RECTANGULAR OTP ROM 2,400+

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Part	Manufacturer	Memory IC Type	Temperature Grade	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Terminal Form	Parallel or Serial	Operating Mode	Maximum Supply Current	No. of Words	Input/Output Type	Nominal Supply Voltage / Vsup (V)	Power Supplies (V)	Memory Width	Package Style (Meter)	Package Equivalence Code	Alternate Memory Width	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Output Characteristics	Organization	No. of Words Code	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Maximum Supply Voltage (Vsup)	Maximum Seated Height	Width	Qualification	Memory Density	Minimum Supply Voltage (Vsup)	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Maximum Standby Current	Length	Maximum Access Time	Programming Voltage (V)
M87C257-45XC1	STMicroelectronics	OTP ROM	COMMERCIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	30 mA	32768 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6		OTP ROMs	1.27 mm	70 Cel	3-STATE	32KX8	32K	0 Cel	MATTE TIN	QUAD	R-PQCC-J32	5.25 V	3.56 mm	11.43 mm	Not Qualified	262144 bit	4.75 V	e3			.0001 Amp	13.97 mm	45 ns
M27V405-150K4	STMicroelectronics	OTP ROM	COMMERCIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	30 mA	524288 words	COMMON	3.3	3.3	8	CHIP CARRIER	LDCC32,.5X.6		OTP ROMs	1.27 mm	70 Cel	3-STATE	512KX8	512K	-20 Cel	TIN LEAD	QUAD	R-PQCC-J32	3.63 V	3.56 mm	11.455 mm	Not Qualified	4194304 bit	2.97 V	e0			.0001 Amp	13.995 mm	150 ns
M27W06490N1	STMicroelectronics	OTP ROM	COMMERCIAL	48	TSOP1	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	20 mA	4194304 words	COMMON	3.3	3.3	16	SMALL OUTLINE, THIN PROFILE	TSSOP48,.8,20		OTP ROMs	.5 mm	70 Cel	3-STATE	4MX16	4M	0 Cel	TIN LEAD	DUAL	R-PDSO-G48	3.6 V	1.2 mm	12 mm	Not Qualified	67108864 bit	3 V	e0			.0001 Amp	18.4 mm	90 ns
M27W101-100K6TR	STMicroelectronics	OTP ROM	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	15 mA	131072 words	COMMON	3	3/3.3	8	CHIP CARRIER	LDCC32,.5X.6		OTP ROMs	1.27 mm	85 Cel	3-STATE	128KX8	128K	-40 Cel	MATTE TIN	QUAD	R-PQCC-J32	3.6 V	3.56 mm	11.43 mm	Not Qualified	1048576 bit	2.7 V	e3			.000015 Amp	13.97 mm	100 ns
M2764A20CP	STMicroelectronics	OTP ROM	COMMERCIAL	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		MOS	THROUGH-HOLE			75 mA	8192 words	COMMON	5	5	8	IN-LINE	DIP28,.6		OTP ROMs	2.54 mm	70 Cel	3-STATE	8KX8	8K	0 Cel	TIN LEAD	DUAL	R-PDIP-T28				Not Qualified	65536 bit		e0					200 ns	12.5
M27W201-120N6	STMicroelectronics	OTP ROM	INDUSTRIAL	32	TSOP1	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	15 mA	262144 words	COMMON	3	3/3.3	8	SMALL OUTLINE, THIN PROFILE	TSSOP32,.8,20		OTP ROMs	.5 mm	85 Cel	3-STATE	256KX8	256K	-40 Cel	MATTE TIN/TIN BISMUTH	DUAL	R-PDSO-G32	3.6 V	1.2 mm	8 mm	Not Qualified	2097152 bit	2.7 V	e3/e6	40	260	.000015 Amp	18.4 mm	100 ns
M27V405-120K1TR	STMicroelectronics	OTP ROM	COMMERCIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	15 mA	524288 words	COMMON	3.3	3.3	8	CHIP CARRIER	LDCC32,.5X.6		Other Memory ICs	1.27 mm	70 Cel	3-STATE	512KX8	512K	0 Cel	TIN LEAD	QUAD	R-PQCC-J32	3.63 V	3.56 mm	11.455 mm	Not Qualified	4194304 bit	2.97 V	e0			.00002 Amp	13.995 mm	120 ns
M27W201-80F6TR	STMicroelectronics	OTP ROM	INDUSTRIAL	32	WDIP	RECTANGULAR	CERAMIC, METAL-SEALED COFIRED	NO	1	CMOS	THROUGH-HOLE	PARALLEL	ASYNCHRONOUS		262144 words				8	IN-LINE, WINDOW				2.54 mm	85 Cel		256KX8	256K	-40 Cel		DUAL	R-CDIP-T32	3.6 V	5.72 mm	15.24 mm		2097152 bit	2.7 V					41.885 mm	80 ns
M87C257-70XC7XTR	STMicroelectronics	OTP ROM	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	30 mA	32768 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6		OTP ROMs	1.27 mm	105 Cel	3-STATE	32KX8	32K	-40 Cel	MATTE TIN	QUAD	R-PQCC-J32			11.455 mm		262144 bit		e3			.0001 Amp	13.995 mm	70 ns
M87C257-20XC3X	STMicroelectronics	OTP ROM	AUTOMOTIVE	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	30 mA	32768 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6		OTP ROMs	1.27 mm	125 Cel	3-STATE	32KX8	32K	-40 Cel	MATTE TIN	QUAD	R-PQCC-J32	5.25 V	3.56 mm	11.455 mm	Not Qualified	262144 bit	4.75 V	e3			.0001 Amp	13.995 mm	150 ns
M27W201-100K6TR	STMicroelectronics	OTP ROM	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	15 mA	262144 words	COMMON	3	3/3.3	8	CHIP CARRIER	LDCC32,.5X.6		OTP ROMs	1.27 mm	85 Cel	3-STATE	256KX8	256K	-40 Cel	MATTE TIN	QUAD	R-PQCC-J32	3.6 V	3.56 mm	11.43 mm	Not Qualified	2097152 bit	2.7 V	e3			.000015 Amp	13.97 mm	100 ns
M27V801-120N1TR	STMicroelectronics	OTP ROM	COMMERCIAL	32	TSOP1	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	15 mA	1048576 words	COMMON	3.3	3.3	8	SMALL OUTLINE, THIN PROFILE	TSSOP32,.8,20		OTP ROMs	.5 mm	70 Cel	3-STATE	1MX8	1M	0 Cel	TIN LEAD	DUAL	R-PDSO-G32	3.6 V	1.2 mm	8 mm	Not Qualified	8388608 bit	3 V	e0			.00002 Amp	18.4 mm	120 ns
M27W512-150B6	STMicroelectronics	OTP ROM	INDUSTRIAL	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	THROUGH-HOLE	PARALLEL	ASYNCHRONOUS		65536 words		3		8	IN-LINE				2.54 mm	85 Cel		64KX8	64K	-40 Cel	Matte Tin (Sn)	DUAL	R-PDIP-T28	3.6 V	5.08 mm	15.24 mm	Not Qualified	524288 bit	2.7 V	e3				36.83 mm	100 ns
M27V320-150M6	STMicroelectronics	OTP ROM	INDUSTRIAL	44	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	30 mA	2097152 words	COMMON	3.3	3.3	16	SMALL OUTLINE	SOP44,.63	8	OTP ROMs	1.27 mm	85 Cel	3-STATE	2MX16	2M	-40 Cel	MATTE TIN	DUAL	R-PDSO-G44	3.63 V	2.8 mm	13.3 mm	Not Qualified	33554432 bit	2.97 V	e3			.00006 Amp	28.2 mm	150 ns
M27W512-150N6TR	STMicroelectronics	OTP ROM	INDUSTRIAL	28	TSOP1	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS		65536 words		3		8	SMALL OUTLINE, THIN PROFILE				.55 mm	85 Cel		64KX8	64K	-40 Cel	TIN	DUAL	R-PDSO-G28	3.6 V	1.25 mm	8 mm	Not Qualified	524288 bit	2.7 V	e3				11.8 mm	100 ns
M87C257-12X6TR	STMicroelectronics	OTP ROM	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS		32768 words		5		8	CHIP CARRIER					85 Cel		32KX8	32K	-40 Cel		QUAD	R-PQCC-J32	5.25 V			Not Qualified	262144 bit	4.75 V						120 ns
M87C257-45C1	STMicroelectronics	OTP ROM	COMMERCIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	30 mA	32768 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6		OTP ROMs	1.27 mm	70 Cel	3-STATE	32KX8	32K	0 Cel	MATTE TIN	QUAD	R-PQCC-J32	5.5 V	3.56 mm	11.43 mm	Not Qualified	262144 bit	4.5 V	e3			.0001 Amp	13.97 mm	45 ns
M27W202-150B6	STMicroelectronics	OTP ROM	INDUSTRIAL	40	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	THROUGH-HOLE	PARALLEL	ASYNCHRONOUS		131072 words		3.3		16	IN-LINE				2.54 mm	85 Cel		128KX16	128K	-40 Cel		DUAL	R-PDIP-T40	3.6 V		15.24 mm	Not Qualified	2097152 bit	2.7 V					52.18 mm	100 ns
M27W101-100N6TR	STMicroelectronics	OTP ROM	INDUSTRIAL	32	TSOP1	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	15 mA	131072 words	COMMON	3	3/3.3	8	SMALL OUTLINE, THIN PROFILE	TSSOP32,.8,20		OTP ROMs	.5 mm	85 Cel	3-STATE	128KX8	128K	-40 Cel	TIN	DUAL	R-PDSO-G32	3.6 V	1.2 mm	8 mm	Not Qualified	1048576 bit	2.7 V	e3			.000015 Amp	18.4 mm	100 ns
M27V256-150K6	STMicroelectronics	OTP ROM	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	10 mA	32768 words	COMMON	3.3	3.3	8	CHIP CARRIER	LDCC32,.5X.6		OTP ROMs	1.27 mm	85 Cel	3-STATE	32KX8	32K	-40 Cel	TIN LEAD	QUAD	R-PQCC-J32	3.6 V	3.56 mm	11.43 mm	Not Qualified	262144 bit	3 V	e0			.00001 Amp	13.97 mm	150 ns	12.75
M27V801-180P6	STMicroelectronics	OTP ROM	INDUSTRIAL	32	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	THROUGH-HOLE	PARALLEL	ASYNCHRONOUS	15 mA	1048576 words	COMMON	3.3	3.3	8	IN-LINE	DIP32,.6		OTP ROMs	2.54 mm	85 Cel	3-STATE	1MX8	1M	-40 Cel	TIN LEAD	DUAL	R-PDIP-T32	3.63 V	5.08 mm	15.24 mm	Not Qualified	8388608 bit	2.97 V	e0			.00002 Amp	41.91 mm	180 ns
TS27C64A-25TP	STMicroelectronics		INDUSTRIAL	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		CMOS	THROUGH-HOLE				8192 words	COMMON	5	5	8	IN-LINE	DIP28,.6		OTP ROMs	2.54 mm	105 Cel	3-STATE	8KX8	8K	-40 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDIP-T28				Not Qualified	65536 bit		e0					250 ns	12.5
M27V101-250K1	STMicroelectronics		COMMERCIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS	J BEND			30 mA	131072 words	COMMON		3.3/5	8	CHIP CARRIER	LDCC32,.5X.6		OTP ROMs	1.27 mm	70 Cel	3-STATE	128KX8	128K	0 Cel	Tin/Lead (Sn/Pb)	QUAD	R-PQCC-J32				Not Qualified	1048576 bit		e0			.00002 Amp		250 ns
M27V201-150K1TR	STMicroelectronics	OTP ROM	COMMERCIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	15 mA	262144 words	COMMON	3.3	3.3	8	CHIP CARRIER	LDCC32,.5X.6		OTP ROMs	1.27 mm	70 Cel	3-STATE	256KX8	256K	0 Cel	MATTE TIN	QUAD	R-PQCC-J32	3.6 V	3.56 mm	11.43 mm	Not Qualified	2097152 bit	3 V	e3			.00002 Amp	13.97 mm	150 ns
M87C257-90XC6TR	STMicroelectronics	OTP ROM	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	30 mA	32768 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6		OTP ROMs	1.27 mm	85 Cel	3-STATE	32KX8	32K	-40 Cel	MATTE TIN	QUAD	R-PQCC-J32	5.25 V	3.56 mm	11.43 mm	Not Qualified	262144 bit	4.75 V	e3			.0001 Amp	13.97 mm	90 ns
M27W512-120K6	STMicroelectronics	OTP ROM	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	15 mA	65536 words	COMMON	3	3/3.3	8	CHIP CARRIER	LDCC32,.5X.6		OTP ROMs	1.27 mm	85 Cel	3-STATE	64KX8	64K	-40 Cel	MATTE TIN	QUAD	R-PQCC-J32	3.6 V	3.56 mm	11.43 mm	Not Qualified	524288 bit	2.7 V	e3			.00002 Amp	13.97 mm	100 ns
M27V101-150B1	STMicroelectronics	OTP ROM	COMMERCIAL	32	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	THROUGH-HOLE	PARALLEL	ASYNCHRONOUS	15 mA	131072 words	COMMON	3.3	3.3	8	IN-LINE	DIP32,.6		OTP ROMs	2.54 mm	70 Cel	3-STATE	128KX8	128K	0 Cel	TIN LEAD	DUAL	R-PDIP-T32	3.6 V	5.08 mm	15.24 mm	Not Qualified	1048576 bit	3 V	e0			.00002 Amp	41.91 mm	150 ns
M27W401-200K4	STMicroelectronics		COMMERCIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS	J BEND			30 mA	524288 words	COMMON		3/5	8	CHIP CARRIER	LDCC32,.5X.6		OTP ROMs	1.27 mm	70 Cel	3-STATE	512KX8	512K	-20 Cel	TIN LEAD	QUAD	R-PQCC-J32				Not Qualified	4194304 bit		e0			.00002 Amp		200 ns
M27W201-120K6TR	STMicroelectronics	OTP ROM	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	15 mA	262144 words	COMMON	3	3/3.3	8	CHIP CARRIER	LDCC32,.5X.6		OTP ROMs	1.27 mm	85 Cel	3-STATE	256KX8	256K	-40 Cel	MATTE TIN	QUAD	R-PQCC-J32	3.6 V	3.56 mm	11.43 mm	Not Qualified	2097152 bit	2.7 V	e3			.000015 Amp	13.97 mm	100 ns
M87C257-45C6TR	STMicroelectronics	OTP ROM	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	30 mA	32768 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6		OTP ROMs	1.27 mm	85 Cel	3-STATE	32KX8	32K	-40 Cel	MATTE TIN	QUAD	R-PQCC-J32	5.5 V	3.56 mm	11.43 mm	Not Qualified	262144 bit	4.5 V	e3			.0001 Amp	13.97 mm	45 ns
M27V256-150K6TR	STMicroelectronics	OTP ROM	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	10 mA	32768 words	COMMON	3.3	3.3	8	CHIP CARRIER	LDCC32,.5X.6		OTP ROMs	1.27 mm	85 Cel	3-STATE	32KX8	32K	-40 Cel	TIN LEAD	QUAD	R-PQCC-J32	3.6 V	3.56 mm	11.43 mm	Not Qualified	262144 bit	3 V	e0			.00001 Amp	13.97 mm	150 ns	3.3
M27V405-180N5	STMicroelectronics	OTP ROM	OTHER	32	TSOP1	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	30 mA	524288 words	COMMON	3.3	3.3	8	SMALL OUTLINE, THIN PROFILE	TSSOP32,.8,20		OTP ROMs	.5 mm	85 Cel	3-STATE	512KX8	512K	-20 Cel	TIN LEAD	DUAL	R-PDSO-G32	3.63 V	1.2 mm	8 mm	Not Qualified	4194304 bit	2.97 V	e0			.0001 Amp	18.4 mm	180 ns
M27V160-120XS6	STMicroelectronics	OTP ROM	INDUSTRIAL	42	SDIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	THROUGH-HOLE	PARALLEL	ASYNCHRONOUS	30 mA	1048576 words	COMMON	3.3	3.3	16	IN-LINE, SHRINK PITCH	SDIP42,.6	8	OTP ROMs	1.778 mm	85 Cel	3-STATE	1MX16	1M	-40 Cel	TIN	DUAL	R-PDIP-T42	3.465 V	5.08 mm	15.24 mm	Not Qualified	16777216 bit	3.135 V	e3			.00006 Amp	36.83 mm	120 ns
TS27C64A-25VP	STMicroelectronics	OTP ROM	INDUSTRIAL	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	THROUGH-HOLE	PARALLEL	ASYNCHRONOUS	30 mA	8192 words	COMMON	5	5	8	IN-LINE	DIP28,.6		OTP ROMs	2.54 mm	85 Cel	3-STATE	8KX8	8K	-40 Cel	TIN LEAD	DUAL	R-PDIP-T28	5.5 V		15.24 mm	Not Qualified	65536 bit	4.5 V	e0			.0001 Amp	36.83 mm	250 ns	12.5
M27V102-200N1TR	STMicroelectronics	OTP ROM	COMMERCIAL	40	TSOP1	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	15 mA	65536 words	COMMON	3.3	3.3	16	SMALL OUTLINE, THIN PROFILE	TSSOP40,.56,20		OTP ROMs	.5 mm	70 Cel	3-STATE	64KX16	64K	0 Cel	TIN LEAD	DUAL	R-PDSO-G40	3.63 V	1.2 mm	10 mm	Not Qualified	1048576 bit	2.97 V	e0			.00002 Amp	12.4 mm	200 ns
M27V801-200P6TR	STMicroelectronics	OTP ROM	INDUSTRIAL	32	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	THROUGH-HOLE	PARALLEL	ASYNCHRONOUS		1048576 words		3.3		8	IN-LINE				2.54 mm	85 Cel		1MX8	1M	-40 Cel		DUAL	R-PDIP-T32	3.6 V	5.08 mm	15.24 mm	Not Qualified	8388608 bit	3 V					41.91 mm	200 ns
M87C257-90C1TR	STMicroelectronics	OTP ROM	COMMERCIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	30 mA	32768 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6		OTP ROMs	1.27 mm	70 Cel	3-STATE	32KX8	32K	0 Cel	MATTE TIN	QUAD	R-PQCC-J32	5.5 V	3.56 mm	11.43 mm	Not Qualified	262144 bit	4.5 V	e3			.0001 Amp	13.97 mm	90 ns
ST27256-30CP	STMicroelectronics		COMMERCIAL	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		MOS	THROUGH-HOLE			100 mA	32768 words	COMMON	5	5	8	IN-LINE	DIP28,.6		OTP ROMs	2.54 mm	70 Cel	3-STATE	32KX8	32K	0 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDIP-T28				Not Qualified	262144 bit		e0					300 ns	12.5
M27W256-200K6TR	STMicroelectronics	OTP ROM	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	15 mA	32768 words	COMMON	3	3/3.3	8	CHIP CARRIER	LDCC32,.5X.6		OTP ROMs	1.27 mm	85 Cel	3-STATE	32KX8	32K	-40 Cel	TIN LEAD	QUAD	R-PQCC-J32	3.6 V	3.56 mm	11.43 mm	Not Qualified	262144 bit	2.7 V	e0			.000015 Amp	13.97 mm	100 ns	12.75
M27W101-120K6	STMicroelectronics	OTP ROM	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS		131072 words		3		8	CHIP CARRIER				1.27 mm	85 Cel		128KX8	128K	-40 Cel		QUAD	R-PQCC-J32	3.6 V	3.56 mm	11.43 mm	Not Qualified	1048576 bit	2.7 V		NOT SPECIFIED	NOT SPECIFIED		13.97 mm	100 ns
M87C257-12XC7	STMicroelectronics	OTP ROM	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	30 mA	32768 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6		OTP ROMs	1.27 mm	105 Cel	3-STATE	32KX8	32K	-40 Cel	MATTE TIN	QUAD	R-PQCC-J32			11.455 mm	Not Qualified	262144 bit		e3			.0001 Amp	13.995 mm	120 ns
M87C257-15C3	STMicroelectronics	OTP ROM	AUTOMOTIVE	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	30 mA	32768 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6		OTP ROMs	1.27 mm	125 Cel	3-STATE	32KX8	32K	-40 Cel	MATTE TIN	QUAD	R-PQCC-J32	5.5 V	3.56 mm	11.43 mm	Not Qualified	262144 bit	4.5 V	e3			.0001 Amp	13.97 mm	150 ns
M27W512-120B6E	STMicroelectronics	OTP ROM	INDUSTRIAL	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	THROUGH-HOLE	PARALLEL	ASYNCHRONOUS		65536 words		3		8	IN-LINE				2.54 mm	85 Cel		64KX8	64K	-40 Cel	MATTE TIN	DUAL	R-PDIP-T28	3.6 V	5.08 mm	15.24 mm	Not Qualified	524288 bit	2.7 V	e3				36.83 mm	100 ns
M87C257-15XC1TR	STMicroelectronics	OTP ROM	COMMERCIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	30 mA	32768 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6		OTP ROMs	1.27 mm	70 Cel	3-STATE	32KX8	32K	0 Cel	MATTE TIN	QUAD	R-PQCC-J32	5.25 V	3.56 mm	11.43 mm	Not Qualified	262144 bit	4.75 V	e3			.0001 Amp	13.97 mm	150 ns
M27W201-150NZ6TR	STMicroelectronics	OTP ROM	INDUSTRIAL	32	TSOP1	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	15 mA	262144 words	COMMON	3	3/3.3	8	SMALL OUTLINE, THIN PROFILE	TSSOP32,.56,20		OTP ROMs	.5 mm	85 Cel	3-STATE	256KX8	256K	-40 Cel	TIN	DUAL	R-PDSO-G32	3.6 V	1.2 mm	8 mm	Not Qualified	2097152 bit	2.7 V	e3			.000015 Amp	12.4 mm	100 ns
M27V101-90B6TR	STMicroelectronics	OTP ROM	INDUSTRIAL	32	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	THROUGH-HOLE	PARALLEL	ASYNCHRONOUS		131072 words		3.3		8	IN-LINE				2.54 mm	85 Cel		128KX8	128K	-40 Cel		DUAL	R-PDIP-T32	3.6 V	5.08 mm	15.24 mm	Not Qualified	1048576 bit	3 V					41.91 mm	90 ns
M27V160-150XM1TR	STMicroelectronics	OTP ROM	COMMERCIAL	44	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	30 mA	1048576 words	COMMON	3.3	3.3	16	SMALL OUTLINE	SOP44,.63	8	OTP ROMs	1.27 mm	70 Cel	3-STATE	1MX16	1M	0 Cel	MATTE TIN	DUAL	R-PDSO-G44	3.465 V	2.8 mm	13.3 mm	Not Qualified	16777216 bit	3.135 V	e3			.00006 Amp	28.2 mm	150 ns
M27W064100M1	STMicroelectronics	OTP ROM	COMMERCIAL	44	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	20 mA	4194304 words	COMMON	3	3/3.3	16	SMALL OUTLINE	SOP44,.63		OTP ROMs	1.27 mm	70 Cel	3-STATE	4MX16	4M	0 Cel	TIN LEAD	DUAL	R-PDSO-G44	3.6 V	3 mm	12.6 mm	Not Qualified	67108864 bit	2.7 V	e0			.0001 Amp	28.5 mm	100 ns

OTP ROM

OTP ROM, or One-Time Programmable Read-Only Memory, is a type of non-volatile computer memory that is programmed once and cannot be reprogrammed. OTP ROM is used to store data that needs to be permanently stored and cannot be changed or updated in the future.

OTP ROM is created using a process similar to that used to manufacture Mask ROM. However, instead of programming the memory during the manufacturing process, OTP ROM is programmed after the manufacturing process, but before it is delivered to the customer. This allows the customer to program the memory with the data that they need to store permanently.

OTP ROM is commonly used in devices such as microcontrollers, smart cards, and other electronic devices that require permanent storage of data. It is ideal for storing critical data, such as system settings, encryption keys, and other sensitive information that needs to be permanently stored and cannot be changed or updated in the future.