TSSOP OTP ROM 391

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Part	Manufacturer	Memory IC Type	Temperature Grade	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Terminal Form	Parallel or Serial	Operating Mode	Maximum Supply Current	No. of Words	Input/Output Type	Nominal Supply Voltage / Vsup (V)	Power Supplies (V)	Memory Width	Package Style (Meter)	Package Equivalence Code	Alternate Memory Width	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Output Characteristics	Organization	No. of Words Code	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Supply Voltage (Vsup)	Maximum Seated Height	Maximum Clock Frequency (fCLK)	Width	Qualification	Memory Density	Minimum Supply Voltage (Vsup)	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Maximum Standby Current	Length	Maximum Access Time
DS2502R/T&R	Maxim Integrated	OTP ROM	INDUSTRIAL	3	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	SERIAL	ASYNCHRONOUS		128 words	COMMON	5	3/5	8	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TO-236		Other Memory ICs	.95 mm	85 Cel		128X8	128	-40 Cel	TIN LEAD	DUAL	R-PDSO-G3	1	6 V	1.12 mm		1.3 mm	Not Qualified	1024 bit	2.8 V	MICROLAN COMPATIBLE	e0				2.92 mm	15000 ns
DS2502R+T&R	Analog Devices	OTP ROM	INDUSTRIAL	3	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	SERIAL	ASYNCHRONOUS		128 words	COMMON	5	3/5	8	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TO-236		Other Memory ICs	.95 mm	85 Cel		128X8	128	-40 Cel	Matte Tin (Sn) - annealed	DUAL	R-PDSO-G3	1	6 V	1.12 mm		1.3 mm	Not Qualified	1024 bit	2.8 V	MICROLAN COMPATIBLE	e3	30	260		2.92 mm	15000 ns
BQ2022ADBZR	Texas Instruments	OTP ROM	OTHER	3	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	SERIAL	ASYNCHRONOUS	.02 mA	1024 words	COMMON	2.7	3/5	1	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TO-236		OTP ROMs	.95 mm	70 Cel	OPEN-DRAIN	1KX1	1K	-20 Cel	Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)	DUAL	R-PDSO-G3	1	5.5 V	1.12 mm	.01667 MHz	1.3 mm	Not Qualified	1024 bit	2.65 V	ORGANIZED AS 4 PAGES OF 32 BYTES EACH	e4	NOT SPECIFIED	260		2.92 mm
BQ2022ADBZRG4	Texas Instruments	OTP ROM	OTHER	3	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	SERIAL	ASYNCHRONOUS	.02 mA	1024 words	COMMON	2.7	3/5	1	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TO-236		OTP ROMs	.95 mm	70 Cel	OPEN-DRAIN	1KX1	1K	-20 Cel	Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)	DUAL	R-PDSO-G3	1	5.5 V	1.12 mm	.01667 MHz	1.3 mm	Not Qualified	1024 bit	2.65 V	ORGANIZED AS 4 PAGES OF 32 BYTES EACH	e4	NOT SPECIFIED	260		2.92 mm
BQ2024DBZR	Texas Instruments	OTP ROM	OTHER	3	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	SERIAL	ASYNCHRONOUS	.02 mA	1536 words	COMMON	2.7	3/5	1	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TO-236		OTP ROMs	.95 mm	70 Cel	OPEN-DRAIN	1.5KX1	1.5K	-20 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	R-PDSO-G3	1	5.5 V	1.12 mm	.01667 MHz	1.3 mm	Not Qualified	1536 bit	2.65 V	ORGANIZED AS 6 PAGES OF 32 BYTES EACH	e4	NOT SPECIFIED	260		2.92 mm
BQ2024DBZRG4	Texas Instruments	OTP ROM	OTHER	3	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	SERIAL	ASYNCHRONOUS	.02 mA	1536 words	COMMON		3/5	1	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TO-236		OTP ROMs	.95 mm	70 Cel	OPEN-DRAIN	1.5KX1	1.5K	-20 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	R-PDSO-G3	1	5.5 V	1.12 mm	.01667 MHz	1.3 mm	Not Qualified	1536 bit	2.65 V	ORGANIZED AS 6 PAGES OF 32 BYTES EACH	e4	NOT SPECIFIED	260		2.92 mm
BQ2022DBZRG4	Texas Instruments	OTP ROM	INDUSTRIAL	3	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	SERIAL	ASYNCHRONOUS	.02 mA	1024 words	COMMON	2.7	3/5	1	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TO-236		OTP ROMs	.95 mm	85 Cel	OPEN-DRAIN	1KX1	1K	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G3	1	5.5 V	1.12 mm	.01667 MHz	1.3 mm	Not Qualified	1024 bit	2.65 V	ORGANIZED AS 4 PAGES OF 32 BYTES EACH	e4	30	260		2.92 mm
BQ2022DBZR	Texas Instruments	OTP ROM	INDUSTRIAL	3	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	SERIAL	ASYNCHRONOUS	.02 mA	1024 words	COMMON	2.7	3/5	1	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TO-236		OTP ROMs	.95 mm	85 Cel	OPEN-DRAIN	1KX1	1K	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G3	1	5.5 V	1.12 mm	.01667 MHz	1.3 mm	Not Qualified	1024 bit	2.65 V	ORGANIZED AS 4 PAGES OF 32 BYTES EACH	e4	30	260		2.92 mm
M27W801-80N6	STMicroelectronics	OTP ROM	INDUSTRIAL	32	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS	GULL WING			15 mA	1048576 words	COMMON		3/3.3	8	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP32,.8,20		OTP ROMs	.5 mm	85 Cel	3-STATE	1MX8	1M	-40 Cel	TIN LEAD	DUAL	R-PDSO-G32						Not Qualified	8388608 bit			e0			.00002 Amp		80 ns
M27W801-150N6TR	STMicroelectronics	OTP ROM	INDUSTRIAL	32	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	15 mA	1048576 words	COMMON	3	3/3.3	8	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP32,.8,20		OTP ROMs	.5 mm	85 Cel	3-STATE	1MX8	1M	-40 Cel	MATTE TIN	DUAL	R-PDSO-G32		3.6 V	1.2 mm		8 mm	Not Qualified	8388608 bit	2.7 V		e3			.000015 Amp	18.4 mm	120 ns
M27W512-150N1	STMicroelectronics	OTP ROM	COMMERCIAL	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS	GULL WING			30 mA	65536 words	COMMON		3/5	8	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP28,.53,22		OTP ROMs	.55 mm	70 Cel	3-STATE	64KX8	64K	0 Cel	TIN LEAD	DUAL	R-PDSO-G28						Not Qualified	524288 bit			e0			.00001 Amp		150 ns
M27W401-150N1	STMicroelectronics		COMMERCIAL	32	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS	GULL WING			30 mA	524288 words	COMMON		3/5	8	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP32,.8,20		OTP ROMs	.5 mm	70 Cel	3-STATE	512KX8	512K	0 Cel	TIN LEAD	DUAL	R-PDSO-G32						Not Qualified	4194304 bit			e0			.00002 Amp		150 ns
M27W016100N1	STMicroelectronics	OTP ROM	COMMERCIAL	48	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS		1048576 words	COMMON	3	3/3.3	16	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP48,.8,20		Other Memory ICs	.5 mm	70 Cel	3-STATE	1MX16	1M	0 Cel	TIN LEAD	DUAL	R-PDSO-G48		3.6 V	1.2 mm		12 mm	Not Qualified	16777216 bit	2.7 V	90NS ACCESS TIME AT VCC = 3.0 TO 3.6V.	e0			.0001 Amp	18.4 mm	100 ns
M27V402-120N1TR	STMicroelectronics	OTP ROM	COMMERCIAL	40	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	20 mA	262144 words	COMMON	3.3	3.3	16	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP40,.8,20		Other Memory ICs	.5 mm	70 Cel	3-STATE	256KX16	256K	0 Cel	TIN LEAD	DUAL	R-PDSO-G40		3.63 V	1.2 mm		10 mm	Not Qualified	4194304 bit	2.97 V		e0			.00002 Amp	18.4 mm	120 ns
M27W401-200N1	STMicroelectronics		COMMERCIAL	32	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS	GULL WING			30 mA	524288 words	COMMON		3/5	8	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP32,.8,20		OTP ROMs	.5 mm	70 Cel	3-STATE	512KX8	512K	0 Cel	TIN LEAD	DUAL	R-PDSO-G32						Not Qualified	4194304 bit			e0			.00002 Amp		200 ns
M27V320-150N1	STMicroelectronics	OTP ROM	COMMERCIAL	48	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	30 mA	2097152 words	COMMON	3.3	3.3	16	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP48,.8,20	8	OTP ROMs	.5 mm	70 Cel	3-STATE	2MX16	2M	0 Cel	MATTE TIN	DUAL	R-PDSO-G48		3.63 V	1.2 mm		12 mm	Not Qualified	33554432 bit	2.97 V		e3			.00006 Amp	18.4 mm	150 ns
M27V320-120N1	STMicroelectronics	OTP ROM	COMMERCIAL	48	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	30 mA	2097152 words	COMMON	3.3	3.3	16	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP48,.8,20	8	OTP ROMs	.5 mm	70 Cel	3-STATE	2MX16	2M	0 Cel	MATTE TIN	DUAL	R-PDSO-G48		3.63 V	1.2 mm		12 mm	Not Qualified	33554432 bit	2.97 V		e3			.00006 Amp	18.4 mm	120 ns
M27W512-200N4	STMicroelectronics	OTP ROM	COMMERCIAL	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS	GULL WING			30 mA	65536 words	COMMON		3/5	8	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP28,.53,22		OTP ROMs	.55 mm	70 Cel	3-STATE	64KX8	64K	-20 Cel	TIN LEAD	DUAL	R-PDSO-G28						Not Qualified	524288 bit			e0			.00001 Amp		200 ns
M27V402-120N6TR	STMicroelectronics	OTP ROM	INDUSTRIAL	40	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	20 mA	262144 words	COMMON	3.3	3.3	16	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP40,.8,20		Other Memory ICs	.5 mm	85 Cel	3-STATE	256KX16	256K	-40 Cel	TIN LEAD	DUAL	R-PDSO-G40		3.63 V	1.2 mm		10 mm	Not Qualified	4194304 bit	2.97 V		e0			.00002 Amp	18.4 mm	120 ns
M27W402-150N4	STMicroelectronics		COMMERCIAL	40	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS	GULL WING			50 mA	262144 words	COMMON		3/5	16	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP40,.8,20		OTP ROMs	.5 mm	70 Cel	3-STATE	256KX16	256K	-20 Cel	TIN LEAD	DUAL	R-PDSO-G40						Not Qualified	4194304 bit			e0			.00002 Amp		150 ns
M27V402-200N6TR	STMicroelectronics	OTP ROM	INDUSTRIAL	40	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	20 mA	262144 words	COMMON	3.3	3.3	16	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP40,.8,20		Other Memory ICs	.5 mm	85 Cel	3-STATE	256KX16	256K	-40 Cel	TIN LEAD	DUAL	R-PDSO-G40		3.63 V	1.2 mm		10 mm	Not Qualified	4194304 bit	2.97 V		e0			.00002 Amp	18.4 mm	200 ns
M27W201-150N1	STMicroelectronics		COMMERCIAL	32	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS	GULL WING			30 mA	262144 words	COMMON		3/5	8	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP32,.8,20		OTP ROMs	.5 mm	70 Cel	3-STATE	256KX8	256K	0 Cel	TIN LEAD	DUAL	R-PDSO-G32						Not Qualified	2097152 bit			e0			.00002 Amp		150 ns
M27V402-200N4TR	STMicroelectronics	OTP ROM	OTHER	40	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	20 mA	262144 words	COMMON	3.3	3.3	16	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP40,.8,20		Other Memory ICs	.5 mm	70 Cel	3-STATE	256KX16	256K	-20 Cel	TIN LEAD	DUAL	R-PDSO-G40		3.63 V	1.2 mm		10 mm	Not Qualified	4194304 bit	2.97 V		e0			.00002 Amp	18.4 mm	200 ns
M27W401-150N4	STMicroelectronics		COMMERCIAL	32	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS	GULL WING			30 mA	524288 words	COMMON		3/5	8	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP32,.8,20		OTP ROMs	.5 mm	70 Cel	3-STATE	512KX8	512K	-20 Cel	TIN LEAD	DUAL	R-PDSO-G32						Not Qualified	4194304 bit			e0			.00002 Amp		150 ns
M27V320-100N6	STMicroelectronics	OTP ROM	INDUSTRIAL	48	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	30 mA	2097152 words	COMMON	3.3	3.3	16	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP48,.8,20	8	OTP ROMs	.5 mm	85 Cel	3-STATE	2MX16	2M	-40 Cel	MATTE TIN	DUAL	R-PDSO-G48		3.63 V	1.2 mm		12 mm	Not Qualified	33554432 bit	2.97 V		e3			.00006 Amp	18.4 mm	100 ns
M27W401-200N4	STMicroelectronics		COMMERCIAL	32	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS	GULL WING			30 mA	524288 words	COMMON		3/5	8	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP32,.8,20		OTP ROMs	.5 mm	70 Cel	3-STATE	512KX8	512K	-20 Cel	TIN LEAD	DUAL	R-PDSO-G32						Not Qualified	4194304 bit			e0			.00002 Amp		200 ns
M27W801-200N6TR	STMicroelectronics	OTP ROM	INDUSTRIAL	32	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	15 mA	1048576 words	COMMON	3	3/3.3	8	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP32,.8,20		OTP ROMs	.5 mm	85 Cel	3-STATE	1MX8	1M	-40 Cel	MATTE TIN	DUAL	R-PDSO-G32		3.6 V	1.2 mm		8 mm	Not Qualified	8388608 bit	2.7 V		e3			.000015 Amp	18.4 mm	120 ns
M27V402-150N5TR	STMicroelectronics	OTP ROM	OTHER	40	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	20 mA	262144 words	COMMON	3.3	3.3	16	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP40,.8,20		Other Memory ICs	.5 mm	85 Cel	3-STATE	256KX16	256K	-20 Cel	TIN LEAD	DUAL	R-PDSO-G40		3.63 V	1.2 mm		10 mm	Not Qualified	4194304 bit	2.97 V		e0			.00002 Amp	18.4 mm	150 ns
M27V402-200N1TR	STMicroelectronics	OTP ROM	COMMERCIAL	40	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	20 mA	262144 words	COMMON	3.3	3.3	16	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP40,.8,20		Other Memory ICs	.5 mm	70 Cel	3-STATE	256KX16	256K	0 Cel	TIN LEAD	DUAL	R-PDSO-G40		3.63 V	1.2 mm		10 mm	Not Qualified	4194304 bit	2.97 V		e0			.00002 Amp	18.4 mm	200 ns
M27W064110N1T	STMicroelectronics	OTP ROM	COMMERCIAL	48	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	20 mA	4194304 words	COMMON	3	3/3.3	16	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP48,.8,20		OTP ROMs	.5 mm	70 Cel	3-STATE	4MX16	4M	0 Cel	TIN LEAD	DUAL	R-PDSO-G48		3.6 V	1.2 mm		12 mm	Not Qualified	67108864 bit	2.7 V		e0			.0001 Amp	18.4 mm	110 ns
M27V512-90N6	STMicroelectronics	OTP ROM	INDUSTRIAL	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS	GULL WING			30 mA	65536 words	COMMON		3.3/5	8	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP28,.53,22		OTP ROMs	.55 mm	85 Cel	3-STATE	64KX8	64K	-40 Cel	TIN LEAD	DUAL	R-PDSO-G28						Not Qualified	524288 bit			e0			.00001 Amp		90 ns
M27V320-150N6	STMicroelectronics	OTP ROM	INDUSTRIAL	48	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	30 mA	2097152 words	COMMON	3.3	3.3	16	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP48,.8,20	8	OTP ROMs	.5 mm	85 Cel	3-STATE	2MX16	2M	-40 Cel	MATTE TIN	DUAL	R-PDSO-G48		3.63 V	1.2 mm		12 mm	Not Qualified	33554432 bit	2.97 V		e3			.00006 Amp	18.4 mm	150 ns
M27V320-120N6	STMicroelectronics	OTP ROM	INDUSTRIAL	48	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	30 mA	2097152 words	COMMON	3.3	3.3	16	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP48,.8,20	8	OTP ROMs	.5 mm	85 Cel	3-STATE	2MX16	2M	-40 Cel	MATTE TIN	DUAL	R-PDSO-G48		3.63 V	1.2 mm		12 mm	Not Qualified	33554432 bit	2.97 V		e3			.00006 Amp	18.4 mm	120 ns
M27W016110N1T	STMicroelectronics	OTP ROM	COMMERCIAL	48	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS		1048576 words	COMMON	3	3/3.3	16	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP48,.8,20		Other Memory ICs	.5 mm	70 Cel	3-STATE	1MX16	1M	0 Cel	TIN LEAD	DUAL	R-PDSO-G48		3.6 V	1.2 mm		12 mm	Not Qualified	16777216 bit	2.7 V	90NS ACCESS TIME AT VCC = 3.0 TO 3.6V.	e0			.0001 Amp	18.4 mm	110 ns
M27V402-150N4TR	STMicroelectronics	OTP ROM	OTHER	40	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	20 mA	262144 words	COMMON	3.3	3.3	16	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP40,.8,20		Other Memory ICs	.5 mm	70 Cel	3-STATE	256KX16	256K	-20 Cel	TIN LEAD	DUAL	R-PDSO-G40		3.63 V	1.2 mm		10 mm	Not Qualified	4194304 bit	2.97 V		e0			.00002 Amp	18.4 mm	150 ns
M27V402-150N1TR	STMicroelectronics	OTP ROM	COMMERCIAL	40	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	20 mA	262144 words	COMMON	3.3	3.3	16	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP40,.8,20		Other Memory ICs	.5 mm	70 Cel	3-STATE	256KX16	256K	0 Cel	TIN LEAD	DUAL	R-PDSO-G40		3.63 V	1.2 mm		10 mm	Not Qualified	4194304 bit	2.97 V		e0			.00002 Amp	18.4 mm	150 ns
M27W801-100N6TR	STMicroelectronics	OTP ROM	INDUSTRIAL	32	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	15 mA	1048576 words	COMMON	3	3/3.3	8	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP32,.8,20		OTP ROMs	.5 mm	85 Cel	3-STATE	1MX8	1M	-40 Cel	TIN LEAD	DUAL	R-PDSO-G32		3.6 V	1.2 mm		8 mm	Not Qualified	8388608 bit	2.7 V	ACCESS TIME 80 NANO SECS AT VCC 3V TO 3.6V	e0			.000015 Amp	18.4 mm	100 ns
M27V402-200N5TR	STMicroelectronics	OTP ROM	OTHER	40	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	20 mA	262144 words	COMMON	3.3	3.3	16	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP40,.8,20		Other Memory ICs	.5 mm	85 Cel	3-STATE	256KX16	256K	-20 Cel	TIN LEAD	DUAL	R-PDSO-G40		3.63 V	1.2 mm		10 mm	Not Qualified	4194304 bit	2.97 V		e0			.00002 Amp	18.4 mm	200 ns
M27V402-150N6TR	STMicroelectronics	OTP ROM	INDUSTRIAL	40	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	20 mA	262144 words	COMMON	3.3	3.3	16	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP40,.8,20		Other Memory ICs	.5 mm	85 Cel	3-STATE	256KX16	256K	-40 Cel	TIN LEAD	DUAL	R-PDSO-G40		3.63 V	1.2 mm		10 mm	Not Qualified	4194304 bit	2.97 V		e0			.00002 Amp	18.4 mm	150 ns
M27W016100N1T	STMicroelectronics	OTP ROM	COMMERCIAL	48	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS		1048576 words	COMMON	3	3/3.3	16	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP48,.8,20		Other Memory ICs	.5 mm	70 Cel	3-STATE	1MX16	1M	0 Cel	TIN LEAD	DUAL	R-PDSO-G48		3.6 V	1.2 mm		12 mm	Not Qualified	16777216 bit	2.7 V	90NS ACCESS TIME AT VCC = 3.0 TO 3.6V.	e0			.0001 Amp	18.4 mm	100 ns
M27W402-200N1	STMicroelectronics		COMMERCIAL	40	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS	GULL WING			50 mA	262144 words	COMMON		3/5	16	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP40,.8,20		OTP ROMs	.5 mm	70 Cel	3-STATE	256KX16	256K	0 Cel	TIN LEAD	DUAL	R-PDSO-G40						Not Qualified	4194304 bit			e0			.00002 Amp		200 ns
M27W064100N1T	STMicroelectronics	OTP ROM	COMMERCIAL	48	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	20 mA	4194304 words	COMMON	3	3/3.3	16	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP48,.8,20		OTP ROMs	.5 mm	70 Cel	3-STATE	4MX16	4M	0 Cel	TIN LEAD	DUAL	R-PDSO-G48		3.6 V	1.2 mm		12 mm	Not Qualified	67108864 bit	2.7 V		e0			.0001 Amp	18.4 mm	100 ns
M27W101-150N1	STMicroelectronics		COMMERCIAL	32	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS	GULL WING			30 mA	131072 words	COMMON		3/5	8	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP32,.8,20		OTP ROMs	.5 mm	70 Cel	3-STATE	128KX8	128K	0 Cel	TIN LEAD	DUAL	R-PDSO-G32						Not Qualified	1048576 bit			e0			.00002 Amp		150 ns
M27W016110N1	STMicroelectronics	OTP ROM	COMMERCIAL	48	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS		1048576 words	COMMON	3	3/3.3	16	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP48,.8,20		Other Memory ICs	.5 mm	70 Cel	3-STATE	1MX16	1M	0 Cel	TIN LEAD	DUAL	R-PDSO-G48		3.6 V	1.2 mm		12 mm	Not Qualified	16777216 bit	2.7 V	90NS ACCESS TIME AT VCC = 3.0 TO 3.6V.	e0			.0001 Amp	18.4 mm	110 ns
M27W402-200N4	STMicroelectronics		COMMERCIAL	40	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS	GULL WING			50 mA	262144 words	COMMON		3/5	16	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP40,.8,20		OTP ROMs	.5 mm	70 Cel	3-STATE	256KX16	256K	-20 Cel	TIN LEAD	DUAL	R-PDSO-G40						Not Qualified	4194304 bit			e0			.00002 Amp		200 ns
M27V402-120N4TR	STMicroelectronics	OTP ROM	OTHER	40	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	20 mA	262144 words	COMMON	3.3	3.3	16	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP40,.8,20		Other Memory ICs	.5 mm	70 Cel	3-STATE	256KX16	256K	-20 Cel	TIN LEAD	DUAL	R-PDSO-G40		3.63 V	1.2 mm		10 mm	Not Qualified	4194304 bit	2.97 V		e0			.00002 Amp	18.4 mm	120 ns
M27V402-120N5TR	STMicroelectronics	OTP ROM	OTHER	40	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	20 mA	262144 words	COMMON	3.3	3.3	16	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP40,.8,20		Other Memory ICs	.5 mm	85 Cel	3-STATE	256KX16	256K	-20 Cel	TIN LEAD	DUAL	R-PDSO-G40		3.63 V	1.2 mm		10 mm	Not Qualified	4194304 bit	2.97 V		e0			.00002 Amp	18.4 mm	120 ns
M27W201-200N4	STMicroelectronics		COMMERCIAL	32	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS	GULL WING			30 mA	262144 words	COMMON		3/5	8	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP32,.8,20		OTP ROMs	.5 mm	70 Cel	3-STATE	256KX8	256K	-20 Cel	TIN LEAD	DUAL	R-PDSO-G32						Not Qualified	2097152 bit			e0			.00002 Amp		200 ns

OTP ROM

OTP ROM, or One-Time Programmable Read-Only Memory, is a type of non-volatile computer memory that is programmed once and cannot be reprogrammed. OTP ROM is used to store data that needs to be permanently stored and cannot be changed or updated in the future.

OTP ROM is created using a process similar to that used to manufacture Mask ROM. However, instead of programming the memory during the manufacturing process, OTP ROM is programmed after the manufacturing process, but before it is delivered to the customer. This allows the customer to program the memory with the data that they need to store permanently.

OTP ROM is commonly used in devices such as microcontrollers, smart cards, and other electronic devices that require permanent storage of data. It is ideal for storing critical data, such as system settings, encryption keys, and other sensitive information that needs to be permanently stored and cannot be changed or updated in the future.