Part | RoHS | Manufacturer | Memory IC Type | Temperature Grade | No. of Terminals | Package Code | Refresh Cycles | Package Shape | Total Dose (V) | Package Body Material | Surface Mount | No. of Functions | Technology | Screening Level | Nominal Negative Supply Voltage | Terminal Form | Parallel or Serial | Operating Mode | Maximum Supply Current | No. of Words | Self Refresh | Input/Output Type | Nominal Supply Voltage / Vsup (V) | Power Supplies (V) | Memory Width | Package Style (Meter) | Package Equivalence Code | Alternate Memory Width | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Reverse Pinout | Output Characteristics | Organization | No. of Words Code | Minimum Standby Voltage | Minimum Operating Temperature | Terminal Finish | Terminal Position | No. of Ports | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Maximum Clock Frequency (fCLK) | Width | Qualification | Memory Density | Minimum Supply Voltage (Vsup) | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Output Enable | Maximum Standby Current | Length | Maximum Access Time |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Analog Devices |
NON-VOLATILE SRAM |
COMMERCIAL |
30 |
SIMM |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
100 mA |
131072 words |
8 |
MICROELECTRONIC ASSEMBLY |
SIM30 |
SRAMs |
2.54 mm |
70 Cel |
128KX8 |
128K |
0 Cel |
SINGLE |
R-PSMA-N30 |
Not Qualified |
1048576 bit |
.025 Amp |
200 ns |
|||||||||||||||||||||||||||||||
Analog Devices |
NON-VOLATILE SRAM |
COMMERCIAL |
30 |
SIMM |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
HYBRID |
NO LEAD |
15 mA |
1048576 words |
5 |
5 |
9 |
MICROELECTRONIC ASSEMBLY |
SIM30 |
SRAMs |
2.54 mm |
70 Cel |
1MX9 |
1M |
0 Cel |
SINGLE |
R-PSMA-N30 |
Not Qualified |
9437184 bit |
.015 Amp |
120 ns |
|||||||||||||||||||||||||||||
Analog Devices |
NON-VOLATILE SRAM |
COMMERCIAL |
30 |
SIMM |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
HYBRID |
NO LEAD |
15 mA |
1048576 words |
5 |
5 |
9 |
MICROELECTRONIC ASSEMBLY |
SIM30 |
SRAMs |
2.54 mm |
70 Cel |
1MX9 |
1M |
0 Cel |
SINGLE |
R-PSMA-N30 |
Not Qualified |
9437184 bit |
.015 Amp |
150 ns |
|||||||||||||||||||||||||||||
Analog Devices |
NON-VOLATILE SRAM |
COMMERCIAL |
30 |
PLASTIC/EPOXY |
NO |
CMOS |
75 mA |
2048 words |
8 |
CARD30 |
SRAMs |
70 Cel |
2KX8 |
2K |
0 Cel |
Not Qualified |
16384 bit |
.01 Amp |
250 ns |
||||||||||||||||||||||||||||||||||||||
Maxim Integrated |
NON-VOLATILE SRAM |
COMMERCIAL |
30 |
SIMM |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
100 mA |
131072 words |
8 |
MICROELECTRONIC ASSEMBLY |
SIM30 |
SRAMs |
2.54 mm |
70 Cel |
128KX8 |
128K |
0 Cel |
SINGLE |
R-PSMA-N30 |
Not Qualified |
1048576 bit |
.025 Amp |
120 ns |
|||||||||||||||||||||||||||||||
Maxim Integrated |
NON-VOLATILE SRAM |
COMMERCIAL |
30 |
SIMM |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
100 mA |
131072 words |
8 |
MICROELECTRONIC ASSEMBLY |
SIM30 |
SRAMs |
2.54 mm |
70 Cel |
128KX8 |
128K |
0 Cel |
SINGLE |
R-PSMA-N30 |
Not Qualified |
1048576 bit |
.025 Amp |
150 ns |
|||||||||||||||||||||||||||||||
Toshiba |
STATIC COLUMN DRAM |
COMMERCIAL |
30 |
512 |
PLASTIC/EPOXY |
NO |
CMOS |
540 mA |
1048576 words |
COMMON |
5 |
5 |
9 |
SIP30,.2 |
SRAMs |
2.54 mm |
70 Cel |
3-STATE |
1MX9 |
1M |
0 Cel |
Tin/Lead (Sn/Pb) |
SINGLE |
22.86 mm |
Not Qualified |
9437184 bit |
e0 |
.009 Amp |
100 ns |
||||||||||||||||||||||||||||
Toshiba |
STATIC COLUMN DRAM |
COMMERCIAL |
30 |
SIMM |
512 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
134 mA |
524288 words |
COMMON |
5 |
5 |
8 |
MICROELECTRONIC ASSEMBLY |
SIM30 |
SRAMs |
2.54 mm |
70 Cel |
3-STATE |
512KX8 |
512K |
0 Cel |
SINGLE |
R-PSMA-N30 |
Not Qualified |
4194304 bit |
.004 Amp |
100 ns |
||||||||||||||||||||||||||
Toshiba |
STATIC COLUMN DRAM |
COMMERCIAL |
30 |
512 |
PLASTIC/EPOXY |
NO |
CMOS |
450 mA |
1048576 words |
COMMON |
5 |
5 |
9 |
SIP30,.2 |
SRAMs |
2.54 mm |
70 Cel |
3-STATE |
1MX9 |
1M |
0 Cel |
Tin/Lead (Sn/Pb) |
SINGLE |
12.7 mm |
Not Qualified |
9437184 bit |
e0 |
.009 Amp |
120 ns |
||||||||||||||||||||||||||||
Toshiba |
STATIC COLUMN DRAM |
COMMERCIAL |
30 |
SIMM |
512 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
450 mA |
1048576 words |
COMMON |
5 |
5 |
9 |
MICROELECTRONIC ASSEMBLY |
SIM30 |
SRAMs |
2.54 mm |
70 Cel |
3-STATE |
1MX9 |
1M |
0 Cel |
SINGLE |
R-PSMA-N30 |
20.32 mm |
Not Qualified |
9437184 bit |
.009 Amp |
120 ns |
|||||||||||||||||||||||||
Toshiba |
STATIC COLUMN DRAM |
COMMERCIAL |
30 |
512 |
PLASTIC/EPOXY |
NO |
CMOS |
400 mA |
1048576 words |
COMMON |
5 |
5 |
8 |
SIP30,.2 |
SRAMs |
2.54 mm |
70 Cel |
3-STATE |
1MX8 |
1M |
0 Cel |
Tin/Lead (Sn/Pb) |
SINGLE |
12.7 mm |
Not Qualified |
8388608 bit |
e0 |
.008 Amp |
120 ns |
||||||||||||||||||||||||||||
Toshiba |
STATIC COLUMN DRAM |
COMMERCIAL |
30 |
SIMM |
512 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
400 mA |
1048576 words |
COMMON |
5 |
5 |
8 |
MICROELECTRONIC ASSEMBLY |
SIM30 |
SRAMs |
2.54 mm |
70 Cel |
3-STATE |
1MX8 |
1M |
0 Cel |
SINGLE |
R-PSMA-N30 |
20.32 mm |
Not Qualified |
8388608 bit |
.008 Amp |
120 ns |
|||||||||||||||||||||||||
Toshiba |
STATIC COLUMN DRAM |
COMMERCIAL |
30 |
512 |
PLASTIC/EPOXY |
NO |
CMOS |
400 mA |
1048576 words |
COMMON |
5 |
5 |
8 |
SIP30,.2 |
SRAMs |
2.54 mm |
70 Cel |
3-STATE |
1MX8 |
1M |
0 Cel |
Tin/Lead (Sn/Pb) |
SINGLE |
22.86 mm |
Not Qualified |
8388608 bit |
e0 |
.008 Amp |
120 ns |
||||||||||||||||||||||||||||
Toshiba |
STATIC COLUMN DRAM |
COMMERCIAL |
30 |
512 |
PLASTIC/EPOXY |
NO |
CMOS |
134 mA |
524288 words |
COMMON |
5 |
5 |
8 |
SIP30,.2 |
SRAMs |
2.54 mm |
70 Cel |
3-STATE |
512KX8 |
512K |
0 Cel |
Tin/Lead (Sn/Pb) |
SINGLE |
Not Qualified |
4194304 bit |
e0 |
.004 Amp |
100 ns |
|||||||||||||||||||||||||||||
Toshiba |
STATIC COLUMN DRAM |
COMMERCIAL |
30 |
SIMM |
512 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
560 mA |
1048576 words |
COMMON |
5 |
5 |
8 |
MICROELECTRONIC ASSEMBLY |
SIM30 |
SRAMs |
2.54 mm |
70 Cel |
3-STATE |
1MX8 |
1M |
0 Cel |
SINGLE |
R-PSMA-N30 |
20.32 mm |
Not Qualified |
8388608 bit |
.008 Amp |
85 ns |
|||||||||||||||||||||||||
Toshiba |
STATIC COLUMN DRAM |
COMMERCIAL |
30 |
512 |
PLASTIC/EPOXY |
NO |
CMOS |
450 mA |
1048576 words |
COMMON |
5 |
5 |
9 |
SIP30,.2 |
SRAMs |
2.54 mm |
70 Cel |
3-STATE |
1MX9 |
1M |
0 Cel |
Tin/Lead (Sn/Pb) |
SINGLE |
22.86 mm |
Not Qualified |
9437184 bit |
e0 |
.009 Amp |
120 ns |
||||||||||||||||||||||||||||
Toshiba |
STATIC COLUMN DRAM |
COMMERCIAL |
30 |
SIMM |
512 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
630 mA |
1048576 words |
COMMON |
5 |
5 |
9 |
MICROELECTRONIC ASSEMBLY |
SIM30 |
SRAMs |
2.54 mm |
70 Cel |
3-STATE |
1MX9 |
1M |
0 Cel |
SINGLE |
R-PSMA-N30 |
20.32 mm |
Not Qualified |
9437184 bit |
.009 Amp |
85 ns |
|||||||||||||||||||||||||
Toshiba |
STATIC COLUMN DRAM |
COMMERCIAL |
30 |
512 |
PLASTIC/EPOXY |
NO |
CMOS |
480 mA |
1048576 words |
COMMON |
5 |
5 |
8 |
SIP30,.2 |
SRAMs |
2.54 mm |
70 Cel |
3-STATE |
1MX8 |
1M |
0 Cel |
Tin/Lead (Sn/Pb) |
SINGLE |
12.7 mm |
Not Qualified |
8388608 bit |
e0 |
.008 Amp |
100 ns |
||||||||||||||||||||||||||||
Toshiba |
STATIC COLUMN DRAM |
COMMERCIAL |
30 |
512 |
PLASTIC/EPOXY |
NO |
CMOS |
630 mA |
1048576 words |
COMMON |
5 |
5 |
9 |
SIP30,.2 |
SRAMs |
2.54 mm |
70 Cel |
3-STATE |
1MX9 |
1M |
0 Cel |
Tin/Lead (Sn/Pb) |
SINGLE |
12.7 mm |
Not Qualified |
9437184 bit |
e0 |
.009 Amp |
85 ns |
||||||||||||||||||||||||||||
Toshiba |
STATIC COLUMN DRAM |
COMMERCIAL |
30 |
512 |
PLASTIC/EPOXY |
NO |
CMOS |
630 mA |
1048576 words |
COMMON |
5 |
5 |
9 |
SIP30,.2 |
SRAMs |
2.54 mm |
70 Cel |
3-STATE |
1MX9 |
1M |
0 Cel |
Tin/Lead (Sn/Pb) |
SINGLE |
22.86 mm |
Not Qualified |
9437184 bit |
e0 |
.009 Amp |
85 ns |
||||||||||||||||||||||||||||
Toshiba |
STATIC COLUMN DRAM |
COMMERCIAL |
30 |
512 |
PLASTIC/EPOXY |
NO |
CMOS |
480 mA |
1048576 words |
COMMON |
5 |
5 |
8 |
SIP30,.2 |
SRAMs |
2.54 mm |
70 Cel |
3-STATE |
1MX8 |
1M |
0 Cel |
Tin/Lead (Sn/Pb) |
SINGLE |
22.86 mm |
Not Qualified |
8388608 bit |
e0 |
.008 Amp |
100 ns |
||||||||||||||||||||||||||||
Toshiba |
STATIC COLUMN DRAM |
COMMERCIAL |
30 |
512 |
PLASTIC/EPOXY |
NO |
CMOS |
560 mA |
1048576 words |
COMMON |
5 |
5 |
8 |
SIP30,.2 |
SRAMs |
2.54 mm |
70 Cel |
3-STATE |
1MX8 |
1M |
0 Cel |
Tin/Lead (Sn/Pb) |
SINGLE |
22.86 mm |
Not Qualified |
8388608 bit |
e0 |
.008 Amp |
85 ns |
||||||||||||||||||||||||||||
Toshiba |
STATIC COLUMN DRAM |
COMMERCIAL |
30 |
SIMM |
512 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
114 mA |
524288 words |
COMMON |
5 |
5 |
8 |
MICROELECTRONIC ASSEMBLY |
SIM30 |
SRAMs |
2.54 mm |
70 Cel |
3-STATE |
512KX8 |
512K |
0 Cel |
SINGLE |
R-PSMA-N30 |
Not Qualified |
4194304 bit |
.004 Amp |
120 ns |
||||||||||||||||||||||||||
Toshiba |
STATIC COLUMN DRAM |
COMMERCIAL |
30 |
512 |
PLASTIC/EPOXY |
NO |
CMOS |
114 mA |
524288 words |
COMMON |
5 |
5 |
8 |
SIP30,.2 |
SRAMs |
2.54 mm |
70 Cel |
3-STATE |
512KX8 |
512K |
0 Cel |
Tin/Lead (Sn/Pb) |
SINGLE |
Not Qualified |
4194304 bit |
e0 |
.004 Amp |
120 ns |
|||||||||||||||||||||||||||||
Toshiba |
STATIC COLUMN DRAM |
COMMERCIAL |
30 |
512 |
PLASTIC/EPOXY |
NO |
CMOS |
540 mA |
1048576 words |
COMMON |
5 |
5 |
9 |
SIP30,.2 |
SRAMs |
2.54 mm |
70 Cel |
3-STATE |
1MX9 |
1M |
0 Cel |
Tin/Lead (Sn/Pb) |
SINGLE |
12.7 mm |
Not Qualified |
9437184 bit |
e0 |
.009 Amp |
100 ns |
||||||||||||||||||||||||||||
Toshiba |
STATIC COLUMN DRAM |
COMMERCIAL |
30 |
512 |
PLASTIC/EPOXY |
NO |
CMOS |
560 mA |
1048576 words |
COMMON |
5 |
5 |
8 |
SIP30,.2 |
SRAMs |
2.54 mm |
70 Cel |
3-STATE |
1MX8 |
1M |
0 Cel |
Tin/Lead (Sn/Pb) |
SINGLE |
12.7 mm |
Not Qualified |
8388608 bit |
e0 |
.008 Amp |
85 ns |
||||||||||||||||||||||||||||
Toshiba |
STATIC COLUMN DRAM |
COMMERCIAL |
30 |
SIMM |
512 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
480 mA |
1048576 words |
COMMON |
5 |
5 |
8 |
MICROELECTRONIC ASSEMBLY |
SIM30 |
SRAMs |
2.54 mm |
70 Cel |
3-STATE |
1MX8 |
1M |
0 Cel |
SINGLE |
R-PSMA-N30 |
20.32 mm |
Not Qualified |
8388608 bit |
.008 Amp |
100 ns |
|||||||||||||||||||||||||
Toshiba |
STATIC COLUMN DRAM |
COMMERCIAL |
30 |
SIMM |
512 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
540 mA |
1048576 words |
COMMON |
5 |
5 |
9 |
MICROELECTRONIC ASSEMBLY |
SIM30 |
SRAMs |
2.54 mm |
70 Cel |
3-STATE |
1MX9 |
1M |
0 Cel |
SINGLE |
R-PSMA-N30 |
20.32 mm |
Not Qualified |
9437184 bit |
.009 Amp |
100 ns |
|||||||||||||||||||||||||
Renesas Electronics |
STATIC COLUMN DRAM |
COMMERCIAL |
30 |
512 |
PLASTIC/EPOXY |
NO |
CMOS |
560 mA |
1048576 words |
COMMON |
5 |
5 |
8 |
SIP30,.2 |
SRAMs |
2.54 mm |
70 Cel |
3-STATE |
1MX8 |
1M |
0 Cel |
Tin/Lead (Sn/Pb) |
SINGLE |
Not Qualified |
8388608 bit |
e0 |
.008 Amp |
80 ns |
|||||||||||||||||||||||||||||
Renesas Electronics |
STATIC COLUMN DRAM |
COMMERCIAL |
30 |
512 |
PLASTIC/EPOXY |
NO |
CMOS |
480 mA |
1048576 words |
COMMON |
5 |
5 |
8 |
SIP30,.2 |
SRAMs |
2.54 mm |
70 Cel |
3-STATE |
1MX8 |
1M |
0 Cel |
Tin/Lead (Sn/Pb) |
SINGLE |
Not Qualified |
8388608 bit |
e0 |
.008 Amp |
100 ns |
|||||||||||||||||||||||||||||
Renesas Electronics |
SRAM MODULE |
COMMERCIAL |
30 |
PLASTIC/EPOXY |
NO |
CMOS |
PARALLEL |
ASYNCHRONOUS |
200 mA |
131072 words |
COMMON |
5 |
5 |
8 |
SIP30,.2 |
SRAMs |
2.54 mm |
70 Cel |
3-STATE |
128KX8 |
128K |
4.5 V |
0 Cel |
TIN LEAD |
SINGLE |
Not Qualified |
1048576 bit |
e0 |
.06 Amp |
70 ns |
|||||||||||||||||||||||||||
Renesas Electronics |
SRAM MODULE |
COMMERCIAL |
30 |
PLASTIC/EPOXY |
NO |
CMOS |
PARALLEL |
ASYNCHRONOUS |
200 mA |
131072 words |
COMMON |
5 |
5 |
8 |
SIP30,.2 |
SRAMs |
2.54 mm |
70 Cel |
3-STATE |
128KX8 |
128K |
4.5 V |
0 Cel |
TIN LEAD |
SINGLE |
Not Qualified |
1048576 bit |
e0 |
.06 Amp |
60 ns |
|||||||||||||||||||||||||||
Renesas Electronics |
STATIC COLUMN DRAM |
COMMERCIAL |
30 |
512 |
PLASTIC/EPOXY |
NO |
CMOS |
630 mA |
1048576 words |
COMMON |
5 |
5 |
9 |
SIP30,.2 |
SRAMs |
2.54 mm |
70 Cel |
3-STATE |
1MX9 |
1M |
0 Cel |
Tin/Lead (Sn/Pb) |
SINGLE |
Not Qualified |
9437184 bit |
e0 |
.009 Amp |
80 ns |
|||||||||||||||||||||||||||||
Renesas Electronics |
SRAM MODULE |
COMMERCIAL |
30 |
PLASTIC/EPOXY |
NO |
CMOS |
PARALLEL |
ASYNCHRONOUS |
200 mA |
131072 words |
COMMON |
5 |
5 |
8 |
SIP30,.2 |
SRAMs |
2.54 mm |
70 Cel |
3-STATE |
128KX8 |
128K |
4.5 V |
0 Cel |
TIN LEAD |
SINGLE |
Not Qualified |
1048576 bit |
e0 |
.06 Amp |
70 ns |
|||||||||||||||||||||||||||
Renesas Electronics |
STATIC COLUMN DRAM |
COMMERCIAL |
30 |
SIMM |
512 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
480 mA |
1048576 words |
COMMON |
5 |
5 |
8 |
MICROELECTRONIC ASSEMBLY |
SIM30 |
SRAMs |
2.54 mm |
70 Cel |
3-STATE |
1MX8 |
1M |
0 Cel |
SINGLE |
R-PSMA-N30 |
Not Qualified |
8388608 bit |
.008 Amp |
100 ns |
||||||||||||||||||||||||||
Renesas Electronics |
STATIC COLUMN DRAM |
COMMERCIAL |
30 |
512 |
PLASTIC/EPOXY |
NO |
CMOS |
400 mA |
1048576 words |
COMMON |
5 |
5 |
8 |
SIP30,.2 |
SRAMs |
2.54 mm |
70 Cel |
3-STATE |
1MX8 |
1M |
0 Cel |
Tin/Lead (Sn/Pb) |
SINGLE |
Not Qualified |
8388608 bit |
e0 |
.008 Amp |
120 ns |
|||||||||||||||||||||||||||||
Renesas Electronics |
STATIC COLUMN DRAM |
COMMERCIAL |
30 |
SIMM |
512 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
630 mA |
1048576 words |
COMMON |
5 |
5 |
9 |
MICROELECTRONIC ASSEMBLY |
SIM30 |
SRAMs |
2.54 mm |
70 Cel |
3-STATE |
1MX9 |
1M |
0 Cel |
SINGLE |
R-PSMA-N30 |
Not Qualified |
9437184 bit |
.009 Amp |
80 ns |
||||||||||||||||||||||||||
Renesas Electronics |
SRAM MODULE |
COMMERCIAL |
30 |
PLASTIC/EPOXY |
NO |
CMOS |
PARALLEL |
ASYNCHRONOUS |
200 mA |
131072 words |
COMMON |
5 |
5 |
8 |
SIP30,.2 |
SRAMs |
2.54 mm |
70 Cel |
3-STATE |
128KX8 |
128K |
4.5 V |
0 Cel |
TIN LEAD |
SINGLE |
Not Qualified |
1048576 bit |
e0 |
.06 Amp |
60 ns |
|||||||||||||||||||||||||||
Renesas Electronics |
STATIC COLUMN DRAM |
COMMERCIAL |
30 |
SIMM |
512 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
540 mA |
1048576 words |
COMMON |
5 |
5 |
9 |
MICROELECTRONIC ASSEMBLY |
SIM30 |
SRAMs |
2.54 mm |
70 Cel |
3-STATE |
1MX9 |
1M |
0 Cel |
SINGLE |
R-PSMA-N30 |
Not Qualified |
9437184 bit |
.009 Amp |
100 ns |
||||||||||||||||||||||||||
Renesas Electronics |
STATIC COLUMN DRAM |
COMMERCIAL |
30 |
SIMM |
512 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
400 mA |
1048576 words |
COMMON |
5 |
5 |
8 |
MICROELECTRONIC ASSEMBLY |
SIM30 |
SRAMs |
2.54 mm |
70 Cel |
3-STATE |
1MX8 |
1M |
0 Cel |
SINGLE |
R-PSMA-N30 |
Not Qualified |
8388608 bit |
.008 Amp |
120 ns |
||||||||||||||||||||||||||
Renesas Electronics |
STATIC COLUMN DRAM |
COMMERCIAL |
30 |
SIMM |
512 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
450 mA |
1048576 words |
COMMON |
5 |
5 |
9 |
MICROELECTRONIC ASSEMBLY |
SIM30 |
SRAMs |
2.54 mm |
70 Cel |
3-STATE |
1MX9 |
1M |
0 Cel |
SINGLE |
R-PSMA-N30 |
Not Qualified |
9437184 bit |
.009 Amp |
120 ns |
||||||||||||||||||||||||||
Renesas Electronics |
STATIC COLUMN DRAM |
COMMERCIAL |
30 |
512 |
PLASTIC/EPOXY |
NO |
CMOS |
540 mA |
1048576 words |
COMMON |
5 |
5 |
9 |
SIP30,.2 |
SRAMs |
2.54 mm |
70 Cel |
3-STATE |
1MX9 |
1M |
0 Cel |
Tin/Lead (Sn/Pb) |
SINGLE |
Not Qualified |
9437184 bit |
e0 |
.009 Amp |
100 ns |
|||||||||||||||||||||||||||||
Renesas Electronics |
STATIC COLUMN DRAM |
COMMERCIAL |
30 |
512 |
PLASTIC/EPOXY |
NO |
CMOS |
450 mA |
1048576 words |
COMMON |
5 |
5 |
9 |
SIP30,.2 |
SRAMs |
2.54 mm |
70 Cel |
3-STATE |
1MX9 |
1M |
0 Cel |
Tin/Lead (Sn/Pb) |
SINGLE |
Not Qualified |
9437184 bit |
e0 |
.009 Amp |
120 ns |
|||||||||||||||||||||||||||||
Renesas Electronics |
STATIC COLUMN DRAM |
COMMERCIAL |
30 |
SIMM |
512 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
560 mA |
1048576 words |
COMMON |
5 |
5 |
8 |
MICROELECTRONIC ASSEMBLY |
SIM30 |
SRAMs |
2.54 mm |
70 Cel |
3-STATE |
1MX8 |
1M |
0 Cel |
SINGLE |
R-PSMA-N30 |
Not Qualified |
8388608 bit |
.008 Amp |
80 ns |
SRAM, or Static Random-Access Memory, is a type of volatile computer memory that stores data as a flip-flop, which retains the data as long as power is supplied to the system. SRAM is commonly used as cache memory and in other applications where high-speed access to data is required.
SRAM is a type of memory that is faster and more expensive than DRAM (Dynamic Random-Access Memory). It is commonly used as cache memory in computer systems and other digital devices to improve the speed of data access. SRAM is also used in applications where high-speed data processing is required, such as in networking equipment, video games, and other high-performance computing applications.
One of the advantages of using SRAM is that it provides faster access to data than other types of memory, such as DRAM. This is because SRAM does not need to be refreshed like DRAM, which makes it faster and more reliable. Additionally, SRAM uses less power than other types of memory, which makes it ideal for use in battery-powered devices.
One of the disadvantages of using SRAM is that it is more expensive and less dense than other types of memory, such as DRAM or flash memory. This means that it is not suitable for applications that require large amounts of memory at a low cost. Additionally, SRAM is volatile, which means that it cannot store data permanently.