Part | RoHS | Manufacturer | Memory IC Type | Temperature Grade | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Surface Mount | No. of Functions | Technology | Screening Level | Nominal Negative Supply Voltage | Terminal Form | Parallel or Serial | Operating Mode | Maximum Supply Current | No. of Words | Input/Output Type | Nominal Supply Voltage / Vsup (V) | Power Supplies (V) | Memory Width | Package Style (Meter) | Package Equivalence Code | Alternate Memory Width | Sub-Category | Minimum Data Retention Time | Terminal Pitch | Maximum Operating Temperature | Reverse Pinout | Output Characteristics | Organization | No. of Words Code | Minimum Operating Temperature | Terminal Finish | Terminal Position | No. of Ports | Write Protection | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Endurance | Maximum Clock Frequency (fCLK) | Width | Qualification | Memory Density | Minimum Supply Voltage (Vsup) | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Maximum Standby Current | Length | Maximum Access Time | Programming Voltage (V) |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Defense Logistics Agency |
OTP ROM |
MILITARY |
24 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
SYNCHRONOUS |
512 words |
5 |
8 |
IN-LINE |
125 Cel |
512X8 |
512 |
-55 Cel |
TIN LEAD |
DUAL |
R-GDIP-T24 |
5.5 V |
Qualified |
4096 bit |
4.5 V |
e0 |
|||||||||||||||||||||||||||||
Defense Logistics Agency |
OTP ROM |
MILITARY |
24 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
SYNCHRONOUS |
512 words |
5 |
8 |
IN-LINE |
125 Cel |
512X8 |
512 |
-55 Cel |
TIN LEAD |
DUAL |
R-GDIP-T24 |
5.5 V |
Qualified |
4096 bit |
4.5 V |
e0 |
|||||||||||||||||||||||||||||
STMicroelectronics |
OTP ROM |
MILITARY |
24 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
MIL-STD-883 |
THROUGH-HOLE |
PARALLEL |
SYNCHRONOUS |
2048 words |
5 |
8 |
IN-LINE |
2.54 mm |
125 Cel |
2KX8 |
2K |
-55 Cel |
TIN LEAD |
DUAL |
R-GDIP-T24 |
5.5 V |
5.08 mm |
7.62 mm |
Not Qualified |
16384 bit |
4.5 V |
e0 |
31.877 mm |
15 ns |
|||||||||||||||||||||||
Defense Logistics Agency |
OTP ROM |
MILITARY |
24 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
38535Q/M;38534H;883B |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
120 mA |
1024 words |
5 |
5 |
8 |
IN-LINE |
DIP24,.3 |
OTP ROMs |
2.54 mm |
125 Cel |
1KX8 |
1K |
-55 Cel |
Tin/Lead (Sn/Pb) - hot dipped |
DUAL |
R-GDIP-T24 |
5.5 V |
Qualified |
8192 bit |
4.5 V |
e0 |
.12 Amp |
45 ns |
|||||||||||||||||||||
Defense Logistics Agency |
OTP ROM |
MILITARY |
24 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
SYNCHRONOUS |
1024 words |
5 |
8 |
IN-LINE |
125 Cel |
1KX8 |
1K |
-55 Cel |
TIN LEAD |
DUAL |
R-GDIP-T24 |
5.5 V |
Qualified |
8192 bit |
4.5 V |
e0 |
20 ns |
||||||||||||||||||||||||||||
Cypress Semiconductor |
OTP ROM |
MILITARY |
24 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
38535Q/M;38534H;883B |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
90 mA |
2048 words |
COMMON |
5 |
5 |
8 |
IN-LINE |
DIP24,.3 |
OTP ROMs |
2.54 mm |
125 Cel |
3-STATE |
2KX8 |
2K |
-55 Cel |
TIN LEAD |
DUAL |
R-GDIP-T24 |
1 |
5.5 V |
5.08 mm |
7.62 mm |
Not Qualified |
16384 bit |
4.5 V |
e0 |
.04 Amp |
31.877 mm |
35 ns |
12.5 |
||||||||||||||
Advanced Micro Devices |
MEMORY CIRCUIT |
MILITARY |
20 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
TTL |
MIL-STD-883 Class B (Modified) |
THROUGH-HOLE |
512 words |
5 |
5 |
8 |
IN-LINE |
DIP20,.3 |
OTP ROMs |
2.54 mm |
125 Cel |
512X8 |
512 |
-55 Cel |
DUAL |
R-XDIP-T20 |
Not Qualified |
4096 bit |
70 ns |
||||||||||||||||||||||||||||||
Advanced Micro Devices |
MEMORY CIRCUIT |
MILITARY |
20 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
TTL |
MIL-STD-883 Class B (Modified) |
THROUGH-HOLE |
512 words |
5 |
5 |
8 |
IN-LINE |
DIP20,.3 |
OTP ROMs |
2.54 mm |
125 Cel |
512X8 |
512 |
-55 Cel |
DUAL |
R-XDIP-T20 |
Not Qualified |
4096 bit |
70 ns |
||||||||||||||||||||||||||||||
Intersil |
OTP ROM |
MILITARY |
16 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
TTL |
MIL-STD-883 Class B (Modified) |
THROUGH-HOLE |
512 words |
5 |
5 |
4 |
IN-LINE |
DIP16,.3 |
OTP ROMs |
2.54 mm |
125 Cel |
512X4 |
512 |
-55 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-XDIP-T16 |
Not Qualified |
2048 bit |
e0 |
70 ns |
||||||||||||||||||||||||||||
NXP Semiconductors |
OTP ROM |
MILITARY |
16 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
BIPOLAR |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
32 words |
5 |
8 |
IN-LINE |
2.54 mm |
125 Cel |
3-STATE |
32X8 |
32 |
-55 Cel |
DUAL |
R-GDIP-T16 |
5.5 V |
5.08 mm |
7.62 mm |
Not Qualified |
256 bit |
4.5 V |
19.535 mm |
50 ns |
|||||||||||||||||||||||||
Qp Semiconductor |
OTP ROM |
MILITARY |
16 |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
NO |
1 |
BIPOLAR |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
32 words |
5 |
8 |
IN-LINE |
125 Cel |
32X8 |
32 |
-55 Cel |
DUAL |
R-CDIP-T16 |
5.5 V |
Not Qualified |
256 bit |
4.5 V |
50 ns |
|||||||||||||||||||||||||||||||
Defense Logistics Agency |
OTP ROM |
MILITARY |
24 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
38535Q/M;38534H;883B |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
120 mA |
1024 words |
5 |
5 |
8 |
IN-LINE |
DIP24,.3 |
OTP ROMs |
2.54 mm |
125 Cel |
3-STATE |
1KX8 |
1K |
-55 Cel |
TIN LEAD |
DUAL |
R-GDIP-T24 |
5.5 V |
5.08 mm |
7.62 mm |
Not Qualified |
8192 bit |
4.5 V |
e0 |
.12 Amp |
31.877 mm |
45 ns |
|||||||||||||||||
Cypress Semiconductor |
OTP ROM |
MILITARY |
24 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
MIL-STD-883 |
THROUGH-HOLE |
PARALLEL |
SYNCHRONOUS |
120 mA |
512 words |
COMMON |
5 |
5 |
8 |
IN-LINE |
DIP24,.3 |
EPROMs |
2.54 mm |
125 Cel |
3-STATE |
512X8 |
512 |
-55 Cel |
DUAL |
R-GDIP-T24 |
5.5 V |
5.08 mm |
7.62 mm |
Not Qualified |
4096 bit |
4.5 V |
BUFFERED COMMON NOT_PRESET AND NOT_CLEAR INPUTS |
.12 Amp |
31.877 mm |
12 ns |
12.5 |
||||||||||||||||
Renesas Electronics |
OTP ROM |
MILITARY |
28 |
DIP |
RECTANGULAR |
300k Rad(Si) |
CERAMIC, METAL-SEALED COFIRED |
NO |
1 |
CMOS |
MIL-PRF-38535 Class V |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
8192 words |
5 |
8 |
IN-LINE |
2.54 mm |
125 Cel |
8KX8 |
8K |
-55 Cel |
TIN LEAD |
DUAL |
R-CDIP-T28 |
5.5 V |
5.92 mm |
15.24 mm |
Not Qualified |
65536 bit |
4.5 V |
e0 |
||||||||||||||||||||||||
|
Renesas Electronics |
OTP ROM |
MILITARY |
28 |
DFP |
RECTANGULAR |
300k Rad(Si) |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
CMOS |
MIL-PRF-38535 Class V |
FLAT |
PARALLEL |
ASYNCHRONOUS |
8192 words |
5 |
8 |
FLATPACK |
1.27 mm |
125 Cel |
8KX8 |
8K |
-55 Cel |
GOLD |
DUAL |
R-CDFP-F28 |
5.5 V |
2.92 mm |
12.445 mm |
Not Qualified |
65536 bit |
4.5 V |
e4 |
|||||||||||||||||||||||
NXP Semiconductors |
OTP ROM |
MILITARY |
16 |
DIP |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
BIPOLAR |
MIL-M-38510 Class B |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
512 words |
5 |
4 |
IN-LINE |
125 Cel |
512X4 |
512 |
-55 Cel |
DUAL |
R-XDIP-T16 |
5.5 V |
Not Qualified |
2048 bit |
4.5 V |
85 ns |
|||||||||||||||||||||||||||||
Texas Instruments |
OTP ROM |
MILITARY |
24 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
TTL |
THROUGH-HOLE |
1024 words |
8 |
IN-LINE |
DIP24,.6 |
OTP ROMs |
2.54 mm |
125 Cel |
1KX8 |
1K |
-55 Cel |
DUAL |
R-XDIP-T24 |
Not Qualified |
8192 bit |
NOT SPECIFIED |
NOT SPECIFIED |
60 ns |
|||||||||||||||||||||||||||||||
Texas Instruments |
OTP ROM |
MILITARY |
24 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
TTL |
38535Q/M;38534H;883B |
THROUGH-HOLE |
1024 words |
8 |
IN-LINE |
DIP24,.6 |
OTP ROMs |
2.54 mm |
125 Cel |
1KX8 |
1K |
-55 Cel |
DUAL |
R-XDIP-T24 |
Not Qualified |
8192 bit |
NOT SPECIFIED |
NOT SPECIFIED |
70 ns |
||||||||||||||||||||||||||||||
Texas Instruments |
OTP ROM |
MILITARY |
20 |
QCCN |
SQUARE |
CERAMIC |
YES |
TTL |
38535Q/M;38534H;883B |
NO LEAD |
4096 words |
5 |
5 |
4 |
CHIP CARRIER |
LCC20,.35SQ |
OTP ROMs |
1.27 mm |
125 Cel |
4KX4 |
4K |
-55 Cel |
QUAD |
S-XQCC-N20 |
Not Qualified |
16384 bit |
NOT SPECIFIED |
NOT SPECIFIED |
|||||||||||||||||||||||||||||
Texas Instruments |
OTP ROM |
MILITARY |
20 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
BIPOLAR |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
512 words |
5 |
5 |
8 |
IN-LINE |
DIP20,.3 |
OTP ROMs |
2.54 mm |
125 Cel |
512X8 |
512 |
-55 Cel |
DUAL |
R-GDIP-T20 |
5.5 V |
5.08 mm |
7.62 mm |
Not Qualified |
4096 bit |
4.5 V |
NOT SPECIFIED |
NOT SPECIFIED |
24.195 mm |
110 ns |
|||||||||||||||||||||
Texas Instruments |
OTP ROM |
MILITARY |
20 |
QCCN |
SQUARE |
CERAMIC |
YES |
TTL |
NO LEAD |
100 mA |
4096 words |
5 |
5 |
4 |
CHIP CARRIER |
LCC20,.35SQ |
OTP ROMs |
1.27 mm |
125 Cel |
4KX4 |
4K |
-55 Cel |
QUAD |
S-XQCC-N20 |
Not Qualified |
16384 bit |
NOT SPECIFIED |
NOT SPECIFIED |
40 ns |
||||||||||||||||||||||||||||
Texas Instruments |
OTP ROM |
MILITARY |
20 |
QCCN |
SQUARE |
CERAMIC |
YES |
TTL |
NO LEAD |
125 mA |
32 words |
5 |
5 |
8 |
CHIP CARRIER |
LCC20,.35SQ |
OTP ROMs |
1.27 mm |
125 Cel |
32X8 |
32 |
-55 Cel |
QUAD |
S-XQCC-N20 |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
30 ns |
|||||||||||||||||||||||||||||
Texas Instruments |
OTP ROM |
MILITARY |
16 |
DFP |
RECTANGULAR |
CERAMIC |
YES |
TTL |
38535Q/M;38534H;883B |
FLAT |
110 mA |
32 words |
5 |
5 |
8 |
FLATPACK |
FL16,.3 |
OTP ROMs |
1.27 mm |
125 Cel |
32X8 |
32 |
-55 Cel |
DUAL |
R-XDFP-F16 |
Not Qualified |
50 ns |
||||||||||||||||||||||||||||||
Texas Instruments |
OTP ROM |
MILITARY |
20 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
TTL |
38535Q/M;38534H;883B |
THROUGH-HOLE |
512 words |
8 |
IN-LINE |
DIP20,.3 |
OTP ROMs |
2.54 mm |
125 Cel |
512X8 |
512 |
-55 Cel |
DUAL |
R-XDIP-T20 |
Not Qualified |
4096 bit |
85 ns |
||||||||||||||||||||||||||||||||
Texas Instruments |
OTP ROM |
MILITARY |
24 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
TTL |
THROUGH-HOLE |
2048 words |
8 |
IN-LINE |
DIP24,.3 |
OTP ROMs |
2.54 mm |
125 Cel |
2KX8 |
2K |
-55 Cel |
DUAL |
R-XDIP-T24 |
Not Qualified |
16384 bit |
NOT SPECIFIED |
NOT SPECIFIED |
||||||||||||||||||||||||||||||||
Texas Instruments |
OTP ROM |
MILITARY |
24 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
BIPOLAR |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
85 mA |
512 words |
5 |
5 |
8 |
IN-LINE |
DIP24,.6 |
OTP ROMs |
2.54 mm |
125 Cel |
512X8 |
512 |
-55 Cel |
DUAL |
R-GDIP-T24 |
5.5 V |
5.7 mm |
15.24 mm |
Not Qualified |
4096 bit |
4.5 V |
NOT SPECIFIED |
NOT SPECIFIED |
32.07 mm |
110 ns |
||||||||||||||||||||
Texas Instruments |
OTP ROM |
MILITARY |
20 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
TTL |
MIL-STD-883 Class B (Modified) |
THROUGH-HOLE |
512 words |
8 |
IN-LINE |
DIP20,.3 |
OTP ROMs |
2.54 mm |
125 Cel |
512X8 |
512 |
-55 Cel |
DUAL |
R-XDIP-T20 |
Not Qualified |
4096 bit |
85 ns |
||||||||||||||||||||||||||||||||
Texas Instruments |
OTP ROM |
MILITARY |
20 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
TTL |
38535Q/M;38534H;883B |
THROUGH-HOLE |
512 words |
8 |
IN-LINE |
DIP20,.3 |
OTP ROMs |
2.54 mm |
125 Cel |
512X8 |
512 |
-55 Cel |
DUAL |
R-XDIP-T20 |
Not Qualified |
4096 bit |
NOT SPECIFIED |
NOT SPECIFIED |
75 ns |
||||||||||||||||||||||||||||||
Texas Instruments |
OTP ROM |
MILITARY |
20 |
QCCN |
SQUARE |
CERAMIC |
YES |
TTL |
NO LEAD |
95 mA |
256 words |
5 |
5 |
4 |
CHIP CARRIER |
LCC20,.35SQ |
OTP ROMs |
1.27 mm |
125 Cel |
256X4 |
256 |
-55 Cel |
QUAD |
S-XQCC-N20 |
Not Qualified |
1024 bit |
NOT SPECIFIED |
NOT SPECIFIED |
30 ns |
||||||||||||||||||||||||||||
Texas Instruments |
OTP ROM |
MILITARY |
24 |
DFP |
RECTANGULAR |
CERAMIC |
YES |
TTL |
MIL-STD-883 Class B (Modified) |
FLAT |
155 mA |
512 words |
8 |
FLATPACK |
FL24,.4 |
OTP ROMs |
1.27 mm |
125 Cel |
512X8 |
512 |
-55 Cel |
DUAL |
R-XDFP-F24 |
Not Qualified |
4096 bit |
85 ns |
|||||||||||||||||||||||||||||||
Texas Instruments |
OTP ROM |
MILITARY |
20 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
TTL |
MIL-STD-883 Class B (Modified) |
THROUGH-HOLE |
256 words |
5 |
5 |
8 |
IN-LINE |
DIP20,.3 |
OTP ROMs |
2.54 mm |
125 Cel |
256X8 |
256 |
-55 Cel |
DUAL |
R-XDIP-T20 |
Not Qualified |
2048 bit |
NOT SPECIFIED |
NOT SPECIFIED |
75 ns |
||||||||||||||||||||||||||||
Texas Instruments |
OTP ROM |
MILITARY |
24 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
TTL |
THROUGH-HOLE |
1024 words |
5 |
5 |
8 |
IN-LINE |
DIP24,.6 |
OTP ROMs |
2.54 mm |
125 Cel |
1KX8 |
1K |
-55 Cel |
DUAL |
R-XDIP-T24 |
Not Qualified |
8192 bit |
NOT SPECIFIED |
NOT SPECIFIED |
||||||||||||||||||||||||||||||
Texas Instruments |
OTP ROM |
MILITARY |
16 |
DFP |
RECTANGULAR |
CERAMIC |
YES |
TTL |
FLAT |
110 mA |
32 words |
5 |
5 |
8 |
FLATPACK |
FL16,.3 |
OTP ROMs |
1.27 mm |
125 Cel |
32X8 |
32 |
-55 Cel |
DUAL |
R-XDFP-F16 |
Not Qualified |
50 ns |
|||||||||||||||||||||||||||||||
Texas Instruments |
OTP ROM |
MILITARY |
24 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
TTL |
38535Q/M;38534H;883B |
THROUGH-HOLE |
155 mA |
512 words |
8 |
IN-LINE |
DIP24,.6 |
OTP ROMs |
2.54 mm |
125 Cel |
512X8 |
512 |
-55 Cel |
DUAL |
R-XDIP-T24 |
Not Qualified |
4096 bit |
85 ns |
|||||||||||||||||||||||||||||||
Texas Instruments |
OTP ROM |
MILITARY |
18 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
TTL |
MIL-STD-883 Class B (Modified) |
THROUGH-HOLE |
1024 words |
4 |
IN-LINE |
DIP18,.3 |
OTP ROMs |
2.54 mm |
125 Cel |
1KX4 |
1K |
-55 Cel |
DUAL |
R-XDIP-T18 |
Not Qualified |
4096 bit |
NOT SPECIFIED |
NOT SPECIFIED |
75 ns |
||||||||||||||||||||||||||||||
Texas Instruments |
OTP ROM |
MILITARY |
20 |
QCCN |
SQUARE |
CERAMIC |
YES |
TTL |
NO LEAD |
70 mA |
256 words |
5 |
5 |
8 |
CHIP CARRIER |
LCC20,.35SQ |
OTP ROMs |
1.27 mm |
125 Cel |
256X8 |
256 |
-55 Cel |
QUAD |
S-XQCC-N20 |
Not Qualified |
2048 bit |
40 ns |
||||||||||||||||||||||||||||||
Texas Instruments |
OTP ROM |
MILITARY |
16 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
TTL |
THROUGH-HOLE |
256 words |
5 |
5 |
4 |
IN-LINE |
DIP16,.3 |
OTP ROMs |
2.54 mm |
125 Cel |
256X4 |
256 |
-55 Cel |
DUAL |
R-XDIP-T16 |
Not Qualified |
1024 bit |
NOT SPECIFIED |
NOT SPECIFIED |
||||||||||||||||||||||||||||||
Texas Instruments |
OTP ROM |
MILITARY |
24 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
TTL |
MIL-STD-883 Class B (Modified) |
THROUGH-HOLE |
1024 words |
5 |
5 |
8 |
IN-LINE |
DIP24,.6 |
OTP ROMs |
2.54 mm |
125 Cel |
1KX8 |
1K |
-55 Cel |
DUAL |
R-XDIP-T24 |
Not Qualified |
8192 bit |
70 ns |
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Texas Instruments |
OTP ROM |
MILITARY |
24 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
TTL |
THROUGH-HOLE |
1024 words |
8 |
IN-LINE |
DIP24,.6 |
OTP ROMs |
2.54 mm |
125 Cel |
1KX8 |
1K |
-55 Cel |
DUAL |
R-XDIP-T24 |
Not Qualified |
8192 bit |
NOT SPECIFIED |
NOT SPECIFIED |
70 ns |
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Texas Instruments |
OTP ROM |
MILITARY |
18 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
BIPOLAR |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
175 mA |
2048 words |
5 |
4 |
IN-LINE |
DIP18,.3 |
OTP ROMs |
2.54 mm |
125 Cel |
2KX4 |
2K |
-55 Cel |
DUAL |
R-GDIP-T18 |
5.5 V |
5.08 mm |
7.62 mm |
Not Qualified |
8192 bit |
4.5 V |
NOT SPECIFIED |
NOT SPECIFIED |
85 ns |
||||||||||||||||||||||
Texas Instruments |
OTP ROM |
MILITARY |
20 |
QCCN |
SQUARE |
CERAMIC |
YES |
TTL |
NO LEAD |
155 mA |
4096 words |
5 |
5 |
4 |
CHIP CARRIER |
LCC20,.35SQ |
OTP ROMs |
1.27 mm |
125 Cel |
4KX4 |
4K |
-55 Cel |
QUAD |
S-XQCC-N20 |
Not Qualified |
16384 bit |
NOT SPECIFIED |
NOT SPECIFIED |
45 ns |
||||||||||||||||||||||||||||
Texas Instruments |
OTP ROM |
MILITARY |
18 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
TTL |
MIL-STD-883 Class B (Modified) |
THROUGH-HOLE |
175 mA |
2048 words |
4 |
IN-LINE |
DIP18,.3 |
OTP ROMs |
2.54 mm |
125 Cel |
2KX4 |
2K |
-55 Cel |
DUAL |
R-XDIP-T18 |
Not Qualified |
8192 bit |
NOT SPECIFIED |
NOT SPECIFIED |
55 ns |
|||||||||||||||||||||||||||||
Texas Instruments |
OTP ROM |
MILITARY |
24 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
TTL |
MIL-STD-883 Class C |
THROUGH-HOLE |
155 mA |
512 words |
8 |
IN-LINE |
DIP24,.6 |
OTP ROMs |
2.54 mm |
125 Cel |
512X8 |
512 |
-55 Cel |
DUAL |
R-XDIP-T24 |
Not Qualified |
4096 bit |
85 ns |
|||||||||||||||||||||||||||||||
Texas Instruments |
OTP ROM |
MILITARY |
18 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
TTL |
THROUGH-HOLE |
1024 words |
4 |
IN-LINE |
DIP18,.3 |
OTP ROMs |
2.54 mm |
125 Cel |
1KX4 |
1K |
-55 Cel |
DUAL |
R-XDIP-T18 |
Not Qualified |
4096 bit |
NOT SPECIFIED |
NOT SPECIFIED |
||||||||||||||||||||||||||||||||
Texas Instruments |
OTP ROM |
MILITARY |
20 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
TTL |
38535Q/M;38534H;883B |
THROUGH-HOLE |
256 words |
5 |
5 |
8 |
IN-LINE |
DIP20,.3 |
OTP ROMs |
2.54 mm |
125 Cel |
256X8 |
256 |
-55 Cel |
DUAL |
R-XDIP-T20 |
Not Qualified |
2048 bit |
80 ns |
||||||||||||||||||||||||||||||
Texas Instruments |
OTP ROM |
MILITARY |
20 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
TTL |
38535Q/M;38534H;883B |
THROUGH-HOLE |
256 words |
5 |
5 |
8 |
IN-LINE |
DIP20,.3 |
OTP ROMs |
2.54 mm |
125 Cel |
256X8 |
256 |
-55 Cel |
DUAL |
R-XDIP-T20 |
Not Qualified |
2048 bit |
NOT SPECIFIED |
NOT SPECIFIED |
80 ns |
||||||||||||||||||||||||||||
Texas Instruments |
OTP ROM |
MILITARY |
20 |
QCCN |
SQUARE |
CERAMIC |
YES |
TTL |
38535Q/M;38534H;883B |
NO LEAD |
256 words |
5 |
5 |
4 |
CHIP CARRIER |
LCC20,.35SQ |
OTP ROMs |
1.27 mm |
125 Cel |
256X4 |
256 |
-55 Cel |
QUAD |
S-XQCC-N20 |
Not Qualified |
1024 bit |
NOT SPECIFIED |
NOT SPECIFIED |
|||||||||||||||||||||||||||||
Texas Instruments |
OTP ROM |
MILITARY |
24 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
TTL |
MIL-STD-883 Class B (Modified) |
THROUGH-HOLE |
512 words |
5 |
5 |
8 |
IN-LINE |
DIP24,.3 |
OTP ROMs |
2.54 mm |
125 Cel |
512X8 |
512 |
-55 Cel |
DUAL |
R-XDIP-T24 |
Not Qualified |
4096 bit |
60 ns |
OTP ROM, or One-Time Programmable Read-Only Memory, is a type of non-volatile computer memory that is programmed once and cannot be reprogrammed. OTP ROM is used to store data that needs to be permanently stored and cannot be changed or updated in the future.
OTP ROM is created using a process similar to that used to manufacture Mask ROM. However, instead of programming the memory during the manufacturing process, OTP ROM is programmed after the manufacturing process, but before it is delivered to the customer. This allows the customer to program the memory with the data that they need to store permanently.
OTP ROM is commonly used in devices such as microcontrollers, smart cards, and other electronic devices that require permanent storage of data. It is ideal for storing critical data, such as system settings, encryption keys, and other sensitive information that needs to be permanently stored and cannot be changed or updated in the future.