25 % XO Clock Oscillators 2,400+

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Part RoHS Manufacturer Oscillator Type Mounting Feature No. of Terminals Frequency Stability Frequency Adjustment (Mechanical) Aging Package Body Material Maximum Supply Voltage Technology Screening Level Output Load Maximum Supply Current Nominal Supply Voltage Power Supplies (V) Package Equivalence Code Maximum Rise Time Sub-Category Physical Dimension Minimum Supply Voltage Maximum Operating Temperature Minimum Operating Temperature Terminal Finish Nominal Operating Frequency Maximum Fall Time Maximum Symmetry (%) Manufacturer Series Qualification Maximum Output Low Current Additional Features JESD-609 Code Minimum Operating Frequency Maximum Operating Frequency

DSC1001BI2-100.0000T

Microchip Technology

CMOS

SURFACE MOUNT

4

25 %

NO

10 KOHM, 15 pF

3.3 V

2 ms

5.0mm x 3.2mm x 0.85mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

100 MHz

2 ns

55/45

STANDBY; ENABLE/DISABLE FUNCTION; AEC-Q100; SUPPLY VOLTAGE 1.8 AND 2.5V ALSO AVAILABLE; TR

e4

DSC1001CE2-022.5792

Microchip Technology

CMOS

SURFACE MOUNT

4

25 %

NO

PLASTIC/EPOXY

3.6 V

AEC-Q100

10 KOHM, 15 pF

12.2 mA

3.3 V

SOLCC4,.01,83

2 ms

3.2mm x 2.5mm x 0.9mm

1.7 V

70 Cel

-20 Cel

NICKEL PALLADIUM GOLD

22.5792 MHz

2 ns

55/45

ALSO OPERATES AT 2.5V AND 1.8V SUPPLY VOLTAGE

e4

DSC1001CI2-012.0000T

Microchip Technology

CMOS

SURFACE MOUNT

4

25 %

NO

10 KOHM, 15 pF

1.8 V

3 ms

3.2mm x 2.5mm x 0.85mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

12 MHz

3 ns

55/45

STANDBY; ENABLE/DISABLE FUNCTION; SUPPLY VOLTAGE 2.5 AND 3.3V ALSO AVAILABLE; TAPE AND REEL

e4

DSC1001CI2-012.2880T

Microchip Technology

CMOS

SURFACE MOUNT

4

25 %

NO

10 KOHM, 15 pF

3.3 V

2 ms

3.2mm x 2.5mm x 0.85mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

12.288 MHz

2 ns

55/45

AEC-Q100; STANDBY; ENABLE/DISABLE FUNCTION; TR; 1.8 AND 2.5V SUPPLY VOLTAGE ALSO AVAILABLE

e4

DSC1001CI2-024.0000

Microchip Technology

CMOS

SURFACE MOUNT

4

25 %

NO

10 KOHM, 15 pF

3.3 V

2 ms

3.2mm x 2.5mm x 0.85mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

24 MHz

2 ns

55/45

AEC-Q100; STANDBY; ENABLE/DISABLE FUNCTION; TUBE; 1.8 AND 2.5V SUPPLY VOLTAGE ALSO AVAILABLE

e4

DSC1001DI2-025.0000

Microchip Technology

CMOS

SURFACE MOUNT

4

25 %

NO

10 KOHM, 15 pF

3.3 V

2 ms

2.5mm x 2.0mm x 0.85mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

25 MHz

2 ns

55/45

AEC-Q100; STANDBY; ENABLE/DISABLE FUNCTION; TUBE; 1.8 AND 2.5V SUPPLY VOLTAGE ALSO AVAILABLE

e4

DSC1004DI2-010.0000

Microchip Technology

CMOS

SURFACE MOUNT

4

25 %

NO

10 KOHM, 15 pF

3.3 V

2 ms

2.5mm x 2.0mm x 0.85mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

10 MHz

2 ns

55/45

AEC-Q100; STANDBY; ENABLE/DISABLE FUNCTION; TUBE; SUPPLY VOLTAGE OF 1.8V & 2.5V ALSO AVAILABLE

e4

DSC1101DM2-125.0000

Microchip Technology

CMOS

SURFACE MOUNT

25 %

NO

3.6 V

15 pF

2 ms

2.5mm x 2.0mm x 0.9mm

2.25 V

125 Cel

-55 Cel

NICKEL PALLADIUM GOLD

125 MHz

2 ns

55/45

STANDBY; ENABLE/DISABLE FUNCTION; TUBE

e4

DSC1103BL2-200.0000

Microchip Technology

LVDS

SURFACE MOUNT

6

25 %

NO

3.63 V

100 OHM

5.0mm x 3.2mm x 0.85mm

2.25 V

105 Cel

-40 Cel

NICKEL PALLADIUM GOLD

200 MHz

52/48

STANDBY; ENABLE/DISABLE FUNCTION; DIFFERENTIAL OUTPUT; TUBE

e4

DSC1121AM2-125.0000T

Microchip Technology

CMOS

SURFACE MOUNT

25 %

NO

3.6 V

15 pF

2 ms

7.0mm x 5.0mm x 0.9mm

2.25 V

125 Cel

-55 Cel

NICKEL PALLADIUM GOLD

125 MHz

2 ns

55/45

ENABLE/DISABLE FUNCTION; TR

e4

DSC1123BE2-050.0000

Microchip Technology

LVDS

SURFACE MOUNT

6

25 %

NO

3.63 V

100 OHM

5.0mm x 3.2mm x 0.85mm

2.25 V

70 Cel

-20 Cel

NICKEL PALLADIUM GOLD

50 MHz

52/48

ENABLE/DISABLE FUNCTION; DIFFERENTIAL OUTPUT; TUBE

e4

DSC1123CI2-025.0000

Microchip Technology

LVDS

SURFACE MOUNT

6

25 %

NO

3.63 V

100 OHM

3.2mm x 2.5mm x 0.9mm

2.25 V

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

25 MHz

52/48

ENABLE/DISABLE FUNCTION; DIFFERENTIAL OUTPUT; TUBE

e4

DSC1123CI2-150.0000

Microchip Technology

LVDS

SURFACE MOUNT

25 %

NO

3.6 V

100 OHM

3.2mm x 2.5mm x 0.85mm

2.25 V

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

150 MHz

52/48

ENABLE/DISABLE FUNCTION; DIFFERENTIAL OUTPUT; TUBE

e4

DSC8003BI2

Microchip Technology

CMOS

SURFACE MOUNT

4

25 %

NO

10 KOHM, 15 pF

3.3 V

3 ms

5.0mm x 3.2mm x 0.85mm

85 Cel

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

3 ns

55/45

STANDBY; ENABLE/DISABLE FUNCTION; OPERATING NOMINAL SUPPLY VOLTAGE IS FROM 1.8 TO 3.3V; TUBE

e4

1 MHz

150 MHz

DSC8003BI2-T

Microchip Technology

CMOS

SURFACE MOUNT

4

25 %

NO

10 KOHM, 15 pF

3.3 V

3 ms

5.0mm x 3.2mm x 0.85mm

85 Cel

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

3 ns

55/45

STANDBY; ENABLE/DISABLE FUNCTION; OPERATING NOMINAL SUPPLY VOLTAGE IS FROM 1.8 TO 3.3V; TR

e4

1 MHz

150 MHz

DSC8003CI2

Microchip Technology

CMOS

SURFACE MOUNT

4

25 %

NO

10 KOHM, 15 pF

3.3 V

3 ms

3.2mm x 2.5mm x 0.85mm

85 Cel

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

3 ns

55/45

STANDBY; ENABLE/DISABLE FUNCTION; OPERATING NOMINAL SUPPLY VOLTAGE IS FROM 1.8 TO 3.3V; TUBE

e4

1 MHz

150 MHz

DSC8003CI2-T

Microchip Technology

CMOS

SURFACE MOUNT

4

25 %

NO

10 KOHM, 15 pF

3.3 V

3 ms

3.2mm x 2.5mm x 0.85mm

85 Cel

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

3 ns

55/45

STANDBY; ENABLE/DISABLE FUNCTION; OPERATING NOMINAL SUPPLY VOLTAGE IS FROM 1.8 TO 3.3V; TR

e4

1 MHz

150 MHz

DSC8003DI2-T

Microchip Technology

CMOS

SURFACE MOUNT

4

25 %

NO

10 KOHM, 15 pF

3.3 V

3 ms

2.5mm x 2.0mm x 0.85mm

85 Cel

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

3 ns

55/45

STANDBY; ENABLE/DISABLE FUNCTION; OPERATING NOMINAL SUPPLY VOLTAGE IS FROM 1.8 TO 3.3V; TR

e4

1 MHz

150 MHz

DSC8003DL2

Microchip Technology

CMOS

SURFACE MOUNT

4

25 %

NO

10 KOHM, 15 pF

3.3 V

3 ms

2.5mm x 2.0mm x 0.85mm

105 Cel

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

3 ns

55/45

STANDBY; ENABLE/DISABLE FUNCTION; OPERATING NOMINAL SUPPLY VOLTAGE IS FROM 1.8 TO 3.3V; TUBE

e4

1 MHz

150 MHz

DSC8101CM2

Microchip Technology

CMOS

SURFACE MOUNT

25 %

NO

3.6 V

15 pF

2 ms

3.2mm x 2.5mm x 0.85mm

2.25 V

125 Cel

-55 Cel

2 ns

55/45

STANDBY; ENABLE/DISABLE FUNCTION; TUBE

10 MHz

100 MHz

ECS-1612MV-120-CN-TR

Ecs International

HCMOS

SURFACE MOUNT

4

25 %

NO

CERAMIC

3.63 V

15 pF

SOLCC4,.05,40

4.5 ms

1.6mm x 1.2mm x 0.6mm

1.6 V

85 Cel

-40 Cel

12 MHz

4.5 ns

45/55

STANDBY; TRI-STATE; ENABLE/DISABLE FUNCTION

ECS-3225MV-120-CN-TR3

Ecs International

CMOS

SURFACE MOUNT

4

25 %

NO

CERAMIC

3.63 V

15 pF

4 mA

LCC4,.1X.12,83/65

7 ms

3.2mm x 2.5mm x 1.2mm

1.62 V

85 Cel

-40 Cel

Gold (Au)

12 MHz

7 ns

45/55

TRI-STATE; ENABLE/DISABLE FUNCTION

e4

ECS-327MVATX-1-CN-TR

Ecs International

CMOS

SURFACE MOUNT

4

25 %

NO

3.6 V

15 pF

.2 mA

LCC4,.06X.08,50/38

30 ms

2mm x 1.6mm x 0.9mm

1.6 V

85 Cel

-40 Cel

.032768 MHz

30 ns

45/55

TRI-STATE; ENABLE/DISABLE FUNCTION

FXO-HC536R-1

Renesas Electronics

HCMOS

SURFACE MOUNT

25 %

NO

3.465 V

15 pF

3.3 V

3 ms

5.15mm x 3.35mm x 1.4mm

3.135 V

85 Cel

-40 Cel

Gold (Au) - with Nickel (Ni) barrier

1 MHz

3 ns

55/45

TRI-STATE; ENABLE/DISABLE FUNCTION; TR, 7/10 INCH

e4

FXO-HC536R-1.25

Renesas Electronics

HCMOS

SURFACE MOUNT

25 %

NO

3.465 V

15 pF

3.3 V

3 ms

5.15mm x 3.35mm x 1.4mm

3.135 V

85 Cel

-40 Cel

Gold (Au) - with Nickel (Ni) barrier

1.25 MHz

3 ns

55/45

TRI-STATE; ENABLE/DISABLE FUNCTION; TR, 7/10 INCH

e4

FXO-HC536R-125

Renesas Electronics

HCMOS

SURFACE MOUNT

25 %

NO

3.465 V

15 pF

3.3 V

3 ms

5.15mm x 3.35mm x 1.4mm

3.135 V

85 Cel

-40 Cel

Gold (Au) - with Nickel (Ni) barrier

125 MHz

3 ns

55/45

TRI-STATE; ENABLE/DISABLE FUNCTION; TR, 7/10 INCH

e4

FXO-HC736R-1.8432

Renesas Electronics

HCMOS

SURFACE MOUNT

6

25 %

NO

3.465 V

15 pF

3.3 V

3 ms

7.5mm x 5.2mm x 1.4mm

3.135 V

85 Cel

-40 Cel

Gold (Au) - with Nickel (Ni) barrier

1.8432 MHz

3 ns

55/45

TRI-STATE; ENABLE/DISABLE FUNCTION; TAPE AND REEL

e4

FXO-HC736R-108

Renesas Electronics

HCMOS

SURFACE MOUNT

25 %

NO

3.465 V

15 pF

3.3 V

3 ms

7.5mm x 5.2mm x 1.4mm

3.135 V

85 Cel

-40 Cel

Gold (Au) - with Nickel (Ni) barrier

108 MHz

3 ns

55/45

TRI-STATE; ENABLE/DISABLE FUNCTION; TR, 7 INCH

e4

FXO-HC736R-125

Renesas Electronics

HCMOS

SURFACE MOUNT

6

25 %

NO

3.465 V

15 pF

3.3 V

3 ms

7.5mm x 5.2mm x 1.4mm

3.135 V

85 Cel

-40 Cel

Gold (Au) - with Nickel (Ni) barrier

125 MHz

3 ns

55/45

TRI-STATE; ENABLE/DISABLE FUNCTION; TAPE AND REEL

e4

FXO-HC736R-18.432

Renesas Electronics

HCMOS

SURFACE MOUNT

25 %

NO

3.465 V

15 pF

3.3 V

3 ms

7.5mm x 5.2mm x 1.4mm

3.135 V

85 Cel

-40 Cel

Gold (Au) - with Nickel (Ni) barrier

18.432 MHz

3 ns

55/45

TRI-STATE; ENABLE/DISABLE FUNCTION; TR, 7 INCH

e4

FXO-HC736R-184.32

Renesas Electronics

HCMOS

SURFACE MOUNT

25 %

NO

3.465 V

15 pF

3.3 V

3 ms

7.5mm x 5.2mm x 1.4mm

3.135 V

85 Cel

-40 Cel

Gold (Au) - with Nickel (Ni) barrier

184.32 MHz

3 ns

55/45

TRI-STATE; ENABLE/DISABLE FUNCTION; TR, 7 INCH

e4

FXO-HC736R-54

Renesas Electronics

HCMOS

SURFACE MOUNT

25 %

NO

3.465 V

15 pF

3.3 V

3 ms

7.5mm x 5.2mm x 1.4mm

3.135 V

85 Cel

-40 Cel

Gold (Au) - with Nickel (Ni) barrier

54 MHz

3 ns

55/45

TRI-STATE; ENABLE/DISABLE FUNCTION; TR, 7 INCH

e4

FXO-HC736R-66.666

Renesas Electronics

HCMOS

SURFACE MOUNT

6

25 %

NO

3.465 V

15 pF

3.3 V

3 ms

7.5mm x 5.2mm x 1.4mm

3.135 V

85 Cel

-40 Cel

Gold (Au) - with Nickel (Ni) barrier

66.666 MHz

3 ns

55/45

TRI-STATE; ENABLE/DISABLE FUNCTION; TAPE AND REEL

e4

OCETDLJANF-25.000000

Taitien Electronics

CMOS

SURFACE MOUNT

4

25 %

NO

CERAMIC

3.63 V

15 pF

10 mA

3.3 V

DILCC4,.2,200

5 ms

7.0mm x 5.0mm x 1.3 mm

2.97 V

85 Cel

-40 Cel

GOLD OVER NICKEL

25 MHz

5 ns

55/45

TRI-STATE; ENABLE/DISABLE FUNCTION

e4

SG-210STF48.0000MS3

Seiko Epson

CMOS

SURFACE MOUNT

4

25 %

NO

3.63 V

15 pF

2.6 mA

3.3 V

LCC4,.08X.1,67/51

3 ms

2.5mm x 2.0mm x 0.8mm

2.97 V

70 Cel

-20 Cel

GOLD

48 MHz

3 ns

55/45

STANDBY; ENABLE/DISABLE FUNCTION

e4

SIT8008BI-22-33E-8.000000G

Sitime

LVCMOS

SURFACE MOUNT

4

25 %

NO

PLASTIC/EPOXY

3.63 V

15 pF

3.3 V

DILCC4,.1,83

2 ms

3.2mm x 2.5mm x 0.75mm

2.97 V

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

8 MHz

2 ns

55/45

4 Amp

ENABLE/DISABLE FUNCTION; ALSO COMPATIBLE WITH HCMOS O/P

e4

SIT8103AC-32-33E-25.00000T

Sitime

LVCMOS

SURFACE MOUNT

25 %

NO

3.63 V

15 pF

3.3 V

2 ms

5.0mm x 3.2mm x 0.75mm

2.97 V

70 Cel

-20 Cel

NICKEL PALLADIUM GOLD

25 MHz

2 ns

55/45

ENABLE/DISABLE FUNCTION; ALSO COMPATIBLE WITH LVTTL OUTPUT; TR

e4

SIT8924BA-72-33E-24.000000D

Sitime

LVCMOS

SURFACE MOUNT

4

25 %

NO

PLASTIC/EPOXY

3.63 V

AEC-Q100

15 pF

3.3 V

SOLCC4,.08,37

3 ms

2mm x 1.6mm x 0.8mm

2.97 V

125 Cel

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

24 MHz

3 ns

55/45

4 Amp

ENABLE/DISABLE FUNCTION; ALSO COMPATIBLE WITH LVTTL O/P

e4

SIT8924BA-72-33E-24.000000E

Sitime

LVCMOS

SURFACE MOUNT

4

25 %

NO

PLASTIC/EPOXY

3.63 V

AEC-Q100

15 pF

3.3 V

SOLCC4,.08,37

3 ms

2mm x 1.6mm x 0.8mm

2.97 V

125 Cel

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

24 MHz

3 ns

55/45

4 Amp

ENABLE/DISABLE FUNCTION; ALSO COMPATIBLE WITH LVTTL O/P

e4

SIT9346AE-2B2A33E159.375000

Sitime

LVDS

SURFACE MOUNT

6

25 %

NO

3.63 V

100 OHM

79 mA

3.3 V

SOLCC6,.1,43

.47 ms

3.2mm x 2.5mm x 0.9mm

2.97 V

105 Cel

-40 Cel

159.375 MHz

.47 ns

55/45

ENABLE/DISABLE FUNCTION; COMPLEMENTARY OUTPUT; BULK

TA-6.000MBD-T

Txc

CMOS

SURFACE MOUNT

4

25 %

NO

PLASTIC/EPOXY

15 pF

25 mA

3.3 V

DILCC4,.2,200

3 ms

7mm x 5mm x 0.9mm

85 Cel

-40 Cel

6 MHz

3 ns

55/45

STANDBY; ENABLE/DISABLE FUNCTION

VPC1-B1E-111M992000

Microchip Technology

HCMOS/TTL

SURFACE MOUNT

25 %

NO

3.63 V

15 pF

3.3 V

6 ms

7.0mm x 5.0mm x 1.4mm

2.97 V

70 Cel

0 Cel

111.992 MHz

6 ns

60/40

ENABLE/DISABLE FUNCTION; TR, 7 INCH

VPC1-B1E-125M000000

Microchip Technology

CMOS

SURFACE MOUNT

4

25 %

NO

CERAMIC

3.63 V

15 pF

28 mA

3.3 V

DILCC4,.2,200

6 ms

7.0mm x 5.0mm x 1.4mm

2.97 V

70 Cel

0 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

125 MHz

6 ns

60/40

ENABLE/DISABLE FUNCTION; ALSO COMPATIBLE WITH HCMOS/TTL OUTPUT; TR, 7 INCH

e4

VPC1-B1E-50M0000000

Microchip Technology

HCMOS/TTL

SURFACE MOUNT

25 %

NO

3.63 V

15 pF

3.3 V

6 ms

7.0mm x 5.0mm x 1.4mm

2.97 V

70 Cel

0 Cel

50 MHz

6 ns

60/40

ENABLE/DISABLE FUNCTION; TR, 7 INCH

VPC1-B1F-50M0000000

Microchip Technology

HCMOS/TTL

SURFACE MOUNT

25 %

NO

3.63 V

15 pF

3.3 V

6 ms

7.0mm x 5.0mm x 1.4mm

2.97 V

85 Cel

-40 Cel

50 MHz

6 ns

60/40

ENABLE/DISABLE FUNCTION; TR, 7 INCH

VPC1-B3F-25M6000000

Microchip Technology

HCMOS/TTL

SURFACE MOUNT

25 %

NO

3.63 V

15 pF

3.3 V

6 ms

7.0mm x 5.0mm x 1.4mm

2.97 V

85 Cel

-40 Cel

25.6 MHz

6 ns

45/55

ENABLE/DISABLE FUNCTION; TR, 7 INCH

X1G004171007700

Seiko Epson

CMOS

SURFACE MOUNT

4

25 %

NO

3.6 V

15 pF

2.2 mA

3.5 ms

2.5mm x 2.0mm x 0.8mm

1.6 V

70 Cel

-20 Cel

GOLD

25 MHz

3.5 ns

55/45

STANDBY; ENABLE/DISABLE FUNCTION; TR, 7 INCH

e4

XLH536016.000000I

Renesas Electronics

HCMOS

SURFACE MOUNT

6

25 %

NO

3.465 V

15 pF

3.3 V

3 ms

5.0mm x 3.2mm x 1.1mm

3.135 V

85 Cel

-40 Cel

16 MHz

3 ns

55/45

ENABLE/DISABLE FUNCTION; ALSO COMPATIBLE WITH LVCMOS OUTPUT

XO Clock Oscillators

Crystal Oscillator (XO) Clock Oscillators are electronic devices that generate a stable clock signal with a fixed frequency. They use a quartz crystal resonator as the frequency-determining element, which provides a stable and accurate frequency over a wide temperature range.

One of the main advantages of XO Clock Oscillators is their ability to generate a stable and precise clock signal with a fixed frequency. This makes them ideal for use in applications that require precise timing, such as in digital signal processing, telecommunications, and scientific research.

XO Clock Oscillators offer a low phase noise, which is important in applications that require a clean and stable clock signal. They are capable of generating frequencies ranging from a few kilohertz to several hundred megahertz, making them suitable for use in various electronic circuits.

Additionally, XO Clock Oscillators have a relatively simple design and are easy to integrate into electronic systems. They are available in a range of package sizes and configurations, allowing them to be used in various applications, including in communication systems, network equipment, and instrumentation.