INDUSTRIAL OTP ROM 2,400+

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Part RoHS Manufacturer Memory IC Type Temperature Grade No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Surface Mount No. of Functions Technology Screening Level Nominal Negative Supply Voltage Terminal Form Parallel or Serial Operating Mode Maximum Supply Current No. of Words Input/Output Type Nominal Supply Voltage / Vsup (V) Power Supplies (V) Memory Width Package Style (Meter) Package Equivalence Code Alternate Memory Width Sub-Category Minimum Data Retention Time Terminal Pitch Maximum Operating Temperature Reverse Pinout Output Characteristics Organization No. of Words Code Minimum Operating Temperature Terminal Finish Terminal Position No. of Ports Write Protection JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Supply Voltage (Vsup) Maximum Seated Height Endurance Maximum Clock Frequency (fCLK) Width Qualification Memory Density Minimum Supply Voltage (Vsup) Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Maximum Standby Current Length Maximum Access Time Programming Voltage (V)

M27C1024-20XK6TR

STMicroelectronics

OTP ROM

INDUSTRIAL

44

QCCJ

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

J BEND

PARALLEL

ASYNCHRONOUS

65536 words

5

16

CHIP CARRIER

1.27 mm

85 Cel

64KX16

64K

-40 Cel

QUAD

S-PQCC-J44

5.25 V

4.7 mm

16.5862 mm

Not Qualified

1048576 bit

4.75 V

16.5862 mm

100 ns

M27C800-50M6TR

STMicroelectronics

OTP ROM

INDUSTRIAL

44

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

70 mA

524288 words

COMMON

5

5

16

SMALL OUTLINE

SOP44,.63

8

OTP ROMs

1.27 mm

85 Cel

3-STATE

512KX16

512K

-40 Cel

MATTE TIN

DUAL

R-PDSO-G44

5.5 V

2.62 mm

13.3 mm

Not Qualified

8388608 bit

4.5 V

e3

.00005 Amp

28.2 mm

50 ns

M27C4001-45C6XTR

STMicroelectronics

INDUSTRIAL

32

QCCJ

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

J BEND

30 mA

524288 words

COMMON

5

5

8

CHIP CARRIER

LDCC32,.5X.6

OTP ROMs

1.27 mm

85 Cel

3-STATE

512KX8

512K

-40 Cel

Matte Tin (Sn)

QUAD

R-PQCC-J32

4194304 bit

e3

.0001 Amp

45 ns

M27C1024-80N6X

STMicroelectronics

OTP ROM

INDUSTRIAL

40

TSOP1

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

35 mA

65536 words

COMMON

5

5

16

SMALL OUTLINE, THIN PROFILE

TSSOP40,.56,20

OTP ROMs

.5 mm

85 Cel

3-STATE

64KX16

64K

-40 Cel

TIN LEAD

DUAL

R-PDSO-G40

5.5 V

1.2 mm

10 mm

Not Qualified

1048576 bit

4.5 V

e0

.0001 Amp

12.4 mm

80 ns

M27C512-25C6TR

STMicroelectronics

OTP ROM

INDUSTRIAL

32

QCCJ

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

J BEND

PARALLEL

ASYNCHRONOUS

30 mA

65536 words

COMMON

5

5

8

CHIP CARRIER

LDCC32,.5X.6

OTP ROMs

1.27 mm

85 Cel

3-STATE

64KX8

64K

-40 Cel

TIN LEAD

QUAD

R-PQCC-J32

5.5 V

3.56 mm

11.43 mm

Not Qualified

524288 bit

4.5 V

e0

.0001 Amp

13.97 mm

250 ns

M27C256B-10M7

STMicroelectronics

INDUSTRIAL

28

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

30 mA

32768 words

COMMON

5

5

8

SMALL OUTLINE

SOP28,.4

OTP ROMs

1.27 mm

105 Cel

3-STATE

32KX8

32K

-40 Cel

TIN LEAD

DUAL

R-PDSO-G28

Not Qualified

262144 bit

e0

.0001 Amp

100 ns

12.75

M27C1024-45C7X

STMicroelectronics

OTP ROM

INDUSTRIAL

44

QCCJ

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

J BEND

PARALLEL

ASYNCHRONOUS

35 mA

65536 words

COMMON

5

5

16

CHIP CARRIER

LDCC44,.7SQ

OTP ROMs

1.27 mm

105 Cel

3-STATE

64KX16

64K

-40 Cel

MATTE TIN

QUAD

S-PQCC-J44

5.5 V

4.7 mm

16.5862 mm

Not Qualified

1048576 bit

4.5 V

e3

.0001 Amp

16.5862 mm

45 ns

M27C1024-20C6TR

STMicroelectronics

OTP ROM

INDUSTRIAL

44

QCCJ

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

J BEND

PARALLEL

ASYNCHRONOUS

35 mA

65536 words

COMMON

5

5

16

CHIP CARRIER

LDCC44,.7SQ

OTP ROMs

1.27 mm

85 Cel

3-STATE

64KX16

64K

-40 Cel

MATTE TIN

QUAD

S-PQCC-J44

5.5 V

4.7 mm

16.5862 mm

Not Qualified

1048576 bit

4.5 V

e3

.0001 Amp

16.5862 mm

100 ns

M27C2001-25N6

STMicroelectronics

OTP ROM

INDUSTRIAL

32

TSOP1

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

30 mA

262144 words

COMMON

5

5

8

SMALL OUTLINE, THIN PROFILE

TSSOP32,.8,20

OTP ROMs

.5 mm

85 Cel

3-STATE

256KX8

256K

-40 Cel

TIN

DUAL

R-PDSO-G32

5.5 V

1.2 mm

8 mm

Not Qualified

2097152 bit

4.5 V

e3

.0001 Amp

18.4 mm

250 ns

M27C1024-80XN6X

STMicroelectronics

OTP ROM

INDUSTRIAL

40

TSOP1

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

35 mA

65536 words

COMMON

5

5

16

SMALL OUTLINE, THIN PROFILE

TSSOP40,.56,20

OTP ROMs

.5 mm

85 Cel

3-STATE

64KX16

64K

-40 Cel

TIN LEAD

DUAL

R-PDSO-G40

5.25 V

1.2 mm

10 mm

Not Qualified

1048576 bit

4.75 V

e0

.0001 Amp

12.4 mm

80 ns

M27C1024-70N6TR

STMicroelectronics

OTP ROM

INDUSTRIAL

40

TSOP1

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

35 mA

65536 words

COMMON

5

5

16

SMALL OUTLINE, THIN PROFILE

TSSOP40,.56,20

OTP ROMs

.5 mm

85 Cel

3-STATE

64KX16

64K

-40 Cel

TIN LEAD

DUAL

R-PDSO-G40

5.5 V

1.2 mm

10 mm

Not Qualified

1048576 bit

4.5 V

e0

.0001 Amp

12.4 mm

70 ns

M27C256B-10N7X

STMicroelectronics

OTP ROM

INDUSTRIAL

28

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

32768 words

5

8

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

.55 mm

105 Cel

32KX8

32K

-40 Cel

DUAL

R-PDSO-G28

5.5 V

1.25 mm

8 mm

Not Qualified

262144 bit

4.5 V

11.8 mm

100 ns

M27C202-200N6

STMicroelectronics

OTP ROM

INDUSTRIAL

40

TSOP1

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

131072 words

5

16

SMALL OUTLINE, THIN PROFILE

.5 mm

85 Cel

128KX16

128K

-40 Cel

DUAL

R-PDSO-G40

5.5 V

1.2 mm

10 mm

Not Qualified

2097152 bit

4.5 V

12.4 mm

100 ns

M27C4002-10C6XTR

STMicroelectronics

INDUSTRIAL

44

QCCJ

SQUARE

PLASTIC/EPOXY

YES

CMOS

J BEND

70 mA

262144 words

COMMON

5

5

16

CHIP CARRIER

LDCC44,.7SQ

OTP ROMs

1.27 mm

85 Cel

3-STATE

256KX16

256K

-40 Cel

Matte Tin (Sn)

QUAD

S-PQCC-J44

4194304 bit

e3

.0001 Amp

100 ns

M27C4001-15XC6XTR

STMicroelectronics

INDUSTRIAL

32

QCCJ

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

J BEND

30 mA

524288 words

COMMON

5

5

8

CHIP CARRIER

LDCC32,.5X.6

OTP ROMs

1.27 mm

85 Cel

3-STATE

512KX8

512K

-40 Cel

Matte Tin (Sn)

QUAD

R-PQCC-J32

4194304 bit

e3

.0001 Amp

100 ns

M27C405-90K6TR

STMicroelectronics

OTP ROM

INDUSTRIAL

32

QCCJ

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

J BEND

PARALLEL

ASYNCHRONOUS

30 mA

524288 words

COMMON

5

5

8

CHIP CARRIER

LDCC32,.5X.6

OTP ROMs

1.27 mm

85 Cel

3-STATE

512KX8

512K

-40 Cel

TIN LEAD

QUAD

R-PQCC-J32

5.5 V

3.56 mm

11.4554 mm

Not Qualified

4194304 bit

4.5 V

e0

.0001 Amp

13.995 mm

90 ns

M27C256B-80M6

STMicroelectronics

INDUSTRIAL

28

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

30 mA

32768 words

COMMON

5

5

8

SMALL OUTLINE

SOP28,.4

OTP ROMs

1.27 mm

85 Cel

3-STATE

32KX8

32K

-40 Cel

TIN LEAD

DUAL

R-PDSO-G28

Not Qualified

262144 bit

e0

.0001 Amp

80 ns

12.75

M27C2001-15XC6X

STMicroelectronics

OTP ROM

INDUSTRIAL

32

QCCJ

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

J BEND

PARALLEL

ASYNCHRONOUS

30 mA

262144 words

COMMON

5

5

8

CHIP CARRIER

LDCC32,.5X.6

OTP ROMs

1.27 mm

85 Cel

3-STATE

256KX8

256K

-40 Cel

MATTE TIN

QUAD

R-PQCC-J32

5.25 V

3.56 mm

11.43 mm

Not Qualified

2097152 bit

4.75 V

e3

.0001 Amp

13.97 mm

150 ns

M27C2001-70K6X

STMicroelectronics

OTP ROM

INDUSTRIAL

32

QCCJ

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

J BEND

PARALLEL

ASYNCHRONOUS

262144 words

5

8

CHIP CARRIER

1.27 mm

85 Cel

256KX8

256K

-40 Cel

QUAD

R-PQCC-J32

5.5 V

3.56 mm

11.455 mm

Not Qualified

2097152 bit

4.5 V

13.995 mm

70 ns

M27C1001-35XC6

STMicroelectronics

OTP ROM

INDUSTRIAL

32

QCCJ

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

J BEND

PARALLEL

ASYNCHRONOUS

30 mA

131072 words

COMMON

5

5

8

CHIP CARRIER

LDCC32,.5X.6

OTP ROMs

1.27 mm

85 Cel

3-STATE

128KX8

128K

-40 Cel

MATTE TIN

QUAD

R-PQCC-J32

5.25 V

3.56 mm

11.43 mm

Not Qualified

1048576 bit

4.75 V

e3

.0001 Amp

13.97 mm

35 ns

M27C2001-55XN6TR

STMicroelectronics

OTP ROM

INDUSTRIAL

32

TSOP1

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

30 mA

262144 words

COMMON

5

5

8

SMALL OUTLINE, THIN PROFILE

TSSOP32,.8,20

OTP ROMs

.5 mm

85 Cel

3-STATE

256KX8

256K

-40 Cel

TIN

DUAL

R-PDSO-G32

5.25 V

1.2 mm

8 mm

Not Qualified

2097152 bit

4.75 V

e3

.0001 Amp

18.4 mm

55 ns

M27C800-70K6TR

STMicroelectronics

OTP ROM

INDUSTRIAL

44

QCCJ

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

J BEND

PARALLEL

ASYNCHRONOUS

70 mA

524288 words

COMMON

5

5

16

CHIP CARRIER

LDCC44,.7SQ

8

OTP ROMs

1.27 mm

85 Cel

3-STATE

512KX16

512K

-40 Cel

MATTE TIN

QUAD

S-PQCC-J44

5.5 V

4.7 mm

16.5862 mm

Not Qualified

8388608 bit

4.5 V

e3

.00005 Amp

16.5862 mm

70 ns

M27C4002-90XN6X

STMicroelectronics

OTP ROM

INDUSTRIAL

40

TSOP1

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

70 mA

262144 words

COMMON

5

5

16

SMALL OUTLINE, THIN PROFILE

TSSOP40,.8,20

OTP ROMs

.5 mm

85 Cel

3-STATE

256KX16

256K

-40 Cel

TIN

DUAL

R-PDSO-G40

5.25 V

1.2 mm

10 mm

Not Qualified

4194304 bit

4.75 V

e3

.0001 Amp

18.4 mm

90 ns

M27C512-20B6

STMicroelectronics

OTP ROM

INDUSTRIAL

28

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

CMOS

THROUGH-HOLE

PARALLEL

ASYNCHRONOUS

30 mA

65536 words

COMMON

5

5

8

IN-LINE

DIP28,.6

OTP ROMs

2.54 mm

85 Cel

3-STATE

64KX8

64K

-40 Cel

TIN LEAD

DUAL

R-PDIP-T28

5.5 V

5.08 mm

15.24 mm

Not Qualified

524288 bit

4.5 V

e0

.0001 Amp

36.83 mm

200 ns

M27C512-20XB7

STMicroelectronics

INDUSTRIAL

28

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

CMOS

THROUGH-HOLE

30 mA

65536 words

COMMON

5

5

8

IN-LINE

DIP28,.6

OTP ROMs

2.54 mm

105 Cel

3-STATE

64KX8

64K

-40 Cel

Tin/Lead (Sn/Pb)

DUAL

R-PDIP-T28

Not Qualified

524288 bit

e0

.0002 Amp

200 ns

M27C2001-12C6XTR

STMicroelectronics

INDUSTRIAL

32

QCCJ

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

J BEND

30 mA

262144 words

COMMON

5

5

8

CHIP CARRIER

LDCC32,.5X.6

OTP ROMs

1.27 mm

85 Cel

3-STATE

256KX8

256K

-40 Cel

Matte Tin (Sn)

QUAD

R-PQCC-J32

2097152 bit

e3

.0001 Amp

120 ns

M27C256B-10XK6

STMicroelectronics

OTP ROM

INDUSTRIAL

32

QCCJ

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

J BEND

PARALLEL

ASYNCHRONOUS

30 mA

32768 words

COMMON

5

5

8

CHIP CARRIER

LDCC32,.5X.6

OTP ROMs

1.27 mm

85 Cel

3-STATE

32KX8

32K

-40 Cel

MATTE TIN

QUAD

R-PQCC-J32

5.25 V

3.56 mm

11.455 mm

Not Qualified

262144 bit

4.75 V

e3

.0001 Amp

13.995 mm

100 ns

12.75

M27C256B-15B7X

STMicroelectronics

OTP ROM

INDUSTRIAL

28

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

CMOS

THROUGH-HOLE

PARALLEL

ASYNCHRONOUS

32768 words

5

8

IN-LINE

2.54 mm

105 Cel

32KX8

32K

-40 Cel

DUAL

R-PDIP-T28

5.5 V

5.08 mm

15.24 mm

Not Qualified

262144 bit

4.5 V

37.085 mm

150 ns

M27C202-45K6TR

STMicroelectronics

OTP ROM

INDUSTRIAL

44

QCCJ

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

J BEND

PARALLEL

ASYNCHRONOUS

50 mA

131072 words

COMMON

5

5

16

CHIP CARRIER

LDCC44,.7SQ

OTP ROMs

1.27 mm

85 Cel

3-STATE

128KX16

128K

-40 Cel

MATTE TIN

QUAD

S-PQCC-J44

5.5 V

4.7 mm

16.5862 mm

Not Qualified

2097152 bit

4.5 V

e3

.0001 Amp

16.5862 mm

45 ns

M27C1024-15XN6

STMicroelectronics

OTP ROM

INDUSTRIAL

40

TSOP1

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

35 mA

65536 words

COMMON

5

5

16

SMALL OUTLINE, THIN PROFILE

TSSOP40,.56,20

OTP ROMs

.5 mm

85 Cel

3-STATE

64KX16

64K

-40 Cel

TIN LEAD

DUAL

R-PDSO-G40

5.25 V

1.2 mm

10 mm

Not Qualified

1048576 bit

4.75 V

e0

.0001 Amp

12.4 mm

100 ns

M27C4001-10C6XTR

STMicroelectronics

INDUSTRIAL

32

QCCJ

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

J BEND

30 mA

524288 words

COMMON

5

5

8

CHIP CARRIER

LDCC32,.5X.6

OTP ROMs

1.27 mm

85 Cel

3-STATE

512KX8

512K

-40 Cel

Matte Tin (Sn)

QUAD

R-PQCC-J32

4194304 bit

e3

.0001 Amp

100 ns

M27C512-25XC6XTR

STMicroelectronics

INDUSTRIAL

32

QCCJ

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

J BEND

30 mA

65536 words

COMMON

5

5

8

CHIP CARRIER

LDCC32,.5X.6

OTP ROMs

1.27 mm

85 Cel

3-STATE

64KX8

64K

-40 Cel

Matte Tin (Sn)

QUAD

R-PQCC-J32

524288 bit

e3

.0001 Amp

250 ns

M27C512-90C6TR

STMicroelectronics

OTP ROM

INDUSTRIAL

32

QCCJ

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

J BEND

PARALLEL

ASYNCHRONOUS

30 mA

65536 words

COMMON

5

5

8

CHIP CARRIER

LDCC32,.5X.6

OTP ROMs

1.27 mm

85 Cel

3-STATE

64KX8

64K

-40 Cel

TIN LEAD

QUAD

R-PQCC-J32

5.5 V

3.56 mm

11.43 mm

Not Qualified

524288 bit

4.5 V

e0

.0001 Amp

13.97 mm

90 ns

M27C1001-90C6XTR

STMicroelectronics

INDUSTRIAL

32

QCCJ

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

J BEND

30 mA

131072 words

COMMON

5

5

8

CHIP CARRIER

LDCC32,.5X.6

OTP ROMs

1.27 mm

85 Cel

3-STATE

128KX8

128K

-40 Cel

Matte Tin (Sn)

QUAD

R-PQCC-J32

1048576 bit

e3

.0001 Amp

90 ns

M27C256B-15XC7

STMicroelectronics

INDUSTRIAL

32

QCCJ

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

J BEND

30 mA

32768 words

COMMON

5

5

8

CHIP CARRIER

LDCC32,.5X.6

OTP ROMs

1.27 mm

105 Cel

3-STATE

32KX8

32K

-40 Cel

TIN LEAD

QUAD

R-PQCC-J32

Not Qualified

262144 bit

e0

.0001 Amp

150 ns

12.75

M27C256B-80XN7TR

STMicroelectronics

OTP ROM

INDUSTRIAL

28

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

32768 words

5

8

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

.55 mm

105 Cel

32KX8

32K

-40 Cel

DUAL

R-PDSO-G28

5.25 V

1.25 mm

8 mm

Not Qualified

262144 bit

4.75 V

11.8 mm

80 ns

M27C512-80XB6E

STMicroelectronics

OTP ROM

INDUSTRIAL

28

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

CMOS

THROUGH-HOLE

PARALLEL

ASYNCHRONOUS

30 mA

65536 words

COMMON

5

5

8

IN-LINE

DIP28,.6

OTP ROMs

2.54 mm

85 Cel

3-STATE

64KX8

64K

-40 Cel

MATTE TIN

DUAL

R-PDIP-T28

5.5 V

5.08 mm

15.24 mm

Not Qualified

524288 bit

4.75 V

e3

.0001 Amp

36.83 mm

80 ns

M27C256B-90C6TR

STMicroelectronics

OTP ROM

INDUSTRIAL

32

QCCJ

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

J BEND

PARALLEL

ASYNCHRONOUS

30 mA

32768 words

COMMON

5

5

8

CHIP CARRIER

LDCC32,.5X.6

OTP ROMs

1.27 mm

85 Cel

3-STATE

32KX8

32K

-40 Cel

MATTE TIN

QUAD

R-PQCC-J32

5.5 V

3.56 mm

11.43 mm

Not Qualified

262144 bit

4.5 V

e3

.0001 Amp

13.97 mm

90 ns

12.75

M27C4002-20N6TR

STMicroelectronics

OTP ROM

INDUSTRIAL

40

TSOP2

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

70 mA

262144 words

COMMON

5

5

16

SMALL OUTLINE, THIN PROFILE

TSSOP40,.8,20

OTP ROMs

.5 mm

85 Cel

3-STATE

256KX16

256K

-40 Cel

TIN LEAD

TRIPLE

R-PTSO-G40

5.5 V

1.2 mm

10 mm

Not Qualified

4194304 bit

4.5 V

e0

.0001 Amp

18.4 mm

200 ns

M27C1024-15XC6TR

STMicroelectronics

OTP ROM

INDUSTRIAL

44

QCCJ

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

J BEND

PARALLEL

ASYNCHRONOUS

35 mA

65536 words

COMMON

5

5

16

CHIP CARRIER

LDCC44,.7SQ

OTP ROMs

1.27 mm

85 Cel

3-STATE

64KX16

64K

-40 Cel

MATTE TIN

QUAD

S-PQCC-J44

5.25 V

4.7 mm

16.5862 mm

Not Qualified

1048576 bit

4.75 V

e3

.0001 Amp

16.5862 mm

100 ns

M27C1024-10XN6X

STMicroelectronics

OTP ROM

INDUSTRIAL

40

TSOP1

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

35 mA

65536 words

COMMON

5

5

16

SMALL OUTLINE, THIN PROFILE

TSSOP40,.56,20

OTP ROMs

.5 mm

85 Cel

3-STATE

64KX16

64K

-40 Cel

TIN LEAD

DUAL

R-PDSO-G40

5.25 V

1.2 mm

10 mm

Not Qualified

1048576 bit

4.75 V

e0

.0001 Amp

12.4 mm

100 ns

M27C1024-80K7

STMicroelectronics

OTP ROM

INDUSTRIAL

44

QCCJ

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

J BEND

PARALLEL

ASYNCHRONOUS

65536 words

5

16

CHIP CARRIER

1.27 mm

105 Cel

64KX16

64K

-40 Cel

QUAD

S-PQCC-J44

5.5 V

4.7 mm

16.5862 mm

Not Qualified

1048576 bit

4.5 V

16.5862 mm

80 ns

M27C256B-90B7X

STMicroelectronics

OTP ROM

INDUSTRIAL

28

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

CMOS

THROUGH-HOLE

PARALLEL

ASYNCHRONOUS

32768 words

5

8

IN-LINE

2.54 mm

105 Cel

32KX8

32K

-40 Cel

DUAL

R-PDIP-T28

5.5 V

5.08 mm

15.24 mm

Not Qualified

262144 bit

4.5 V

37.085 mm

90 ns

M27C256B-60B7

STMicroelectronics

INDUSTRIAL

28

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

CMOS

THROUGH-HOLE

30 mA

32768 words

COMMON

5

5

8

IN-LINE

DIP28,.6

OTP ROMs

2.54 mm

105 Cel

3-STATE

32KX8

32K

-40 Cel

TIN LEAD

DUAL

R-PDIP-T28

Not Qualified

262144 bit

e0

.0001 Amp

60 ns

12.75

M27C1024-70B7X

STMicroelectronics

OTP ROM

INDUSTRIAL

40

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

CMOS

THROUGH-HOLE

PARALLEL

ASYNCHRONOUS

35 mA

65536 words

COMMON

5

5

16

IN-LINE

DIP40,.6

OTP ROMs

2.54 mm

105 Cel

3-STATE

64KX16

64K

-40 Cel

MATTE TIN

DUAL

R-PDIP-T40

5.5 V

15.24 mm

Not Qualified

1048576 bit

4.5 V

e3

.0001 Amp

52.18 mm

70 ns

M27C801-150N6

STMicroelectronics

OTP ROM

INDUSTRIAL

32

TSOP1

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

35 mA

1048576 words

COMMON

5

5

8

SMALL OUTLINE, THIN PROFILE

TSSOP32,.8,20

OTP ROMs

.5 mm

85 Cel

3-STATE

1MX8

1M

-40 Cel

TIN

DUAL

R-PDSO-G32

5.5 V

1.2 mm

8 mm

Not Qualified

8388608 bit

4.5 V

e3

.0001 Amp

18.4 mm

150 ns

M27C405-80N6TR

STMicroelectronics

OTP ROM

INDUSTRIAL

32

TSOP1

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

30 mA

524288 words

COMMON

5

5

8

SMALL OUTLINE, THIN PROFILE

TSSOP32,.8,20

OTP ROMs

.5 mm

85 Cel

3-STATE

512KX8

512K

-40 Cel

TIN LEAD

DUAL

R-PDSO-G32

5.5 V

1.2 mm

8 mm

Not Qualified

4194304 bit

4.5 V

e0

.0001 Amp

18.4 mm

80 ns

M27C4002-12N6TR

STMicroelectronics

OTP ROM

INDUSTRIAL

40

TSOP2

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

70 mA

262144 words

COMMON

5

5

16

SMALL OUTLINE, THIN PROFILE

TSSOP40,.8,20

OTP ROMs

.5 mm

85 Cel

3-STATE

256KX16

256K

-40 Cel

TIN

TRIPLE

R-PTSO-G40

5.5 V

1.2 mm

10 mm

Not Qualified

4194304 bit

4.5 V

e3

.0001 Amp

18.4 mm

120 ns

OTP ROM

OTP ROM, or One-Time Programmable Read-Only Memory, is a type of non-volatile computer memory that is programmed once and cannot be reprogrammed. OTP ROM is used to store data that needs to be permanently stored and cannot be changed or updated in the future.

OTP ROM is created using a process similar to that used to manufacture Mask ROM. However, instead of programming the memory during the manufacturing process, OTP ROM is programmed after the manufacturing process, but before it is delivered to the customer. This allows the customer to program the memory with the data that they need to store permanently.

OTP ROM is commonly used in devices such as microcontrollers, smart cards, and other electronic devices that require permanent storage of data. It is ideal for storing critical data, such as system settings, encryption keys, and other sensitive information that needs to be permanently stored and cannot be changed or updated in the future.