Part | RoHS | Manufacturer | Memory IC Type | Temperature Grade | No. of Terminals | Package Code | Refresh Cycles | Package Shape | Total Dose (V) | Package Body Material | Surface Mount | No. of Functions | Technology | Screening Level | Nominal Negative Supply Voltage | Terminal Form | Parallel or Serial | Operating Mode | Maximum Supply Current | No. of Words | Self Refresh | Input/Output Type | Nominal Supply Voltage / Vsup (V) | Power Supplies (V) | Memory Width | Package Style (Meter) | Package Equivalence Code | Alternate Memory Width | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Reverse Pinout | Output Characteristics | Organization | No. of Words Code | Minimum Standby Voltage | Minimum Operating Temperature | Terminal Finish | Terminal Position | No. of Ports | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Maximum Clock Frequency (fCLK) | Width | Qualification | Memory Density | Minimum Supply Voltage (Vsup) | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Output Enable | Maximum Standby Current | Length | Maximum Access Time |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Renesas Electronics |
MULTI-PORT SRAM |
COMMERCIAL |
64 |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
240 mA |
4096 words |
COMMON |
5 |
5 |
8 |
SRAMs |
70 Cel |
4KX8 |
4K |
2 V |
0 Cel |
MATTE TIN |
QUAD |
2 |
S-PQFP-G64 |
3 |
5.5 V |
Not Qualified |
32768 bit |
4.5 V |
e3 |
30 |
260 |
YES |
.08 Amp |
20 ns |
||||||||||||||||||
|
Renesas Electronics |
MULTI-PORT SRAM |
COMMERCIAL |
52 |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
240 mA |
4096 words |
COMMON |
5 |
5 |
8 |
SRAMs |
70 Cel |
4KX8 |
4K |
2 V |
0 Cel |
MATTE TIN |
QUAD |
2 |
S-PQCC-J52 |
1 |
5.5 V |
Not Qualified |
32768 bit |
4.5 V |
e3 |
30 |
260 |
YES |
.08 Amp |
20 ns |
||||||||||||||||||
|
Renesas Electronics |
MULTI-PORT SRAM |
INDUSTRIAL |
52 |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
260 mA |
4096 words |
COMMON |
5 |
5 |
8 |
SRAMs |
85 Cel |
4KX8 |
4K |
2 V |
-40 Cel |
MATTE TIN |
QUAD |
2 |
S-PQCC-J52 |
3 |
5.5 V |
Not Qualified |
32768 bit |
4.5 V |
e3 |
260 |
YES |
.08 Amp |
25 ns |
|||||||||||||||||||
|
Renesas Electronics |
MULTI-PORT SRAM |
INDUSTRIAL |
52 |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
260 mA |
4096 words |
COMMON |
5 |
5 |
8 |
SRAMs |
85 Cel |
4KX8 |
4K |
2 V |
-40 Cel |
MATTE TIN |
QUAD |
2 |
S-PQCC-J52 |
3 |
5.5 V |
Not Qualified |
32768 bit |
4.5 V |
e3 |
260 |
YES |
.08 Amp |
25 ns |
|||||||||||||||||||
Integrated Device Technology |
MULTI-PORT SRAM |
COMMERCIAL |
52 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
200 mA |
4096 words |
COMMON |
5 |
5 |
8 |
CHIP CARRIER |
LDCC52,.8SQ |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
4KX8 |
4K |
2 V |
0 Cel |
TIN LEAD |
QUAD |
2 |
S-PQCC-J52 |
3 |
5.5 V |
4.57 mm |
19.1262 mm |
Not Qualified |
32768 bit |
4.5 V |
e0 |
20 |
225 |
.0015 Amp |
19.1262 mm |
55 ns |
||||||||||||
Integrated Device Technology |
MULTI-PORT SRAM |
COMMERCIAL |
52 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
240 mA |
4096 words |
COMMON |
5 |
5 |
8 |
CHIP CARRIER |
LDCC52,.8SQ |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
4KX8 |
4K |
4.5 V |
0 Cel |
TIN LEAD |
QUAD |
2 |
S-PQCC-J52 |
3 |
5.5 V |
4.57 mm |
19.1262 mm |
Not Qualified |
32768 bit |
4.5 V |
e0 |
20 |
225 |
.015 Amp |
19.1262 mm |
55 ns |
||||||||||||
Integrated Device Technology |
MULTI-PORT SRAM |
COMMERCIAL |
64 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
240 mA |
4096 words |
COMMON |
5 |
5 |
8 |
FLATPACK, LOW PROFILE |
QFP64,.66SQ,32 |
SRAMs |
.8 mm |
70 Cel |
3-STATE |
4KX8 |
4K |
4.5 V |
0 Cel |
TIN LEAD |
QUAD |
2 |
S-PQFP-G64 |
3 |
5.5 V |
1.6 mm |
14 mm |
Not Qualified |
32768 bit |
4.5 V |
e0 |
30 |
240 |
.015 Amp |
14 mm |
55 ns |
||||||||||||
Integrated Device Technology |
MULTI-PORT SRAM |
COMMERCIAL |
64 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
280 mA |
4096 words |
COMMON |
5 |
5 |
8 |
FLATPACK, LOW PROFILE |
QFP64,.66SQ,32 |
SRAMs |
.8 mm |
70 Cel |
3-STATE |
4KX8 |
4K |
4.5 V |
0 Cel |
TIN LEAD |
QUAD |
2 |
S-PQFP-G64 |
3 |
5.5 V |
1.6 mm |
14 mm |
Not Qualified |
32768 bit |
4.5 V |
SEMAPHORE; AUTOMATIC POWER-DOWN |
e0 |
30 |
240 |
YES |
.015 Amp |
14 mm |
25 ns |
||||||||||
|
Renesas Electronics |
MULTI-PORT SRAM |
INDUSTRIAL |
64 |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
260 mA |
4096 words |
COMMON |
5 |
5 |
8 |
SRAMs |
85 Cel |
4KX8 |
4K |
2 V |
-40 Cel |
TIN |
QUAD |
2 |
S-PQFP-G64 |
3 |
5.5 V |
Not Qualified |
32768 bit |
4.5 V |
e3 |
260 |
YES |
.08 Amp |
25 ns |
|||||||||||||||||||
Integrated Device Technology |
MULTI-PORT SRAM |
INDUSTRIAL |
64 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
260 mA |
4096 words |
COMMON |
5 |
5 |
8 |
FLATPACK, LOW PROFILE |
QFP64,.66SQ,32 |
SRAMs |
.8 mm |
85 Cel |
3-STATE |
4KX8 |
4K |
2 V |
-40 Cel |
TIN LEAD |
QUAD |
2 |
S-PQFP-G64 |
3 |
5.5 V |
1.6 mm |
14 mm |
Not Qualified |
32768 bit |
4.5 V |
e0 |
30 |
240 |
.0015 Amp |
14 mm |
25 ns |
||||||||||||
|
Renesas Electronics |
MULTI-PORT SRAM |
COMMERCIAL |
64 |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
240 mA |
4096 words |
COMMON |
5 |
5 |
8 |
SRAMs |
70 Cel |
4KX8 |
4K |
2 V |
0 Cel |
MATTE TIN |
QUAD |
2 |
S-PQFP-G64 |
3 |
5.5 V |
Not Qualified |
32768 bit |
4.5 V |
e3 |
30 |
260 |
YES |
.08 Amp |
20 ns |
||||||||||||||||||
Integrated Device Technology |
MULTI-PORT SRAM |
INDUSTRIAL |
52 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
260 mA |
4096 words |
COMMON |
5 |
5 |
8 |
CHIP CARRIER |
LDCC52,.8SQ |
SRAMs |
1.27 mm |
85 Cel |
3-STATE |
4KX8 |
4K |
2 V |
-40 Cel |
TIN LEAD |
QUAD |
2 |
S-PQCC-J52 |
3 |
5.5 V |
4.57 mm |
19.1262 mm |
Not Qualified |
32768 bit |
4.5 V |
e0 |
20 |
225 |
.0015 Amp |
19.1262 mm |
25 ns |
||||||||||||
Integrated Device Technology |
MULTI-PORT SRAM |
COMMERCIAL |
64 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
240 mA |
4096 words |
COMMON |
5 |
5 |
8 |
FLATPACK, LOW PROFILE |
QFP64,.66SQ,32 |
SRAMs |
.8 mm |
70 Cel |
3-STATE |
4KX8 |
4K |
2 V |
0 Cel |
TIN LEAD |
QUAD |
2 |
S-PQFP-G64 |
3 |
5.5 V |
1.6 mm |
14 mm |
Not Qualified |
32768 bit |
4.5 V |
SEMAPHORE; AUTOMATIC POWER-DOWN; BATTERY BACKUP |
e0 |
30 |
240 |
.0015 Amp |
14 mm |
20 ns |
|||||||||||
Integrated Device Technology |
MULTI-PORT SRAM |
COMMERCIAL |
64 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
240 mA |
4096 words |
COMMON |
5 |
5 |
8 |
FLATPACK, LOW PROFILE |
QFP64,.66SQ,32 |
SRAMs |
.8 mm |
70 Cel |
3-STATE |
4KX8 |
4K |
2 V |
0 Cel |
TIN LEAD |
QUAD |
2 |
S-PQFP-G64 |
3 |
5.5 V |
1.6 mm |
14 mm |
Not Qualified |
32768 bit |
4.5 V |
SEMAPHORE; AUTOMATIC POWER-DOWN; BATTERY BACKUP |
e0 |
30 |
240 |
.0015 Amp |
14 mm |
25 ns |
|||||||||||
Integrated Device Technology |
MULTI-PORT SRAM |
COMMERCIAL |
52 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
200 mA |
4096 words |
COMMON |
5 |
5 |
8 |
CHIP CARRIER |
LDCC52,.8SQ |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
4KX8 |
4K |
2 V |
0 Cel |
TIN LEAD |
QUAD |
2 |
S-PQCC-J52 |
3 |
5.5 V |
4.57 mm |
19.1262 mm |
Not Qualified |
32768 bit |
4.5 V |
SEMAPHORE; AUTOMATIC POWER-DOWN; BATTERY BACKUP |
e0 |
20 |
225 |
.0015 Amp |
19.1262 mm |
55 ns |
|||||||||||
Integrated Device Technology |
MULTI-PORT SRAM |
COMMERCIAL |
52 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
280 mA |
4096 words |
COMMON |
5 |
5 |
8 |
CHIP CARRIER |
LDCC52,.8SQ |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
4KX8 |
4K |
4.5 V |
0 Cel |
TIN LEAD |
QUAD |
2 |
S-PQCC-J52 |
3 |
5.5 V |
4.57 mm |
19.1262 mm |
Not Qualified |
32768 bit |
4.5 V |
SEMAPHORE; AUTOMATIC POWER-DOWN |
e0 |
20 |
225 |
.015 Amp |
19.1262 mm |
20 ns |
|||||||||||
Integrated Device Technology |
MULTI-PORT SRAM |
COMMERCIAL |
64 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
280 mA |
4096 words |
COMMON |
5 |
5 |
8 |
FLATPACK, LOW PROFILE |
QFP64,.66SQ,32 |
SRAMs |
.8 mm |
70 Cel |
3-STATE |
4KX8 |
4K |
4.5 V |
0 Cel |
TIN LEAD |
QUAD |
2 |
S-PQFP-G64 |
3 |
5.5 V |
1.6 mm |
14 mm |
Not Qualified |
32768 bit |
4.5 V |
SEMAPHORE; AUTOMATIC POWER-DOWN |
e0 |
30 |
240 |
.015 Amp |
14 mm |
20 ns |
|||||||||||
Integrated Device Technology |
MULTI-PORT SRAM |
COMMERCIAL |
64 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
260 mA |
4096 words |
COMMON |
5 |
5 |
8 |
FLATPACK, LOW PROFILE |
QFP64,.66SQ,32 |
SRAMs |
.8 mm |
70 Cel |
3-STATE |
4KX8 |
4K |
4.5 V |
0 Cel |
TIN LEAD |
QUAD |
2 |
S-PQFP-G64 |
3 |
5.5 V |
1.6 mm |
14 mm |
Not Qualified |
32768 bit |
4.5 V |
e0 |
30 |
240 |
.015 Amp |
14 mm |
35 ns |
||||||||||||
Integrated Device Technology |
MULTI-PORT SRAM |
COMMERCIAL |
64 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
260 mA |
4096 words |
COMMON |
5 |
5 |
8 |
FLATPACK, LOW PROFILE |
QFP64,.66SQ,32 |
SRAMs |
.8 mm |
70 Cel |
3-STATE |
4KX8 |
4K |
4.5 V |
0 Cel |
TIN LEAD |
QUAD |
2 |
S-PQFP-G64 |
3 |
5.5 V |
1.6 mm |
14 mm |
Not Qualified |
32768 bit |
4.5 V |
SEMAPHORE; AUTOMATIC POWER-DOWN |
e0 |
30 |
240 |
.015 Amp |
14 mm |
35 ns |
|||||||||||
Integrated Device Technology |
MULTI-PORT SRAM |
COMMERCIAL |
64 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
280 mA |
4096 words |
COMMON |
5 |
5 |
8 |
FLATPACK, LOW PROFILE |
QFP64,.66SQ,32 |
SRAMs |
.8 mm |
70 Cel |
3-STATE |
4KX8 |
4K |
4.5 V |
0 Cel |
TIN LEAD |
QUAD |
2 |
S-PQFP-G64 |
3 |
5.5 V |
1.6 mm |
14 mm |
Not Qualified |
32768 bit |
4.5 V |
e0 |
30 |
240 |
.015 Amp |
14 mm |
20 ns |
||||||||||||
Integrated Device Technology |
MULTI-PORT SRAM |
COMMERCIAL |
52 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
260 mA |
4096 words |
COMMON |
5 |
5 |
8 |
CHIP CARRIER |
LDCC52,.8SQ |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
4KX8 |
4K |
4.5 V |
0 Cel |
TIN LEAD |
QUAD |
2 |
S-PQCC-J52 |
3 |
5.5 V |
4.57 mm |
19.1262 mm |
Not Qualified |
32768 bit |
4.5 V |
SEMAPHORE; AUTOMATIC POWER-DOWN |
e0 |
20 |
225 |
.015 Amp |
19.1262 mm |
35 ns |
|||||||||||
|
Renesas Electronics |
MULTI-PORT SRAM |
COMMERCIAL |
52 |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
240 mA |
4096 words |
COMMON |
5 |
5 |
8 |
SRAMs |
70 Cel |
4KX8 |
4K |
2 V |
0 Cel |
MATTE TIN |
QUAD |
2 |
S-PQCC-J52 |
1 |
5.5 V |
Not Qualified |
32768 bit |
4.5 V |
e3 |
30 |
260 |
YES |
.08 Amp |
20 ns |
||||||||||||||||||
Integrated Device Technology |
MULTI-PORT SRAM |
INDUSTRIAL |
52 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
260 mA |
4096 words |
COMMON |
5 |
5 |
8 |
CHIP CARRIER |
LDCC52,.8SQ |
SRAMs |
1.27 mm |
85 Cel |
3-STATE |
4KX8 |
4K |
2 V |
-40 Cel |
TIN LEAD |
QUAD |
2 |
S-PQCC-J52 |
3 |
5.5 V |
4.57 mm |
19.1262 mm |
Not Qualified |
32768 bit |
4.5 V |
e0 |
20 |
225 |
.0015 Amp |
19.1262 mm |
25 ns |
||||||||||||
|
Renesas Electronics |
MULTI-PORT SRAM |
INDUSTRIAL |
64 |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
260 mA |
4096 words |
COMMON |
5 |
5 |
8 |
SRAMs |
85 Cel |
4KX8 |
4K |
2 V |
-40 Cel |
TIN |
QUAD |
2 |
S-PQFP-G64 |
3 |
5.5 V |
Not Qualified |
32768 bit |
4.5 V |
e3 |
260 |
YES |
.08 Amp |
25 ns |
|||||||||||||||||||
Cypress Semiconductor |
MULTI-PORT SRAM |
COMMERCIAL |
52 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
240 mA |
4096 words |
COMMON |
5 |
5 |
8 |
CHIP CARRIER |
LDCC52,.8SQ |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
4KX8 |
4K |
0 Cel |
TIN LEAD |
QUAD |
2 |
S-PQCC-J52 |
1 |
5.5 V |
5.08 mm |
19.1262 mm |
Not Qualified |
32768 bit |
4.5 V |
AUTOMATIC POWER-DOWN |
e0 |
YES |
19.1262 mm |
20 ns |
||||||||||||||
|
Cypress Semiconductor |
MULTI-PORT SRAM |
COMMERCIAL |
52 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
220 mA |
4096 words |
COMMON |
5 |
5 |
8 |
CHIP CARRIER |
LDCC52,.8SQ |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
4KX8 |
4K |
4.5 V |
0 Cel |
Matte Tin (Sn) |
QUAD |
2 |
S-PQCC-J52 |
3 |
5.5 V |
5.08 mm |
19.1262 mm |
Not Qualified |
32768 bit |
4.5 V |
e3 |
20 |
260 |
.015 Amp |
19.1262 mm |
15 ns |
|||||||||||
Integrated Device Technology |
MULTI-PORT SRAM |
COMMERCIAL |
52 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
240 mA |
4096 words |
COMMON |
5 |
5 |
8 |
CHIP CARRIER |
LDCC52,.8SQ |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
4KX8 |
4K |
4.5 V |
0 Cel |
Tin/Lead (Sn85Pb15) |
QUAD |
2 |
S-PQCC-J52 |
3 |
5.5 V |
4.57 mm |
19.1262 mm |
Not Qualified |
32768 bit |
4.5 V |
SEMAPHORE; AUTOMATIC POWER-DOWN |
e0 |
20 |
225 |
YES |
.015 Amp |
19.1262 mm |
70 ns |
||||||||||
Integrated Device Technology |
MULTI-PORT SRAM |
COMMERCIAL |
64 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
240 mA |
4096 words |
COMMON |
5 |
5 |
8 |
FLATPACK, LOW PROFILE |
QFP64,.66SQ,32 |
SRAMs |
.8 mm |
70 Cel |
3-STATE |
4KX8 |
4K |
2 V |
0 Cel |
TIN LEAD |
QUAD |
2 |
S-PQFP-G64 |
3 |
5.5 V |
1.6 mm |
14 mm |
Not Qualified |
32768 bit |
4.5 V |
e0 |
30 |
240 |
.0015 Amp |
14 mm |
25 ns |
||||||||||||
Integrated Device Technology |
MULTI-PORT SRAM |
COMMERCIAL |
52 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
240 mA |
4096 words |
COMMON |
5 |
5 |
8 |
CHIP CARRIER |
LDCC52,.8SQ |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
4KX8 |
4K |
4.5 V |
0 Cel |
TIN LEAD |
QUAD |
2 |
S-PQCC-J52 |
3 |
5.5 V |
4.57 mm |
19.1262 mm |
Not Qualified |
32768 bit |
4.5 V |
SEMAPHORE; AUTOMATIC POWER-DOWN |
e0 |
20 |
225 |
.015 Amp |
19.1262 mm |
55 ns |
|||||||||||
Integrated Device Technology |
MULTI-PORT SRAM |
COMMERCIAL |
52 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
240 mA |
4096 words |
COMMON |
5 |
5 |
8 |
CHIP CARRIER |
LDCC52,.8SQ |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
4KX8 |
4K |
2 V |
0 Cel |
TIN LEAD |
QUAD |
2 |
S-PQCC-J52 |
3 |
5.5 V |
4.57 mm |
19.1262 mm |
Not Qualified |
32768 bit |
4.5 V |
SEMAPHORE; AUTOMATIC POWER-DOWN; BATTERY BACKUP |
e0 |
20 |
225 |
.0015 Amp |
19.1262 mm |
20 ns |
|||||||||||
Integrated Device Technology |
MULTI-PORT SRAM |
COMMERCIAL |
64 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
240 mA |
4096 words |
COMMON |
5 |
5 |
8 |
FLATPACK, LOW PROFILE |
QFP64,.66SQ,32 |
SRAMs |
.8 mm |
70 Cel |
3-STATE |
4KX8 |
4K |
2 V |
0 Cel |
TIN LEAD |
QUAD |
2 |
S-PQFP-G64 |
3 |
5.5 V |
1.6 mm |
14 mm |
Not Qualified |
32768 bit |
4.5 V |
e0 |
30 |
240 |
.0015 Amp |
14 mm |
20 ns |
||||||||||||
Integrated Device Technology |
MULTI-PORT SRAM |
COMMERCIAL |
64 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
200 mA |
4096 words |
COMMON |
5 |
5 |
8 |
FLATPACK, LOW PROFILE |
QFP64,.66SQ,32 |
SRAMs |
.8 mm |
70 Cel |
3-STATE |
4KX8 |
4K |
2 V |
0 Cel |
TIN LEAD |
QUAD |
2 |
S-PQFP-G64 |
3 |
5.5 V |
1.6 mm |
14 mm |
Not Qualified |
32768 bit |
4.5 V |
SEMAPHORE; AUTOMATIC POWER-DOWN; BATTERY BACKUP |
e0 |
30 |
240 |
.0015 Amp |
14 mm |
55 ns |
|||||||||||
Integrated Device Technology |
MULTI-PORT SRAM |
COMMERCIAL |
52 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
200 mA |
4096 words |
COMMON |
5 |
5 |
8 |
CHIP CARRIER |
LDCC52,.8SQ |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
4KX8 |
4K |
2 V |
0 Cel |
TIN LEAD |
QUAD |
2 |
S-PQCC-J52 |
3 |
5.5 V |
4.57 mm |
19.1262 mm |
Not Qualified |
32768 bit |
4.5 V |
SEMAPHORE; AUTOMATIC POWER-DOWN; BATTERY BACKUP |
e0 |
20 |
225 |
.0015 Amp |
19.1262 mm |
70 ns |
|||||||||||
Integrated Device Technology |
MULTI-PORT SRAM |
COMMERCIAL |
52 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
280 mA |
4096 words |
COMMON |
5 |
5 |
8 |
CHIP CARRIER |
LDCC52,.8SQ |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
4KX8 |
4K |
4.5 V |
0 Cel |
TIN LEAD |
QUAD |
2 |
S-PQCC-J52 |
3 |
5.5 V |
4.57 mm |
19.1262 mm |
Not Qualified |
32768 bit |
4.5 V |
e0 |
20 |
225 |
.015 Amp |
19.1262 mm |
20 ns |
||||||||||||
Integrated Device Technology |
MULTI-PORT SRAM |
COMMERCIAL |
52 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
280 mA |
4096 words |
COMMON |
5 |
5 |
8 |
CHIP CARRIER |
LDCC52,.8SQ |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
4KX8 |
4K |
4.5 V |
0 Cel |
TIN LEAD |
QUAD |
2 |
S-PQCC-J52 |
3 |
5.5 V |
4.57 mm |
19.1262 mm |
Not Qualified |
32768 bit |
4.5 V |
SEMAPHORE; AUTOMATIC POWER-DOWN |
e0 |
20 |
225 |
.015 Amp |
19.1262 mm |
25 ns |
|||||||||||
Integrated Device Technology |
MULTI-PORT SRAM |
COMMERCIAL |
64 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
220 mA |
4096 words |
COMMON |
5 |
5 |
8 |
FLATPACK, LOW PROFILE |
QFP64,.66SQ,32 |
SRAMs |
.8 mm |
70 Cel |
3-STATE |
4KX8 |
4K |
2 V |
0 Cel |
TIN LEAD |
QUAD |
2 |
S-PQFP-G64 |
3 |
5.5 V |
1.6 mm |
14 mm |
Not Qualified |
32768 bit |
4.5 V |
e0 |
30 |
240 |
.0015 Amp |
14 mm |
35 ns |
||||||||||||
Integrated Device Technology |
MULTI-PORT SRAM |
COMMERCIAL |
52 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
200 mA |
4096 words |
COMMON |
5 |
5 |
8 |
CHIP CARRIER |
LDCC52,.8SQ |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
4KX8 |
4K |
2 V |
0 Cel |
TIN LEAD |
QUAD |
2 |
S-PQCC-J52 |
3 |
5.5 V |
4.57 mm |
19.1262 mm |
Not Qualified |
32768 bit |
4.5 V |
e0 |
20 |
225 |
.0015 Amp |
19.1262 mm |
45 ns |
||||||||||||
Integrated Device Technology |
MULTI-PORT SRAM |
COMMERCIAL |
64 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
200 mA |
4096 words |
COMMON |
5 |
5 |
8 |
FLATPACK, LOW PROFILE |
QFP64,.66SQ,32 |
SRAMs |
.8 mm |
70 Cel |
3-STATE |
4KX8 |
4K |
2 V |
0 Cel |
TIN LEAD |
QUAD |
2 |
S-PQFP-G64 |
3 |
5.5 V |
1.6 mm |
14 mm |
Not Qualified |
32768 bit |
4.5 V |
e0 |
30 |
240 |
.0015 Amp |
14 mm |
55 ns |
||||||||||||
Integrated Device Technology |
MULTI-PORT SRAM |
COMMERCIAL |
52 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
200 mA |
4096 words |
COMMON |
5 |
5 |
8 |
CHIP CARRIER |
LDCC52,.8SQ |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
4KX8 |
4K |
2 V |
0 Cel |
TIN LEAD |
QUAD |
2 |
S-PQCC-J52 |
3 |
5.5 V |
4.57 mm |
19.1262 mm |
Not Qualified |
32768 bit |
4.5 V |
e0 |
20 |
225 |
.0015 Amp |
19.1262 mm |
70 ns |
||||||||||||
Integrated Device Technology |
MULTI-PORT SRAM |
COMMERCIAL |
52 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
280 mA |
4096 words |
COMMON |
5 |
5 |
8 |
CHIP CARRIER |
LDCC52,.8SQ |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
4KX8 |
4K |
4.5 V |
0 Cel |
TIN LEAD |
QUAD |
2 |
S-PQCC-J52 |
3 |
5.5 V |
4.57 mm |
19.1262 mm |
Not Qualified |
32768 bit |
4.5 V |
e0 |
20 |
225 |
.015 Amp |
19.1262 mm |
25 ns |
||||||||||||
Integrated Device Technology |
MULTI-PORT SRAM |
COMMERCIAL |
64 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
280 mA |
4096 words |
COMMON |
5 |
5 |
8 |
FLATPACK, LOW PROFILE |
QFP64,.66SQ,32 |
SRAMs |
.8 mm |
70 Cel |
3-STATE |
4KX8 |
4K |
4.5 V |
0 Cel |
TIN LEAD |
QUAD |
2 |
S-PQFP-G64 |
3 |
5.5 V |
1.6 mm |
14 mm |
Not Qualified |
32768 bit |
4.5 V |
SEMAPHORE; AUTOMATIC POWER-DOWN |
e0 |
30 |
240 |
.015 Amp |
14 mm |
25 ns |
|||||||||||
Integrated Device Technology |
MULTI-PORT SRAM |
COMMERCIAL |
52 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
240 mA |
4096 words |
COMMON |
5 |
5 |
8 |
CHIP CARRIER |
LDCC52,.8SQ |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
4KX8 |
4K |
4.5 V |
0 Cel |
TIN LEAD |
QUAD |
2 |
S-PQCC-J52 |
3 |
5.5 V |
4.57 mm |
19.1262 mm |
Not Qualified |
32768 bit |
4.5 V |
e0 |
20 |
225 |
.015 Amp |
19.1262 mm |
45 ns |
||||||||||||
Integrated Device Technology |
MULTI-PORT SRAM |
COMMERCIAL |
52 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
240 mA |
4096 words |
COMMON |
5 |
5 |
8 |
CHIP CARRIER |
LDCC52,.8SQ |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
4KX8 |
4K |
4.5 V |
0 Cel |
TIN LEAD |
QUAD |
2 |
S-PQCC-J52 |
3 |
5.5 V |
4.57 mm |
19.1262 mm |
Not Qualified |
32768 bit |
4.5 V |
e0 |
20 |
225 |
.015 Amp |
19.1262 mm |
70 ns |
||||||||||||
Integrated Device Technology |
MULTI-PORT SRAM |
COMMERCIAL |
52 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
240 mA |
4096 words |
COMMON |
5 |
5 |
8 |
CHIP CARRIER |
LDCC52,.8SQ |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
4KX8 |
4K |
4.5 V |
0 Cel |
TIN LEAD |
QUAD |
2 |
S-PQCC-J52 |
3 |
5.5 V |
4.57 mm |
19.1262 mm |
Not Qualified |
32768 bit |
4.5 V |
SEMAPHORE; AUTOMATIC POWER-DOWN |
e0 |
20 |
225 |
.015 Amp |
19.1262 mm |
70 ns |
|||||||||||
Integrated Device Technology |
MULTI-PORT SRAM |
COMMERCIAL |
52 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
240 mA |
4096 words |
COMMON |
5 |
5 |
8 |
CHIP CARRIER |
LDCC52,.8SQ |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
4KX8 |
4K |
2 V |
0 Cel |
TIN LEAD |
QUAD |
2 |
S-PQCC-J52 |
3 |
5.5 V |
4.57 mm |
19.1262 mm |
Not Qualified |
32768 bit |
4.5 V |
e0 |
20 |
225 |
.0015 Amp |
19.1262 mm |
20 ns |
||||||||||||
Integrated Device Technology |
MULTI-PORT SRAM |
COMMERCIAL |
52 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
240 mA |
4096 words |
COMMON |
5 |
5 |
8 |
CHIP CARRIER |
LDCC52,.8SQ |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
4KX8 |
4K |
2 V |
0 Cel |
TIN LEAD |
QUAD |
2 |
S-PQCC-J52 |
3 |
5.5 V |
4.57 mm |
19.1262 mm |
Not Qualified |
32768 bit |
4.5 V |
SEMAPHORE; AUTOMATIC POWER-DOWN; BATTERY BACKUP |
e0 |
20 |
225 |
.0015 Amp |
19.1262 mm |
25 ns |
|||||||||||
Integrated Device Technology |
MULTI-PORT SRAM |
COMMERCIAL |
52 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
220 mA |
4096 words |
COMMON |
5 |
5 |
8 |
CHIP CARRIER |
LDCC52,.8SQ |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
4KX8 |
4K |
2 V |
0 Cel |
TIN LEAD |
QUAD |
2 |
S-PQCC-J52 |
3 |
5.5 V |
4.57 mm |
19.1262 mm |
Not Qualified |
32768 bit |
4.5 V |
e0 |
20 |
225 |
.0015 Amp |
19.1262 mm |
35 ns |
||||||||||||
Integrated Device Technology |
MULTI-PORT SRAM |
COMMERCIAL |
52 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
220 mA |
4096 words |
COMMON |
5 |
5 |
8 |
CHIP CARRIER |
LDCC52,.8SQ |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
4KX8 |
4K |
2 V |
0 Cel |
TIN LEAD |
QUAD |
2 |
S-PQCC-J52 |
3 |
5.5 V |
4.57 mm |
19.1262 mm |
Not Qualified |
32768 bit |
4.5 V |
SEMAPHORE; AUTOMATIC POWER-DOWN; BATTERY BACKUP |
e0 |
20 |
225 |
.0015 Amp |
19.1262 mm |
35 ns |
SRAM, or Static Random-Access Memory, is a type of volatile computer memory that stores data as a flip-flop, which retains the data as long as power is supplied to the system. SRAM is commonly used as cache memory and in other applications where high-speed access to data is required.
SRAM is a type of memory that is faster and more expensive than DRAM (Dynamic Random-Access Memory). It is commonly used as cache memory in computer systems and other digital devices to improve the speed of data access. SRAM is also used in applications where high-speed data processing is required, such as in networking equipment, video games, and other high-performance computing applications.
One of the advantages of using SRAM is that it provides faster access to data than other types of memory, such as DRAM. This is because SRAM does not need to be refreshed like DRAM, which makes it faster and more reliable. Additionally, SRAM uses less power than other types of memory, which makes it ideal for use in battery-powered devices.
One of the disadvantages of using SRAM is that it is more expensive and less dense than other types of memory, such as DRAM or flash memory. This means that it is not suitable for applications that require large amounts of memory at a low cost. Additionally, SRAM is volatile, which means that it cannot store data permanently.