Part | RoHS | Manufacturer | Memory IC Type | Temperature Grade | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Surface Mount | No. of Functions | Technology | Screening Level | Nominal Negative Supply Voltage | Terminal Form | Parallel or Serial | Operating Mode | Maximum Supply Current | No. of Words | Input/Output Type | Nominal Supply Voltage / Vsup (V) | Power Supplies (V) | Memory Width | Package Style (Meter) | Package Equivalence Code | Alternate Memory Width | Sub-Category | Minimum Data Retention Time | Terminal Pitch | Maximum Operating Temperature | Reverse Pinout | Output Characteristics | Organization | No. of Words Code | Minimum Operating Temperature | Terminal Finish | Terminal Position | No. of Ports | Write Protection | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Endurance | Maximum Clock Frequency (fCLK) | Width | Qualification | Memory Density | Minimum Supply Voltage (Vsup) | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Maximum Standby Current | Length | Maximum Access Time | Programming Voltage (V) |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Renesas Electronics |
OTP ROM |
MILITARY |
28 |
DFP |
RECTANGULAR |
300k Rad(Si) |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
CMOS |
MIL-PRF-38535 Class V |
FLAT |
PARALLEL |
ASYNCHRONOUS |
8192 words |
5 |
8 |
FLATPACK |
1.27 mm |
125 Cel |
8KX8 |
8K |
-55 Cel |
GOLD |
DUAL |
R-CDFP-F28 |
5.5 V |
2.92 mm |
12.445 mm |
Not Qualified |
65536 bit |
4.5 V |
e4 |
|||||||||||||||||||||||
Texas Instruments |
OTP ROM |
MILITARY |
16 |
DFP |
RECTANGULAR |
CERAMIC |
YES |
TTL |
38535Q/M;38534H;883B |
FLAT |
110 mA |
32 words |
5 |
5 |
8 |
FLATPACK |
FL16,.3 |
OTP ROMs |
1.27 mm |
125 Cel |
32X8 |
32 |
-55 Cel |
DUAL |
R-XDFP-F16 |
Not Qualified |
50 ns |
||||||||||||||||||||||||||||||
Texas Instruments |
OTP ROM |
MILITARY |
24 |
DFP |
RECTANGULAR |
CERAMIC |
YES |
TTL |
MIL-STD-883 Class B (Modified) |
FLAT |
155 mA |
512 words |
8 |
FLATPACK |
FL24,.4 |
OTP ROMs |
1.27 mm |
125 Cel |
512X8 |
512 |
-55 Cel |
DUAL |
R-XDFP-F24 |
Not Qualified |
4096 bit |
85 ns |
|||||||||||||||||||||||||||||||
Texas Instruments |
OTP ROM |
MILITARY |
16 |
DFP |
RECTANGULAR |
CERAMIC |
YES |
TTL |
FLAT |
110 mA |
32 words |
5 |
5 |
8 |
FLATPACK |
FL16,.3 |
OTP ROMs |
1.27 mm |
125 Cel |
32X8 |
32 |
-55 Cel |
DUAL |
R-XDFP-F16 |
Not Qualified |
50 ns |
|||||||||||||||||||||||||||||||
Texas Instruments |
OTP ROM |
MILITARY |
24 |
DFP |
RECTANGULAR |
CERAMIC |
YES |
TTL |
38535Q/M;38534H;883B |
FLAT |
64 words |
8 |
FLATPACK |
FL24,.4 |
OTP ROMs |
1.27 mm |
125 Cel |
64X8 |
64 |
-55 Cel |
DUAL |
R-XDFP-F24 |
Not Qualified |
||||||||||||||||||||||||||||||||||
Texas Instruments |
OTP ROM |
MILITARY |
16 |
DFP |
RECTANGULAR |
CERAMIC |
YES |
TTL |
MIL-STD-883 Class B (Modified) |
FLAT |
110 mA |
32 words |
5 |
5 |
8 |
FLATPACK |
FL16,.3 |
OTP ROMs |
1.27 mm |
125 Cel |
32X8 |
32 |
-55 Cel |
DUAL |
R-XDFP-F16 |
Not Qualified |
50 ns |
||||||||||||||||||||||||||||||
Texas Instruments |
OTP ROM |
MILITARY |
24 |
DFP |
RECTANGULAR |
CERAMIC |
YES |
TTL |
FLAT |
120 mA |
64 words |
8 |
FLATPACK |
FL24,.4 |
OTP ROMs |
1.27 mm |
125 Cel |
64X8 |
64 |
-55 Cel |
DUAL |
R-XDFP-F24 |
Not Qualified |
75 ns |
|||||||||||||||||||||||||||||||||
Texas Instruments |
OTP ROM |
MILITARY |
24 |
DFP |
RECTANGULAR |
CERAMIC |
YES |
TTL |
38535Q/M;38534H;883B |
FLAT |
155 mA |
512 words |
5 |
5 |
8 |
FLATPACK |
FL24,.4 |
OTP ROMs |
1.27 mm |
125 Cel |
512X8 |
512 |
-55 Cel |
DUAL |
R-XDFP-F24 |
Not Qualified |
4096 bit |
85 ns |
|||||||||||||||||||||||||||||
Texas Instruments |
OTP ROM |
MILITARY |
16 |
DFP |
RECTANGULAR |
CERAMIC |
YES |
TTL |
FLAT |
110 mA |
32 words |
5 |
5 |
8 |
FLATPACK |
FL16,.3 |
OTP ROMs |
1.27 mm |
125 Cel |
32X8 |
32 |
-55 Cel |
DUAL |
R-XDFP-F16 |
Not Qualified |
50 ns |
|||||||||||||||||||||||||||||||
Texas Instruments |
OTP ROM |
MILITARY |
16 |
DFP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
YES |
1 |
CMOS |
FLAT |
PARALLEL |
ASYNCHRONOUS |
110 mA |
32 words |
5 |
5 |
8 |
FLATPACK |
FL16,.3 |
OTP ROMs |
1.27 mm |
125 Cel |
32X8 |
32 |
-55 Cel |
DUAL |
R-GDFP-F16 |
5.5 V |
2.03 mm |
6.73 mm |
Not Qualified |
256 bit |
4.5 V |
NOT SPECIFIED |
NOT SPECIFIED |
10.16 mm |
50 ns |
||||||||||||||||||||
Texas Instruments |
OTP ROM |
MILITARY |
24 |
DFP |
RECTANGULAR |
CERAMIC |
YES |
TTL |
38535Q/M;38534H;883B |
FLAT |
155 mA |
512 words |
8 |
FLATPACK |
FL24,.4 |
OTP ROMs |
1.27 mm |
125 Cel |
512X8 |
512 |
-55 Cel |
DUAL |
R-XDFP-F24 |
Not Qualified |
4096 bit |
85 ns |
|||||||||||||||||||||||||||||||
Texas Instruments |
OTP ROM |
MILITARY |
24 |
DFP |
RECTANGULAR |
CERAMIC |
YES |
TTL |
MIL-STD-883 Class B (Modified) |
FLAT |
155 mA |
512 words |
5 |
5 |
8 |
FLATPACK |
FL24,.4 |
OTP ROMs |
1.27 mm |
125 Cel |
512X8 |
512 |
-55 Cel |
DUAL |
R-XDFP-F24 |
Not Qualified |
4096 bit |
85 ns |
|||||||||||||||||||||||||||||
Texas Instruments |
OTP ROM |
MILITARY |
24 |
DFP |
RECTANGULAR |
CERAMIC |
YES |
TTL |
FLAT |
155 mA |
512 words |
5 |
5 |
8 |
FLATPACK |
FL24,.4 |
OTP ROMs |
1.27 mm |
125 Cel |
512X8 |
512 |
-55 Cel |
DUAL |
R-XDFP-F24 |
Not Qualified |
4096 bit |
85 ns |
||||||||||||||||||||||||||||||
Texas Instruments |
OTP ROM |
MILITARY |
24 |
DFP |
RECTANGULAR |
CERAMIC |
YES |
TTL |
FLAT |
155 mA |
512 words |
8 |
FLATPACK |
FL24,.4 |
OTP ROMs |
1.27 mm |
125 Cel |
512X8 |
512 |
-55 Cel |
DUAL |
R-XDFP-F24 |
Not Qualified |
4096 bit |
85 ns |
||||||||||||||||||||||||||||||||
Texas Instruments |
OTP ROM |
MILITARY |
24 |
DFP |
RECTANGULAR |
CERAMIC |
YES |
TTL |
MIL-STD-883 Class B (Modified) |
FLAT |
64 words |
8 |
FLATPACK |
FL24,.4 |
OTP ROMs |
1.27 mm |
125 Cel |
64X8 |
64 |
-55 Cel |
DUAL |
R-XDFP-F24 |
Not Qualified |
||||||||||||||||||||||||||||||||||
NXP Semiconductors |
OTP ROM |
MILITARY |
24 |
DFP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
BIPOLAR |
FLAT |
PARALLEL |
ASYNCHRONOUS |
1024 words |
5 |
8 |
FLATPACK |
1.27 mm |
125 Cel |
3-STATE |
1KX8 |
1K |
-55 Cel |
DUAL |
R-CDFP-F24 |
5.5 V |
2.286 mm |
9.144 mm |
Not Qualified |
8192 bit |
4.5 V |
55 ns |
||||||||||||||||||||||||||
NXP Semiconductors |
OTP ROM |
MILITARY |
16 |
DFP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
BIPOLAR |
FLAT |
PARALLEL |
ASYNCHRONOUS |
512 words |
5 |
4 |
FLATPACK |
1.27 mm |
125 Cel |
OPEN-COLLECTOR |
512X4 |
512 |
-55 Cel |
DUAL |
R-CDFP-F16 |
5.5 V |
2.159 mm |
6.731 mm |
Not Qualified |
2048 bit |
4.5 V |
35 ns |
||||||||||||||||||||||||||
NXP Semiconductors |
OTP ROM |
MILITARY |
16 |
DFP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
BIPOLAR |
FLAT |
PARALLEL |
ASYNCHRONOUS |
32 words |
5 |
8 |
FLATPACK |
1.27 mm |
125 Cel |
3-STATE |
32X8 |
32 |
-55 Cel |
DUAL |
R-CDFP-F16 |
5.5 V |
2.159 mm |
6.731 mm |
Not Qualified |
256 bit |
4.5 V |
30 ns |
||||||||||||||||||||||||||
NXP Semiconductors |
OTP ROM |
MILITARY |
24 |
DFP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
BIPOLAR |
FLAT |
PARALLEL |
ASYNCHRONOUS |
512 words |
5 |
8 |
FLATPACK |
1.27 mm |
125 Cel |
3-STATE |
512X8 |
512 |
-55 Cel |
DUAL |
R-CDFP-F24 |
5.5 V |
2.286 mm |
9.144 mm |
Not Qualified |
4096 bit |
4.5 V |
90 ns |
||||||||||||||||||||||||||
NXP Semiconductors |
OTP ROM |
MILITARY |
16 |
DFP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
BIPOLAR |
FLAT |
PARALLEL |
ASYNCHRONOUS |
512 words |
5 |
4 |
FLATPACK |
1.27 mm |
125 Cel |
3-STATE |
512X4 |
512 |
-55 Cel |
DUAL |
R-CDFP-F16 |
5.5 V |
2.159 mm |
6.731 mm |
Not Qualified |
2048 bit |
4.5 V |
35 ns |
||||||||||||||||||||||||||
NXP Semiconductors |
OTP ROM |
MILITARY |
16 |
DFP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
BIPOLAR |
FLAT |
PARALLEL |
ASYNCHRONOUS |
32 words |
5 |
8 |
FLATPACK |
1.27 mm |
125 Cel |
OPEN-COLLECTOR |
32X8 |
32 |
-55 Cel |
DUAL |
R-CDFP-F16 |
5.5 V |
2.159 mm |
6.731 mm |
Not Qualified |
256 bit |
4.5 V |
50 ns |
||||||||||||||||||||||||||
NXP Semiconductors |
OTP ROM |
MILITARY |
24 |
DFP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
BIPOLAR |
FLAT |
PARALLEL |
ASYNCHRONOUS |
1024 words |
5 |
8 |
FLATPACK |
1.27 mm |
125 Cel |
3-STATE |
1KX8 |
1K |
-55 Cel |
DUAL |
R-CDFP-F24 |
5.5 V |
2.286 mm |
9.144 mm |
Not Qualified |
8192 bit |
4.5 V |
90 ns |
||||||||||||||||||||||||||
NXP Semiconductors |
OTP ROM |
MILITARY |
16 |
DFP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
BIPOLAR |
FLAT |
PARALLEL |
ASYNCHRONOUS |
32 words |
5 |
8 |
FLATPACK |
1.27 mm |
125 Cel |
3-STATE |
32X8 |
32 |
-55 Cel |
DUAL |
R-CDFP-F16 |
5.5 V |
2.159 mm |
6.731 mm |
Not Qualified |
256 bit |
4.5 V |
50 ns |
||||||||||||||||||||||||||
NXP Semiconductors |
OTP ROM |
MILITARY |
16 |
DFP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
BIPOLAR |
FLAT |
PARALLEL |
ASYNCHRONOUS |
256 words |
5 |
4 |
FLATPACK |
1.27 mm |
125 Cel |
OPEN-COLLECTOR |
256X4 |
256 |
-55 Cel |
DUAL |
R-CDFP-F16 |
5.5 V |
2.159 mm |
6.731 mm |
Not Qualified |
1024 bit |
4.5 V |
60 ns |
||||||||||||||||||||||||||
NXP Semiconductors |
OTP ROM |
MILITARY |
24 |
DFP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
YES |
1 |
BIPOLAR |
MIL-STD-883 |
FLAT |
PARALLEL |
ASYNCHRONOUS |
4096 words |
5 |
8 |
FLATPACK |
125 Cel |
4KX8 |
4K |
-55 Cel |
DUAL |
R-GDFP-F24 |
5.5 V |
Not Qualified |
32768 bit |
4.5 V |
70 ns |
|||||||||||||||||||||||||||||
NXP Semiconductors |
OTP ROM |
MILITARY |
16 |
DFP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
BIPOLAR |
FLAT |
PARALLEL |
ASYNCHRONOUS |
512 words |
5 |
4 |
FLATPACK |
1.27 mm |
125 Cel |
3-STATE |
512X4 |
512 |
-55 Cel |
DUAL |
R-CDFP-F16 |
5.5 V |
2.159 mm |
6.731 mm |
Not Qualified |
2048 bit |
4.5 V |
60 ns |
||||||||||||||||||||||||||
NXP Semiconductors |
OTP ROM |
MILITARY |
16 |
DFP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
BIPOLAR |
FLAT |
PARALLEL |
ASYNCHRONOUS |
32 words |
5 |
8 |
FLATPACK |
1.27 mm |
125 Cel |
OPEN-COLLECTOR |
32X8 |
32 |
-55 Cel |
DUAL |
R-CDFP-F16 |
5.5 V |
2.159 mm |
6.731 mm |
Not Qualified |
256 bit |
4.5 V |
35 ns |
||||||||||||||||||||||||||
NXP Semiconductors |
OTP ROM |
MILITARY |
24 |
DFP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
YES |
1 |
BIPOLAR |
FLAT |
PARALLEL |
ASYNCHRONOUS |
4096 words |
5 |
8 |
FLATPACK |
125 Cel |
4KX8 |
4K |
-55 Cel |
DUAL |
R-GDFP-F24 |
5.5 V |
Not Qualified |
32768 bit |
4.5 V |
55 ns |
||||||||||||||||||||||||||||||
NXP Semiconductors |
OTP ROM |
MILITARY |
24 |
DFP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
BIPOLAR |
FLAT |
PARALLEL |
ASYNCHRONOUS |
2048 words |
5 |
8 |
FLATPACK |
1.27 mm |
125 Cel |
3-STATE |
2KX8 |
2K |
-55 Cel |
DUAL |
R-CDFP-F24 |
5.5 V |
2.286 mm |
9.144 mm |
Not Qualified |
16384 bit |
4.5 V |
55 ns |
||||||||||||||||||||||||||
NXP Semiconductors |
OTP ROM |
MILITARY |
24 |
DFP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
YES |
1 |
CMOS |
MIL-STD-883 |
FLAT |
PARALLEL |
ASYNCHRONOUS |
4096 words |
5 |
8 |
FLATPACK |
125 Cel |
4KX8 |
4K |
-55 Cel |
DUAL |
R-GDFP-F24 |
5.5 V |
32768 bit |
4.5 V |
70 ns |
||||||||||||||||||||||||||||||
NXP Semiconductors |
OTP ROM |
MILITARY |
18 |
DFP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
BIPOLAR |
FLAT |
PARALLEL |
ASYNCHRONOUS |
2048 words |
5 |
4 |
FLATPACK |
125 Cel |
3-STATE |
2KX4 |
2K |
-55 Cel |
DUAL |
R-CDFP-F18 |
5.5 V |
Not Qualified |
8192 bit |
4.5 V |
55 ns |
|||||||||||||||||||||||||||||
NXP Semiconductors |
OTP ROM |
MILITARY |
24 |
DFP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
YES |
1 |
BIPOLAR |
MIL-STD-883 |
FLAT |
PARALLEL |
ASYNCHRONOUS |
4096 words |
5 |
8 |
FLATPACK |
125 Cel |
4KX8 |
4K |
-55 Cel |
DUAL |
R-GDFP-F24 |
5.5 V |
Not Qualified |
32768 bit |
4.5 V |
55 ns |
|||||||||||||||||||||||||||||
NXP Semiconductors |
OTP ROM |
MILITARY |
24 |
DFP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
YES |
1 |
BIPOLAR |
MIL-STD-883 |
FLAT |
PARALLEL |
ASYNCHRONOUS |
190 mA |
4096 words |
5 |
5 |
8 |
FLATPACK |
FL24,.4 |
OTP ROMs |
1.27 mm |
125 Cel |
4KX8 |
4K |
-55 Cel |
DUAL |
R-GDFP-F24 |
5.5 V |
Not Qualified |
32768 bit |
4.5 V |
45 ns |
||||||||||||||||||||||||
NXP Semiconductors |
OTP ROM |
MILITARY |
24 |
DFP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
BIPOLAR |
FLAT |
PARALLEL |
ASYNCHRONOUS |
4096 words |
5 |
8 |
FLATPACK |
1.27 mm |
125 Cel |
3-STATE |
4KX8 |
4K |
-55 Cel |
DUAL |
R-CDFP-F24 |
5.5 V |
2.286 mm |
9.144 mm |
Not Qualified |
32768 bit |
4.5 V |
30 ns |
||||||||||||||||||||||||||
NXP Semiconductors |
OTP ROM |
MILITARY |
16 |
DFP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
BIPOLAR |
FLAT |
PARALLEL |
ASYNCHRONOUS |
256 words |
5 |
4 |
FLATPACK |
1.27 mm |
125 Cel |
3-STATE |
256X4 |
256 |
-55 Cel |
DUAL |
R-CDFP-F16 |
5.5 V |
2.159 mm |
6.731 mm |
Not Qualified |
1024 bit |
4.5 V |
60 ns |
||||||||||||||||||||||||||
NXP Semiconductors |
OTP ROM |
MILITARY |
24 |
DFP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
YES |
1 |
BIPOLAR |
MIL-STD-883 |
FLAT |
PARALLEL |
ASYNCHRONOUS |
4096 words |
5 |
8 |
FLATPACK |
125 Cel |
4KX8 |
4K |
-55 Cel |
DUAL |
R-GDFP-F24 |
5.5 V |
Not Qualified |
32768 bit |
4.5 V |
95 ns |
|||||||||||||||||||||||||||||
NXP Semiconductors |
OTP ROM |
MILITARY |
16 |
DFP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
BIPOLAR |
FLAT |
PARALLEL |
ASYNCHRONOUS |
256 words |
5 |
4 |
FLATPACK |
1.27 mm |
125 Cel |
3-STATE |
256X4 |
256 |
-55 Cel |
DUAL |
R-CDFP-F16 |
5.5 V |
2.159 mm |
6.731 mm |
Not Qualified |
1024 bit |
4.5 V |
35 ns |
||||||||||||||||||||||||||
NXP Semiconductors |
OTP ROM |
MILITARY |
16 |
DFP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
BIPOLAR |
FLAT |
PARALLEL |
ASYNCHRONOUS |
512 words |
5 |
4 |
FLATPACK |
1.27 mm |
125 Cel |
OPEN-COLLECTOR |
512X4 |
512 |
-55 Cel |
DUAL |
R-CDFP-F16 |
5.5 V |
2.159 mm |
6.731 mm |
Not Qualified |
2048 bit |
4.5 V |
60 ns |
||||||||||||||||||||||||||
NXP Semiconductors |
OTP ROM |
MILITARY |
18 |
DFP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
BIPOLAR |
FLAT |
PARALLEL |
ASYNCHRONOUS |
2048 words |
5 |
4 |
FLATPACK |
125 Cel |
3-STATE |
2KX4 |
2K |
-55 Cel |
DUAL |
R-CDFP-F18 |
5.5 V |
Not Qualified |
8192 bit |
4.5 V |
90 ns |
|||||||||||||||||||||||||||||
NXP Semiconductors |
OTP ROM |
MILITARY |
24 |
DFP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
BIPOLAR |
FLAT |
PARALLEL |
ASYNCHRONOUS |
2048 words |
5 |
8 |
FLATPACK |
1.27 mm |
125 Cel |
3-STATE |
2KX8 |
2K |
-55 Cel |
DUAL |
R-CDFP-F24 |
5.5 V |
2.286 mm |
9.144 mm |
Not Qualified |
16384 bit |
4.5 V |
100 ns |
||||||||||||||||||||||||||
NXP Semiconductors |
OTP ROM |
MILITARY |
16 |
DFP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
BIPOLAR |
FLAT |
PARALLEL |
ASYNCHRONOUS |
256 words |
5 |
4 |
FLATPACK |
1.27 mm |
125 Cel |
OPEN-COLLECTOR |
256X4 |
256 |
-55 Cel |
DUAL |
R-CDFP-F16 |
5.5 V |
2.159 mm |
6.731 mm |
Not Qualified |
1024 bit |
4.5 V |
35 ns |
||||||||||||||||||||||||||
NXP Semiconductors |
OTP ROM |
MILITARY |
16 |
DFP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
BIPOLAR |
FLAT |
PARALLEL |
ASYNCHRONOUS |
32 words |
5 |
8 |
FLATPACK |
1.27 mm |
125 Cel |
3-STATE |
32X8 |
32 |
-55 Cel |
DUAL |
R-CDFP-F16 |
5.5 V |
2.159 mm |
6.731 mm |
Not Qualified |
256 bit |
4.5 V |
35 ns |
||||||||||||||||||||||||||
NXP Semiconductors |
OTP ROM |
MILITARY |
24 |
DFP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
CMOS |
FLAT |
PARALLEL |
ASYNCHRONOUS |
512 words |
5 |
8 |
FLATPACK |
125 Cel |
512X8 |
512 |
-55 Cel |
DUAL |
R-CDFP-F24 |
5.5 V |
Not Qualified |
4096 bit |
4.5 V |
90 ns |
||||||||||||||||||||||||||||||
NXP Semiconductors |
OTP ROM |
MILITARY |
24 |
DFP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
BIPOLAR |
FLAT |
PARALLEL |
ASYNCHRONOUS |
512 words |
5 |
8 |
FLATPACK |
1.27 mm |
125 Cel |
3-STATE |
512X8 |
512 |
-55 Cel |
DUAL |
R-CDFP-F24 |
5.5 V |
2.286 mm |
9.144 mm |
Not Qualified |
4096 bit |
4.5 V |
90 ns |
||||||||||||||||||||||||||
NXP Semiconductors |
OTP ROM |
MILITARY |
18 |
DFP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
BIPOLAR |
FLAT |
PARALLEL |
ASYNCHRONOUS |
2048 words |
5 |
4 |
FLATPACK |
125 Cel |
3-STATE |
2KX4 |
2K |
-55 Cel |
DUAL |
R-CDFP-F18 |
5.5 V |
Not Qualified |
8192 bit |
4.5 V |
115 ns |
|||||||||||||||||||||||||||||
NXP Semiconductors |
OTP ROM |
MILITARY |
16 |
DFP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
BIPOLAR |
FLAT |
PARALLEL |
ASYNCHRONOUS |
32 words |
5 |
8 |
FLATPACK |
1.27 mm |
125 Cel |
OPEN-COLLECTOR |
32X8 |
32 |
-55 Cel |
DUAL |
R-CDFP-F16 |
5.5 V |
2.159 mm |
6.731 mm |
Not Qualified |
256 bit |
4.5 V |
30 ns |
||||||||||||||||||||||||||
NXP Semiconductors |
OTP ROM |
MILITARY |
18 |
DFP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
BIPOLAR |
FLAT |
PARALLEL |
ASYNCHRONOUS |
1024 words |
5 |
4 |
FLATPACK |
125 Cel |
3-STATE |
1KX4 |
1K |
-55 Cel |
DUAL |
R-CDFP-F18 |
5.5 V |
Not Qualified |
4096 bit |
4.5 V |
70 ns |
|||||||||||||||||||||||||||||
NXP Semiconductors |
OTP ROM |
MILITARY |
18 |
DFP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
BIPOLAR |
FLAT |
PARALLEL |
ASYNCHRONOUS |
1024 words |
5 |
4 |
FLATPACK |
125 Cel |
3-STATE |
1KX4 |
1K |
-55 Cel |
DUAL |
R-CDFP-F18 |
5.5 V |
Not Qualified |
4096 bit |
4.5 V |
55 ns |
OTP ROM, or One-Time Programmable Read-Only Memory, is a type of non-volatile computer memory that is programmed once and cannot be reprogrammed. OTP ROM is used to store data that needs to be permanently stored and cannot be changed or updated in the future.
OTP ROM is created using a process similar to that used to manufacture Mask ROM. However, instead of programming the memory during the manufacturing process, OTP ROM is programmed after the manufacturing process, but before it is delivered to the customer. This allows the customer to program the memory with the data that they need to store permanently.
OTP ROM is commonly used in devices such as microcontrollers, smart cards, and other electronic devices that require permanent storage of data. It is ideal for storing critical data, such as system settings, encryption keys, and other sensitive information that needs to be permanently stored and cannot be changed or updated in the future.