INDUSTRIAL OTP ROM 2,400+

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Part	Manufacturer	Memory IC Type	Temperature Grade	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Terminal Form	Parallel or Serial	Operating Mode	Maximum Supply Current	No. of Words	Input/Output Type	Nominal Supply Voltage / Vsup (V)	Power Supplies (V)	Memory Width	Package Style (Meter)	Package Equivalence Code	Alternate Memory Width	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Reverse Pinout	Output Characteristics	Organization	No. of Words Code	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Supply Voltage (Vsup)	Maximum Seated Height	Maximum Clock Frequency (fCLK)	Width	Qualification	Memory Density	Minimum Supply Voltage (Vsup)	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Maximum Standby Current	Length	Maximum Access Time	Programming Voltage (V)
TMS27PC128-1NE4	Texas Instruments	OTP ROM	INDUSTRIAL	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	THROUGH-HOLE	PARALLEL	ASYNCHRONOUS	30 mA	16384 words	COMMON	5	5	8	IN-LINE	DIP28,.6		OTP ROMs	2.54 mm	85 Cel		3-STATE	16KX8	16K	-40 Cel		DUAL	R-PDIP-T28		5.25 V	5.08 mm		15.24 mm	Not Qualified	131072 bit	4.75 V			NOT SPECIFIED	NOT SPECIFIED	.00025 Amp	36.32 mm	150 ns	13
TMS27PC256-100FME	Texas Instruments	OTP ROM	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	30 mA	32768 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6		OTP ROMs	1.27 mm	85 Cel		3-STATE	32KX8	32K	-40 Cel		QUAD	R-PQCC-J32		5.25 V	3.56 mm		11.43 mm	Not Qualified	262144 bit	4.75 V			NOT SPECIFIED	NOT SPECIFIED	.00025 Amp	13.97 mm	100 ns	13
TMS27PC040-15FME	Texas Instruments	OTP ROM	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS		524288 words		5		8	CHIP CARRIER				1.27 mm	85 Cel		3-STATE	512KX8	512K	-40 Cel		QUAD	R-PQCC-J32		5.5 V	3.56 mm		11.43 mm	Not Qualified	4194304 bit	4.5 V						13.97 mm	150 ns
TMS27PC400-10NE4	Texas Instruments	OTP ROM	INDUSTRIAL	40	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	THROUGH-HOLE	PARALLEL	ASYNCHRONOUS	50 mA	524288 words	COMMON	5	5	8	IN-LINE	DIP32,.6	16	OTP ROMs	2.54 mm	85 Cel		3-STATE	512KX8	512K	-40 Cel		DUAL	R-PDIP-T40		5.5 V	5.08 mm		15.24 mm	Not Qualified	4194304 bit	4.5 V			NOT SPECIFIED	NOT SPECIFIED	.0001 Amp	52.455 mm	100 ns
TMS27PC512-100FME	Texas Instruments	OTP ROM	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	30 mA	65536 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6		OTP ROMs	1.27 mm	85 Cel		3-STATE	64KX8	64K	-40 Cel		QUAD	R-PQCC-J32		5.25 V	3.56 mm		11.43 mm	Not Qualified	524288 bit	4.75 V			NOT SPECIFIED	NOT SPECIFIED	.00025 Amp	13.97 mm	100 ns
TMS27PC256-25FME	Texas Instruments	OTP ROM	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	30 mA	32768 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6		OTP ROMs	1.27 mm	85 Cel		3-STATE	32KX8	32K	-40 Cel		QUAD	R-PQCC-J32		5.5 V	3.56 mm		11.43 mm	Not Qualified	262144 bit	4.5 V			NOT SPECIFIED	NOT SPECIFIED	.00025 Amp	13.97 mm	250 ns	13
TMS27PC256-150FME	Texas Instruments	OTP ROM	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	30 mA	32768 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6		OTP ROMs	1.27 mm	85 Cel		3-STATE	32KX8	32K	-40 Cel		QUAD	R-PQCC-J32		5.25 V	3.56 mm		11.43 mm	Not Qualified	262144 bit	4.75 V			NOT SPECIFIED	NOT SPECIFIED	.00025 Amp	13.97 mm	150 ns	13
TMS27PC400-15NE	Texas Instruments	OTP ROM	INDUSTRIAL	40	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	THROUGH-HOLE	PARALLEL	ASYNCHRONOUS	50 mA	524288 words	COMMON	5	5	8	IN-LINE	DIP32,.6	16	OTP ROMs	2.54 mm	85 Cel		3-STATE	512KX8	512K	-40 Cel		DUAL	R-PDIP-T40		5.5 V	5.08 mm		15.24 mm	Not Qualified	4194304 bit	4.5 V			NOT SPECIFIED	NOT SPECIFIED	.0001 Amp	52.455 mm	150 ns
TMS27PC210A-12FNE	Texas Instruments	OTP ROM	INDUSTRIAL	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	50 mA	65536 words	COMMON	5	5	16	CHIP CARRIER	LDCC44,.7SQ		OTP ROMs	1.27 mm	85 Cel		3-STATE	64KX16	64K	-40 Cel		QUAD	S-PQCC-J44		5.5 V	4.57 mm		16.5862 mm	Not Qualified	1048576 bit	4.5 V			NOT SPECIFIED	NOT SPECIFIED	.0001 Amp	16.5862 mm	120 ns
TMS27PC512-2NE4	Texas Instruments	OTP ROM	INDUSTRIAL	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	THROUGH-HOLE	PARALLEL	ASYNCHRONOUS	30 mA	65536 words	COMMON	5	5	8	IN-LINE	DIP28,.6		OTP ROMs	2.54 mm	85 Cel		3-STATE	64KX8	64K	-40 Cel		DUAL	R-PDIP-T28		5.25 V	5.08 mm		15.24 mm	Not Qualified	524288 bit	4.75 V			NOT SPECIFIED	NOT SPECIFIED	.00025 Amp	36.32 mm	200 ns
TMS27PC512-12DDE	Texas Instruments	OTP ROM	INDUSTRIAL	32	TSOP1	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	30 mA	65536 words	COMMON	5	5	8	SMALL OUTLINE, THIN PROFILE	TSSOP32,.8,20		OTP ROMs	.5 mm	85 Cel		3-STATE	64KX8	64K	-40 Cel		DUAL	R-PDSO-G32		5.5 V	1.2 mm		8 mm	Not Qualified	524288 bit	4.5 V			NOT SPECIFIED	NOT SPECIFIED	.00025 Amp	18.415 mm	120 ns
TMS27PC400-10NE	Texas Instruments	OTP ROM	INDUSTRIAL	40	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	THROUGH-HOLE	PARALLEL	ASYNCHRONOUS	50 mA	524288 words	COMMON	5	5	8	IN-LINE	DIP32,.6	16	OTP ROMs	2.54 mm	85 Cel		3-STATE	512KX8	512K	-40 Cel		DUAL	R-PDIP-T40		5.5 V	5.08 mm		15.24 mm	Not Qualified	4194304 bit	4.5 V			NOT SPECIFIED	NOT SPECIFIED	.0001 Amp	52.455 mm	100 ns
TMS27PC512-15FME	Texas Instruments	OTP ROM	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	30 mA	65536 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6		OTP ROMs	1.27 mm	85 Cel		3-STATE	64KX8	64K	-40 Cel		QUAD	R-PQCC-J32		5.5 V	3.56 mm		11.43 mm	Not Qualified	524288 bit	4.5 V			NOT SPECIFIED	NOT SPECIFIED	.00025 Amp	13.97 mm	150 ns
TMS27PC010A-12FME4	Texas Instruments	OTP ROM	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	30 mA	131072 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6		OTP ROMs	1.27 mm	85 Cel		3-STATE	128KX8	128K	-40 Cel		QUAD	R-PQCC-J32		5.5 V	3.56 mm		11.43 mm	Not Qualified	1048576 bit	4.5 V			NOT SPECIFIED	NOT SPECIFIED	.0001 Amp	13.97 mm	120 ns
TMS27PC510-120FME4	Texas Instruments	OTP ROM	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	250 mA	65536 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6		OTP ROMs	1.27 mm	85 Cel		3-STATE	64KX8	64K	-40 Cel		QUAD	R-PQCC-J32		5.25 V	3.56 mm		11.43 mm	Not Qualified	524288 bit	4.75 V			NOT SPECIFIED	NOT SPECIFIED	.00003 Amp	13.97 mm	120 ns
TMS27PC510-20NE4	Texas Instruments	OTP ROM	INDUSTRIAL	32	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	THROUGH-HOLE	PARALLEL	ASYNCHRONOUS	30 mA	65536 words	COMMON	5	5	8	IN-LINE	DIP32,.6		OTP ROMs	2.54 mm	85 Cel		3-STATE	64KX8	64K	-40 Cel		DUAL	R-PDIP-T32		5.5 V	5.08 mm		15.24 mm	Not Qualified	524288 bit	4.5 V			NOT SPECIFIED	NOT SPECIFIED	.00025 Amp	41.4 mm	200 ns
TMS27PC128-2FME4	Texas Instruments	OTP ROM	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	30 mA	16384 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6		OTP ROMs	1.27 mm	85 Cel		3-STATE	16KX8	16K	-40 Cel		QUAD	R-PQCC-J32		5.25 V	3.56 mm		11.43 mm	Not Qualified	131072 bit	4.75 V			NOT SPECIFIED	NOT SPECIFIED	.00025 Amp	13.97 mm	200 ns	13
TMS27PC256-20NE	Texas Instruments	OTP ROM	INDUSTRIAL	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	THROUGH-HOLE	PARALLEL	ASYNCHRONOUS	30 mA	32768 words	COMMON	5	5	8	IN-LINE	DIP28,.6		OTP ROMs	2.54 mm	85 Cel		3-STATE	32KX8	32K	-40 Cel		DUAL	R-PDIP-T28		5.5 V	5.08 mm		15.24 mm	Not Qualified	262144 bit	4.5 V			NOT SPECIFIED	NOT SPECIFIED	.00025 Amp	36.32 mm	200 ns	13
TMS27PC256NE	Texas Instruments	OTP ROM	INDUSTRIAL	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	THROUGH-HOLE	PARALLEL	ASYNCHRONOUS	30 mA	32768 words	COMMON	5	5	8	IN-LINE	DIP28,.6		OTP ROMs	2.54 mm	85 Cel		3-STATE	32KX8	32K	-40 Cel		DUAL	R-PDIP-T28		5.25 V	5.08 mm		15.24 mm	Not Qualified	262144 bit	4.75 V			NOT SPECIFIED	NOT SPECIFIED	.00025 Amp	36.32 mm	250 ns	13
TMS27PC010A-12DUE	Texas Instruments	OTP ROM	INDUSTRIAL	32	TSOP1-R	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	30 mA	131072 words	COMMON	5	5	8	SMALL OUTLINE, THIN PROFILE	TSSOP32,.8,20		OTP ROMs	.5 mm	85 Cel	YES	3-STATE	128KX8	128K	-40 Cel		DUAL	R-PDSO-G32		5.5 V	1.2 mm		8 mm	Not Qualified	1048576 bit	4.5 V			NOT SPECIFIED	NOT SPECIFIED	.0001 Amp	18.415 mm	120 ns
TMS27PC512NE	Texas Instruments	OTP ROM	INDUSTRIAL	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	THROUGH-HOLE	PARALLEL	ASYNCHRONOUS	30 mA	65536 words	COMMON	5	5	8	IN-LINE	DIP28,.6		OTP ROMs	2.54 mm	85 Cel		3-STATE	64KX8	64K	-40 Cel		DUAL	R-PDIP-T28		5.25 V	5.08 mm		15.24 mm	Not Qualified	524288 bit	4.75 V			NOT SPECIFIED	NOT SPECIFIED	.00025 Amp	36.32 mm	250 ns
BQ2022DBZRG4	Texas Instruments	OTP ROM	INDUSTRIAL	3	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	SERIAL	ASYNCHRONOUS	.02 mA	1024 words	COMMON	2.7	3/5	1	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TO-236		OTP ROMs	.95 mm	85 Cel		OPEN-DRAIN	1KX1	1K	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G3	1	5.5 V	1.12 mm	.01667 MHz	1.3 mm	Not Qualified	1024 bit	2.65 V	ORGANIZED AS 4 PAGES OF 32 BYTES EACH	e4	30	260		2.92 mm
BQ2022DBZR	Texas Instruments	OTP ROM	INDUSTRIAL	3	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	SERIAL	ASYNCHRONOUS	.02 mA	1024 words	COMMON	2.7	3/5	1	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TO-236		OTP ROMs	.95 mm	85 Cel		OPEN-DRAIN	1KX1	1K	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G3	1	5.5 V	1.12 mm	.01667 MHz	1.3 mm	Not Qualified	1024 bit	2.65 V	ORGANIZED AS 4 PAGES OF 32 BYTES EACH	e4	30	260		2.92 mm
DS1986U-F3	Analog Devices	OTP ROM	INDUSTRIAL	2		ROUND	METAL	YES	1	CMOS	NO LEAD	SERIAL	SYNCHRONOUS		8192 words				8	DISK BUTTON					85 Cel			8KX8	8K	-40 Cel	TIN LEAD	END	O-MEDB-N2		6 V				Not Qualified	65536 bit	2.8 V		e0
DS1986U-F3-PPPP	Analog Devices	OTP ROM	INDUSTRIAL	2		ROUND	METAL	YES	1	CMOS	NO LEAD	SERIAL	SYNCHRONOUS		8192 words				8	DISK BUTTON					85 Cel			8KX8	8K	-40 Cel	TIN LEAD	END	O-MEDB-N2		6 V				Not Qualified	65536 bit	2.8 V		e0
DS1985U-F5-PPPP	Analog Devices	OTP ROM	INDUSTRIAL	2		ROUND	METAL	YES	1	CMOS	NO LEAD	SERIAL	SYNCHRONOUS		2048 words				8	DISK BUTTON					85 Cel			2KX8	2K	-40 Cel	TIN LEAD	END	O-MEDB-N2		6 V				Not Qualified	16384 bit	2.8 V		e0
DS1985U-F3	Analog Devices	OTP ROM	INDUSTRIAL	2		ROUND	METAL	YES	1	CMOS	NO LEAD	SERIAL	SYNCHRONOUS		2048 words				8	DISK BUTTON					85 Cel			2KX8	2K	-40 Cel	TIN LEAD	END	O-MEDB-N2		6 V				Not Qualified	16384 bit	2.8 V		e0
DS1422	Analog Devices	OTP ROM	INDUSTRIAL	2		ROUND	METAL	YES	1	CMOS	NO LEAD	SERIAL	SYNCHRONOUS		128 words			3/5	8	DISK BUTTON	BUTTON,.68IN		Other Memory ICs		85 Cel			128X8	128	-40 Cel	TIN LEAD	END	O-MEDB-N2		6 V				Not Qualified	1024 bit	2.8 V		e0
DS1982-F5+	Analog Devices	OTP ROM	INDUSTRIAL	2		ROUND	METAL	YES	1	CMOS	NO LEAD	SERIAL	ASYNCHRONOUS		1024 words	COMMON	5	3/5	1	DISK BUTTON	BUTTON,.68IN		Other Memory ICs		85 Cel			1KX1	1K	-40 Cel	Matte Tin (Sn) - annealed	END	O-MEDB-N2	1	6 V				Not Qualified	1024 bit	2.8 V	MICROLAN COMPATIBLE	e3					15000 ns
DS1986U-F5	Analog Devices	OTP ROM	INDUSTRIAL	2		ROUND	METAL	YES	1	CMOS	NO LEAD	SERIAL	SYNCHRONOUS		8192 words				8	DISK BUTTON					85 Cel			8KX8	8K	-40 Cel	TIN LEAD	END	O-MEDB-N2		6 V				Not Qualified	65536 bit	2.8 V		e0
DS1985U-F3-PPPP	Analog Devices	OTP ROM	INDUSTRIAL	2		ROUND	METAL	YES	1	CMOS	NO LEAD	SERIAL	SYNCHRONOUS		2048 words				8	DISK BUTTON					85 Cel			2KX8	2K	-40 Cel	TIN LEAD	END	O-MEDB-N2		6 V				Not Qualified	16384 bit	2.8 V		e0
DS1986U-F5-PPPP	Analog Devices	OTP ROM	INDUSTRIAL	2		ROUND	METAL	YES	1	CMOS	NO LEAD	SERIAL	SYNCHRONOUS		8192 words				8	DISK BUTTON					85 Cel			8KX8	8K	-40 Cel	TIN LEAD	END	O-MEDB-N2		6 V				Not Qualified	65536 bit	2.8 V		e0
DS2502-E64+	Analog Devices	OTP ROM	INDUSTRIAL	3	TO-92	ROUND	PLASTIC/EPOXY	NO	1	MOS	THROUGH-HOLE	SERIAL	SYNCHRONOUS		1024 words		5		1	CYLINDRICAL					85 Cel			1KX1	1K	-40 Cel	Matte Tin (Sn) - annealed	BOTTOM	O-PBCY-T3		6 V				Not Qualified	1024 bit	2.8 V		e3		250
DS2506-UNW	Analog Devices	OTP ROM	INDUSTRIAL	3	TO-92	ROUND	PLASTIC/EPOXY	NO	1	CMOS	THROUGH-HOLE	SERIAL	SYNCHRONOUS		8192 words	COMMON		3/5	8	CYLINDRICAL	SIP3,.1,50		Other Memory ICs	1.27 mm	85 Cel			8KX8	8K	-40 Cel	TIN LEAD	BOTTOM	O-PBCY-T3		6 V				Not Qualified	65536 bit	2.8 V	MICROLAN COMPATIBLE	e0
DS2406+T&R	Analog Devices	OTP ROM	INDUSTRIAL	3	TO-92	ROUND	PLASTIC/EPOXY	NO	1	CMOS	THROUGH-HOLE	SERIAL	ASYNCHRONOUS		1024 words		4	3/5	1	CYLINDRICAL	SIP3,.1,50		SRAMs	1.27 mm	85 Cel			1KX1	1K	-40 Cel	Matte Tin (Sn) - annealed	BOTTOM	O-PBCY-T3		6 V				Not Qualified	1024 bit	2.8 V		e3		250
DS25051AT	Analog Devices	OTP ROM	INDUSTRIAL	3	TO-92	ROUND	PLASTIC/EPOXY	NO	1	CMOS	THROUGH-HOLE	SERIAL	ASYNCHRONOUS		16384 words				1	CYLINDRICAL					85 Cel			16KX1	16K	-40 Cel	TIN LEAD	BOTTOM	O-PBCY-T3		6 V				Not Qualified	16384 bit	2.8 V		e0
DS25051A	Analog Devices	OTP ROM	INDUSTRIAL	3	TO-92	ROUND	PLASTIC/EPOXY	NO	1	CMOS	THROUGH-HOLE	SERIAL	ASYNCHRONOUS		16384 words				1	CYLINDRICAL					85 Cel			16KX1	16K	-40 Cel	TIN LEAD	BOTTOM	O-PBCY-T3		6 V				Not Qualified	16384 bit	2.8 V		e0
DS25021AT	Analog Devices	OTP ROM	INDUSTRIAL	3	TO-92	ROUND	PLASTIC/EPOXY	NO	1	CMOS	THROUGH-HOLE	SERIAL	ASYNCHRONOUS		1024 words				1	CYLINDRICAL					85 Cel			1KX1	1K	-40 Cel	TIN LEAD	BOTTOM	O-PBCY-T3		6 V				Not Qualified	1024 bit	2.8 V		e0
DS25021A	Analog Devices	OTP ROM	INDUSTRIAL	3	TO-92	ROUND	PLASTIC/EPOXY	NO	1	CMOS	THROUGH-HOLE	SERIAL	ASYNCHRONOUS		1024 words				1	CYLINDRICAL					85 Cel			1KX1	1K	-40 Cel	TIN LEAD	BOTTOM	O-PBCY-T3		6 V				Not Qualified	1024 bit	2.8 V		e0
DS2502SY	Analog Devices	OTP ROM	INDUSTRIAL	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	SERIAL	ASYNCHRONOUS		1024 words				1	SMALL OUTLINE				1.27 mm	85 Cel			1KX1	1K	-40 Cel	TIN LEAD	DUAL	R-PDSO-G8	1	6 V	1.75 mm		3.9 mm	Not Qualified	1024 bit	2.8 V		e0				4.9 mm
DS2406+	Analog Devices	OTP ROM	INDUSTRIAL	3	TO-92	ROUND	PLASTIC/EPOXY	NO	1	CMOS	THROUGH-HOLE	SERIAL	ASYNCHRONOUS		1024 words		4	3/5	1	CYLINDRICAL	SIP3,.1,50		SRAMs	1.27 mm	85 Cel			1KX1	1K	-40 Cel	Matte Tin (Sn) - annealed	BOTTOM	O-PBCY-T3		6 V				Not Qualified	1024 bit	2.8 V		e3		250
DS2506P-UNW	Analog Devices	OTP ROM	INDUSTRIAL	6	LSOC	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	C BEND	SERIAL	SYNCHRONOUS		8192 words				8	SMALL OUTLINE, LOW PROFILE				1.27 mm	85 Cel			8KX8	8K	-40 Cel	TIN LEAD	DUAL	R-PDSO-C6		6 V	1.5 mm		3.76 mm	Not Qualified	65536 bit	2.8 V	MICROLAN COMPATIBLE	e0				3.94 mm
DS2506S-UNW	Analog Devices	OTP ROM	INDUSTRIAL	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	SERIAL	ASYNCHRONOUS		65536 words	COMMON		3/5	1	SMALL OUTLINE	SOP8,.3		Other Memory ICs	1.27 mm	85 Cel			64KX1	64K	-40 Cel	TIN LEAD	DUAL	R-PDSO-G8	1	6 V	1.75 mm		3.9 mm	Not Qualified	65536 bit	2.8 V		e0				4.9 mm
M27V801-120N6	STMicroelectronics	OTP ROM	INDUSTRIAL	32	TSOP1	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	15 mA	1048576 words	COMMON	3.3	3.3	8	SMALL OUTLINE, THIN PROFILE	TSSOP32,.8,20		OTP ROMs	.5 mm	85 Cel		3-STATE	1MX8	1M	-40 Cel	TIN LEAD	DUAL	R-PDSO-G32		3.63 V	1.2 mm		8 mm	Not Qualified	8388608 bit	2.97 V		e0			.00002 Amp	18.4 mm	120 ns
M27V322-100P6	STMicroelectronics	OTP ROM	INDUSTRIAL	42	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	THROUGH-HOLE	PARALLEL	ASYNCHRONOUS	30 mA	2097152 words	COMMON	3.3	3.3	16	IN-LINE	DIP42,.6		OTP ROMs	2.54 mm	85 Cel		3-STATE	2MX16	2M	-40 Cel	MATTE TIN	DUAL	R-PDIP-T42		3.6 V	5.08 mm		15.24 mm	Not Qualified	33554432 bit	3 V		e3			.00006 Amp	52.455 mm	100 ns
M27V405-200K6TR	STMicroelectronics	OTP ROM	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	15 mA	524288 words	COMMON	3.3	3.3	8	CHIP CARRIER	LDCC32,.5X.6		Other Memory ICs	1.27 mm	85 Cel		3-STATE	512KX8	512K	-40 Cel	TIN LEAD	QUAD	R-PQCC-J32		3.63 V	3.56 mm		11.455 mm	Not Qualified	4194304 bit	2.97 V		e0			.00002 Amp	13.995 mm	200 ns
M27W512-100K6	STMicroelectronics	OTP ROM	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	15 mA	65536 words	COMMON	3	3/3.3	8	CHIP CARRIER	LDCC32,.5X.6		OTP ROMs	1.27 mm	85 Cel		3-STATE	64KX8	64K	-40 Cel	TIN	QUAD	R-PQCC-J32		3.6 V	3.556 mm		11.43 mm	Not Qualified	524288 bit	2.7 V		e3			.000015 Amp	13.97 mm	100 ns
M27W512-200N6E	STMicroelectronics	OTP ROM	INDUSTRIAL	28	TSOP1	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS		65536 words		3		8	SMALL OUTLINE, THIN PROFILE				.55 mm	85 Cel			64KX8	64K	-40 Cel	TIN/TIN BISMUTH	DUAL	R-PDSO-G28		3.6 V	1.25 mm		8 mm	Not Qualified	524288 bit	2.7 V		e3/e6	NOT SPECIFIED	260		11.8 mm	100 ns

OTP ROM

OTP ROM, or One-Time Programmable Read-Only Memory, is a type of non-volatile computer memory that is programmed once and cannot be reprogrammed. OTP ROM is used to store data that needs to be permanently stored and cannot be changed or updated in the future.

OTP ROM is created using a process similar to that used to manufacture Mask ROM. However, instead of programming the memory during the manufacturing process, OTP ROM is programmed after the manufacturing process, but before it is delivered to the customer. This allows the customer to program the memory with the data that they need to store permanently.

OTP ROM is commonly used in devices such as microcontrollers, smart cards, and other electronic devices that require permanent storage of data. It is ideal for storing critical data, such as system settings, encryption keys, and other sensitive information that needs to be permanently stored and cannot be changed or updated in the future.