Part | RoHS | Manufacturer | Oscillator Type | Mounting Feature | No. of Terminals | Frequency Stability | Frequency Adjustment (Mechanical) | Aging | Package Body Material | Maximum Supply Voltage | Technology | Screening Level | Output Load | Maximum Supply Current | Nominal Supply Voltage | Power Supplies (V) | Package Equivalence Code | Maximum Rise Time | Sub-Category | Physical Dimension | Minimum Supply Voltage | Maximum Operating Temperature | Minimum Operating Temperature | Terminal Finish | Nominal Operating Frequency | Maximum Fall Time | Maximum Symmetry (%) | Manufacturer Series | Qualification | Maximum Output Low Current | Additional Features | JESD-609 Code | Minimum Operating Frequency | Maximum Operating Frequency |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Microchip Technology |
CMOS |
SURFACE MOUNT |
4 |
25 % |
NO |
3.63 V |
5 pF |
3.5 ms |
1.6mm x 1.2mm x 0.89mm |
1.71 V |
85 Cel |
-40 Cel |
NICKEL GOLD |
24 MHz |
3.5 ns |
55/45 |
ENABLE/DISABLE FUNCTION; TR |
e4 |
|||||||||||||||
|
Microchip Technology |
CMOS |
SURFACE MOUNT |
4 |
25 % |
NO |
3.63 V |
5 pF |
3.5 ms |
2.5mm x 2.0mm x 0.89mm |
1.71 V |
85 Cel |
-40 Cel |
GOLD OVER NICKEL |
24 MHz |
3.5 ns |
55/45 |
ENABLE/DISABLE FUNCTION; TUBE |
e4 |
|||||||||||||||
|
Microchip Technology |
CMOS |
SURFACE MOUNT |
4 |
25 % |
NO |
3.63 V |
5 pF |
3.5 ms |
2.5mm x 2.0mm x 0.89mm |
1.71 V |
85 Cel |
-40 Cel |
GOLD OVER NICKEL |
.032768 MHz |
3.5 ns |
55/45 |
ENABLE/DISABLE FUNCTION; TUBE |
e4 |
|||||||||||||||
|
Microchip Technology |
CMOS |
SURFACE MOUNT |
4 |
25 % |
NO |
3.63 V |
5 pF |
3.5 ms |
2.5mm x 2.0mm x 0.89mm |
1.71 V |
70 Cel |
-20 Cel |
GOLD OVER NICKEL |
25 MHz |
3.5 ns |
55/45 |
AEC-Q100; STANDBY; ENABLE/DISABLE FUNCTION; TR |
e4 |
|||||||||||||||
|
Microchip Technology |
CMOS |
SURFACE MOUNT |
4 |
25 % |
NO |
3.63 V |
5 pF |
3.5 ms |
2.5mm x 2.0mm x 0.89mm |
1.71 V |
85 Cel |
-40 Cel |
GOLD OVER NICKEL |
12 MHz |
3.5 ns |
55/45 |
AEC-Q100; STANDBY; ENABLE/DISABLE FUNCTION; TR |
e4 |
|||||||||||||||
Microchip Technology |
CMOS |
SURFACE MOUNT |
4 |
25 % |
NO |
3.63 V |
5 pF |
3.5 ms |
3.2mm x 2.5mm x 0.85mm |
1.71 V |
85 Cel |
-40 Cel |
.032768 MHz |
3.5 ns |
55/45 |
AEC-Q100; BULK |
||||||||||||||||||
Microchip Technology |
CMOS |
SURFACE MOUNT |
4 |
25 % |
NO |
3.63 V |
10 pF |
2.2 ms |
2.5mm x 2.0mm x 0.89mm |
1.71 V |
85 Cel |
-40 Cel |
50 MHz |
2.2 ns |
55/45 |
ENABLE/DISABLE FUNCTION; TR |
||||||||||||||||||
Microchip Technology |
CMOS |
SURFACE MOUNT |
4 |
25 % |
NO |
3.63 V |
10 pF |
2 ms |
2.5mm x 2.0mm x 0.89mm |
1.71 V |
85 Cel |
-40 Cel |
25 MHz |
2 ns |
55/45 |
ENABLE/DISABLE FUNCTION; TUBE |
||||||||||||||||||
Microchip Technology |
CMOS |
SURFACE MOUNT |
4 |
25 % |
NO |
3.63 V |
10 pF |
2.2 ms |
2.0mm x 1.6mm x 0.89mm |
1.71 V |
85 Cel |
-40 Cel |
24 MHz |
2.2 ns |
55/45 |
ENABLE/DISABLE FUNCTION; TR |
||||||||||||||||||
|
Microchip Technology |
CMOS |
SURFACE MOUNT |
4 |
25 % |
NO |
3.63 V |
15 pF |
1.5 ms |
3.2mm x 2.5mm x 0.85mm |
1.71 V |
85 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
100 MHz |
1.5 ns |
55/45 |
AEC-Q100; ENABLE/DISABLE FUNCTION; TR |
e4 |
|||||||||||||||
Microchip Technology |
CMOS |
SURFACE MOUNT |
4 |
25 % |
NO |
3.63 V |
15 pF |
1.5 ms |
1.6mm x 1.2mm x 0.9mm |
1.71 V |
85 Cel |
-40 Cel |
25 MHz |
1.5 ns |
55/45 |
ENABLE/DISABLE FUNCTION; BAG |
||||||||||||||||||
|
Microchip Technology |
CMOS |
SURFACE MOUNT |
4 |
25 % |
NO |
3.63 V |
15 pF |
1.5 ms |
2.5mm x 2.0mm x 0.89mm |
1.71 V |
85 Cel |
-40 Cel |
MATTE TIN |
.032768 MHz |
1.5 ns |
55/45 |
STANDBY; ENABLE/DISABLE FUNCTION; TR |
e3 |
|||||||||||||||
|
Microchip Technology |
CMOS |
SURFACE MOUNT |
4 |
25 % |
NO |
3.63 V |
CMOS |
10 pF |
3 mA |
2.2 ms |
3.2mm x 2.5mm x 0.85mm |
1.71 V |
85 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
.032768 MHz |
2.2 ns |
55/45 |
STANDBY; ENABLE/DISABLE FUNCTION |
e4 |
|||||||||||||
|
Microchip Technology |
CMOS |
SURFACE MOUNT |
4 |
25 % |
NO |
3.63 V |
10 pF |
2 ms |
2.5mm x 2.0mm x 0.89mm |
1.71 V |
85 Cel |
-40 Cel |
100 MHz |
2 ns |
55/45 |
AEC-Q100; STANDBY; ENABLE/DISABLE FUNCTION; TUBE |
|||||||||||||||||
|
Microchip Technology |
CMOS |
SURFACE MOUNT |
4 |
25 % |
NO |
10 KOHM, 15 pF |
1.8 V |
3 ms |
3.2mm x 2.5mm x 0.85mm |
105 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
3 ns |
55/45 |
STANDBY; ENABLE/DISABLE FUNCTION; 2.5V 3.3V ARE AVAILABLE; TUBE |
e4 |
1 MHz |
150 MHz |
|||||||||||||||
|
Microchip Technology |
CMOS |
SURFACE MOUNT |
25 % |
NO |
3.6 V |
15 pF |
2 ms |
5.0mm x 3.2mm x 0.85mm |
2.25 V |
85 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
2 ns |
55/45 |
STANDBY; ENABLE/DISABLE FUNCTION; TUBE |
e4 |
10 MHz |
170 MHz |
|||||||||||||||
|
Microchip Technology |
LVDS |
SURFACE MOUNT |
25 % |
NO |
3.6 V |
50 OHM, 2 pF |
.2 ms |
5.0mm x 3.2mm x 0.85mm |
2.25 V |
85 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
.2 ns |
52/48 |
ENABLE/DISABLE FUNCTION; COMPLEMENTARY OUTPUT; TUBE |
e4 |
10 MHz |
460 MHz |
|||||||||||||||
|
Abracon |
LVCMOS |
SURFACE MOUNT |
4 |
25 % |
NO |
3.63 V |
30 pF |
3.3 V |
5 ms |
7.0mm x 5.0mm x 1.6mm |
2.97 V |
85 Cel |
-40 Cel |
Nickel/Gold (Ni/Au) |
16 MHz |
5 ns |
60/40 |
TRI-STATE; ENABLE/DISABLE FUNCTION; TAPE AND REEL |
e4 |
||||||||||||||
|
Abracon |
LVCMOS |
SURFACE MOUNT |
4 |
25 % |
NO |
3.63 V |
30 pF |
3.3 V |
5 ms |
7.0mm x 5.0mm x 1.6mm |
2.97 V |
85 Cel |
-40 Cel |
Nickel/Gold (Ni/Au) |
2.048 MHz |
5 ns |
60/40 |
TRI-STATE; ENABLE/DISABLE FUNCTION; TAPE AND REEL |
e4 |
||||||||||||||
|
Abracon |
HCMOS |
SURFACE MOUNT |
4 |
25 % |
NO |
1.89 V |
15 pF |
1.8 V |
6 ms |
5.0mm x 3.2mm x 1.3mm |
1.71 V |
85 Cel |
-40 Cel |
Nickel/Gold (Ni/Au) |
100 MHz |
6 ns |
55/45 |
TRI-STATE; ENABLE/DISABLE FUNCTION; TAPE AND REEL |
e4 |
||||||||||||||
|
Ecs International |
HCMOS |
SURFACE MOUNT |
4 |
25 % |
NO |
CERAMIC |
3.63 V |
15 pF |
SOLCC4,.05,40 |
4.5 ms |
1.6mm x 1.2mm x 0.6mm |
1.6 V |
85 Cel |
-40 Cel |
12.288 MHz |
4.5 ns |
45/55 |
STANDBY; TRI-STATE; ENABLE/DISABLE FUNCTION |
|||||||||||||||
|
Ecs International |
HCMOS |
SURFACE MOUNT |
4 |
25 % |
NO |
CERAMIC |
3.63 V |
15 pF |
SOLCC4,.05,40 |
4.5 ms |
1.6mm x 1.2mm x 0.6mm |
1.6 V |
85 Cel |
-40 Cel |
19.2 MHz |
4.5 ns |
45/55 |
STANDBY; TRI-STATE; ENABLE/DISABLE FUNCTION |
|||||||||||||||
|
Ecs International |
HCMOS |
SURFACE MOUNT |
4 |
25 % |
NO |
CERAMIC |
3.6 V |
AEC-Q200 |
15 pF |
7 mA |
LCC4,.06X.08,50/38 |
6.5 ms |
2mm x 1.6mm x 0.85mm |
1.7 V |
85 Cel |
-40 Cel |
Gold (Au) |
25 MHz |
6.5 ns |
45/55 |
TRI-STATE; ENABLE/DISABLE FUNCTION |
e4 |
|||||||||||
|
Ecs International |
HCMOS |
SURFACE MOUNT |
4 |
25 % |
NO |
CERAMIC |
3.6 V |
15 pF |
6 mA |
LCC4,.08X.1,68/52 |
7 ms |
2.5mm x 2.0mm x 0.8mm |
1.6 V |
85 Cel |
-40 Cel |
Gold (Au) - with Nickel (Ni) barrier |
8 MHz |
7 ns |
45/55 |
TRI-STATE; ENABLE/DISABLE FUNCTION; TR, 7 INCH |
e4 |
||||||||||||
|
Ecs International |
HCMOS |
SURFACE MOUNT |
4 |
25 % |
NO |
CERAMIC |
3.6 V |
HCMOS |
15 pF |
7 mA |
LCC4,.08X.1,68/52 |
7 ms |
2.5mm x 2mm x 0.8mm |
1.6 V |
85 Cel |
-40 Cel |
Gold (Au) - with Nickel (Ni) barrier |
26 MHz |
7 ns |
45/55 |
TRI-STATE; ENABLE/DISABLE FIUNCTION |
e4 |
|||||||||||
|
Ecs International |
HCMOS |
SURFACE MOUNT |
4 |
25 % |
NO |
CERAMIC |
3.6 V |
HCMOS |
15 pF |
8 mA |
LCC4,.08X.1,68/52 |
7 ms |
2.5mm x 2mm x 0.8mm |
1.6 V |
85 Cel |
-40 Cel |
Gold (Au) - with Nickel (Ni) barrier |
48 MHz |
7 ns |
45/55 |
TRI-STATE; ENABLE/DISABLE FIUNCTION |
e4 |
|||||||||||
|
Ecs International |
HCMOS |
SURFACE MOUNT |
4 |
25 % |
NO |
CERAMIC |
3.6 V |
HCMOS |
15 pF |
8 mA |
DILCC4,.08,52 |
7 ms |
2.5mm x 2 mm x 0.8mm |
1.6 V |
85 Cel |
-40 Cel |
Gold (Au) - with Nickel (Ni) barrier |
50 MHz |
7 ns |
45/55 |
TRI-STATE; ENABLE/DISABLE FUNCTION; COMPATIBLE WITH 1.8V, 2.5V AND 3.3V ALSO AVAILABLE. |
e4 |
|||||||||||
|
Ecs International |
CMOS |
SURFACE MOUNT |
4 |
25 % |
NO |
CERAMIC |
3.6 V |
AEC-Q200 |
15 pF |
10 mA |
LCC4,.08X.1,68/52 |
7 ms |
2.5mm x 2mm x 0.8mm |
1.7 V |
85 Cel |
-40 Cel |
Gold (Au) |
25 MHz |
7 ns |
45/55 |
TRI-STATE; ENABLE/DISABLE FUNCTION |
e4 |
|||||||||||
|
Ecs International |
CMOS |
SURFACE MOUNT |
4 |
25 % |
NO |
CERAMIC |
3.63 V |
CMOS |
15 pF |
7 ms |
3.2mmx2.5mmx1.2mm |
1.62 V |
85 Cel |
-40 Cel |
Gold (Au) |
24 MHz |
7 ns |
45/55 |
TRI-STATE; ENABLE/DISABLE FUNCTION |
e4 |
|||||||||||||
|
Ecs International |
CMOS |
SURFACE MOUNT |
4 |
25 % |
NO |
CERAMIC |
3.63 V |
CMOS |
15 pF |
7 ms |
3.2mmx2.5mmx1.2mm |
1.62 V |
85 Cel |
-40 Cel |
Gold (Au) |
48 MHz |
7 ns |
45/55 |
TRI-STATE; ENABLE/DISABLE FUNCTION |
e4 |
|||||||||||||
|
Ecs International |
CMOS |
SURFACE MOUNT |
4 |
25 % |
NO |
CERAMIC |
3.6 V |
AEC-Q200 |
15 pF |
20 mA |
LCC4,.09X.12,87/69 |
7 ms |
3.2mm x 2.5mm x 1.0mm |
1.7 V |
85 Cel |
-40 Cel |
Gold (Au) |
100 MHz |
7 ns |
45/55 |
TRI STATE |
e4 |
|||||||||||
|
Ecs International |
CMOS |
SURFACE MOUNT |
4 |
25 % |
NO |
CERAMIC |
3.6 V |
AEC-Q200 |
15 pF |
20 mA |
LCC4,.09X.12,87/69 |
7 ms |
3.2mm x 2.5mm x 1.0mm |
1.7 V |
85 Cel |
-40 Cel |
Gold (Au) |
125 MHz |
7 ns |
45/55 |
TRI STATE |
e4 |
|||||||||||
|
Ecs International |
HCMOS |
SURFACE MOUNT |
4 |
25 % |
NO |
3.6 V |
15 pF |
7 ms |
5.0mm x 3.2mm x 1.3mm |
1.6 V |
85 Cel |
-40 Cel |
Gold (Au) - with Nickel (Ni) barrier |
16 MHz |
7 ns |
45/55 |
TRI-STATE; ENABLE/DISABLE FUNCTION; TR, 7 INCH |
e4 |
|||||||||||||||
|
Ecs International |
HCMOS |
SURFACE MOUNT |
4 |
25 % |
NO |
3.6 V |
15 pF |
7 ms |
5.0mm x 3.2mm x 1.3mm |
1.6 V |
85 Cel |
-40 Cel |
Gold (Au) - with Nickel (Ni) barrier |
25 MHz |
7 ns |
45/55 |
TRI-STATE; ENABLE/DISABLE FUNCTION; TR, 7 INCH |
e4 |
|||||||||||||||
|
Ecs International |
HCMOS |
SURFACE MOUNT |
4 |
25 % |
NO |
3.6 V |
15 pF |
7 ms |
5.0mm x 3.2mm x 1.3mm |
1.6 V |
85 Cel |
-40 Cel |
Gold (Au) - with Nickel (Ni) barrier |
40 MHz |
7 ns |
45/55 |
TRI-STATE; ENABLE/DISABLE FUNCTION; TR, 7 INCH |
e4 |
|||||||||||||||
|
Ecs International |
HCMOS |
SURFACE MOUNT |
4 |
25 % |
NO |
3.6 V |
15 pF |
7 ms |
5.0mm x 3.2mm x 1.3mm |
1.6 V |
85 Cel |
-40 Cel |
Gold (Au) - with Nickel (Ni) barrier |
50 MHz |
7 ns |
45/55 |
TRI-STATE; ENABLE/DISABLE FUNCTION; TR, 7 INCH |
e4 |
|||||||||||||||
|
Ecs International |
LVPECL |
SURFACE MOUNT |
6 |
25 % |
NO |
3.465 V |
3.3 V |
.25 ms |
2.5mm x 2.0mm x 1.0mm |
3.135 V |
70 Cel |
-20 Cel |
Gold (Au) - with Nickel (Ni) barrier |
33.333 MHz |
.25 ns |
48/52 |
ENABLE/DISABLE FUNCTION; COMPLEMENTARY OUTPUT |
e4 |
|||||||||||||||
|
Ecs International |
LVDS |
SURFACE MOUNT |
6 |
25 % |
NO |
3.63 V |
100 OHM |
24 mA |
DILCC6,.2 |
.3 ms |
7mm x 5mm x 1.5mm |
2.375 V |
85 Cel |
-40 Cel |
Gold (Au) |
100 MHz |
.3 ns |
45/55 |
ENABLE DISABLE FUNCTION; COMPLIMENTARY OUTPUT |
e4 |
|||||||||||||
|
Ecs International |
LVDS |
SURFACE MOUNT |
6 |
25 % |
NO |
3.63 V |
100 OHM |
24 mA |
DILCC6,.2 |
.3 ms |
7.0mm x 5.0mm x 1.5mm |
2.375 V |
85 Cel |
-40 Cel |
Gold (Au) |
156.25 MHz |
.3 ns |
45/55 |
e4 |
||||||||||||||
|
Abracon |
HCMOS/TTL |
SURFACE MOUNT |
4 |
25 % |
NO |
5.5 V |
10 TTL, 50 pF |
5 V |
6 ms |
7.0mm x 5.0mm x 1.6mm |
4.5 V |
85 Cel |
-40 Cel |
Nickel/Gold (Ni/Au) |
1.8432 MHz |
6 ns |
55/45 |
TRI-STATE; ENABLE/DISABLE FUNCTION |
e4 |
||||||||||||||
|
Abracon |
HCMOS/TTL |
SURFACE MOUNT |
4 |
25 % |
NO |
5.5 V |
10 TTL, 50 pF |
5 V |
6 ms |
7.0mm x 5.0mm x 1.6mm |
4.5 V |
85 Cel |
-40 Cel |
Nickel/Gold (Ni/Au) |
18.432 MHz |
6 ns |
55/45 |
TRI-STATE; ENABLE/DISABLE FUNCTION |
e4 |
||||||||||||||
|
Abracon |
LVCMOS |
SURFACE MOUNT |
4 |
25 % |
NO |
3.465 V |
30 pF |
3.3 V |
6 ms |
3.2mm x 2.5mm x 1.05mm |
3.135 V |
85 Cel |
-40 Cel |
Nickel/Gold (Ni/Au) |
25 MHz |
6 ns |
55/45 |
TRI-STATE; ENABLE/DISABLE FUNCTION; TAPE AND REEL |
e4 |
||||||||||||||
|
Abracon |
HCMOS |
SURFACE MOUNT |
4 |
25 % |
NO |
1.89 V |
15 pF |
1.8 V |
3.5 ms |
3.2mm x 2.5mm x 1.2mm |
1.71 V |
85 Cel |
-40 Cel |
GOLD OVER NICKEL |
33.333 MHz |
3.5 ns |
55/45 |
ENABLE/DISABLE FUNCTION; TR, 7 INCH |
e4 |
||||||||||||||
|
Abracon |
HCMOS |
SURFACE MOUNT |
4 |
25 % |
NO |
3.63 V |
15 pF |
3.3 V |
4 ms |
7.5mm x 5.2mm x 1.5mm |
2.97 V |
85 Cel |
-40 Cel |
GOLD OVER NICKEL |
100 MHz |
4 ns |
60/40 |
ENABLE/DISABLE FUNCTION; TR, 10 INCH |
e4 |
||||||||||||||
|
Abracon |
HCMOS |
SURFACE MOUNT |
4 |
25 % |
NO |
3.63 V |
15 pF |
40 mA |
3.3 V |
DILCC4,.2,200 |
4 ms |
7.5mm x 5.2mm x 1.5mm |
2.97 V |
85 Cel |
-40 Cel |
Gold (Au) - with Nickel (Ni) barrier |
100 MHz |
4 ns |
60/40 |
2 Amp |
ENABLE/DISABLE FUNCTION |
e4 |
|||||||||||
|
Renesas Electronics |
HCMOS |
SURFACE MOUNT |
25 % |
NO |
3.465 V |
15 pF |
3.3 V |
3 ms |
5.15mm x 3.35mm x 1.4mm |
3.135 V |
85 Cel |
-40 Cel |
Gold (Au) - with Nickel (Ni) barrier |
20 MHz |
3 ns |
55/45 |
TRI-STATE; ENABLE/DISABLE FUNCTION; TR, 7/10 INCH |
e4 |
|||||||||||||||
|
Renesas Electronics |
HCMOS |
SURFACE MOUNT |
25 % |
NO |
3.465 V |
15 pF |
3.3 V |
3 ms |
5.15mm x 3.35mm x 1.4mm |
3.135 V |
85 Cel |
-40 Cel |
Gold (Au) - with Nickel (Ni) barrier |
200 MHz |
3 ns |
55/45 |
TRI-STATE; ENABLE/DISABLE FUNCTION; TR, 7/10 INCH |
e4 |
|||||||||||||||
|
Renesas Electronics |
HCMOS |
SURFACE MOUNT |
25 % |
NO |
3.465 V |
15 pF |
3.3 V |
3 ms |
5.15mm x 3.35mm x 1.4mm |
3.135 V |
85 Cel |
-40 Cel |
Gold (Au) - with Nickel (Ni) barrier |
24 MHz |
3 ns |
55/45 |
TRI-STATE; ENABLE/DISABLE FUNCTION; TR, 7/10 INCH |
e4 |
Crystal Oscillator (XO) Clock Oscillators are electronic devices that generate a stable clock signal with a fixed frequency. They use a quartz crystal resonator as the frequency-determining element, which provides a stable and accurate frequency over a wide temperature range.
One of the main advantages of XO Clock Oscillators is their ability to generate a stable and precise clock signal with a fixed frequency. This makes them ideal for use in applications that require precise timing, such as in digital signal processing, telecommunications, and scientific research.
XO Clock Oscillators offer a low phase noise, which is important in applications that require a clean and stable clock signal. They are capable of generating frequencies ranging from a few kilohertz to several hundred megahertz, making them suitable for use in various electronic circuits.
Additionally, XO Clock Oscillators have a relatively simple design and are easy to integrate into electronic systems. They are available in a range of package sizes and configurations, allowing them to be used in various applications, including in communication systems, network equipment, and instrumentation.