SQUARE OTP ROM 1,262

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Part	Manufacturer	Memory IC Type	Temperature Grade	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	Terminal Form	Parallel or Serial	Operating Mode	Maximum Supply Current	No. of Words	Input/Output Type	Nominal Supply Voltage / Vsup (V)	Power Supplies (V)	Memory Width	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Output Characteristics	Organization	No. of Words Code	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Supply Voltage (Vsup)	Maximum Seated Height	Maximum Clock Frequency (fCLK)	Width	Qualification	Memory Density	Minimum Supply Voltage (Vsup)	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Maximum Standby Current	Length	Maximum Access Time	Programming Voltage (V)
M38510/20604BYA	NXP Semiconductors	OTP ROM	MILITARY	24	QCCN	SQUARE	CERAMIC	YES		TTL	38535Q/M;38534H;883B	NO LEAD			140 mA	1024 words		5	5	4	CHIP CARRIER	LCC24,.4SQ	OTP ROMs	1.27 mm	125 Cel		1KX4	1K	-55 Cel	TIN LEAD	QUAD	S-XQCC-N24						Qualified	4096 bit		e0					55 ns
M38510/20602BYA	NXP Semiconductors	OTP ROM	MILITARY	24	QCCN	SQUARE	CERAMIC	YES		TTL	38535Q/M;38534H;883B	NO LEAD			140 mA	1024 words		5	5	4	CHIP CARRIER	LCC24,.4SQ	OTP ROMs	1.27 mm	125 Cel		1KX4	1K	-55 Cel	TIN LEAD	QUAD	S-XQCC-N24						Qualified	4096 bit		e0					85 ns
M38510/20602BYX	NXP Semiconductors	OTP ROM	MILITARY	24	QCCN	SQUARE	UNSPECIFIED	YES	1	BIPOLAR	MIL-M-38510 Class B	NO LEAD	PARALLEL	ASYNCHRONOUS	140 mA	1024 words	COMMON	5		4	CHIP CARRIER	LCC24,.4SQ		1.27 mm	125 Cel	3-STATE	1KX4	1K	-55 Cel		QUAD	S-XQCC-N24		5.5 V	2.24 mm		10.22 mm	Qualified	4096 bit	4.5 V					10.22 mm	85 ns	5
CY7C291AL-35JCR	Infineon Technologies	OTP ROM	COMMERCIAL	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		J BEND	PARALLEL	ASYNCHRONOUS		2048 words		5		8	CHIP CARRIER				70 Cel	3-STATE	2KX8	2K	0 Cel	TIN LEAD	QUAD	S-PQCC-J28		5.5 V				Not Qualified	16384 bit	4.5 V	e0					35 ns
DS2502G+T&R	Maxim Integrated	OTP ROM	INDUSTRIAL	2	VBCC	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		BUTT	SERIAL	ASYNCHRONOUS		128 words	COMMON		3/5	8	CHIP CARRIER, VERY THIN PROFILE	SURF MNT 2,.25SQ	Other Memory ICs		85 Cel		128X8	128	-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	S-PBCC-B2			1 mm		6 mm	Not Qualified	1024 bit		e4				6 mm	15000 ns
XC1718-PC20C	Xilinx	CONFIGURATION MEMORY	COMMERCIAL	20	QCCJ	SQUARE	PLASTIC/EPOXY	YES		CMOS		J BEND				18144 words	COMMON	5	5	1	CHIP CARRIER	LDCC20,.4SQ	OTP ROMs	1.27 mm	70 Cel	3-STATE	18144X1	18144	0 Cel	TIN LEAD	QUAD	S-PQCC-J20	3			5 MHz		Not Qualified			e0	30	225				15
XC1765ELPC2OC	Xilinx	CONFIGURATION MEMORY	COMMERCIAL	20	QCCJ	SQUARE	PLASTIC/EPOXY	YES		CMOS		J BEND			5 mA	65536 words	COMMON	3.3	3.3	1	CHIP CARRIER	LDCC20,.4SQ	OTP ROMs	1.27 mm	70 Cel	3-STATE	64KX1	64K	0 Cel		QUAD	S-PQCC-J20				2.5 MHz		Not Qualified	65536 bit					.00005 Amp
XC1765EPC2OC	Xilinx	CONFIGURATION MEMORY	COMMERCIAL	20	QCCJ	SQUARE	PLASTIC/EPOXY	YES		CMOS		J BEND			10 mA	65536 words	COMMON	5	5	1	CHIP CARRIER	LDCC20,.4SQ	OTP ROMs	1.27 mm	70 Cel	3-STATE	64KX1	64K	0 Cel		QUAD	S-PQCC-J20				10 MHz		Not Qualified	65536 bit					.00005 Amp
XC1765ELPC2OI	Xilinx	CONFIGURATION MEMORY	INDUSTRIAL	20	QCCJ	SQUARE	PLASTIC/EPOXY	YES		CMOS		J BEND			5 mA	65536 words	COMMON	3.3	3.3	1	CHIP CARRIER	LDCC20,.4SQ	OTP ROMs	1.27 mm	85 Cel	3-STATE	64KX1	64K	-40 Cel		QUAD	S-PQCC-J20				2.5 MHz		Not Qualified	65536 bit					.00005 Amp
XC1736A-PC20I	Xilinx	CONFIGURATION MEMORY	INDUSTRIAL	20	QCCJ	SQUARE	PLASTIC/EPOXY	YES		CMOS		J BEND			10 mA	36288 words	COMMON	5	5	1	CHIP CARRIER	LDCC20,.4SQ	OTP ROMs	1.27 mm	85 Cel	3-STATE	36288X1	36288	-40 Cel	TIN LEAD	QUAD	S-PQCC-J20	3			2.5 MHz		Not Qualified			e0	30	225	.0005 Amp			15
XC1765EPC2OI	Xilinx	CONFIGURATION MEMORY	INDUSTRIAL	20	QCCJ	SQUARE	PLASTIC/EPOXY	YES		CMOS		J BEND			10 mA	65536 words	COMMON	5	5	1	CHIP CARRIER	LDCC20,.4SQ	OTP ROMs	1.27 mm	85 Cel	3-STATE	64KX1	64K	-40 Cel		QUAD	S-PQCC-J20				10 MHz		Not Qualified	65536 bit					.00005 Amp
XC1764-PC20I	Xilinx	CONFIGURATION MEMORY	INDUSTRIAL	20	QCCJ	SQUARE	PLASTIC/EPOXY	YES		CMOS		J BEND			10 mA	65536 words	COMMON	5	5	1	CHIP CARRIER	LDCC20,.4SQ	OTP ROMs	1.27 mm	85 Cel	3-STATE	64KX1	64K	-40 Cel	TIN LEAD	QUAD	S-PQCC-J20	3			2.5 MHz		Not Qualified	65536 bit		e0	30	225	.0005 Amp
XC1764-PC20C	Xilinx	CONFIGURATION MEMORY	COMMERCIAL	20	QCCJ	SQUARE	PLASTIC/EPOXY	YES		CMOS		J BEND			10 mA	65536 words	COMMON	5	5	1	CHIP CARRIER	LDCC20,.4SQ	OTP ROMs	1.27 mm	70 Cel	3-STATE	64KX1	64K	0 Cel	TIN LEAD	QUAD	S-PQCC-J20	3			2.5 MHz		Not Qualified	65536 bit		e0	30	225	.0005 Amp
HM4-6642/883	Renesas Electronics	OTP ROM	MILITARY	28	QCCN	SQUARE	CERAMIC	YES	1	CMOS	MIL-STD-883	NO LEAD	PARALLEL	ASYNCHRONOUS	20 mA	512 words		5		8	CHIP CARRIER	LCC28,.45SQ		1.27 mm	125 Cel		512X8	512	-55 Cel		QUAD	S-CQCC-N28		5.5 V	2.54 mm		11.23 mm		4096 bit	4.5 V				.0001 Amp	11.23 mm	220 ns	5

OTP ROM

OTP ROM, or One-Time Programmable Read-Only Memory, is a type of non-volatile computer memory that is programmed once and cannot be reprogrammed. OTP ROM is used to store data that needs to be permanently stored and cannot be changed or updated in the future.

OTP ROM is created using a process similar to that used to manufacture Mask ROM. However, instead of programming the memory during the manufacturing process, OTP ROM is programmed after the manufacturing process, but before it is delivered to the customer. This allows the customer to program the memory with the data that they need to store permanently.

OTP ROM is commonly used in devices such as microcontrollers, smart cards, and other electronic devices that require permanent storage of data. It is ideal for storing critical data, such as system settings, encryption keys, and other sensitive information that needs to be permanently stored and cannot be changed or updated in the future.