44 OTP ROM 1,246

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Part	Manufacturer	Memory IC Type	Temperature Grade	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Terminal Form	Parallel or Serial	Operating Mode	Maximum Supply Current	No. of Words	Input/Output Type	Nominal Supply Voltage / Vsup (V)	Power Supplies (V)	Memory Width	Package Style (Meter)	Package Equivalence Code	Alternate Memory Width	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Output Characteristics	Organization	No. of Words Code	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Maximum Supply Voltage (Vsup)	Maximum Seated Height	Width	Qualification	Memory Density	Minimum Supply Voltage (Vsup)	Additional Features	JESD-609 Code	Maximum Standby Current	Length	Maximum Access Time
M27V160-120M1	STMicroelectronics	OTP ROM	COMMERCIAL	44	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	30 mA	1048576 words	COMMON	3.3	3.3	16	SMALL OUTLINE	SOP44,.63	8	OTP ROMs	1.27 mm	70 Cel	3-STATE	1MX16	1M	0 Cel	MATTE TIN	DUAL	R-PDSO-G44	3.63 V	2.8 mm	13.3 mm	Not Qualified	16777216 bit	2.97 V		e3	.00006 Amp	28.2 mm	120 ns
M27W102-100K6TR	STMicroelectronics	OTP ROM	INDUSTRIAL	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	15 mA	65536 words	COMMON	3.3	3/3.3	16	CHIP CARRIER	LDCC44,.7SQ		OTP ROMs	1.27 mm	85 Cel	3-STATE	64KX16	64K	-40 Cel	MATTE TIN	QUAD	S-PQCC-J44	3.6 V	4.7 mm	16.5862 mm	Not Qualified	1048576 bit	2.7 V		e3	.000015 Amp	16.5862 mm	100 ns
M27W064100M1T	STMicroelectronics	OTP ROM	COMMERCIAL	44	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	20 mA	4194304 words	COMMON	3	3/3.3	16	SMALL OUTLINE	SOP44,.63		OTP ROMs	1.27 mm	70 Cel	3-STATE	4MX16	4M	0 Cel	TIN LEAD	DUAL	R-PDSO-G44	3.6 V	3 mm	12.6 mm	Not Qualified	67108864 bit	2.7 V		e0	.0001 Amp	28.5 mm	100 ns
M27V800-100K6TR	STMicroelectronics		INDUSTRIAL	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES		CMOS	J BEND			30 mA	1048576 words	COMMON		3/3.3	8	CHIP CARRIER	LDCC44,.7SQ		OTP ROMs	1.27 mm	85 Cel	3-STATE	1MX8	1M	-40 Cel	Tin/Lead (Sn/Pb)	QUAD	S-PQCC-J44				Not Qualified	8388608 bit			e0	.000015 Amp		100 ns
M27V102-120K1TR	STMicroelectronics	OTP ROM	COMMERCIAL	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	15 mA	65536 words	COMMON	3.3	3.3	16	CHIP CARRIER	LDCC44,.7SQ		OTP ROMs	1.27 mm	70 Cel	3-STATE	64KX16	64K	0 Cel	TIN LEAD	QUAD	S-PQCC-J44	3.63 V	4.7 mm	16.5862 mm	Not Qualified	1048576 bit	2.97 V		e0	.00002 Amp	16.5862 mm	120 ns
M27V160-120XM1	STMicroelectronics	OTP ROM	COMMERCIAL	44	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	30 mA	1048576 words	COMMON	3.3	3.3	16	SMALL OUTLINE	SOP44,.63	8	OTP ROMs	1.27 mm	70 Cel	3-STATE	1MX16	1M	0 Cel	MATTE TIN	DUAL	R-PDSO-G44	3.465 V	2.8 mm	13.3 mm	Not Qualified	16777216 bit	3.135 V		e3	.00006 Amp	28.2 mm	120 ns
M27V800-120XM1TR	STMicroelectronics	OTP ROM	COMMERCIAL	44	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	30 mA	524288 words	COMMON	3.3	3.3	16	SMALL OUTLINE	SOP44,.63	8	OTP ROMs	1.27 mm	70 Cel	3-STATE	512KX16	512K	0 Cel	TIN LEAD	DUAL	R-PDSO-G44	3.465 V	2.62 mm	13.3 mm	Not Qualified	8388608 bit	3.135 V	CONFIGURABLE AS 512K X 16	e0	.00002 Amp	28.2 mm	120 ns
M27V160-100K6TR	STMicroelectronics	OTP ROM	INDUSTRIAL	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	30 mA	1048576 words	COMMON	3.3	3.3	16	CHIP CARRIER	LDCC44,.7SQ	8	OTP ROMs	1.27 mm	85 Cel	3-STATE	1MX16	1M	-40 Cel	MATTE TIN	QUAD	S-PQCC-J44	3.63 V	4.57 mm	16.586 mm	Not Qualified	16777216 bit	2.97 V		e3	.00006 Amp	16.586 mm	100 ns
M27V402120K6	STMicroelectronics	OTP ROM	INDUSTRIAL	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	20 mA	262144 words	COMMON	3.3	3.3	16	CHIP CARRIER	LDCC44,.7SQ		OTP ROMs	1.27 mm	85 Cel	3-STATE	256KX16	256K	-40 Cel	TIN LEAD	QUAD	S-PQCC-J44	3.63 V	4.7 mm	16.5862 mm	Not Qualified	4194304 bit	2.97 V		e0	.00002 Amp	16.5862 mm	120 ns
M27V320-100M6	STMicroelectronics	OTP ROM	INDUSTRIAL	44	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	30 mA	2097152 words	COMMON	3.3	3.3	16	SMALL OUTLINE	SOP44,.63	8	OTP ROMs	1.27 mm	85 Cel	3-STATE	2MX16	2M	-40 Cel	MATTE TIN	DUAL	R-PDSO-G44	3.63 V	2.8 mm	13.3 mm	Not Qualified	33554432 bit	2.97 V		e3	.00006 Amp	28.2 mm	100 ns
M27V160-110M1	STMicroelectronics	OTP ROM	COMMERCIAL	44	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	30 mA	2097152 words	COMMON	3.3	3.3	8	SMALL OUTLINE	SOP44,.63	16	OTP ROMs	1.27 mm	70 Cel	3-STATE	2MX8	2M	0 Cel	TIN LEAD	DUAL	R-PDSO-G44	3.63 V	2.62 mm	13.3 mm	Not Qualified	16777216 bit	2.97 V		e0	.00002 Amp	28.2 mm	110 ns
M27V800-110XM1	STMicroelectronics	OTP ROM	COMMERCIAL	44	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	30 mA	1048576 words	COMMON	3.3	3.3	8	SMALL OUTLINE	SOP44,.63	16	OTP ROMs	1.27 mm	70 Cel	3-STATE	1MX8	1M	0 Cel	TIN LEAD	DUAL	R-PDSO-G44	3.465 V	2.62 mm	13.3 mm	Not Qualified	8388608 bit	3.135 V		e0	.00002 Amp	28.2 mm	110 ns
M27V160-100K1	STMicroelectronics	OTP ROM	COMMERCIAL	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	30 mA	1048576 words	COMMON	3.3	3.3	16	CHIP CARRIER	LDCC44,.7SQ	8	OTP ROMs	1.27 mm	70 Cel	3-STATE	1MX16	1M	0 Cel	MATTE TIN	QUAD	S-PQCC-J44	3.63 V	4.57 mm	16.586 mm	Not Qualified	16777216 bit	2.97 V		e3	.00006 Amp	16.586 mm	100 ns
M27V800-150XK1	STMicroelectronics	OTP ROM	COMMERCIAL	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	30 mA	524288 words	COMMON	3.3	3.3	16	CHIP CARRIER	LDCC44,.7SQ	8	OTP ROMs	1.27 mm	70 Cel	3-STATE	512KX16	512K	0 Cel	TIN LEAD	QUAD	S-PQCC-J44	3.465 V	4.7 mm	16.5862 mm	Not Qualified	8388608 bit	3.135 V	CONFIGURABLE AS 512K X 16	e0	.00002 Amp	16.5862 mm	150 ns
M27V402200K4	STMicroelectronics	OTP ROM	COMMERCIAL	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	20 mA	262144 words	COMMON	3.3	3.3	16	CHIP CARRIER	LDCC44,.7SQ		OTP ROMs	1.27 mm	70 Cel	3-STATE	256KX16	256K	-20 Cel	TIN LEAD	QUAD	S-PQCC-J44	3.63 V	4.7 mm	16.5862 mm	Not Qualified	4194304 bit	2.97 V		e0	.00002 Amp	16.5862 mm	200 ns
M27V160-120K6	STMicroelectronics	OTP ROM	INDUSTRIAL	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	30 mA	1048576 words	COMMON	3.3	3.3	16	CHIP CARRIER	LDCC44,.7SQ	8	OTP ROMs	1.27 mm	85 Cel	3-STATE	1MX16	1M	-40 Cel	MATTE TIN	QUAD	S-PQCC-J44	3.63 V	4.57 mm	16.586 mm	Not Qualified	16777216 bit	2.97 V		e3	.00006 Amp	16.586 mm	120 ns
M27W032100M1T	STMicroelectronics	OTP ROM	COMMERCIAL	44	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	20 mA	2097152 words	COMMON	3	3/3.3	16	SMALL OUTLINE	SOP44,.63		OTP ROMs	1.27 mm	70 Cel	3-STATE	2MX16	2M	0 Cel	Matte Tin (Sn)	DUAL	R-PDSO-G44	3.6 V	3 mm	12.6 mm	Not Qualified	33554432 bit	2.7 V		e3	.0001 Amp	28.5 mm	100 ns
M27V402150K5	STMicroelectronics	OTP ROM	OTHER	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	20 mA	262144 words	COMMON	3.3	3.3	16	CHIP CARRIER	LDCC44,.7SQ		OTP ROMs	1.27 mm	85 Cel	3-STATE	256KX16	256K	-20 Cel	TIN LEAD	QUAD	S-PQCC-J44	3.63 V	4.7 mm	16.5862 mm	Not Qualified	4194304 bit	2.97 V		e0	.00002 Amp	16.5862 mm	150 ns
M27W160-150M6	STMicroelectronics		INDUSTRIAL	44	SOP	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS	GULL WING			50 mA	1048576 words	COMMON		3/3.3	16	SMALL OUTLINE	SOP44,.63		OTP ROMs	1.27 mm	85 Cel	3-STATE	1MX16	1M	-40 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDSO-G44				Not Qualified	16777216 bit			e0	.00003 Amp		150 ns
M27W1282100M1T	STMicroelectronics	OTP ROM	COMMERCIAL	44	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	20 mA	4194304 words	COMMON	3	3/3.3	16	SMALL OUTLINE	SOP44,.63		Other Memory ICs	1.27 mm	70 Cel	3-STATE	4MX16	4M	0 Cel	TIN LEAD	DUAL	R-PDSO-G44	3.6 V	3 mm	12.6 mm	Not Qualified	67108864 bit	2.7 V		e0	.00015 Amp	28.5 mm	100 ns
M27V402150K6	STMicroelectronics	OTP ROM	INDUSTRIAL	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	20 mA	262144 words	COMMON	3.3	3.3	16	CHIP CARRIER	LDCC44,.7SQ		OTP ROMs	1.27 mm	85 Cel	3-STATE	256KX16	256K	-40 Cel	TIN LEAD	QUAD	S-PQCC-J44	3.63 V	4.7 mm	16.5862 mm	Not Qualified	4194304 bit	2.97 V		e0	.00002 Amp	16.5862 mm	150 ns
M27V800-100K1TR	STMicroelectronics	OTP ROM	COMMERCIAL	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	30 mA	524288 words	COMMON	3.3	3.3	16	CHIP CARRIER	LDCC44,.7SQ	8	OTP ROMs	1.27 mm	70 Cel	3-STATE	512KX16	512K	0 Cel	TIN LEAD	QUAD	S-PQCC-J44	3.63 V	4.7 mm	16.5862 mm	Not Qualified	8388608 bit	2.97 V	CONFIGURABLE AS 512K X 16	e0	.00002 Amp	16.5862 mm	100 ns
M27W400-120K6TR	STMicroelectronics	OTP ROM	INDUSTRIAL	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	20 mA	524288 words	COMMON		3/3.3	8	CHIP CARRIER	LDCC44,.7SQ	16	Other Memory ICs	1.27 mm	85 Cel	3-STATE	512KX8	512K	-40 Cel	TIN LEAD	QUAD	S-PQCC-J44	3.96 V	4.7 mm	16.5862 mm	Not Qualified	4194304 bit	2.43 V		e0	.000015 Amp	16.5862 mm	120 ns
M27W402-150K6TR	STMicroelectronics	OTP ROM	INDUSTRIAL	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	50 mA	262144 words	COMMON	3	3/3.3	16	CHIP CARRIER	LDCC44,.7SQ		OTP ROMs	1.27 mm	85 Cel	3-STATE	256KX16	256K	-40 Cel	Matte Tin (Sn)	QUAD	S-PQCC-J44	3.6 V	4.57 mm	16.586 mm	Not Qualified	4194304 bit	2.7 V		e3	.000015 Amp	16.586 mm	120 ns
M27V160-100K1TR	STMicroelectronics	OTP ROM	COMMERCIAL	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	30 mA	1048576 words	COMMON	3.3	3.3	16	CHIP CARRIER	LDCC44,.7SQ	8	OTP ROMs	1.27 mm	70 Cel	3-STATE	1MX16	1M	0 Cel	MATTE TIN	QUAD	S-PQCC-J44	3.63 V	4.57 mm	16.586 mm	Not Qualified	16777216 bit	2.97 V		e3	.00006 Amp	16.586 mm	100 ns
M27V160-120XK1	STMicroelectronics	OTP ROM	COMMERCIAL	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	30 mA	1048576 words	COMMON	3.3	3.3	16	CHIP CARRIER	LDCC44,.7SQ	8	OTP ROMs	1.27 mm	70 Cel	3-STATE	1MX16	1M	0 Cel	MATTE TIN	QUAD	S-PQCC-J44	3.465 V	4.57 mm	16.586 mm	Not Qualified	16777216 bit	3.135 V		e3	.00006 Amp	16.586 mm	120 ns
M27W160-120M6	STMicroelectronics		INDUSTRIAL	44	SOP	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS	GULL WING			50 mA	1048576 words	COMMON		3/3.3	16	SMALL OUTLINE	SOP44,.63		OTP ROMs	1.27 mm	85 Cel	3-STATE	1MX16	1M	-40 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDSO-G44				Not Qualified	16777216 bit			e0	.00003 Amp		120 ns
M27V402-120K4TR	STMicroelectronics	OTP ROM	OTHER	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	20 mA	262144 words	COMMON	3.3	3.3	16	CHIP CARRIER	LDCC44,.7SQ		Other Memory ICs	1.27 mm	70 Cel	3-STATE	256KX16	256K	-20 Cel	TIN LEAD	QUAD	S-PQCC-J44	3.63 V	4.7 mm	16.585 mm	Not Qualified	4194304 bit	2.97 V		e0	.00002 Amp	16.585 mm	120 ns
M27V160-120K6TR	STMicroelectronics	OTP ROM	INDUSTRIAL	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	30 mA	1048576 words	COMMON	3.3	3.3	16	CHIP CARRIER	LDCC44,.7SQ	8	OTP ROMs	1.27 mm	85 Cel	3-STATE	1MX16	1M	-40 Cel	MATTE TIN	QUAD	S-PQCC-J44	3.63 V	4.57 mm	16.586 mm	Not Qualified	16777216 bit	2.97 V		e3	.00006 Amp	16.586 mm	120 ns
M27V160-110XM1	STMicroelectronics	OTP ROM	COMMERCIAL	44	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	30 mA	2097152 words	COMMON	3.3	3.3	8	SMALL OUTLINE	SOP44,.63	16	OTP ROMs	1.27 mm	70 Cel	3-STATE	2MX8	2M	0 Cel	TIN LEAD	DUAL	R-PDSO-G44	3.465 V	2.62 mm	13.3 mm	Not Qualified	16777216 bit	3.135 V		e0	.00002 Amp	28.2 mm	110 ns
M27V160-120XK1TR	STMicroelectronics	OTP ROM	COMMERCIAL	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	30 mA	1048576 words	COMMON	3.3	3.3	16	CHIP CARRIER	LDCC44,.7SQ	8	OTP ROMs	1.27 mm	70 Cel	3-STATE	1MX16	1M	0 Cel	MATTE TIN	QUAD	S-PQCC-J44	3.465 V	4.57 mm	16.586 mm	Not Qualified	16777216 bit	3.135 V		e3	.00006 Amp	16.586 mm	120 ns
M27V102-90K1	STMicroelectronics	OTP ROM	COMMERCIAL	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	15 mA	65536 words	COMMON	3.3	3.3	16	CHIP CARRIER	LDCC44,.7SQ		OTP ROMs	1.27 mm	70 Cel	3-STATE	64KX16	64K	0 Cel	TIN LEAD	QUAD	S-PQCC-J44	3.63 V	4.7 mm	16.5862 mm	Not Qualified	1048576 bit	2.97 V		e0	.00002 Amp	16.5862 mm	90 ns
M27V102-100K1TR	STMicroelectronics	OTP ROM	COMMERCIAL	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	15 mA	65536 words	COMMON	3.3	3.3	16	CHIP CARRIER	LDCC44,.7SQ		OTP ROMs	1.27 mm	70 Cel	3-STATE	64KX16	64K	0 Cel	TIN LEAD	QUAD	S-PQCC-J44	3.63 V	4.7 mm	16.5862 mm	Not Qualified	1048576 bit	2.97 V		e0	.00002 Amp	16.5862 mm	100 ns
M27W01690M1	STMicroelectronics	OTP ROM	COMMERCIAL	44	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS		1048576 words	COMMON	3.3	3.3	16	SMALL OUTLINE	SOP44,.63		Other Memory ICs	1.27 mm	70 Cel	3-STATE	1MX16	1M	0 Cel	Matte Tin (Sn)	DUAL	R-PDSO-G44	3.6 V	3 mm	12.6 mm	Not Qualified	16777216 bit	3 V		e3	.0001 Amp	28.5 mm	90 ns
M27V160-120XK6TR	STMicroelectronics	OTP ROM	INDUSTRIAL	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	30 mA	1048576 words	COMMON	3.3	3.3	16	CHIP CARRIER	LDCC44,.7SQ	8	OTP ROMs	1.27 mm	85 Cel	3-STATE	1MX16	1M	-40 Cel	MATTE TIN	QUAD	S-PQCC-J44	3.465 V	4.57 mm	16.586 mm	Not Qualified	16777216 bit	3.135 V		e3	.00006 Amp	16.586 mm	120 ns
M27V160-120M6	STMicroelectronics	OTP ROM	INDUSTRIAL	44	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	30 mA	1048576 words	COMMON	3.3	3.3	16	SMALL OUTLINE	SOP44,.63	8	OTP ROMs	1.27 mm	85 Cel	3-STATE	1MX16	1M	-40 Cel	MATTE TIN	DUAL	R-PDSO-G44	3.63 V	2.8 mm	13.3 mm	Not Qualified	16777216 bit	2.97 V		e3	.00006 Amp	28.2 mm	120 ns
M27V800-150K1	STMicroelectronics	OTP ROM	COMMERCIAL	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	30 mA	524288 words	COMMON	3.3	3.3	16	CHIP CARRIER	LDCC44,.7SQ	8	OTP ROMs	1.27 mm	70 Cel	3-STATE	512KX16	512K	0 Cel	TIN LEAD	QUAD	S-PQCC-J44	3.63 V	4.7 mm	16.5862 mm	Not Qualified	8388608 bit	2.97 V	CONFIGURABLE AS 512K X 16	e0	.00002 Amp	16.5862 mm	150 ns
M27V800-120XK1TR	STMicroelectronics	OTP ROM	COMMERCIAL	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	30 mA	524288 words	COMMON	3.3	3.3	16	CHIP CARRIER	LDCC44,.7SQ	8	OTP ROMs	1.27 mm	70 Cel	3-STATE	512KX16	512K	0 Cel	TIN LEAD	QUAD	S-PQCC-J44	3.465 V	4.7 mm	16.5862 mm	Not Qualified	8388608 bit	3.135 V	CONFIGURABLE AS 512K X 16	e0	.00002 Amp	16.5862 mm	120 ns
M27V160-100M1	STMicroelectronics	OTP ROM	COMMERCIAL	44	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	30 mA	1048576 words	COMMON	3.3	3.3	16	SMALL OUTLINE	SOP44,.63	8	OTP ROMs	1.27 mm	70 Cel	3-STATE	1MX16	1M	0 Cel	MATTE TIN	DUAL	R-PDSO-G44	3.63 V	2.8 mm	13.3 mm	Not Qualified	16777216 bit	2.97 V	CONFIGURABLE AS 1M X 16	e3	.00006 Amp	28.2 mm	100 ns
M27W202-200K6	STMicroelectronics	OTP ROM	INDUSTRIAL	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS		131072 words		3.3		16	CHIP CARRIER				1.27 mm	85 Cel		128KX16	128K	-40 Cel		QUAD	S-PQCC-J44	3.6 V	4.7 mm	16.5862 mm	Not Qualified	2097152 bit	2.7 V				16.5862 mm	100 ns
M27W064110M1T	STMicroelectronics	OTP ROM	COMMERCIAL	44	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	20 mA	4194304 words	COMMON	3	3/3.3	16	SMALL OUTLINE	SOP44,.63		OTP ROMs	1.27 mm	70 Cel	3-STATE	4MX16	4M	0 Cel	TIN LEAD	DUAL	R-PDSO-G44	3.6 V	3 mm	12.6 mm	Not Qualified	67108864 bit	2.7 V		e0	.0001 Amp	28.5 mm	110 ns
M27V800-120M1	STMicroelectronics	OTP ROM	COMMERCIAL	44	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	30 mA	524288 words	COMMON	3.3	3.3	16	SMALL OUTLINE	SOP44,.63	8	OTP ROMs	1.27 mm	70 Cel	3-STATE	512KX16	512K	0 Cel	TIN LEAD	DUAL	R-PDSO-G44	3.63 V	2.62 mm	13.3 mm	Not Qualified	8388608 bit	2.97 V		e0	.00002 Amp	28.2 mm	120 ns
M27V160-150XK6TR	STMicroelectronics	OTP ROM	INDUSTRIAL	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	30 mA	1048576 words	COMMON	3.3	3.3	16	CHIP CARRIER	LDCC44,.7SQ	8	OTP ROMs	1.27 mm	85 Cel	3-STATE	1MX16	1M	-40 Cel	MATTE TIN	QUAD	S-PQCC-J44	3.465 V	4.57 mm	16.586 mm	Not Qualified	16777216 bit	3.135 V		e3	.00006 Amp	16.586 mm	150 ns
M27V402200K5	STMicroelectronics	OTP ROM	OTHER	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	20 mA	262144 words	COMMON	3.3	3.3	16	CHIP CARRIER	LDCC44,.7SQ		OTP ROMs	1.27 mm	85 Cel	3-STATE	256KX16	256K	-20 Cel	TIN LEAD	QUAD	S-PQCC-J44	3.63 V	4.7 mm	16.5862 mm	Not Qualified	4194304 bit	2.97 V		e0	.00002 Amp	16.5862 mm	200 ns
M27V800-110M1	STMicroelectronics	OTP ROM	COMMERCIAL	44	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	30 mA	1048576 words	COMMON	3.3	3.3	8	SMALL OUTLINE	SOP44,.63	16	OTP ROMs	1.27 mm	70 Cel	3-STATE	1MX8	1M	0 Cel	TIN LEAD	DUAL	R-PDSO-G44	3.63 V	2.62 mm	13.3 mm	Not Qualified	8388608 bit	2.97 V		e0	.00002 Amp	28.2 mm	110 ns
M27V800-150M1TR	STMicroelectronics	OTP ROM	COMMERCIAL	44	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	30 mA	524288 words	COMMON	3.3	3.3	16	SMALL OUTLINE	SOP44,.63	8	OTP ROMs	1.27 mm	70 Cel	3-STATE	512KX16	512K	0 Cel	TIN LEAD	DUAL	R-PDSO-G44	3.63 V	2.62 mm	13.3 mm	Not Qualified	8388608 bit	2.97 V		e0	.00002 Amp	28.2 mm	150 ns
M27V402-150K1TR	STMicroelectronics	OTP ROM	COMMERCIAL	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	20 mA	262144 words	COMMON	3.3	3.3	16	CHIP CARRIER	LDCC44,.7SQ		Other Memory ICs	1.27 mm	70 Cel	3-STATE	256KX16	256K	0 Cel	TIN LEAD	QUAD	S-PQCC-J44	3.63 V	4.7 mm	16.585 mm	Not Qualified	4194304 bit	2.97 V		e0	.00002 Amp	16.585 mm	150 ns
M27V320-150M1	STMicroelectronics	OTP ROM	COMMERCIAL	44	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	30 mA	2097152 words	COMMON	3.3	3.3	16	SMALL OUTLINE	SOP44,.63	8	OTP ROMs	1.27 mm	70 Cel	3-STATE	2MX16	2M	0 Cel	MATTE TIN	DUAL	R-PDSO-G44	3.63 V	2.8 mm	13.3 mm	Not Qualified	33554432 bit	2.97 V		e3	.00006 Amp	28.2 mm	150 ns

OTP ROM

OTP ROM, or One-Time Programmable Read-Only Memory, is a type of non-volatile computer memory that is programmed once and cannot be reprogrammed. OTP ROM is used to store data that needs to be permanently stored and cannot be changed or updated in the future.

OTP ROM is created using a process similar to that used to manufacture Mask ROM. However, instead of programming the memory during the manufacturing process, OTP ROM is programmed after the manufacturing process, but before it is delivered to the customer. This allows the customer to program the memory with the data that they need to store permanently.

OTP ROM is commonly used in devices such as microcontrollers, smart cards, and other electronic devices that require permanent storage of data. It is ideal for storing critical data, such as system settings, encryption keys, and other sensitive information that needs to be permanently stored and cannot be changed or updated in the future.