COMMERCIAL OTP ROM 2,400+

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Part	Manufacturer	Memory IC Type	Temperature Grade	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Terminal Form	Parallel or Serial	Operating Mode	Maximum Supply Current	No. of Words	Input/Output Type	Nominal Supply Voltage / Vsup (V)	Power Supplies (V)	Memory Width	Package Style (Meter)	Package Equivalence Code	Alternate Memory Width	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Output Characteristics	Organization	No. of Words Code	Terminal Finish	Terminal Position	JESD-30 Code	Maximum Supply Voltage (Vsup)	Maximum Seated Height	Width	Qualification	Memory Density	Minimum Supply Voltage (Vsup)	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Maximum Standby Current	Length	Maximum Access Time	Programming Voltage (V)
M27V405-200N1	STMicroelectronics	OTP ROM	COMMERCIAL	32	TSOP1	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	30 mA	524288 words	COMMON	3.3	3.3	8	SMALL OUTLINE, THIN PROFILE	TSSOP32,.8,20		OTP ROMs	.5 mm	70 Cel	3-STATE	512KX8	512K	TIN LEAD	DUAL	R-PDSO-G32	3.63 V	1.2 mm	8 mm	Not Qualified	4194304 bit	2.97 V		e0			.0001 Amp	18.4 mm	200 ns
M87C257-12X1X	STMicroelectronics	OTP ROM	COMMERCIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS		32768 words		5		8	CHIP CARRIER					70 Cel		32KX8	32K		QUAD	R-PQCC-J32	5.25 V			Not Qualified	262144 bit	4.75 V							120 ns
M27W101-200N1TR	STMicroelectronics	OTP ROM	COMMERCIAL	32	TSOP1	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS		131072 words				8	SMALL OUTLINE, THIN PROFILE				.5 mm	70 Cel		128KX8	128K	TIN	DUAL	R-PDSO-G32	5.5 V	1.2 mm	8 mm	Not Qualified	1048576 bit	2.7 V		e3				18.4 mm	200 ns
M27V201-180N1TR	STMicroelectronics	OTP ROM	COMMERCIAL	32	TSOP1	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	15 mA	262144 words	COMMON	3.3	3.3	8	SMALL OUTLINE, THIN PROFILE	TSSOP32,.8,20		OTP ROMs	.5 mm	70 Cel	3-STATE	256KX8	256K	TIN LEAD	DUAL	R-PDSO-G32	3.6 V	1.2 mm	8 mm	Not Qualified	2097152 bit	3 V		e0			.00002 Amp	18.4 mm	180 ns
M27W101-150K1TR	STMicroelectronics	OTP ROM	COMMERCIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	30 mA	131072 words	COMMON		3/5	8	CHIP CARRIER	LDCC32,.5X.6		OTP ROMs	1.27 mm	70 Cel	3-STATE	128KX8	128K	TIN LEAD	QUAD	R-PQCC-J32	5.5 V	3.56 mm	11.455 mm	Not Qualified	1048576 bit	2.7 V		e0			.00002 Amp	13.995 mm	150 ns
ST2764A-20CP	STMicroelectronics	OTP ROM	COMMERCIAL	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	NMOS	THROUGH-HOLE	PARALLEL	ASYNCHRONOUS		8192 words	COMMON	5	5	8	IN-LINE	DIP28,.6		OTP ROMs	2.54 mm	70 Cel	3-STATE	8KX8	8K	TIN LEAD	DUAL	R-PDIP-T28	5.5 V		15.24 mm	Not Qualified	65536 bit	4.5 V		e0				36.83 mm	200 ns	12.5
M27C160-150B1	STMicroelectronics	OTP ROM	COMMERCIAL	42	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	THROUGH-HOLE	PARALLEL	ASYNCHRONOUS	70 mA	1048576 words	COMMON	5	5	16	IN-LINE	DIP42,.6	8	OTP ROMs	2.54 mm	70 Cel	3-STATE	1MX16	1M	MATTE TIN	DUAL	R-PDIP-T42	5.5 V	5.08 mm	15.24 mm	Not Qualified	16777216 bit	4.5 V	CONFIGURABLE AS 1M X 16	e3			.0001 Amp	52.455 mm	150 ns
M27C405-150B1	STMicroelectronics	OTP ROM	COMMERCIAL	32	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	THROUGH-HOLE	PARALLEL	ASYNCHRONOUS	30 mA	524288 words	COMMON	5	5	8	IN-LINE	DIP32,.6		OTP ROMs	2.54 mm	70 Cel	3-STATE	512KX8	512K	TIN LEAD	DUAL	R-PDIP-T32	5.5 V	5.08 mm	15.24 mm	Not Qualified	4194304 bit	4.5 V		e0			.0001 Amp	41.91 mm	150 ns
M27C1024-12C1X	STMicroelectronics	OTP ROM	COMMERCIAL	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	35 mA	65536 words	COMMON	5	5	16	CHIP CARRIER	LDCC44,.7SQ		OTP ROMs	1.27 mm	70 Cel	3-STATE	64KX16	64K	MATTE TIN	QUAD	S-PQCC-J44	5.5 V	4.7 mm	16.5862 mm	Not Qualified	1048576 bit	4.5 V		e3			.0001 Amp	16.5862 mm	100 ns
M27C512-12XN1XTR	STMicroelectronics		COMMERCIAL	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS	GULL WING			30 mA	65536 words	COMMON	5	5	8	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP28,.53,22		OTP ROMs	.55 mm	70 Cel	3-STATE	64KX8	64K	Tin/Lead (Sn/Pb)	DUAL	R-PDSO-G28					524288 bit			e0			.0001 Amp		120 ns
M27C1001-45N1TR	STMicroelectronics	OTP ROM	COMMERCIAL	32	TSOP1	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	30 mA	131072 words	COMMON	5	5	8	SMALL OUTLINE, THIN PROFILE	TSSOP32,.8,20		OTP ROMs	.5 mm	70 Cel	3-STATE	128KX8	128K	TIN	DUAL	R-PDSO-G32	5.5 V	1.2 mm	8 mm	Not Qualified	1048576 bit	4.5 V		e3			.0001 Amp	18.4 mm	45 ns
M27C64A-20C1TR	STMicroelectronics	OTP ROM	COMMERCIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	30 mA	8192 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6		OTP ROMs	1.27 mm	70 Cel	3-STATE	8KX8	8K	MATTE TIN	QUAD	R-PQCC-J32	5.5 V	3.56 mm	11.455 mm	Not Qualified	65536 bit	4.5 V		e3			.0001 Amp	13.995 mm	200 ns	12.5
M27C512-12XC1	STMicroelectronics	OTP ROM	COMMERCIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	30 mA	65536 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6		OTP ROMs	1.27 mm	70 Cel	3-STATE	64KX8	64K		QUAD	R-PQCC-J32	5.5 V	3.56 mm	11.43 mm	Not Qualified	524288 bit	4.75 V					.0001 Amp	13.97 mm	120 ns
M27C2001-55XK1	STMicroelectronics	OTP ROM	COMMERCIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS		262144 words		5		8	CHIP CARRIER				1.27 mm	70 Cel		256KX8	256K		QUAD	R-PQCC-J32	5.25 V	3.56 mm	11.455 mm	Not Qualified	2097152 bit	4.75 V						13.995 mm	55 ns
M27C256B-80XC1	STMicroelectronics	OTP ROM	COMMERCIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	30 mA	32768 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6		OTP ROMs	1.27 mm	70 Cel	3-STATE	32KX8	32K	MATTE TIN	QUAD	R-PQCC-J32	5.25 V	3.56 mm	11.43 mm	Not Qualified	262144 bit	4.75 V		e3			.0001 Amp	13.97 mm	80 ns	12.75
M27C256B-20XK1X	STMicroelectronics	OTP ROM	COMMERCIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	30 mA	32768 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6		OTP ROMs	1.27 mm	70 Cel	3-STATE	32KX8	32K	MATTE TIN	QUAD	R-PQCC-J32	5.25 V	3.56 mm	11.455 mm	Not Qualified	262144 bit	4.75 V		e3			.0001 Amp	13.995 mm	150 ns	12.75
M27C4002-10C1X	STMicroelectronics	OTP ROM	COMMERCIAL	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	70 mA	262144 words	COMMON	5	5	16	CHIP CARRIER	LDCC44,.7SQ		OTP ROMs	1.27 mm	70 Cel	3-STATE	256KX16	256K	MATTE TIN	QUAD	S-PQCC-J44	5.5 V	4.7 mm	16.5862 mm	Not Qualified	4194304 bit	4.5 V		e3			.0001 Amp	16.5862 mm	100 ns
M27C4002-12N1TR	STMicroelectronics	OTP ROM	COMMERCIAL	40	TSOP2	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	70 mA	262144 words	COMMON	5	5	16	SMALL OUTLINE, THIN PROFILE	TSSOP40,.8,20		OTP ROMs	.5 mm	70 Cel	3-STATE	256KX16	256K	TIN	TRIPLE	R-PTSO-G40	5.5 V	1.2 mm	10 mm	Not Qualified	4194304 bit	4.5 V		e3			.0001 Amp	18.4 mm	120 ns
M27C512-90N1E	STMicroelectronics	OTP ROM	COMMERCIAL	28	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	30 mA	65536 words	COMMON	5	5	8	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	TSSOP28,.53,22		OTP ROMs	.55 mm	70 Cel	3-STATE	64KX8	64K	TIN/TIN BISMUTH	DUAL	R-PDSO-G28	5.5 V	1.25 mm	8 mm	Not Qualified	524288 bit	4.5 V		e3/e6	NOT SPECIFIED	260	.0001 Amp	11.8 mm	90 ns
M27C512-45XC1	STMicroelectronics	OTP ROM	COMMERCIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	30 mA	65536 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6		OTP ROMs	1.27 mm	70 Cel	3-STATE	64KX8	64K		QUAD	R-PQCC-J32	5.5 V	3.56 mm	11.43 mm	Not Qualified	524288 bit	4.75 V		e0	NOT SPECIFIED	NOT SPECIFIED	.0001 Amp	13.97 mm	45 ns
M27C1001-15XC1XTR	STMicroelectronics		COMMERCIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS	J BEND			30 mA	131072 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6		OTP ROMs	1.27 mm	70 Cel	3-STATE	128KX8	128K	Matte Tin (Sn)	QUAD	R-PQCC-J32					1048576 bit			e3			.0001 Amp		120 ns
M27C2001-20K1TR	STMicroelectronics	OTP ROM	COMMERCIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS		262144 words		5		8	CHIP CARRIER				1.27 mm	70 Cel		256KX8	256K		QUAD	R-PQCC-J32	5.5 V	3.56 mm	11.455 mm	Not Qualified	2097152 bit	4.5 V						13.995 mm	150 ns
M27C1024-45XN1	STMicroelectronics	OTP ROM	COMMERCIAL	40	TSOP1	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	35 mA	65536 words	COMMON	5	5	16	SMALL OUTLINE, THIN PROFILE	TSSOP40,.56,20		OTP ROMs	.5 mm	70 Cel	3-STATE	64KX16	64K	TIN LEAD	DUAL	R-PDSO-G40	5.25 V	1.2 mm	10 mm	Not Qualified	1048576 bit	4.75 V		e0			.0001 Amp	12.4 mm	45 ns
M27C512-25N1	STMicroelectronics	OTP ROM	COMMERCIAL	28	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	30 mA	65536 words	COMMON	5	5	8	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	TSSOP28,.53,22		OTP ROMs	.55 mm	70 Cel	3-STATE	64KX8	64K	TIN LEAD	DUAL	R-PDSO-G28	5.5 V	1.25 mm	8 mm	Not Qualified	524288 bit	4.5 V		e0			.0001 Amp	11.8 mm	250 ns
M27C4002-80XN1TR	STMicroelectronics	OTP ROM	COMMERCIAL	40	TSOP2	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	70 mA	262144 words	COMMON	5	5	16	SMALL OUTLINE, THIN PROFILE	TSSOP40,.8,20		OTP ROMs	.5 mm	70 Cel	3-STATE	256KX16	256K	TIN	TRIPLE	R-PTSO-G40	5.25 V	1.2 mm	10 mm	Not Qualified	4194304 bit	4.75 V		e3			.0001 Amp	18.4 mm	80 ns
WS57C128FB-45J	STMicroelectronics	OTP ROM	COMMERCIAL	32	WQCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	139 mA	16384 words	COMMON	5	5	8	CHIP CARRIER, WINDOW	LDCC32,.5X.6		OTP ROMs	1.27 mm	70 Cel	3-STATE	16KX8	16K	TIN LEAD	QUAD	R-PQCC-J32	5.5 V	3.56 mm	11.455 mm	Not Qualified	131072 bit	4.5 V		e0			.0005 Amp	13.995 mm	45 ns	12.5
M27C322-100P1	STMicroelectronics	OTP ROM	COMMERCIAL	42	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	THROUGH-HOLE	PARALLEL	ASYNCHRONOUS	70 mA	2097152 words	COMMON	5	5	16	IN-LINE	DIP42,.6		OTP ROMs	2.54 mm	70 Cel	3-STATE	2MX16	2M	MATTE TIN	DUAL	R-PDIP-T42	5.5 V	5.08 mm	15.24 mm	Not Qualified	33554432 bit	4.5 V		e3			.0001 Amp	52.455 mm	100 ns
M27C256B-70K1X	STMicroelectronics	OTP ROM	COMMERCIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	30 mA	32768 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6		OTP ROMs	1.27 mm	70 Cel	3-STATE	32KX8	32K	MATTE TIN	QUAD	R-PQCC-J32	5.5 V	3.56 mm	11.455 mm	Not Qualified	262144 bit	4.5 V		e3			.0001 Amp	13.995 mm	70 ns	12.75
M27C4001-55N1XTR	STMicroelectronics		COMMERCIAL	32	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS	GULL WING			30 mA	524288 words	COMMON	5	5	8	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP32,.8,20		OTP ROMs	.5 mm	70 Cel	3-STATE	512KX8	512K	Tin/Lead (Sn/Pb)	DUAL	R-PDSO-G32					4194304 bit			e0			.0001 Amp		55 ns
M27C801-120K1XTR	STMicroelectronics		COMMERCIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS	J BEND			35 mA	1048576 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6		OTP ROMs	1.27 mm	70 Cel	3-STATE	1MX8	1M	Matte Tin (Sn)	QUAD	R-PQCC-J32					8388608 bit			e3			.0001 Amp		100 ns
M27C1001-90N1X	STMicroelectronics	OTP ROM	COMMERCIAL	32	TSOP1	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	30 mA	131072 words	COMMON	5	5	8	SMALL OUTLINE, THIN PROFILE	TSSOP32,.8,20		OTP ROMs	.5 mm	70 Cel	3-STATE	128KX8	128K	TIN	DUAL	R-PDSO-G32	5.5 V	1.2 mm	8 mm	Not Qualified	1048576 bit	4.5 V		e3			.0001 Amp	18.4 mm	90 ns
WS57C191C-45J	STMicroelectronics	OTP ROM	COMMERCIAL	28	WQCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	40 mA	2048 words	COMMON	5	5	8	CHIP CARRIER, WINDOW	LDCC28,.5SQ		OTP ROMs	1.27 mm	70 Cel	3-STATE	2KX8	2K	TIN LEAD	QUAD	S-PQCC-J28	5.5 V	4.57 mm	11.48 mm	Not Qualified	16384 bit	4.5 V		e0			.025 Amp	11.48 mm	45 ns	12.75
M27C4001-70XN1XTR	STMicroelectronics		COMMERCIAL	32	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS	GULL WING			30 mA	524288 words	COMMON	5	5	8	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP32,.8,20		OTP ROMs	.5 mm	70 Cel	3-STATE	512KX8	512K	Tin/Lead (Sn/Pb)	DUAL	R-PDSO-G32					4194304 bit			e0			.0001 Amp		70 ns
M27C4002-10XB1X	STMicroelectronics	OTP ROM	COMMERCIAL	40	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	THROUGH-HOLE	PARALLEL	ASYNCHRONOUS	70 mA	262144 words	COMMON	5	5	16	IN-LINE	DIP40,.6		OTP ROMs	2.54 mm	70 Cel	3-STATE	256KX16	256K	MATTE TIN	DUAL	R-PDIP-T40	5.25 V		15.24 mm	Not Qualified	4194304 bit	4.75 V		e3			.0001 Amp	52.18 mm	100 ns
M27C2001-80XN1	STMicroelectronics	OTP ROM	COMMERCIAL	32	TSOP1	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	30 mA	262144 words	COMMON	5	5	8	SMALL OUTLINE, THIN PROFILE	TSSOP32,.8,20		OTP ROMs	.5 mm	70 Cel	3-STATE	256KX8	256K	TIN	DUAL	R-PDSO-G32	5.25 V	1.2 mm	8 mm	Not Qualified	2097152 bit	4.75 V		e3			.0001 Amp	18.4 mm	80 ns
M27C160-90XB1	STMicroelectronics	OTP ROM	COMMERCIAL	42	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	THROUGH-HOLE	PARALLEL	ASYNCHRONOUS	70 mA	1048576 words	COMMON	5	5	16	IN-LINE	DIP42,.6	8	OTP ROMs	2.54 mm	70 Cel	3-STATE	1MX16	1M	MATTE TIN	DUAL	R-PDIP-T42	5.25 V	5.08 mm	15.24 mm	Not Qualified	16777216 bit	4.75 V	CONFIGURABLE AS 1M X 16	e3			.0001 Amp	52.455 mm	90 ns
M27C1001-90N1XTR	STMicroelectronics		COMMERCIAL	32	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS	GULL WING			30 mA	131072 words	COMMON	5	5	8	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP32,.8,20		OTP ROMs	.5 mm	70 Cel	3-STATE	128KX8	128K	Tin/Lead (Sn/Pb)	DUAL	R-PDSO-G32					1048576 bit			e0			.0001 Amp		90 ns
M27C4002-20XB1	STMicroelectronics	OTP ROM	COMMERCIAL	40	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	THROUGH-HOLE	PARALLEL	ASYNCHRONOUS	70 mA	262144 words	COMMON	5	5	16	IN-LINE	DIP40,.6		OTP ROMs	2.54 mm	70 Cel	3-STATE	256KX16	256K	MATTE TIN	DUAL	R-PDIP-T40	5.25 V		15.24 mm	Not Qualified	4194304 bit	4.75 V		e3			.0001 Amp	52.18 mm	200 ns
M27C801-90K1TR	STMicroelectronics	OTP ROM	COMMERCIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS		1048576 words		5		8	CHIP CARRIER				1.27 mm	70 Cel	3-STATE	1MX8	1M	Matte Tin (Sn)	QUAD	R-PQCC-J32	5.5 V	3.56 mm	11.43 mm	Not Qualified	8388608 bit	4.5 V		e3				13.97 mm	90 ns
M27C1001-60B1	STMicroelectronics	OTP ROM	COMMERCIAL	32	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	THROUGH-HOLE	PARALLEL	ASYNCHRONOUS	30 mA	131072 words	COMMON	5	5	8	IN-LINE	DIP32,.6		OTP ROMs	2.54 mm	70 Cel	3-STATE	128KX8	128K	MATTE TIN	DUAL	R-PDIP-T32	5.5 V	4.83 mm	15.24 mm	Not Qualified	1048576 bit	4.5 V		e3			.0001 Amp	42.035 mm	60 ns
M27C1024-35B1X	STMicroelectronics	OTP ROM	COMMERCIAL	40	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	THROUGH-HOLE	PARALLEL	ASYNCHRONOUS	35 mA	65536 words	COMMON	5	5	16	IN-LINE	DIP40,.6		OTP ROMs	2.54 mm	70 Cel	3-STATE	64KX16	64K	MATTE TIN	DUAL	R-PDIP-T40	5.5 V		15.24 mm	Not Qualified	1048576 bit	4.5 V		e3			.0001 Amp	52.18 mm	35 ns
M27C4001-45C1TR	STMicroelectronics	OTP ROM	COMMERCIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	30 mA	524288 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6		OTP ROMs	1.27 mm	70 Cel	3-STATE	512KX8	512K	MATTE TIN	QUAD	R-PQCC-J32	5.5 V	3.56 mm	11.43 mm	Not Qualified	4194304 bit	4.5 V		e3			.0001 Amp	13.97 mm	45 ns
M27C1001-20XN1TR	STMicroelectronics	OTP ROM	COMMERCIAL	32	TSOP1	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	30 mA	131072 words	COMMON	5	5	8	SMALL OUTLINE, THIN PROFILE	TSSOP32,.8,20		OTP ROMs	.5 mm	70 Cel	3-STATE	128KX8	128K	TIN	DUAL	R-PDSO-G32	5.25 V	1.2 mm	8 mm	Not Qualified	1048576 bit	4.75 V		e3			.0001 Amp	18.4 mm	200 ns
M27C256B-60N1TR	STMicroelectronics	OTP ROM	COMMERCIAL	28	TSOP1	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	30 mA	32768 words	COMMON	5	5	8	SMALL OUTLINE, THIN PROFILE	TSSOP28,.53,22		OTP ROMs	.55 mm	70 Cel	3-STATE	32KX8	32K	TIN LEAD	DUAL	R-PDSO-G28	5.5 V	1.2 mm	8 mm	Not Qualified	262144 bit	4.5 V		e0			.0001 Amp	11.8 mm	60 ns	12.75
M27C512-70N1E	STMicroelectronics	OTP ROM	COMMERCIAL	28	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	30 mA	65536 words	COMMON	5	5	8	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	TSSOP28,.53,22		OTP ROMs	.55 mm	70 Cel	3-STATE	64KX8	64K	TIN/TIN BISMUTH	DUAL	R-PDSO-G28	5.5 V	1.25 mm	8 mm	Not Qualified	524288 bit	4.5 V		e3/e6	NOT SPECIFIED	260	.0001 Amp	11.8 mm	70 ns
M27C516-35XN1TR	STMicroelectronics	OTP ROM	COMMERCIAL	40	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	30 mA	32768 words	COMMON	5	5	16	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP40,.56,20		OTP ROMs	.5 mm	70 Cel	3-STATE	32KX16	32K	TIN LEAD	DUAL	R-PDSO-G40	5.25 V	1.2 mm	10 mm	Not Qualified	524288 bit	4.75 V		e0			.0001 Amp	12.4 mm	35 ns
M27C801-100B1	STMicroelectronics	OTP ROM	COMMERCIAL	32	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	THROUGH-HOLE	PARALLEL	ASYNCHRONOUS	35 mA	1048576 words	COMMON	5	5	8	IN-LINE	DIP32,.6		OTP ROMs	2.54 mm	70 Cel	3-STATE	1MX8	1M	MATTE TIN	DUAL	R-PDIP-T32	5.5 V	4.83 mm	15.24 mm	Not Qualified	8388608 bit	4.5 V		e3			.0001 Amp	42.035 mm	100 ns
M27C516-90XN1	STMicroelectronics		COMMERCIAL	40	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS	GULL WING			30 mA	32768 words	COMMON	5	5	16	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP40,.56,20		OTP ROMs	.5 mm	70 Cel	3-STATE	32KX16	32K	Tin/Lead (Sn/Pb)	DUAL	R-PDSO-G40				Not Qualified	524288 bit			e0			.0001 Amp		90 ns

OTP ROM

OTP ROM, or One-Time Programmable Read-Only Memory, is a type of non-volatile computer memory that is programmed once and cannot be reprogrammed. OTP ROM is used to store data that needs to be permanently stored and cannot be changed or updated in the future.

OTP ROM is created using a process similar to that used to manufacture Mask ROM. However, instead of programming the memory during the manufacturing process, OTP ROM is programmed after the manufacturing process, but before it is delivered to the customer. This allows the customer to program the memory with the data that they need to store permanently.

OTP ROM is commonly used in devices such as microcontrollers, smart cards, and other electronic devices that require permanent storage of data. It is ideal for storing critical data, such as system settings, encryption keys, and other sensitive information that needs to be permanently stored and cannot be changed or updated in the future.