6 OTP ROM 29

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Part	Manufacturer	Memory IC Type	Temperature Grade	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Terminal Form	Parallel or Serial	Operating Mode	Maximum Supply Current	No. of Words	Input/Output Type	Nominal Supply Voltage / Vsup (V)	Power Supplies (V)	Memory Width	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Organization	No. of Words Code	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Supply Voltage (Vsup)	Maximum Seated Height	Width	Qualification	Memory Density	Minimum Supply Voltage (Vsup)	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Maximum Standby Current	Length	Maximum Access Time
DS2502P-E48/T&R	Maxim Integrated	OTP ROM	INDUSTRIAL	6	LSOC	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	C BEND	SERIAL	SYNCHRONOUS	.005 mA	1024 words	COMMON		3/5	1	SMALL OUTLINE, LOW PROFILE	SOC6,.17	Other Memory ICs	1.27 mm	85 Cel	1KX1	1K	-40 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDSO-C6		6 V	1.5 mm	3.76 mm	Not Qualified	1024 bit	2.8 V		e0			.000005 Amp	3.94 mm
DS2502P-E48+T&R	Analog Devices	OTP ROM	INDUSTRIAL	6	SOC	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	C BEND	SERIAL	ASYNCHRONOUS	.005 mA	1024 words	COMMON		3/5	1	SMALL OUTLINE	SOC6,.17	Other Memory ICs	1.27 mm	85 Cel	1KX1	1K	-40 Cel	Matte Tin (Sn) - annealed	DUAL	R-PDSO-C6	1	6 V	1.5 mm	3.81 mm	Not Qualified	1024 bit	2.8 V		e3	30	260	.000005 Amp	3.937 mm
DS2502P-E48	Maxim Integrated	OTP ROM	INDUSTRIAL	6	LSOC	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	C BEND	SERIAL	SYNCHRONOUS	.005 mA	1024 words	COMMON		3/5	1	SMALL OUTLINE, LOW PROFILE	SOC6,.17	Other Memory ICs	1.27 mm	85 Cel	1KX1	1K	-40 Cel	Tin/Lead (Sn85Pb15)	DUAL	R-PDSO-C6	1	6 V	1.5 mm	3.76 mm	Not Qualified	1024 bit	2.8 V		e0	20	240	.000005 Amp	3.94 mm
DS2502P-E48+	Analog Devices	OTP ROM	INDUSTRIAL	6	SOC	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	C BEND	SERIAL	ASYNCHRONOUS	.005 mA	1024 words	COMMON		3/5	1	SMALL OUTLINE	SOC6,.17	Other Memory ICs	1.27 mm	85 Cel	1KX1	1K	-40 Cel	Matte Tin (Sn) - annealed	DUAL	R-PDSO-C6	1	6 V	1.5 mm	3.76 mm	Not Qualified	1024 bit	2.8 V		e3	30	260	.000005 Amp	3.94 mm
DS2502P/T&R	Maxim Integrated	OTP ROM	INDUSTRIAL	6	SOC	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	C BEND	SERIAL	ASYNCHRONOUS		128 words	COMMON	5	3/5	8	SMALL OUTLINE	SOC6,.17	Other Memory ICs	1.27 mm	85 Cel	128X8	128	-40 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDSO-C6	1	6 V	1.5 mm	3.76 mm	Not Qualified	1024 bit	2.8 V	MICROLAN COMPATIBLE	e0	20	240		3.94 mm	15000 ns
DS2502P+T&R	Analog Devices	OTP ROM	INDUSTRIAL	6	SOC	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	C BEND	SERIAL	ASYNCHRONOUS		128 words		5		8	SMALL OUTLINE			1.27 mm	85 Cel	128X8	128	-40 Cel	Matte Tin (Sn) - annealed	DUAL	R-PDSO-C6	1	6 V	1.5 mm	3.76 mm	Not Qualified	1024 bit	2.8 V	MICROLAN COMPATIBLE	e3	30	260		3.94 mm
DS2502P	Maxim Integrated	OTP ROM	INDUSTRIAL	6	SOC	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	C BEND	SERIAL	ASYNCHRONOUS		128 words	COMMON	5	3/5	8	SMALL OUTLINE	SOC6,.17	Other Memory ICs	1.27 mm	85 Cel	128X8	128	-40 Cel	Tin/Lead (Sn85Pb15)	DUAL	R-PDSO-C6	1	6 V	1.5 mm	3.76 mm	Not Qualified	1024 bit	2.8 V	MICROLAN COMPATIBLE	e0	20	240		3.94 mm	15000 ns
DS2502P+	Analog Devices	OTP ROM	INDUSTRIAL	6	SOC	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	C BEND	SERIAL	ASYNCHRONOUS		128 words	COMMON	5	3/5	8	SMALL OUTLINE	SOC6,.17	Other Memory ICs	1.27 mm	85 Cel	128X8	128	-40 Cel	Matte Tin (Sn) - annealed	DUAL	R-PDSO-C6	1	6 V	1.5 mm	3.76 mm	Not Qualified	1024 bit	2.8 V	MICROLAN COMPATIBLE	e3	30	260		3.94 mm	15000 ns
DS2502P-E64	Maxim Integrated	OTP ROM	INDUSTRIAL	6		RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	C BEND				1024 words				1					85 Cel	1KX1	1K	-40 Cel	Tin/Lead (Sn85Pb15)	DUAL	R-PDSO-C6	1	6 V			Not Qualified	1024 bit	2.8 V		e0	20	240
DS2502P-E64+	Analog Devices	OTP ROM	INDUSTRIAL	6	LSOC	RECTANGULAR	PLASTIC/EPOXY	YES	1	MOS	C BEND	SERIAL	SYNCHRONOUS		1024 words		5		1	SMALL OUTLINE, LOW PROFILE			1.27 mm	85 Cel	1KX1	1K	-40 Cel	Matte Tin (Sn) - annealed	DUAL	R-PDSO-C6	1	6 V	1.5 mm	3.76 mm	Not Qualified	1024 bit	2.8 V		e3	30	260		3.94 mm
DS2505P/T&R	Maxim Integrated	OTP ROM	INDUSTRIAL	6	SOC	RECTANGULAR	PLASTIC/EPOXY	YES	1	MOS	C BEND	SERIAL	ASYNCHRONOUS		16384 words	COMMON	5	3/5	1	SMALL OUTLINE	SOC6,.17	Other Memory ICs	1.27 mm	85 Cel	16KX1	16K	-40 Cel	TIN LEAD	DUAL	R-PDSO-C6	1	6 V	1.5 mm	3.76 mm	Not Qualified	16384 bit	2.8 V	MICROLAN COMPATIBLE	e0				3.94 mm	15000 ns
DS2505P+T&R	Analog Devices	OTP ROM	INDUSTRIAL	6	SOC	RECTANGULAR	PLASTIC/EPOXY	YES	1	MOS	C BEND	SERIAL	ASYNCHRONOUS		16384 words	COMMON	5	3/5	1	SMALL OUTLINE	SOC6,.17	Other Memory ICs	1.27 mm	85 Cel	16KX1	16K	-40 Cel	Matte Tin (Sn) - annealed	DUAL	R-PDSO-C6	1	6 V	1.5 mm	3.76 mm	Not Qualified	16384 bit	2.8 V	MICROLAN COMPATIBLE	e3	30	260		3.94 mm	15000 ns
DS2406P/T&R	Maxim Integrated	OTP ROM	INDUSTRIAL	6	SOC	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	C BEND	SERIAL	ASYNCHRONOUS		1024 words		3	3/5	1	SMALL OUTLINE	SOC6,.17	SRAMs	1.27 mm	85 Cel	1KX1	1K	-40 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDSO-C6	1	6 V	1.5 mm	3.76 mm	Not Qualified	1024 bit	2.8 V		e0	20	240		3.94 mm
DS2406P+T&R	Analog Devices	OTP ROM	INDUSTRIAL	6	SOC	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	C BEND	SERIAL	ASYNCHRONOUS		1024 words		4	3/5	1	SMALL OUTLINE	SOC6,.17	SRAMs	1.27 mm	85 Cel	1KX1	1K	-40 Cel	Matte Tin (Sn) - annealed	DUAL	R-PDSO-C6	1	6 V	1.5 mm	3.76 mm	Not Qualified	1024 bit	2.8 V		e3	30	260		3.94 mm
DS2505P	Maxim Integrated	OTP ROM	INDUSTRIAL	6	SOC	RECTANGULAR	PLASTIC/EPOXY	YES	1	MOS	C BEND	SERIAL	ASYNCHRONOUS		16384 words	COMMON	5	3/5	1	SMALL OUTLINE	SOC6,.17	Other Memory ICs	1.27 mm	85 Cel	16KX1	16K	-40 Cel	TIN LEAD	DUAL	R-PDSO-C6	1	6 V	1.5 mm	3.76 mm	Not Qualified	16384 bit	2.8 V	MICROLAN COMPATIBLE	e0		245		3.94 mm	15000 ns
DS2505P+	Analog Devices	OTP ROM	INDUSTRIAL	6	SOC	RECTANGULAR	PLASTIC/EPOXY	YES	1	MOS	C BEND	SERIAL	ASYNCHRONOUS		16384 words	COMMON	5	3/5	1	SMALL OUTLINE	SOC6,.17	Other Memory ICs	1.27 mm	85 Cel	16KX1	16K	-40 Cel	Matte Tin (Sn) - annealed	DUAL	R-PDSO-C6	1	6 V	1.5 mm	3.76 mm	Not Qualified	16384 bit	2.8 V	MICROLAN COMPATIBLE	e3	30	260		3.94 mm	15000 ns
DS2406P	Maxim Integrated	OTP ROM	INDUSTRIAL	6	SOC	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	C BEND	SERIAL	ASYNCHRONOUS		1024 words		3	3/5	1	SMALL OUTLINE	SOC6,.17	SRAMs	1.27 mm	85 Cel	1KX1	1K	-40 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDSO-C6	1	6 V	1.5 mm	3.76 mm	Not Qualified	1024 bit	2.8 V		e0	20	240		3.94 mm
DS2406P+	Analog Devices	OTP ROM	INDUSTRIAL	6	SOC	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	C BEND	SERIAL	ASYNCHRONOUS		1024 words		4	3/5	1	SMALL OUTLINE	SOC6,.17	SRAMs	1.27 mm	85 Cel	1KX1	1K	-40 Cel	Matte Tin (Sn) - annealed	DUAL	R-PDSO-C6	1	6 V	1.5 mm	3.76 mm	Not Qualified	1024 bit	2.8 V		e3	30	260		3.94 mm
DS2502PU-1176+	Analog Devices	OTP ROM		6		RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	C BEND				1024 words				1					85 Cel	1KX1	1K	-40 Cel		DUAL	R-PDSO-C6		6 V				1024 bit	2.8 V
DS2506P-UNW	Analog Devices	OTP ROM	INDUSTRIAL	6	LSOC	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	C BEND	SERIAL	SYNCHRONOUS		8192 words				8	SMALL OUTLINE, LOW PROFILE			1.27 mm	85 Cel	8KX8	8K	-40 Cel	TIN LEAD	DUAL	R-PDSO-C6		6 V	1.5 mm	3.76 mm	Not Qualified	65536 bit	2.8 V	MICROLAN COMPATIBLE	e0				3.94 mm
DS2505PV	Maxim Integrated	OTP ROM	INDUSTRIAL	6	LSOC	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	C BEND	SERIAL	SYNCHRONOUS		2048 words				8	SMALL OUTLINE, LOW PROFILE			1.27 mm	85 Cel	2KX8	2K	-40 Cel	TIN LEAD	DUAL	R-PDSO-C6		6 V	1.5 mm	3.76 mm	Not Qualified	16384 bit	2.8 V		e0				3.94 mm
DS2502C-UNW	Maxim Integrated	OTP ROM	INDUSTRIAL	6	LSOC	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	C BEND	SERIAL	ASYNCHRONOUS		128 words		5		8	SMALL OUTLINE, LOW PROFILE			1.27 mm	85 Cel	128X8	128	-40 Cel	TIN LEAD	DUAL	R-PDSO-C6		6 V	1.5 mm	3.76 mm	Not Qualified	1024 bit	2.8 V	MICROLAN COMPATIBLE	e0				3.94 mm
DS2505V	Maxim Integrated	OTP ROM	INDUSTRIAL	6	LSOC	RECTANGULAR	PLASTIC/EPOXY	YES	1	MOS	C BEND	SERIAL	ASYNCHRONOUS		16384 words		5		1	SMALL OUTLINE, LOW PROFILE			1.27 mm	85 Cel	16KX1	16K	-40 Cel	TIN LEAD	DUAL	R-PDSO-C6		6 V	1.5 mm	3.76 mm	Not Qualified	16384 bit	2.8 V	MICROLAN COMPATIBLE	e0				3.94 mm
DS2502PV	Maxim Integrated	OTP ROM	INDUSTRIAL	6	LSOC	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	C BEND	SERIAL	ASYNCHRONOUS		1024 words				1	SMALL OUTLINE, LOW PROFILE			1.27 mm	85 Cel	1KX1	1K	-40 Cel	TIN LEAD	DUAL	R-PDSO-C6		6 V	1.5 mm	3.76 mm	Not Qualified	1024 bit	2.8 V		e0				3.94 mm
DS2406V	Maxim Integrated	OTP ROM	INDUSTRIAL	6	LSOC	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	C BEND	SERIAL	ASYNCHRONOUS		1024 words		3	3/5	1	SMALL OUTLINE, LOW PROFILE	SOC6,.17	SRAMs	1.27 mm	85 Cel	1KX1	1K	-40 Cel	TIN LEAD	DUAL	R-PDSO-C6		6 V	1.5 mm	3.76 mm	Not Qualified	1024 bit	2.8 V		e0				3.94 mm
DS2406X	Maxim Integrated	OTP ROM	INDUSTRIAL	6	VBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	BALL	SERIAL	ASYNCHRONOUS		1024 words		3	3/5	1	GRID ARRAY, VERY THIN PROFILE	FLIP CHIP	SRAMs	1.2 mm	85 Cel	1KX1	1K	-40 Cel	TIN LEAD	BOTTOM	R-PBGA-B6		6 V	.864 mm	1.91 mm	Not Qualified	1024 bit	2.8 V		e0				2.85 mm
DS2502P-UNW	Maxim Integrated	OTP ROM	INDUSTRIAL	6	LSOC	RECTANGULAR	PLASTIC/EPOXY	YES	1	MOS	C BEND	SERIAL	SYNCHRONOUS		128 words	COMMON	5	3/5	8	SMALL OUTLINE, LOW PROFILE	SOC6,.17	Other Memory ICs	1.27 mm	85 Cel	128X8	128	-40 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDSO-C6		6 V	1.5 mm	3.76 mm	Not Qualified	1024 bit	2.8 V	MICROLAN COMPATIBLE	e0				3.94 mm
DS2505P-UNW	Maxim Integrated	OTP ROM	INDUSTRIAL	6	LSOC	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	C BEND	SERIAL	SYNCHRONOUS		2048 words	COMMON		3/5	8	SMALL OUTLINE, LOW PROFILE	SOC6,.17	Other Memory ICs	1.27 mm	85 Cel	2KX8	2K	-40 Cel		DUAL	R-PDSO-C6	1	6 V	1.5 mm	3.76 mm	Not Qualified	16384 bit	2.8 V	MICROLAN COMPATIBLE					3.94 mm
DS2502V	Maxim Integrated	OTP ROM	INDUSTRIAL	6	LSOC	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	C BEND	SERIAL	ASYNCHRONOUS		128 words	COMMON	5	3/5	8	SMALL OUTLINE, LOW PROFILE	SOC6,.17	Other Memory ICs	1.27 mm	85 Cel	128X8	128	-40 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDSO-C6		6 V	1.5 mm	3.76 mm	Not Qualified	1024 bit	2.8 V	MICROLAN COMPATIBLE	e0				3.94 mm	15000 ns

OTP ROM

OTP ROM, or One-Time Programmable Read-Only Memory, is a type of non-volatile computer memory that is programmed once and cannot be reprogrammed. OTP ROM is used to store data that needs to be permanently stored and cannot be changed or updated in the future.

OTP ROM is created using a process similar to that used to manufacture Mask ROM. However, instead of programming the memory during the manufacturing process, OTP ROM is programmed after the manufacturing process, but before it is delivered to the customer. This allows the customer to program the memory with the data that they need to store permanently.

OTP ROM is commonly used in devices such as microcontrollers, smart cards, and other electronic devices that require permanent storage of data. It is ideal for storing critical data, such as system settings, encryption keys, and other sensitive information that needs to be permanently stored and cannot be changed or updated in the future.