Part | RoHS | Manufacturer | Oscillator Type | Mounting Feature | No. of Terminals | Frequency Stability | Frequency Adjustment (Mechanical) | Aging | Package Body Material | Maximum Supply Voltage | Technology | Screening Level | Output Load | Maximum Supply Current | Nominal Supply Voltage | Power Supplies (V) | Package Equivalence Code | Maximum Rise Time | Sub-Category | Physical Dimension | Minimum Supply Voltage | Maximum Operating Temperature | Minimum Operating Temperature | Terminal Finish | Nominal Operating Frequency | Maximum Fall Time | Maximum Symmetry (%) | Manufacturer Series | Qualification | Maximum Output Low Current | Additional Features | JESD-609 Code | Minimum Operating Frequency | Maximum Operating Frequency |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Microchip Technology |
CMOS |
SURFACE MOUNT |
4 |
25 % |
NO |
10 KOHM, 15 pF |
3.3 V |
2 ms |
7.0mm x 5.0mm x 0.85mm |
70 Cel |
-20 Cel |
NICKEL PALLADIUM GOLD |
10 MHz |
2 ns |
55/45 |
AEC-Q100; STANDBY; ENABLE/DISABLE FUNCTION; TR; SUPPLY VOLTAGE OF 1.8V & 2.5V ALSO AVAILABLE |
e4 |
||||||||||||||||
|
Microchip Technology |
LVDS |
SURFACE MOUNT |
25 % |
NO |
3.6 V |
100 OHM |
3.2mm x 2.5mm x 0.85mm |
2.25 V |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
148.5 MHz |
52/48 |
STANDBY; ENABLE/DISABLE FUNCTION; DIFFERENTIAL OUTPUT; TR |
e4 |
||||||||||||||||||
|
Ecs International |
HCMOS |
SURFACE MOUNT |
4 |
25 % |
NO |
CERAMIC |
3.63 V |
15 pF |
SOLCC4,.05,40 |
4.5 ms |
1.6mm x 1.2mm x 0.6mm |
1.6 V |
85 Cel |
-40 Cel |
24 MHz |
4.5 ns |
45/55 |
STANDBY; TRI-STATE; ENABLE/DISABLE FUNCTION |
|||||||||||||||
|
Ecs International |
CMOS |
SURFACE MOUNT |
4 |
25 % |
NO |
CERAMIC |
3.63 V |
15 pF |
4 mA |
LCC4,.1X.12,83/65 |
7 ms |
3.2mm x 2.5mm x 1.2mm |
1.62 V |
85 Cel |
-40 Cel |
Gold (Au) |
25 MHz |
7 ns |
45/55 |
TRI-STATE; ENABLE/DISABLE FUNCTION |
e4 |
||||||||||||
|
Renesas Electronics |
HCMOS |
SURFACE MOUNT |
25 % |
NO |
3.465 V |
15 pF |
3.3 V |
3 ms |
5.15mm x 3.35mm x 1.4mm |
3.135 V |
85 Cel |
-40 Cel |
Gold (Au) - with Nickel (Ni) barrier |
16.384 MHz |
3 ns |
55/45 |
TRI-STATE; ENABLE/DISABLE FUNCTION; TR, 7/10 INCH |
e4 |
|||||||||||||||
|
Renesas Electronics |
HCMOS |
SURFACE MOUNT |
6 |
25 % |
NO |
3.465 V |
15 pF |
3.3 V |
3 ms |
7.5mm x 5.2mm x 1.4mm |
3.135 V |
85 Cel |
-40 Cel |
Gold (Au) - with Nickel (Ni) barrier |
10 MHz |
3 ns |
55/45 |
TRI-STATE; ENABLE/DISABLE FUNCTION; TAPE AND REEL |
e4 |
||||||||||||||
|
Sitime |
LVCMOS |
SURFACE MOUNT |
25 % |
NO |
3.63 V |
15 pF |
3.3 V |
2 ms |
2.0mm x 1.6mm x 0.75mm |
2.97 V |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
25 MHz |
2 ns |
55/45 |
ENABLE/DISABLE FUNCTION; HCMOS OUTPUT ALSO AVAILABLE |
e4 |
|||||||||||||||
|
Sitime |
LVDS |
SURFACE MOUNT |
6 |
25 % |
NO |
PLASTIC/EPOXY |
3.63 V |
100 OHM |
DILCC6,.2 |
.7 ms |
7mm x 5mm x 0.9mm |
2.25 V |
85 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
40 MHz |
.7 ns |
55/45 |
ENABLE/DISABLE FUNCTION; COMPLEMENTARY OUTPUT |
e4 |
|||||||||||||
Renesas Electronics |
HCMOS |
SURFACE MOUNT |
6 |
25 % |
NO |
3.465 V |
15 pF |
47 mA |
3.3 V |
DILCC6,.2 |
3 ms |
7.0mm x 5.0mm x 1.3 mm |
3.135 V |
85 Cel |
-40 Cel |
90 MHz |
3 ns |
60/40 |
ENABLE/DISABLE FUNCTION; COMPLEMENTARY OUTPUT |
|||||||||||||||
|
Silicon Labs |
LVDS |
SURFACE MOUNT |
25 % |
NO |
2.75 V |
100 OHM |
2.5 V |
.8 ms |
7.0mm x 5.0mm x 1.8mm |
2.25 V |
85 Cel |
-40 Cel |
Gold (Au) - with Nickel (Ni) barrier |
100 MHz |
.8 ns |
52/48 |
ENABLE/DISABLE FUNCTION; COMPLEMENTARY OUTPUT |
e4 |
|||||||||||||||
|
Txc |
CMOS |
SURFACE MOUNT |
4 |
25 % |
NO |
15 pF |
30 mA |
3.3 V |
SOLCC,.12 |
10 ms |
5.0mm x 3.2mm x 1.2mm |
70 Cel |
-10 Cel |
50 MHz |
10 ns |
60/40 |
STANDBY; TRI-STATE; ENABLE/DISABLE FUNCTION; TR; O/P LOAD OF 30PF ALSO AVAILABLE |
||||||||||||||||
|
Txc |
CMOS |
SURFACE MOUNT |
4 |
25 % |
NO |
3.63 V |
15 pF |
25 mA |
3.3 V |
LCC4,.1X.13,83/65 |
5 ms |
3.2mm x 2.5mm x 1.1mm |
2.97 V |
70 Cel |
-10 Cel |
24 MHz |
5 ns |
55/45 |
STANDBY; ENABLE/DISABLE FUNCTION |
||||||||||||||
|
Abracon |
LVDS |
SURFACE MOUNT |
6 |
25 % |
NO |
3.63 V |
100 OHM |
3.3 V |
SOLCC6,.12 |
.4 ms |
5.0mm x 3.2mm x 1.2mm |
2.97 V |
85 Cel |
-40 Cel |
100 MHz |
.4 ns |
55/45 |
ENABLE/DISABLE FUNCTION; COMPLEMENTARY OUTPUT |
|||||||||||||||
|
Abracon |
CMOS |
SURFACE MOUNT |
4 |
25 % |
NO |
3.63 V |
10 pF |
2 ms |
3.2mm x 2.5mm x 0.85mm |
1.71 V |
70 Cel |
-20 Cel |
12 MHz |
2 ns |
55/45 |
24 MHZ FREQ ALSO AVAILABLE; BULK; TUBE |
|||||||||||||||||
|
Abracon |
CMOS |
SURFACE MOUNT |
4 |
25 % |
NO |
3.63 V |
5 pF |
3.5 ms |
3.2mm x 2.5mm x 0.85mm |
1.71 V |
70 Cel |
-20 Cel |
12 MHz |
3.5 ns |
55/45 |
24 MHZ FREQ ALSO AVAILABLE; BULK; TUBE |
|||||||||||||||||
|
Abracon |
CMOS |
SURFACE MOUNT |
4 |
25 % |
NO |
3.63 V |
5 pF |
3.5 ms |
3.2mm x 2.5mm x 0.85mm |
1.71 V |
85 Cel |
-40 Cel |
12 MHz |
3.5 ns |
55/45 |
24 MHZ FREQ ALSO AVAILABLE; BULK; TUBE |
|||||||||||||||||
|
Microchip Technology |
CMOS |
SURFACE MOUNT |
4 |
25 % |
NO |
10 KOHM, 15 pF |
3.3 V |
2 ms |
3.2mm x 2.5mm x 0.85mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
96 MHz |
2 ns |
55/45 |
AEC-Q100; STANDBY; ENABLE/DISABLE FUNCTION; TR; ALSO COMPATIBLE WITH 1.8 & 2.5V SUPPLY VOLTAGE |
e4 |
||||||||||||||||
|
Microchip Technology |
CMOS |
SURFACE MOUNT |
4 |
25 % |
NO |
10 KOHM, 40 pF |
3.3 V |
3 ms |
2.5mm x 2.0mm x 0.85mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
16 MHz |
3 ns |
55/45 |
STANDBY; ENABLE/DISABLE FUNCTION; SUPPLY VOLTAGE 1.8V AND 2.5V ALSO AVAILABLE; TUBE |
e4 |
||||||||||||||||
|
Microchip Technology |
CMOS |
SURFACE MOUNT |
6 |
25 % |
NO |
3.6 V |
15 pF |
2 ms |
2.5mm x 2.0mm x 0.85mm |
2.25 V |
125 Cel |
-55 Cel |
NICKEL PALLADIUM GOLD |
25 MHz |
2 ns |
55/45 |
STANDBY; ENABLE/DISABLE FUNCTION; TUBE |
e4 |
|||||||||||||||
|
Microchip Technology |
HCSL |
SURFACE MOUNT |
6 |
25 % |
NO |
3.6 V |
50 OHM, 2 pF |
.4 ms |
5.0mm x 3.2mm x 0.85mm |
2.25 V |
85 Cel |
-40 Cel |
MATTE TIN |
100 MHz |
52/48 |
STANDBY; ENABLE/DISABLE FUNCTION; COMPLEMENTARY OUTPUT; TR |
e3 |
||||||||||||||||
|
Microchip Technology |
CMOS |
SURFACE MOUNT |
25 % |
NO |
3.6 V |
15 pF |
2 ms |
3.2mm x 2.5mm x 0.85mm |
2.25 V |
125 Cel |
-55 Cel |
NICKEL PALLADIUM GOLD |
40 MHz |
2 ns |
55/45 |
ENABLE/DISABLE FUNCTION; TUBE |
e4 |
||||||||||||||||
|
Microchip Technology |
LVDS |
SURFACE MOUNT |
25 % |
NO |
3.6 V |
100 OHM |
5.0mm x 3.2mm x 0.85mm |
2.25 V |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
148.5 MHz |
52/48 |
ENABLE/DISABLE FUNCTION; DIFFERENTIAL OUTPUT; TR |
e4 |
||||||||||||||||||
|
Ecs International |
CMOS |
SURFACE MOUNT |
4 |
25 % |
NO |
3.6 V |
15 pF |
.2 mA |
DILCC4,.2,200 |
30 ms |
7mm x 5mm x 1.4mm |
1.6 V |
85 Cel |
-40 Cel |
.032768 MHz |
30 ns |
45/55 |
TRI-STATE; ENABLE/DISABLE FUNCTION |
|||||||||||||||
|
Sitime |
LVCMOS |
SURFACE MOUNT |
25 % |
NO |
3.63 V |
15 pF |
3.3 V |
2 ms |
2.0mm x 1.6mm x 0.75mm |
2.97 V |
85 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
25.000625 MHz |
2 ns |
55/45 |
ENABLE/DISABLE FUNCTION; HCMOS OUTPUT ALSO AVAILABLE; BULK |
e4 |
|||||||||||||||
|
Sitime |
LVCMOS |
SURFACE MOUNT |
4 |
25 % |
NO |
PLASTIC/EPOXY |
1.98 V |
15 pF |
1.8 V |
SOLCC4,.1,43 |
2.5 ms |
2.5mm x 2mm x 0.75mm |
1.62 V |
70 Cel |
-20 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
24 MHz |
2.5 ns |
55/45 |
2 Amp |
ENABLE/DISABLE FUNCTION; ALSO COMPATIBLE WITH HCMOS O/P |
e4 |
|||||||||||
|
Sitime |
LVCMOS |
SURFACE MOUNT |
25 % |
NO |
3.63 V |
AEC-Q100 |
15 pF |
3.3 V |
3 ms |
2.0mm x 1.6mm x 0.75mm |
2.97 V |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
12 MHz |
3 ns |
55/45 |
LVTTL COMPATIBLE O/P ALSO AVAILABLE; AEC-Q100; BULK |
e4 |
||||||||||||||
Sitime |
LVDS |
SURFACE MOUNT |
25 % |
NO |
3.63 V |
100 OHM |
3.3 V |
3.2mm x 2.5mm x 0.9mm |
2.97 V |
105 Cel |
-40 Cel |
125 MHz |
55/45 |
AEC-Q100; ENABLE/DISABLE FUNCTION; DIFFERENTIAL OUTPUT; TR |
||||||||||||||||||||
Renesas Electronics |
LVDS |
SURFACE MOUNT |
6 |
25 % |
NO |
3.465 V |
100 OHM |
100 mA |
3.3 V |
DILCC6,.2 |
.4 ms |
7.0mm x 5.0mm x 1.3 mm |
3.135 V |
70 Cel |
-20 Cel |
322.265625 MHz |
.4 ns |
60/40 |
ENABLE/DISABLE FUNCTION; COMPLEMENTARY OUTPUT; DIFFERENTIAL OUTPUT |
|||||||||||||||
|
Txc |
CMOS |
SURFACE MOUNT |
4 |
25 % |
NO |
CERAMIC |
1.98 V |
15 pF |
3 mA |
1.8 V |
1.8 |
LCC4,.09X.12,79/60 |
200 ms |
Other Oscillators |
3.2mm x 2.5mm x 1.0mm |
1.62 V |
70 Cel |
-10 Cel |
.032768 MHz |
200 ns |
55/45 |
Not Qualified |
TRI-STATE; ENABLE/DISABLE FUNCTION |
||||||||||
|
Abracon |
CMOS |
SURFACE MOUNT |
4 |
25 % |
NO |
3.63 V |
5 pF |
3.5 ms |
3.2mm x 2.5mm x 0.85mm |
1.71 V |
70 Cel |
-20 Cel |
12 MHz |
3.5 ns |
55/45 |
24 MHZ FREQ ALSO AVAILABLE; TR, 7 INCH |
|||||||||||||||||
|
Abracon |
CMOS |
SURFACE MOUNT |
4 |
25 % |
NO |
3.63 V |
5 pF |
3.5 ms |
3.2mm x 2.5mm x 0.85mm |
1.71 V |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
20 MHz |
3.5 ns |
55/45 |
ENABLE/DISABLE FUNCTION; TR, 7 INCH |
e4 |
|||||||||||||||
|
Abracon |
LVDS |
SURFACE MOUNT |
6 |
25 % |
NO |
2.62 V |
100 OHM |
2.5 V |
LCC6,.1X.13,59/47 |
.4 ms |
3.2mm x 2.5mm x 1.0mm |
2.37 V |
85 Cel |
-40 Cel |
148.5 MHz |
.4 ns |
55/45 |
ENABLE/DISABLE FUNCTION; COMPLEMENTARY OUTPUT |
|||||||||||||||
|
Abracon |
LVPECL |
SURFACE MOUNT |
8 |
25 % |
NO |
3.63 V |
50 OHM |
94 mA |
3.3 V |
LCC8,.2X.28,100/83 |
.35 ms |
7.0mm x 5.0mm x 1.8mm |
2.97 V |
85 Cel |
-40 Cel |
2100 MHz |
.35 ns |
55/45 |
ENABLE/DISABLE FUNCTION; COMPLEMENTARY OUTPUT |
||||||||||||||
|
Abracon |
LVCMOS |
SURFACE MOUNT |
4 |
25 % |
NO |
3.465 V |
30 pF |
3.3 V |
6 ms |
2.5mm x 2.0mm x 0.9mm |
3.135 V |
85 Cel |
-40 Cel |
Nickel/Gold (Ni/Au) |
48 MHz |
6 ns |
55/45 |
TRI-STATE; ENABLE/DISABLE FUNCTION; TAPE AND REEL |
e4 |
||||||||||||||
|
Renesas Electronics |
HCMOS |
SURFACE MOUNT |
25 % |
NO |
3.465 V |
15 pF |
3.3 V |
3 ms |
5.15mm x 3.35mm x 1.4mm |
3.135 V |
85 Cel |
-40 Cel |
Gold (Au) - with Nickel (Ni) barrier |
66.532547 MHz |
3 ns |
55/45 |
TRI-STATE; ENABLE/DISABLE FUNCTION; TR, 7/10 INCH |
e4 |
|||||||||||||||
|
Renesas Electronics |
HCMOS |
SURFACE MOUNT |
25 % |
NO |
3.465 V |
15 pF |
3.3 V |
3 ms |
5.15mm x 3.35mm x 1.4mm |
3.135 V |
85 Cel |
-40 Cel |
Gold (Au) - with Nickel (Ni) barrier |
66.666 MHz |
3 ns |
55/45 |
TRI-STATE; ENABLE/DISABLE FUNCTION; TR, 7/10 INCH |
e4 |
|||||||||||||||
|
Seiko Epson |
CMOS |
SURFACE MOUNT |
4 |
25 % |
NO |
3.6 V |
15 pF |
3.3 V |
4 ms |
3.2mm x 2.5mm x 1.05mm |
2.7 V |
85 Cel |
-40 Cel |
Gold (Au) - with Nickel (Ni) barrier |
25 MHz |
4 ns |
55/45 |
STAND BY FUNCTION; TAPE AND REEL |
e4 |
||||||||||||||
Sitime |
LVCMOS |
SURFACE MOUNT |
25 % |
NO |
3.63 V |
15 pF |
3.3 V |
2 ms |
7.0mm x 5.0mm x 0.9mm |
2.97 V |
85 Cel |
-40 Cel |
40 MHz |
2 ns |
55/45 |
ENABLE/DISABLE FUNCTION; BULK; ALSO COMPATIBLE WITH LVTTL O/P |
||||||||||||||||||
|
Microchip Technology |
CMOS |
SURFACE MOUNT |
25 % |
NO |
3.63 V |
15 pF |
3.3 V |
2 ms |
7.0mm x 5.0mm x 1.6mm |
2.97 V |
85 Cel |
-40 Cel |
GOLD OVER NICKEL |
114.285 MHz |
2 ns |
55/45 |
ENABLE/DISABLE FUNCTION; TR, 7 INCH |
e4 |
|||||||||||||||
|
Abracon |
CMOS |
SURFACE MOUNT |
4 |
25 % |
NO |
3.63 V |
5 pF |
3.5 ms |
3.2mm x 2.5mm x 0.85mm |
1.71 V |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
20 MHz |
3.5 ns |
55/45 |
ENABLE/DISABLE FUNCTION; BULK; TUBE |
e4 |
|||||||||||||||
|
Abracon |
CMOS |
SURFACE MOUNT |
4 |
25 % |
NO |
3.63 V |
5 pF |
3.5 ms |
3.2mm x 2.5mm x 0.85mm |
1.71 V |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
20 MHz |
3.5 ns |
55/45 |
ENABLE/DISABLE FUNCTION; TR, 7 INCH |
e4 |
|||||||||||||||
|
Abracon |
CMOS |
SURFACE MOUNT |
4 |
25 % |
NO |
1.89 V |
15 pF |
1.8 V |
50 ms |
3.2mm x 2.5mm x 1.2mm |
1.71 V |
85 Cel |
-40 Cel |
GOLD |
.032768 MHz |
50 ns |
40/60 |
TRI-STATE; TAPE AND REEL |
e4 |
||||||||||||||
|
Abracon |
HCMOS/TTL |
SURFACE MOUNT |
4 |
25 % |
NO |
3.63 V |
10 TTL, 15 pF |
3.3 V |
5 ms |
7.0mm x 5.08mm x 1.8mm |
2.97 V |
70 Cel |
-20 Cel |
GOLD OVER NICKEL |
2.048 MHz |
5 ns |
45/55 |
TRI-STATE; ENABLE/DISABLE FUNCTION; TAPE AND REEL |
e4 |
||||||||||||||
|
Abracon |
HCSL |
SURFACE MOUNT |
25 % |
NO |
1.89 V |
50 OHM |
1.8 V |
.5 ms |
3.2mm x 2.5mm x 1.0mm |
1.71 V |
85 Cel |
-40 Cel |
156.25 MHz |
.5 ns |
55/45 |
ENABLE/DISABLE FUNCTION; COMPLEMENTARY OUTPUT; TR, 7 INCH |
|||||||||||||||||
|
Abracon |
LVDS |
SURFACE MOUNT |
8 |
25 % |
NO |
3.63 V |
100 OHM |
70 mA |
3.3 V |
LCC8,.2X.28,100/83 |
.35 ms |
7.0mm x 5.0mm x 1.8mm |
2.97 V |
85 Cel |
-40 Cel |
NICKEL GOLD |
77.76 MHz |
.35 ns |
55/45 |
ENABLE/DISABLE FUNCTION; COMPLEMENTARY OUTPUT |
e4 |
||||||||||||
|
Abracon |
LVDS |
SURFACE MOUNT |
8 |
25 % |
NO |
3.63 V |
100 OHM |
70 mA |
3.3 V |
LCC8,.2X.28,100/83 |
.35 ms |
7.0mm x 5.0mm x 1.8mm |
2.97 V |
85 Cel |
-40 Cel |
Nickel/Gold (Ni/Au) |
156.25 MHz |
.35 ns |
55/45 |
ENABLE/DISABLE FUNCTION; COMPLEMENTARY OUTPUT |
e4 |
||||||||||||
|
Abracon |
LVDS |
SURFACE MOUNT |
8 |
25 % |
NO |
2.75 V |
100 OHM |
2.5 V |
LCC8,.2X.28,100/83 |
.35 ms |
7.0mm x 5.0mm x 1.8mm |
2.25 V |
85 Cel |
-40 Cel |
Nickel/Gold (Ni/Au) |
156.25 MHz |
.35 ns |
55/45 |
ENABLE/DISABLE FUNCTION; COMPLEMENTARY OUTPUT |
e4 |
|||||||||||||
|
Abracon |
LVDS |
SURFACE MOUNT |
8 |
25 % |
NO |
1.89 V |
100 OHM |
1.8 V |
LCC8,.2X.28,100/83 |
.35 ms |
7.0mm x 5.0mm x 1.8mm |
1.71 V |
85 Cel |
-40 Cel |
Nickel/Gold (Ni/Au) |
156.25 MHz |
.35 ns |
55/45 |
ENABLE/DISABLE FUNCTION; COMPLEMENTARY OUTPUT |
e4 |
Crystal Oscillator (XO) Clock Oscillators are electronic devices that generate a stable clock signal with a fixed frequency. They use a quartz crystal resonator as the frequency-determining element, which provides a stable and accurate frequency over a wide temperature range.
One of the main advantages of XO Clock Oscillators is their ability to generate a stable and precise clock signal with a fixed frequency. This makes them ideal for use in applications that require precise timing, such as in digital signal processing, telecommunications, and scientific research.
XO Clock Oscillators offer a low phase noise, which is important in applications that require a clean and stable clock signal. They are capable of generating frequencies ranging from a few kilohertz to several hundred megahertz, making them suitable for use in various electronic circuits.
Additionally, XO Clock Oscillators have a relatively simple design and are easy to integrate into electronic systems. They are available in a range of package sizes and configurations, allowing them to be used in various applications, including in communication systems, network equipment, and instrumentation.