Analog Devices OTP ROM 42

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Part	Manufacturer	Memory IC Type	Temperature Grade	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Terminal Form	Parallel or Serial	Operating Mode	Maximum Supply Current	No. of Words	Input/Output Type	Nominal Supply Voltage / Vsup (V)	Power Supplies (V)	Memory Width	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Organization	No. of Words Code	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Supply Voltage (Vsup)	Maximum Seated Height	Width	Qualification	Memory Density	Minimum Supply Voltage (Vsup)	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Maximum Standby Current	Length	Maximum Access Time
DS2502P-E48+T&R	Analog Devices	OTP ROM	INDUSTRIAL	6	SOC	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	C BEND	SERIAL	ASYNCHRONOUS	.005 mA	1024 words	COMMON		3/5	1	SMALL OUTLINE	SOC6,.17	Other Memory ICs	1.27 mm	85 Cel	1KX1	1K	-40 Cel	Matte Tin (Sn) - annealed	DUAL	R-PDSO-C6	1	6 V	1.5 mm	3.81 mm	Not Qualified	1024 bit	2.8 V		e3	30	260	.000005 Amp	3.937 mm
DS2502P-E48+	Analog Devices	OTP ROM	INDUSTRIAL	6	SOC	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	C BEND	SERIAL	ASYNCHRONOUS	.005 mA	1024 words	COMMON		3/5	1	SMALL OUTLINE	SOC6,.17	Other Memory ICs	1.27 mm	85 Cel	1KX1	1K	-40 Cel	Matte Tin (Sn) - annealed	DUAL	R-PDSO-C6	1	6 V	1.5 mm	3.76 mm	Not Qualified	1024 bit	2.8 V		e3	30	260	.000005 Amp	3.94 mm
DS2502P+T&R	Analog Devices	OTP ROM	INDUSTRIAL	6	SOC	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	C BEND	SERIAL	ASYNCHRONOUS		128 words		5		8	SMALL OUTLINE			1.27 mm	85 Cel	128X8	128	-40 Cel	Matte Tin (Sn) - annealed	DUAL	R-PDSO-C6	1	6 V	1.5 mm	3.76 mm	Not Qualified	1024 bit	2.8 V	MICROLAN COMPATIBLE	e3	30	260		3.94 mm
DS2502R+T&R	Analog Devices	OTP ROM	INDUSTRIAL	3	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	SERIAL	ASYNCHRONOUS		128 words	COMMON	5	3/5	8	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TO-236	Other Memory ICs	.95 mm	85 Cel	128X8	128	-40 Cel	Matte Tin (Sn) - annealed	DUAL	R-PDSO-G3	1	6 V	1.12 mm	1.3 mm	Not Qualified	1024 bit	2.8 V	MICROLAN COMPATIBLE	e3	30	260		2.92 mm	15000 ns
DS2502P+	Analog Devices	OTP ROM	INDUSTRIAL	6	SOC	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	C BEND	SERIAL	ASYNCHRONOUS		128 words	COMMON	5	3/5	8	SMALL OUTLINE	SOC6,.17	Other Memory ICs	1.27 mm	85 Cel	128X8	128	-40 Cel	Matte Tin (Sn) - annealed	DUAL	R-PDSO-C6	1	6 V	1.5 mm	3.76 mm	Not Qualified	1024 bit	2.8 V	MICROLAN COMPATIBLE	e3	30	260		3.94 mm	15000 ns
DS2502-E48+	Analog Devices	OTP ROM	INDUSTRIAL	3		ROUND	PLASTIC/EPOXY	NO	1	CMOS	THROUGH-HOLE	SERIAL	ASYNCHRONOUS	.005 mA	1024 words	COMMON		3/5	1	CYLINDRICAL	SIP3,.1,50	Other Memory ICs	1.27 mm	85 Cel	1KX1	1K	-40 Cel	Matte Tin (Sn) - annealed	BOTTOM	O-PBCY-T3		6 V			Not Qualified	1024 bit	2.8 V		e3		250	.000005 Amp
DS2502S+	Analog Devices	OTP ROM	INDUSTRIAL	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	SERIAL	ASYNCHRONOUS		128 words	COMMON	5	3/5	8	SMALL OUTLINE	SOP8,.25	Other Memory ICs	1.27 mm	85 Cel	128X8	128	-40 Cel	Matte Tin (Sn) - annealed	DUAL	R-PDSO-G8	1	6 V	1.75 mm	3.9 mm	Not Qualified	1024 bit	2.8 V	MICROLAN COMPATIBLE	e3	30	260		4.9 mm	15000 ns
DS2502+	Analog Devices	OTP ROM	INDUSTRIAL	3	TO-92	ROUND	PLASTIC/EPOXY	NO	1	CMOS	THROUGH-HOLE	SERIAL	ASYNCHRONOUS		128 words	COMMON	5	3/5	8	CYLINDRICAL	SIP3,.1,50	Other Memory ICs	1.27 mm	85 Cel	128X8	128	-40 Cel	Matte Tin (Sn) - annealed	BOTTOM	O-PBCY-T3		6 V			Not Qualified	1024 bit	2.8 V	MICROLAN COMPATIBLE	e3		250			15000 ns
DS2502+T&R	Analog Devices	OTP ROM	INDUSTRIAL	3	TO-92	ROUND	PLASTIC/EPOXY	NO	1	CMOS	THROUGH-HOLE	SERIAL	ASYNCHRONOUS		128 words	COMMON	5	3/5	8	CYLINDRICAL	SIP3,.1,50	Other Memory ICs	1.27 mm	85 Cel	128X8	128	-40 Cel	Matte Tin (Sn) - annealed	BOTTOM	O-PBCY-T3		6 V			Not Qualified	1024 bit	2.8 V	MICROLAN COMPATIBLE	e3		250			15000 ns
DS2502P-E64+	Analog Devices	OTP ROM	INDUSTRIAL	6	LSOC	RECTANGULAR	PLASTIC/EPOXY	YES	1	MOS	C BEND	SERIAL	SYNCHRONOUS		1024 words		5		1	SMALL OUTLINE, LOW PROFILE			1.27 mm	85 Cel	1KX1	1K	-40 Cel	Matte Tin (Sn) - annealed	DUAL	R-PDSO-C6	1	6 V	1.5 mm	3.76 mm	Not Qualified	1024 bit	2.8 V		e3	30	260		3.94 mm
DS2505P+T&R	Analog Devices	OTP ROM	INDUSTRIAL	6	SOC	RECTANGULAR	PLASTIC/EPOXY	YES	1	MOS	C BEND	SERIAL	ASYNCHRONOUS		16384 words	COMMON	5	3/5	1	SMALL OUTLINE	SOC6,.17	Other Memory ICs	1.27 mm	85 Cel	16KX1	16K	-40 Cel	Matte Tin (Sn) - annealed	DUAL	R-PDSO-C6	1	6 V	1.5 mm	3.76 mm	Not Qualified	16384 bit	2.8 V	MICROLAN COMPATIBLE	e3	30	260		3.94 mm	15000 ns
DS2502X1+	Analog Devices	OTP ROM	INDUSTRIAL	2	VBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	BALL	SERIAL	ASYNCHRONOUS		128 words	COMMON	5	3/5	8	GRID ARRAY, VERY THIN PROFILE	BGA4,2X2,37/16	Other Memory ICs	.933 mm	85 Cel	128X8	128	-40 Cel	TIN SILVER COPPER NICKEL	BOTTOM	R-PBGA-B2	1	6 V	.639 mm	.91 mm	Not Qualified	1024 bit	2.8 V		e2	30	260		1.6 mm	15000 ns
DS2406P+T&R	Analog Devices	OTP ROM	INDUSTRIAL	6	SOC	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	C BEND	SERIAL	ASYNCHRONOUS		1024 words		4	3/5	1	SMALL OUTLINE	SOC6,.17	SRAMs	1.27 mm	85 Cel	1KX1	1K	-40 Cel	Matte Tin (Sn) - annealed	DUAL	R-PDSO-C6	1	6 V	1.5 mm	3.76 mm	Not Qualified	1024 bit	2.8 V		e3	30	260		3.94 mm
DS2506S+	Analog Devices	OTP ROM	INDUSTRIAL	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	MOS	GULL WING	SERIAL	ASYNCHRONOUS		65536 words	COMMON	5	3/5	1	SMALL OUTLINE	SOP8,.3	Other Memory ICs	1.27 mm	85 Cel	64KX1	64K	-40 Cel	MATTE TIN	DUAL	R-PDSO-G8	1	6 V	2.13 mm	5.285 mm	Not Qualified	65536 bit	2.8 V		e3	30	260		5.31 mm
DS2505P+	Analog Devices	OTP ROM	INDUSTRIAL	6	SOC	RECTANGULAR	PLASTIC/EPOXY	YES	1	MOS	C BEND	SERIAL	ASYNCHRONOUS		16384 words	COMMON	5	3/5	1	SMALL OUTLINE	SOC6,.17	Other Memory ICs	1.27 mm	85 Cel	16KX1	16K	-40 Cel	Matte Tin (Sn) - annealed	DUAL	R-PDSO-C6	1	6 V	1.5 mm	3.76 mm	Not Qualified	16384 bit	2.8 V	MICROLAN COMPATIBLE	e3	30	260		3.94 mm	15000 ns
DS2406P+	Analog Devices	OTP ROM	INDUSTRIAL	6	SOC	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	C BEND	SERIAL	ASYNCHRONOUS		1024 words		4	3/5	1	SMALL OUTLINE	SOC6,.17	SRAMs	1.27 mm	85 Cel	1KX1	1K	-40 Cel	Matte Tin (Sn) - annealed	DUAL	R-PDSO-C6	1	6 V	1.5 mm	3.76 mm	Not Qualified	1024 bit	2.8 V		e3	30	260		3.94 mm
DS2505+	Analog Devices	OTP ROM	INDUSTRIAL	3	TO-92	ROUND	PLASTIC/EPOXY	NO	1	MOS	THROUGH-HOLE	SERIAL	ASYNCHRONOUS		16384 words	COMMON	5	3/5	1	CYLINDRICAL	SIP3,.1	Other Memory ICs	2.54 mm	85 Cel	16KX1	16K	-40 Cel	Matte Tin (Sn) - annealed	BOTTOM	O-PBCY-T3		6 V			Not Qualified	16384 bit	2.8 V	MICROLAN COMPATIBLE	e3	30	250			15000 ns
DS2502S+T&R	Analog Devices	OTP ROM	INDUSTRIAL	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	SERIAL	ASYNCHRONOUS		128 words	COMMON	5	3/5	8	SMALL OUTLINE	SOP8,.25	Other Memory ICs	1.27 mm	85 Cel	128X8	128	-40 Cel	Matte Tin (Sn) - annealed	DUAL	R-PDSO-G8	1	6 V	1.75 mm	3.9 mm	Not Qualified	1024 bit	2.8 V	MICROLAN COMPATIBLE	e3	30	260		4.9 mm	15000 ns
DS1982-F3+	Analog Devices	OTP ROM	INDUSTRIAL	2		ROUND	METAL	YES	1	CMOS	NO LEAD	SERIAL	ASYNCHRONOUS		1024 words	COMMON	5	3/5	1	DISK BUTTON	BUTTON,.68IN	Other Memory ICs		85 Cel	1KX1	1K	-40 Cel	Matte Tin (Sn) - annealed	END	O-MEDB-N2		6 V			Not Qualified	1024 bit	2.8 V	MICROLAN COMPATIBLE	e3					15000 ns
DS2505+T&R	Analog Devices	OTP ROM	INDUSTRIAL	3	TO-92	ROUND	PLASTIC/EPOXY	NO	1	MOS	THROUGH-HOLE	SERIAL	ASYNCHRONOUS		16384 words	COMMON	5	3/5	1	CYLINDRICAL	SIP3,.1	Other Memory ICs	2.54 mm	85 Cel	16KX1	16K	-40 Cel	Matte Tin (Sn) - annealed	BOTTOM	O-PBCY-T3		6 V			Not Qualified	16384 bit	2.8 V	MICROLAN COMPATIBLE	e3		250			15000 ns
DS1986U-F3	Analog Devices	OTP ROM	INDUSTRIAL	2		ROUND	METAL	YES	1	CMOS	NO LEAD	SERIAL	SYNCHRONOUS		8192 words				8	DISK BUTTON				85 Cel	8KX8	8K	-40 Cel	TIN LEAD	END	O-MEDB-N2		6 V			Not Qualified	65536 bit	2.8 V		e0
DS1986U-F3-PPPP	Analog Devices	OTP ROM	INDUSTRIAL	2		ROUND	METAL	YES	1	CMOS	NO LEAD	SERIAL	SYNCHRONOUS		8192 words				8	DISK BUTTON				85 Cel	8KX8	8K	-40 Cel	TIN LEAD	END	O-MEDB-N2		6 V			Not Qualified	65536 bit	2.8 V		e0
DS1985U-F5-PPPP	Analog Devices	OTP ROM	INDUSTRIAL	2		ROUND	METAL	YES	1	CMOS	NO LEAD	SERIAL	SYNCHRONOUS		2048 words				8	DISK BUTTON				85 Cel	2KX8	2K	-40 Cel	TIN LEAD	END	O-MEDB-N2		6 V			Not Qualified	16384 bit	2.8 V		e0
DS1985U-F3	Analog Devices	OTP ROM	INDUSTRIAL	2		ROUND	METAL	YES	1	CMOS	NO LEAD	SERIAL	SYNCHRONOUS		2048 words				8	DISK BUTTON				85 Cel	2KX8	2K	-40 Cel	TIN LEAD	END	O-MEDB-N2		6 V			Not Qualified	16384 bit	2.8 V		e0
DS1422	Analog Devices	OTP ROM	INDUSTRIAL	2		ROUND	METAL	YES	1	CMOS	NO LEAD	SERIAL	SYNCHRONOUS		128 words			3/5	8	DISK BUTTON	BUTTON,.68IN	Other Memory ICs		85 Cel	128X8	128	-40 Cel	TIN LEAD	END	O-MEDB-N2		6 V			Not Qualified	1024 bit	2.8 V		e0
DS1982-F5+	Analog Devices	OTP ROM	INDUSTRIAL	2		ROUND	METAL	YES	1	CMOS	NO LEAD	SERIAL	ASYNCHRONOUS		1024 words	COMMON	5	3/5	1	DISK BUTTON	BUTTON,.68IN	Other Memory ICs		85 Cel	1KX1	1K	-40 Cel	Matte Tin (Sn) - annealed	END	O-MEDB-N2	1	6 V			Not Qualified	1024 bit	2.8 V	MICROLAN COMPATIBLE	e3					15000 ns
DS1986U-F5	Analog Devices	OTP ROM	INDUSTRIAL	2		ROUND	METAL	YES	1	CMOS	NO LEAD	SERIAL	SYNCHRONOUS		8192 words				8	DISK BUTTON				85 Cel	8KX8	8K	-40 Cel	TIN LEAD	END	O-MEDB-N2		6 V			Not Qualified	65536 bit	2.8 V		e0
DS1985U-F3-PPPP	Analog Devices	OTP ROM	INDUSTRIAL	2		ROUND	METAL	YES	1	CMOS	NO LEAD	SERIAL	SYNCHRONOUS		2048 words				8	DISK BUTTON				85 Cel	2KX8	2K	-40 Cel	TIN LEAD	END	O-MEDB-N2		6 V			Not Qualified	16384 bit	2.8 V		e0
DS1986U-F5-PPPP	Analog Devices	OTP ROM	INDUSTRIAL	2		ROUND	METAL	YES	1	CMOS	NO LEAD	SERIAL	SYNCHRONOUS		8192 words				8	DISK BUTTON				85 Cel	8KX8	8K	-40 Cel	TIN LEAD	END	O-MEDB-N2		6 V			Not Qualified	65536 bit	2.8 V		e0
DS1982-F5W+	Analog Devices	OTP ROM
DS2502PU-1176+	Analog Devices	OTP ROM		6		RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	C BEND				1024 words				1					85 Cel	1KX1	1K	-40 Cel		DUAL	R-PDSO-C6		6 V				1024 bit	2.8 V
DS2502-E64+	Analog Devices	OTP ROM	INDUSTRIAL	3	TO-92	ROUND	PLASTIC/EPOXY	NO	1	MOS	THROUGH-HOLE	SERIAL	SYNCHRONOUS		1024 words		5		1	CYLINDRICAL				85 Cel	1KX1	1K	-40 Cel	Matte Tin (Sn) - annealed	BOTTOM	O-PBCY-T3		6 V			Not Qualified	1024 bit	2.8 V		e3		250
DS2506-UNW	Analog Devices	OTP ROM	INDUSTRIAL	3	TO-92	ROUND	PLASTIC/EPOXY	NO	1	CMOS	THROUGH-HOLE	SERIAL	SYNCHRONOUS		8192 words	COMMON		3/5	8	CYLINDRICAL	SIP3,.1,50	Other Memory ICs	1.27 mm	85 Cel	8KX8	8K	-40 Cel	TIN LEAD	BOTTOM	O-PBCY-T3		6 V			Not Qualified	65536 bit	2.8 V	MICROLAN COMPATIBLE	e0
DS2406+T&R	Analog Devices	OTP ROM	INDUSTRIAL	3	TO-92	ROUND	PLASTIC/EPOXY	NO	1	CMOS	THROUGH-HOLE	SERIAL	ASYNCHRONOUS		1024 words		4	3/5	1	CYLINDRICAL	SIP3,.1,50	SRAMs	1.27 mm	85 Cel	1KX1	1K	-40 Cel	Matte Tin (Sn) - annealed	BOTTOM	O-PBCY-T3		6 V			Not Qualified	1024 bit	2.8 V		e3		250
DS25051AT	Analog Devices	OTP ROM	INDUSTRIAL	3	TO-92	ROUND	PLASTIC/EPOXY	NO	1	CMOS	THROUGH-HOLE	SERIAL	ASYNCHRONOUS		16384 words				1	CYLINDRICAL				85 Cel	16KX1	16K	-40 Cel	TIN LEAD	BOTTOM	O-PBCY-T3		6 V			Not Qualified	16384 bit	2.8 V		e0
DS25051A	Analog Devices	OTP ROM	INDUSTRIAL	3	TO-92	ROUND	PLASTIC/EPOXY	NO	1	CMOS	THROUGH-HOLE	SERIAL	ASYNCHRONOUS		16384 words				1	CYLINDRICAL				85 Cel	16KX1	16K	-40 Cel	TIN LEAD	BOTTOM	O-PBCY-T3		6 V			Not Qualified	16384 bit	2.8 V		e0
DS25021AT	Analog Devices	OTP ROM	INDUSTRIAL	3	TO-92	ROUND	PLASTIC/EPOXY	NO	1	CMOS	THROUGH-HOLE	SERIAL	ASYNCHRONOUS		1024 words				1	CYLINDRICAL				85 Cel	1KX1	1K	-40 Cel	TIN LEAD	BOTTOM	O-PBCY-T3		6 V			Not Qualified	1024 bit	2.8 V		e0
DS25021A	Analog Devices	OTP ROM	INDUSTRIAL	3	TO-92	ROUND	PLASTIC/EPOXY	NO	1	CMOS	THROUGH-HOLE	SERIAL	ASYNCHRONOUS		1024 words				1	CYLINDRICAL				85 Cel	1KX1	1K	-40 Cel	TIN LEAD	BOTTOM	O-PBCY-T3		6 V			Not Qualified	1024 bit	2.8 V		e0
DS2502SY	Analog Devices	OTP ROM	INDUSTRIAL	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	SERIAL	ASYNCHRONOUS		1024 words				1	SMALL OUTLINE			1.27 mm	85 Cel	1KX1	1K	-40 Cel	TIN LEAD	DUAL	R-PDSO-G8	1	6 V	1.75 mm	3.9 mm	Not Qualified	1024 bit	2.8 V		e0				4.9 mm
DS2406+	Analog Devices	OTP ROM	INDUSTRIAL	3	TO-92	ROUND	PLASTIC/EPOXY	NO	1	CMOS	THROUGH-HOLE	SERIAL	ASYNCHRONOUS		1024 words		4	3/5	1	CYLINDRICAL	SIP3,.1,50	SRAMs	1.27 mm	85 Cel	1KX1	1K	-40 Cel	Matte Tin (Sn) - annealed	BOTTOM	O-PBCY-T3		6 V			Not Qualified	1024 bit	2.8 V		e3		250
DS2506P-UNW	Analog Devices	OTP ROM	INDUSTRIAL	6	LSOC	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	C BEND	SERIAL	SYNCHRONOUS		8192 words				8	SMALL OUTLINE, LOW PROFILE			1.27 mm	85 Cel	8KX8	8K	-40 Cel	TIN LEAD	DUAL	R-PDSO-C6		6 V	1.5 mm	3.76 mm	Not Qualified	65536 bit	2.8 V	MICROLAN COMPATIBLE	e0				3.94 mm
DS2506S-UNW	Analog Devices	OTP ROM	INDUSTRIAL	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	SERIAL	ASYNCHRONOUS		65536 words	COMMON		3/5	1	SMALL OUTLINE	SOP8,.3	Other Memory ICs	1.27 mm	85 Cel	64KX1	64K	-40 Cel	TIN LEAD	DUAL	R-PDSO-G8	1	6 V	1.75 mm	3.9 mm	Not Qualified	65536 bit	2.8 V		e0				4.9 mm

OTP ROM

OTP ROM, or One-Time Programmable Read-Only Memory, is a type of non-volatile computer memory that is programmed once and cannot be reprogrammed. OTP ROM is used to store data that needs to be permanently stored and cannot be changed or updated in the future.

OTP ROM is created using a process similar to that used to manufacture Mask ROM. However, instead of programming the memory during the manufacturing process, OTP ROM is programmed after the manufacturing process, but before it is delivered to the customer. This allows the customer to program the memory with the data that they need to store permanently.

OTP ROM is commonly used in devices such as microcontrollers, smart cards, and other electronic devices that require permanent storage of data. It is ideal for storing critical data, such as system settings, encryption keys, and other sensitive information that needs to be permanently stored and cannot be changed or updated in the future.