ROMs	1.27 mm	85 Cel	3-STATE	32KX8	32K	-40 Cel	MATTE TIN	QUAD	R-PQCC-J32		5.5 V	3.56 mm	11.43 mm	Not Qualified	262144 bit	4.5 V		e3			.0001 Amp	13.97 mm	150 ns
M87C257-60XC7TR	STMicroelectronics	OTP ROM	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		J BEND	PARALLEL	ASYNCHRONOUS	30 mA	32768 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6		OTP ROMs	1.27 mm	105 Cel	3-STATE	32KX8	32K	-40 Cel	MATTE TIN	QUAD	R-PQCC-J32		5.25 V	3.56 mm	11.455 mm	Not Qualified	262144 bit	4.75 V		e3			.0001 Amp	13.995 mm	60 ns
M87C257-60XC1XTR	STMicroelectronics	OTP ROM	COMMERCIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		J BEND	PARALLEL	ASYNCHRONOUS	30 mA	32768 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6		OTP ROMs	1.27 mm	70 Cel	3-STATE	32KX8	32K	0 Cel	MATTE TIN	QUAD	R-PQCC-J32				11.455 mm		262144 bit			e3			.0001 Amp	13.995 mm	60 ns
M87C257-70C7XTR	STMicroelectronics	OTP ROM	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		J BEND	PARALLEL	ASYNCHRONOUS	30 mA	32768 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6		OTP ROMs	1.27 mm	105 Cel	3-STATE	32KX8	32K	-40 Cel	MATTE TIN	QUAD	R-PQCC-J32				11.455 mm		262144 bit			e3			.0001 Amp	13.995 mm	70 ns
M87C257-90C3XTR	STMicroelectronics	OTP ROM	AUTOMOTIVE	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		J BEND	PARALLEL	ASYNCHRONOUS	30 mA	32768 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6		OTP ROMs	1.27 mm	125 Cel	3-STATE	32KX8	32K	-40 Cel	MATTE TIN	QUAD	R-PQCC-J32				11.455 mm		262144 bit			e3			.0001 Amp	13.995 mm	90 ns
M87C257-45X1TR	STMicroelectronics	OTP ROM	COMMERCIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		J BEND	PARALLEL	ASYNCHRONOUS		32768 words		5		8	CHIP CARRIER					70 Cel		32KX8	32K	0 Cel		QUAD	R-PQCC-J32		5.25 V			Not Qualified	262144 bit	4.75 V							45 ns
M87C257-90X7X	STMicroelectronics	OTP ROM	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		J BEND	PARALLEL	ASYNCHRONOUS		32768 words		5		8	CHIP CARRIER					105 Cel		32KX8	32K	-40 Cel		QUAD	R-PQCC-J32		5.25 V			Not Qualified	262144 bit	4.75 V							90 ns
M27V160-120XM6TR	STMicroelectronics	OTP ROM	INDUSTRIAL	44	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		GULL WING	PARALLEL	ASYNCHRONOUS	30 mA	1048576 words	COMMON	3.3	3.3	16	SMALL OUTLINE	SOP44,.63	8	OTP ROMs	1.27 mm	85 Cel	3-STATE	1MX16	1M	-40 Cel	MATTE TIN	DUAL	R-PDSO-G44		3.465 V	2.8 mm	13.3 mm	Not Qualified	16777216 bit	3.135 V		e3			.00006 Amp	28.2 mm	120 ns
M27V800-120B1	STMicroelectronics	OTP ROM	COMMERCIAL	42	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS		THROUGH-HOLE	PARALLEL	ASYNCHRONOUS	30 mA	524288 words	COMMON	3.3	3.3	16	IN-LINE	DIP42,.6	8	OTP ROMs	2.54 mm	70 Cel	3-STATE	512KX16	512K	0 Cel	TIN LEAD	DUAL	R-PDIP-T42		3.63 V	5.08 mm	15.24 mm	Not Qualified	8388608 bit	2.97 V	CONFIGURABLE AS 512K X 16	e0			.00002 Amp	52.455 mm	120 ns
M87C257-80XC3TR	STMicroelectronics	OTP ROM	AUTOMOTIVE	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		J BEND	PARALLEL	ASYNCHRONOUS	30 mA	32768 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6		OTP ROMs	1.27 mm	125 Cel	3-STATE	32KX8	32K	-40 Cel	MATTE TIN	QUAD	R-PQCC-J32		5.25 V	3.56 mm	11.43 mm	Not Qualified	262144 bit	4.75 V		e3			.0001 Amp	13.97 mm	80 ns
M27W201-200K6	STMicroelectronics	OTP ROM	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		J BEND	PARALLEL	ASYNCHRONOUS	15 mA	262144 words	COMMON	3	3/3.3	8	CHIP CARRIER	LDCC32,.5X.6		OTP ROMs	1.27 mm	85 Cel	3-STATE	256KX8	256K	-40 Cel	MATTE TIN	QUAD	R-PQCC-J32		3.6 V	3.56 mm	11.43 mm	Not Qualified	2097152 bit	2.7 V		e3			.000015 Amp	13.97 mm	100 ns
M27W801-80N6	STMicroelectronics	OTP ROM	INDUSTRIAL	32	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS		GULL WING			15 mA	1048576 words	COMMON		3/3.3	8	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP32,.8,20		OTP ROMs	.5 mm	85 Cel	3-STATE	1MX8	1M	-40 Cel	TIN LEAD	DUAL	R-PDSO-G32					Not Qualified	8388608 bit			e0			.00002 Amp		80 ns
M87C257-70X7TR	STMicroelectronics	OTP ROM	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		J BEND	PARALLEL	ASYNCHRONOUS		32768 words		5		8	CHIP CARRIER					105 Cel		32KX8	32K	-40 Cel		QUAD	R-PQCC-J32		5.25 V			Not Qualified	262144 bit	4.75 V							70 ns
M87C257-15B6	STMicroelectronics	OTP ROM	INDUSTRIAL	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS		THROUGH-HOLE	PARALLEL	ASYNCHRONOUS	30 mA	32768 words	COMMON	5	5	8	IN-LINE	DIP28,.6		OTP ROMs	2.54 mm	85 Cel	3-STATE	32KX8	32K	-40 Cel	TIN LEAD	DUAL	R-PDIP-T28		5.5 V		15.24 mm	Not Qualified	262144 bit	4.5 V		e0			.0002 Amp	36.83 mm	150 ns
M27W102-100B6	STMicroelectronics	OTP ROM	INDUSTRIAL	40	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS		THROUGH-HOLE	PARALLEL	ASYNCHRONOUS	15 mA	65536 words	COMMON	3.3	3/3.3	16	IN-LINE	DIP40,.6		OTP ROMs	2.54 mm	85 Cel	3-STATE	64KX16	64K	-40 Cel	MATTE TIN	DUAL	R-PDIP-T40		3.6 V		15.24 mm	Not Qualified	1048576 bit	2.7 V		e3			.000015 Amp	52.18 mm	100 ns
M27V401-200N1	STMicroelectronics	OTP ROM	COMMERCIAL	32	TSOP1	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		GULL WING	PARALLEL	ASYNCHRONOUS	15 mA	524288 words	COMMON	3.3	3.3	8	SMALL OUTLINE, THIN PROFILE	TSSOP32,.8,20		OTP ROMs	.5 mm	70 Cel	3-STATE	512KX8	512K	0 Cel	TIN LEAD	DUAL	R-PDSO-G32		3.6 V	1.2 mm	8 mm	Not Qualified	4194304 bit	3 V		e0			.00002 Amp	18.4 mm	200 ns
M27V322-120P6	STMicroelectronics	OTP ROM	INDUSTRIAL	42	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS		THROUGH-HOLE	PARALLEL	ASYNCHRONOUS	30 mA	2097152 words	COMMON	3.3	3.3	16	IN-LINE	DIP42,.6		OTP ROMs	2.54 mm	85 Cel	3-STATE	2MX16	2M	-40 Cel	MATTE TIN	DUAL	R-PDIP-T42		3.6 V	5.08 mm	15.24 mm	Not Qualified	33554432 bit	3 V		e3			.00006 Amp	52.455 mm	120 ns
M87C257-80XC1TR	STMicroelectronics	OTP ROM	COMMERCIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		J BEND	PARALLEL	ASYNCHRONOUS	30 mA	32768 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6		OTP ROMs	1.27 mm	70 Cel	3-STATE	32KX8	32K	0 Cel	MATTE TIN	QUAD	R-PQCC-J32		5.25 V	3.56 mm	11.43 mm	Not Qualified	262144 bit	4.75 V		e3			.0001 Amp	13.97 mm	80 ns
M27V201-120N6	STMicroelectronics	OTP ROM	INDUSTRIAL	32	TSOP1	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		GULL WING	PARALLEL	ASYNCHRONOUS	15 mA	262144 words	COMMON	3.3	3.3	8	SMALL OUTLINE, THIN PROFILE	TSSOP32,.8,20		OTP ROMs	.5 mm	85 Cel	3-STATE	256KX8	256K	-40 Cel	TIN LEAD	DUAL	R-PDSO-G32		3.6 V	1.2 mm	8 mm	Not Qualified	2097152 bit	3 V		e0			.00002 Amp	18.4 mm	120 ns
M27V101-150K6	STMicroelectronics	OTP ROM	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		J BEND	PARALLEL	ASYNCHRONOUS	15 mA	131072 words	COMMON	3.3	3.3	8	CHIP CARRIER	LDCC32,.5X.6		OTP ROMs	1.27 mm	85 Cel	3-STATE	128KX8	128K	-40 Cel	TIN LEAD	QUAD	R-PQCC-J32		3.6 V	3.56 mm	11.43 mm	Not Qualified	1048576 bit	3 V		e0			.00002 Amp	13.97 mm	150 ns
M27V101-200B1TR	STMicroelectronics	OTP ROM	COMMERCIAL	32	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS		THROUGH-HOLE	PARALLEL	ASYNCHRONOUS		131072 words		3.3		8	IN-LINE				2.54 mm	70 Cel	3-STATE	128KX8	128K	0 Cel		DUAL	R-PDIP-T32		3.6 V	5.08 mm	15.24 mm	Not Qualified	1048576 bit	3 V						41.91 mm	200 ns
M87C257-45C1XTR	STMicroelectronics	OTP ROM	COMMERCIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		J BEND	PARALLEL	ASYNCHRONOUS	30 mA	32768 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6		OTP ROMs	1.27 mm	70 Cel	3-STATE	32KX8	32K	0 Cel	MATTE TIN	QUAD	R-PQCC-J32				11.455 mm		262144 bit			e3			.0001 Amp	13.995 mm	45 ns
M27V402-150K6TR	STMicroelectronics	OTP ROM	INDUSTRIAL	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		J BEND	PARALLEL	ASYNCHRONOUS	20 mA	262144 words	COMMON	3.3	3.3	16	CHIP CARRIER	LDCC44,.7SQ		Other Memory ICs	1.27 mm	85 Cel	3-STATE	256KX16	256K	-40 Cel	TIN LEAD	QUAD	S-PQCC-J44		3.63 V	4.7 mm	16.585 mm	Not Qualified	4194304 bit	2.97 V		e0			.00002 Amp	16.585 mm	150 ns
M27V800-120XM1	STMicroelectronics	OTP ROM	COMMERCIAL	44	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		GULL WING	PARALLEL	ASYNCHRONOUS	30 mA	524288 words	COMMON	3.3	3.3	16	SMALL OUTLINE	SOP44,.63	8	OTP ROMs	1.27 mm	70 Cel	3-STATE	512KX16	512K	0 Cel	TIN LEAD	DUAL	R-PDSO-G44		3.465 V	2.62 mm	13.3 mm	Not Qualified	8388608 bit	3.135 V	CONFIGURABLE AS 512K X 16	e0			.00002 Amp	28.2 mm	120 ns
M87C257-45XC1	STMicroelectronics	OTP ROM	COMMERCIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		J BEND	PARALLEL	ASYNCHRONOUS	30 mA	32768 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6		OTP ROMs	1.27 mm	70 Cel	3-STATE	32KX8	32K	0 Cel	MATTE TIN	QUAD	R-PQCC-J32		5.25 V	3.56 mm	11.43 mm	Not Qualified	262144 bit	4.75 V		e3			.0001 Amp	13.97 mm	45 ns
M27V405-150K4	STMicroelectronics	OTP ROM	COMMERCIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		J BEND	PARALLEL	ASYNCHRONOUS	30 mA	524288 words	COMMON	3.3	3.3	8	CHIP CARRIER	LDCC32,.5X.6		OTP ROMs	1.27 mm	70 Cel	3-STATE	512KX8	512K	-20 Cel	TIN LEAD	QUAD	R-PQCC-J32		3.63 V	3.56 mm	11.455 mm	Not Qualified	4194304 bit	2.97 V		e0			.0001 Amp	13.995 mm	150 ns

OTP ROM

OTP ROM, or One-Time Programmable Read-Only Memory, is a type of non-volatile computer memory that is programmed once and cannot be reprogrammed. OTP ROM is used to store data that needs to be permanently stored and cannot be changed or updated in the future.

OTP ROM is created using a process similar to that used to manufacture Mask ROM. However, instead of programming the memory during the manufacturing process, OTP ROM is programmed after the manufacturing process, but before it is delivered to the customer. This allows the customer to program the memory with the data that they need to store permanently.

OTP ROM is commonly used in devices such as microcontrollers, smart cards, and other electronic devices that require permanent storage of data. It is ideal for storing critical data, such as system settings, encryption keys, and other sensitive information that needs to be permanently stored and cannot be changed or updated in the future.