WQCCJ OTP ROM 21

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Part	Manufacturer	Memory IC Type	Temperature Grade	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Terminal Form	Parallel or Serial	Operating Mode	Maximum Supply Current	No. of Words	Input/Output Type	Nominal Supply Voltage / Vsup (V)	Power Supplies (V)	Memory Width	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Output Characteristics	Organization	No. of Words Code	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Maximum Supply Voltage (Vsup)	Maximum Seated Height	Width	Qualification	Memory Density	Minimum Supply Voltage (Vsup)	JESD-609 Code	Maximum Standby Current	Length	Maximum Access Time	Programming Voltage (V)
WS57C256F-35J	STMicroelectronics	OTP ROM	COMMERCIAL	32	WQCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	50 mA	32768 words	COMMON	5	5	8	CHIP CARRIER, WINDOW	LDCC32,.5X.6	OTP ROMs	1.27 mm	70 Cel	3-STATE	32KX8	32K	0 Cel	TIN LEAD	QUAD	R-PQCC-J32	5.5 V	3.56 mm	11.455 mm	Not Qualified	262144 bit	4.5 V	e0	.0002 Amp	13.995 mm	35 ns	12.75
WS57C51C-55J	STMicroelectronics	OTP ROM	COMMERCIAL	32	WQCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	133 mA	16384 words		5	5	8	CHIP CARRIER, WINDOW	LDCC32,.5X.6	OTP ROMs	1.27 mm	70 Cel	3-STATE	16KX8	16K	0 Cel	TIN LEAD	QUAD	R-PQCC-J32	5.5 V	3.56 mm	11.455 mm	Not Qualified	131072 bit	4.5 V	e0	.03 Amp	13.995 mm	55 ns
WS57C51C-45J	STMicroelectronics	OTP ROM	COMMERCIAL	32	WQCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	139 mA	16384 words		5	5	8	CHIP CARRIER, WINDOW	LDCC32,.5X.6	OTP ROMs	1.27 mm	70 Cel	3-STATE	16KX8	16K	0 Cel	TIN LEAD	QUAD	R-PQCC-J32	5.5 V	3.56 mm	11.455 mm	Not Qualified	131072 bit	4.5 V	e0	.03 Amp	13.995 mm	45 ns
WS57C43C-45JI	STMicroelectronics	OTP ROM	INDUSTRIAL	28	WQCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	50 mA	4096 words	COMMON	5	5	8	CHIP CARRIER, WINDOW	LDCC28,.5SQ	OTP ROMs	1.27 mm	85 Cel	3-STATE	4KX8	4K	-40 Cel	TIN LEAD	QUAD	S-PQCC-J28	5.5 V	4.57 mm	11.48 mm	Not Qualified	32768 bit	4.5 V	e0	.03 Amp	11.48 mm	45 ns
WS57C128FB-45J	STMicroelectronics	OTP ROM	COMMERCIAL	32	WQCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	139 mA	16384 words	COMMON	5	5	8	CHIP CARRIER, WINDOW	LDCC32,.5X.6	OTP ROMs	1.27 mm	70 Cel	3-STATE	16KX8	16K	0 Cel	TIN LEAD	QUAD	R-PQCC-J32	5.5 V	3.56 mm	11.455 mm	Not Qualified	131072 bit	4.5 V	e0	.0005 Amp	13.995 mm	45 ns	12.5
WS57C191C-45J	STMicroelectronics	OTP ROM	COMMERCIAL	28	WQCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	40 mA	2048 words	COMMON	5	5	8	CHIP CARRIER, WINDOW	LDCC28,.5SQ	OTP ROMs	1.27 mm	70 Cel	3-STATE	2KX8	2K	0 Cel	TIN LEAD	QUAD	S-PQCC-J28	5.5 V	4.57 mm	11.48 mm	Not Qualified	16384 bit	4.5 V	e0	.025 Amp	11.48 mm	45 ns	12.75
WS57C43C-25J	STMicroelectronics	OTP ROM	COMMERCIAL	28	WQCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	40 mA	4096 words	COMMON	5	5	8	CHIP CARRIER, WINDOW	LDCC28,.5SQ	OTP ROMs	1.27 mm	70 Cel	3-STATE	4KX8	4K	0 Cel	TIN LEAD	QUAD	S-PQCC-J28	5.5 V	4.57 mm	11.48 mm	Not Qualified	32768 bit	4.5 V	e0	.03 Amp	11.48 mm	25 ns
WS57C71C-45J	STMicroelectronics	OTP ROM	COMMERCIAL	32	WQCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	50 mA	32768 words	COMMON	5	5	8	CHIP CARRIER, WINDOW	LDCC32,.5X.6	OTP ROMs	1.27 mm	70 Cel	3-STATE	32KX8	32K	0 Cel	TIN LEAD	QUAD	R-PQCC-J32	5.5 V	3.56 mm	11.455 mm	Not Qualified	262144 bit	4.5 V	e0	.025 Amp	13.995 mm	45 ns
WS57C191C-25J	STMicroelectronics	OTP ROM	COMMERCIAL	28	WQCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	40 mA	2048 words	COMMON	5	5	8	CHIP CARRIER, WINDOW	LDCC28,.5SQ	OTP ROMs	1.27 mm	70 Cel	3-STATE	2KX8	2K	0 Cel	TIN LEAD	QUAD	S-PQCC-J28	5.5 V	4.57 mm	11.48 mm	Not Qualified	16384 bit	4.5 V	e0	.025 Amp	11.48 mm	25 ns	12.75
WS57C51C-45JI	STMicroelectronics	OTP ROM	INDUSTRIAL	32	WQCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	149 mA	16384 words		5	5	8	CHIP CARRIER, WINDOW	LDCC32,.5X.6	OTP ROMs	1.27 mm	85 Cel	3-STATE	16KX8	16K	-40 Cel	TIN LEAD	QUAD	R-PQCC-J32	5.5 V	3.56 mm	11.455 mm	Not Qualified	131072 bit	4.5 V	e0		13.995 mm	45 ns
WS57C43C-35JI	STMicroelectronics	OTP ROM	INDUSTRIAL	28	WQCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	50 mA	4096 words	COMMON	5	5	8	CHIP CARRIER, WINDOW	LDCC28,.5SQ	OTP ROMs	1.27 mm	85 Cel	3-STATE	4KX8	4K	-40 Cel	TIN LEAD	QUAD	S-PQCC-J28	5.5 V	4.57 mm	11.48 mm	Not Qualified	32768 bit	4.5 V	e0	.03 Amp	11.48 mm	35 ns
WS57C71C-55J	STMicroelectronics	OTP ROM	COMMERCIAL	32	WQCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	123 mA	32768 words	COMMON	5	5	8	CHIP CARRIER, WINDOW	LDCC32,.5X.6	OTP ROMs	1.27 mm	70 Cel	3-STATE	32KX8	32K	0 Cel	TIN LEAD	QUAD	R-PQCC-J32	5.5 V	3.56 mm	11.455 mm	Not Qualified	262144 bit	4.5 V	e0	.02 Amp	13.995 mm	55 ns
WS57C191C-35J	STMicroelectronics	OTP ROM	COMMERCIAL	28	WQCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	40 mA	2048 words	COMMON	5	5	8	CHIP CARRIER, WINDOW	LDCC28,.5SQ	OTP ROMs	1.27 mm	70 Cel	3-STATE	2KX8	2K	0 Cel	TIN LEAD	QUAD	S-PQCC-J28	5.5 V	4.57 mm	11.48 mm	Not Qualified	16384 bit	4.5 V	e0	.025 Amp	11.48 mm	35 ns	12.75
WS57C256F-70J	STMicroelectronics	OTP ROM	COMMERCIAL	32	WQCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	50 mA	32768 words	COMMON	5	5	8	CHIP CARRIER, WINDOW	LDCC32,.5X.6	OTP ROMs	1.27 mm	70 Cel	3-STATE	32KX8	32K	0 Cel	TIN LEAD	QUAD	R-PQCC-J32	5.5 V	3.56 mm	11.455 mm	Not Qualified	262144 bit	4.5 V	e0	.0002 Amp	13.995 mm	70 ns	12.75
WS57C51C-55JI	STMicroelectronics	OTP ROM	INDUSTRIAL	32	WQCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	133 mA	16384 words		5	5	8	CHIP CARRIER, WINDOW	LDCC32,.5X.6	OTP ROMs	1.27 mm	85 Cel	3-STATE	16KX8	16K	-40 Cel	TIN LEAD	QUAD	R-PQCC-J32	5.5 V	3.56 mm	11.455 mm	Not Qualified	131072 bit	4.5 V	e0	.035 Amp	13.995 mm	55 ns
WS57C43C-45J	STMicroelectronics	OTP ROM	COMMERCIAL	28	WQCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	40 mA	4096 words	COMMON	5	5	8	CHIP CARRIER, WINDOW	LDCC28,.5SQ	OTP ROMs	1.27 mm	70 Cel	3-STATE	4KX8	4K	0 Cel	TIN LEAD	QUAD	S-PQCC-J28	5.5 V	4.57 mm	11.48 mm	Not Qualified	32768 bit	4.5 V	e0	.03 Amp	11.48 mm	45 ns
WS57C43C-35J	STMicroelectronics	OTP ROM	COMMERCIAL	28	WQCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	40 mA	4096 words	COMMON	5	5	8	CHIP CARRIER, WINDOW	LDCC28,.5SQ	OTP ROMs	1.27 mm	70 Cel	3-STATE	4KX8	4K	0 Cel	TIN LEAD	QUAD	S-PQCC-J28	5.5 V	4.57 mm	11.48 mm	Not Qualified	32768 bit	4.5 V	e0	.03 Amp	11.48 mm	35 ns
WS57C256F-70JI	STMicroelectronics	OTP ROM	INDUSTRIAL	32	WQCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	60 mA	32768 words	COMMON	5	5	8	CHIP CARRIER, WINDOW	LDCC32,.5X.6	OTP ROMs	1.27 mm	85 Cel	3-STATE	32KX8	32K	-40 Cel	TIN LEAD	QUAD	R-PQCC-J32	5.5 V	3.56 mm	11.455 mm	Not Qualified	262144 bit	4.5 V	e0	.0005 Amp	13.995 mm	70 ns	12.75
WS57C71C-35J	STMicroelectronics	OTP ROM	COMMERCIAL	32	WQCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	164 mA	32768 words	COMMON	5	5	8	CHIP CARRIER, WINDOW	LDCC32,.5X.6	OTP ROMs	1.27 mm	70 Cel	3-STATE	32KX8	32K	0 Cel	TIN LEAD	QUAD	R-PQCC-J32	5.5 V	3.56 mm	11.455 mm	Not Qualified	262144 bit	4.5 V	e0	.02 Amp	13.995 mm	35 ns
WS57C71C-55JI	STMicroelectronics	OTP ROM	INDUSTRIAL	32	WQCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	133 mA	32768 words	COMMON	5	5	8	CHIP CARRIER, WINDOW	LDCC32,.5X.6	OTP ROMs	1.27 mm	85 Cel	3-STATE	32KX8	32K	-40 Cel	TIN LEAD	QUAD	R-PQCC-J32	5.5 V	3.56 mm	11.455 mm	Not Qualified	262144 bit	4.5 V	e0	.025 Amp	13.995 mm	55 ns
WS57C256F-55J	STMicroelectronics	OTP ROM	COMMERCIAL	32	WQCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	50 mA	32768 words	COMMON	5	5	8	CHIP CARRIER, WINDOW	LDCC32,.5X.6	OTP ROMs	1.27 mm	70 Cel	3-STATE	32KX8	32K	0 Cel	TIN LEAD	QUAD	R-PQCC-J32	5.5 V	3.56 mm	11.455 mm	Not Qualified	262144 bit	4.5 V	e0	.0002 Amp	13.995 mm	55 ns	12.75

OTP ROM

OTP ROM, or One-Time Programmable Read-Only Memory, is a type of non-volatile computer memory that is programmed once and cannot be reprogrammed. OTP ROM is used to store data that needs to be permanently stored and cannot be changed or updated in the future.

OTP ROM is created using a process similar to that used to manufacture Mask ROM. However, instead of programming the memory during the manufacturing process, OTP ROM is programmed after the manufacturing process, but before it is delivered to the customer. This allows the customer to program the memory with the data that they need to store permanently.

OTP ROM is commonly used in devices such as microcontrollers, smart cards, and other electronic devices that require permanent storage of data. It is ideal for storing critical data, such as system settings, encryption keys, and other sensitive information that needs to be permanently stored and cannot be changed or updated in the future.