50 % XO Clock Oscillators 2,400+

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Part RoHS Manufacturer Oscillator Type Mounting Feature No. of Terminals Frequency Stability Frequency Adjustment (Mechanical) Aging Package Body Material Maximum Supply Voltage Technology Screening Level Output Load Maximum Supply Current Nominal Supply Voltage Power Supplies (V) Package Equivalence Code Maximum Rise Time Sub-Category Physical Dimension Minimum Supply Voltage Maximum Operating Temperature Minimum Operating Temperature Terminal Finish Nominal Operating Frequency Maximum Fall Time Maximum Symmetry (%) Manufacturer Series Qualification Maximum Output Low Current Additional Features JESD-609 Code Minimum Operating Frequency Maximum Operating Frequency

MX573EBB125M000

Microchip Technology

LVDS

SURFACE MOUNT

6

50 %

NO

3.63 V

100 OHM

.4 ms

7.0mm x 5.0mm x 1.4mm

2.375 V

85 Cel

-40 Cel

MATTE TIN

125 MHz

.4 ns

55/45

TRI-STATE; ENABLE/DISABLE FUNCTION; DIFFERENTIAL OUTPUT

e3

MX573LBB148M500

Microchip Technology

LVDS

SURFACE MOUNT

6

50 %

NO

3.63 V

100 OHM

.4 ms

7.0mm x 5.0mm x 1.4mm

2.375 V

85 Cel

-40 Cel

148.5 MHz

.4 ns

55/45

TRI-STATE; ENABLE/DISABLE FUNCTION; DIFFERENTIAL OUTPUT; TUBE

MX575ABA100M000

Microchip Technology

LVPECL

SURFACE MOUNT

50 %

NO

3.63 V

50 OHM

7.1mm x 5.1mm x 1.4mm

2.375 V

85 Cel

-40 Cel

Gold (Au) - with Nickel (Ni) barrier

100 MHz

55/45

TRI-STATE; ENABLE/DISABLE FUNCTION; TUBE

e4

MX575ABA100M000-TR

Microchip Technology

LVPECL

SURFACE MOUNT

50 %

NO

3.63 V

50 OHM

7.1mm x 5.1mm x 1.4mm

2.375 V

85 Cel

-40 Cel

Gold (Au) - with Nickel (Ni) barrier

100 MHz

55/45

TRI-STATE; ENABLE/DISABLE FUNCTION; TR

e4

MX575ABB50M0000

Microchip Technology

LVDS

SURFACE MOUNT

6

50 %

NO

3.63 V

100 OHM

.4 ms

7.0mm x 5.0mm x 1.4mm

2.375 V

85 Cel

-40 Cel

MATTE TIN

50 MHz

.4 ns

55/45

TRI-STATE; ENABLE/DISABLE FUNCTION; DIFFERENTIAL OUTPUT

e3

MX575ABB50M0000-TR

Microchip Technology

LVDS

SURFACE MOUNT

6

50 %

NO

3.63 V

100 OHM

.4 ms

7.0mm x 5.0mm x 1.4mm

2.375 V

85 Cel

-40 Cel

MATTE TIN

50 MHz

.4 ns

55/45

TRI-STATE; ENABLE/DISABLE FUNCTION; DIFFERENTIAL OUTPUT; TR

e3

MXO45-3C-8M0000

Cts

CMOS/TTL

THROUGH HOLE MOUNT

14

50 %

NO

5.5 V

10 TTL, 50 pF

5 V

10 ms

20.8mm x 13.2mm x 5.1mm

4.5 V

70 Cel

-20 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

8 MHz

10 ns

55/45

ENABLE/DISABLE FUNCTION

e1

MXO45HS-3C-16M0000

Cts

HCMOS/TTL

THROUGH HOLE MOUNT

8

50 %

NO

5.5 V

10 TTL, 50 pF

5 V

10 ms

12.954mm x 12.954mm x 5.08mm

4.5 V

70 Cel

-20 Cel

TIN SILVER COPPER OVER NICKEL

16 MHz

10 ns

55/45

ENABLE/DISABLE FUNCTION

MXO45HS-3C-1M8432

Cts

HCMOS/TTL

THROUGH HOLE MOUNT

8

50 %

NO

5.5 V

10 TTL, 50 pF

5 V

10 ms

13.2mm x 13.2mm x 6.45mm

4.5 V

70 Cel

-20 Cel

TIN SILVER COPPER OVER NICKEL

1.8432 MHz

10 ns

55/45

ENABLE/DISABLE FUNCTION; ANTISTATIC BAG; TRAY

MXO45HS-3C-40M0000

Cts

HCMOS/TTL

THROUGH HOLE MOUNT

8

50 %

NO

5.5 V

10 TTL, 50 pF

5 V

8 ms

13.2mm x 13.2mm x 5.5mm

4.5 V

70 Cel

-20 Cel

TIN SILVER COPPER OVER NICKEL

40 MHz

8 ns

55/45

ENABLE/DISABLE FUNCTION; TRAY

MXO45HS-3C-6M0000

Cts

HCMOS/TTL

THROUGH HOLE MOUNT

8

50 %

NO

5.5 V

10 TTL, 50 pF

5 V

10 ms

13.2mm x 13.2mm x 6.45mm

4.5 V

70 Cel

-20 Cel

TIN SILVER COPPER OVER NICKEL

6 MHz

10 ns

55/45

ENABLE/DISABLE FUNCTION; ANTISTATIC BAG; TRAY

MXO45HS-3I-1M8432

Cts

HCMOS/TTL

THROUGH HOLE MOUNT

8

50 %

NO

5.5 V

10 TTL, 50 pF

5 V

10 ms

13.2mm x 13.2mm x 6.45mm

4.5 V

85 Cel

-40 Cel

TIN SILVER COPPER OVER NICKEL

1.8432 MHz

10 ns

55/45

ENABLE/DISABLE FUNCTION; ANTISTATIC BAG; TRAY

MXO45HS-3I-40M0000

Cts

HCMOS/TTL

THROUGH HOLE MOUNT

8

50 %

NO

5.5 V

10 TTL, 50 pF

5 V

10 ms

13.2mm x 13.2mm x 6.45mm

4.5 V

85 Cel

-40 Cel

TIN SILVER COPPER OVER NICKEL

40 MHz

10 ns

55/45

ENABLE/DISABLE FUNCTION; ANTISTATIC BAG; TRAY

MXO45HST-3C-16M0000

Cts

HCMOS/TTL

THROUGH HOLE MOUNT

8

50 %

NO

5.5 V

10 TTL, 50 pF

5 V

10 ms

13.2mm x 13.2mm x 6.45mm

4.5 V

70 Cel

-20 Cel

TIN SILVER COPPER OVER NICKEL

16 MHz

10 ns

55/45

TRI-STATE; ENABLE/DISABLE FINCTION; ANTISTATIC BAG; TRAY

O25.0-JO75-B-3.3-2-LF

Jauch Quartz

CMOS

SURFACE MOUNT

4

50 %

NO

3.63 V

30 pF

3.3 V

5 ms

7.5mm x 5.0mm x 1.8mm

2.97 V

70 Cel

-10 Cel

Gold (Au) - with Nickel (Ni) barrier

25 MHz

5 ns

60/40

STAND-BY; ENABLE/DISABLE FUNCTION; BULK; TAPE AND REEL

e4

OC7E25000XCCDRX

Wi2wi

CMOS/TTL

SURFACE MOUNT

4

50 %

NO

3.63 V

15 pF

3.3 V

4 ms

7.0mm x 5.0mm x 1.5mm

2.97 V

85 Cel

-40 Cel

GOLD OVER NICKEL

25 MHz

4 ns

60/40

TRI-STATE; ENABLE/DISABLE FUNCTION; TR, 7 INCH

e4

Q3204DC21004400

Seiko Epson

CMOS

THROUGH HOLE MOUNT

8

50 %

NO

5.5 V

13.7mm x 6.6mm x 5.3mm

4.5 V

70 Cel

-20 Cel

40 MHz

55/45

ENABLE/DISABLE FUNCTION

Q33310F70032100

Seiko Epson

CMOS

SURFACE MOUNT

4

50 %

NO

3.6 V

15 pF

2.5 mA

3.3 V

4 ms

3.2mm x 2.5mm x 1.05 mm

2.7 V

85 Cel

-40 Cel

25 MHz

4 ns

55/45

STANDBY; ENABLE/DISABLE FUNCTION

Q33310F70049000

Seiko Epson

CMOS

SURFACE MOUNT

50 %

NO

3.6 V

15 pF

3.3 V

4 ms

3.2mm x 2.5mm x 1.05mm

2.7 V

85 Cel

-40 Cel

24 MHz

4 ns

55/45

STANDBY; ENABLE/DISABLE FUNCTION; TR, 7 INCH

QT78HCD11-19.580MHZ

Q-tech

HCMOS

SURFACE MOUNT

4

50 %

NO

5.5 V

10 KOHM, 2 LS TTL, 15 pF

5 V

7 ms

13.97mm x 8.89mm x 4.318mm

4.5 V

85 Cel

-40 Cel

Gold (Au) - with Nickel (Ni) barrier

19.58 MHz

7 ns

40/60

TRI-STATE; ENABLE/DISABLE FUNCTION; TUBE; TAPE AND REEL

e4

QX14T50B50.00000B50TT

Qantek Technology

HCMOS

THROUGH HOLE MOUNT

14

50 %

NO

5.5 V

50 pF

15 mA

5 V

DIP4/14,.6

6 ms

20.8mm x 13.2mm x 5.08mm

4.5 V

85 Cel

-40 Cel

50 MHz

6 ns

45/55

TRI-STATE; ENABLE DISABLE FUNCTION

QX8T50B2.457600B50TT

Qantek Technology

HCMOS

THROUGH HOLE MOUNT

8

50 %

NO

5.5 V

50 pF

10 mA

5 V

DIP4/8,.3

10 ms

13.21mm x 13.21mm x 5.87mm

4.5 V

85 Cel

-40 Cel

2.4576 MHz

10 ns

45/55

TRI-STATE; ENABLE/DISABLE FUNCTION

QX8T50B24.57600B50TT

Qantek Technology

HCMOS

THROUGH HOLE MOUNT

8

50 %

NO

5.5 V

50 pF

15 mA

5 V

DIP4/8,.3

6 ms

13.21mm x 13.21mm x 5.87mm

4.5 V

85 Cel

-40 Cel

24.576 MHz

6 ns

45/55

TRI-STATE; ENABLE/DISABLE FUNCTION

S1613B-100.0000(T)

Diodes Incorporated

CMOS

SURFACE MOUNT

4

50 %

NO

3.63 V

15 pF

3.3 V

3 ms

7.0mm x 5.0mm x 1.8mm

2.97 V

70 Cel

-10 Cel

100 MHz

3 ns

55/45

STANDBY; ENABLE/DISABLE FUNCTION; TR

S1613B-80.0000

Diodes Incorporated

CMOS

SURFACE MOUNT

4

50 %

NO

CERAMIC

3.63 V

15 pF

40 mA

3.3 V

3.3

DILCC4,.2,200

5 ms

Other Oscillators

7.0mm x 5.0mm x 1.8mm

2.97 V

70 Cel

-10 Cel

80 MHz

5 ns

55/45

Not Qualified

STANDBY; ENABLE/DISABLE FUNCTION; BULK

1.54 MHz

156.25 MHz

SHPCIE100

Diodes Incorporated

HSCL

SURFACE MOUNT

6

50 %

NO

CERAMIC

3.63 V

40 mA

3.3 V

3.3

DILCC6,.2

.7 ms

Other Oscillators

7.0mm x 5.0mm x 2.0mm

2.97 V

85 Cel

-40 Cel

Gold (Au)

100 MHz

.7 ns

55/45

SHPCIE100

Not Qualified

ENABLE/DISABLE FUNCTION; TAPE AND REEL

e4

SIT1602AI-13-33E-50.000000E

Sitime

LVCMOS

SURFACE MOUNT

50 %

NO

3.63 V

15 pF

3.3 V

2 ms

2.5mm x 2.0mm x 0.75mm

2.97 V

85 Cel

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

50 MHz

2 ns

55/45

ENABLE/DISABLE FUNCTION; HCMOS OUTPUT ALSO AVAILABLE; TR

e4

SIT1602AI-23-33S-25.000000

Sitime

LVCMOS

SURFACE MOUNT

50 %

NO

3.63 V

15 pF

3.3 V

2 ms

3.2mm x 2.5mm x 0.75mm

2.97 V

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

25 MHz

2 ns

55/45

STANDBY; ENABLE/DISABLE FUNCTION; HCMOS OUTPUT ALSO AVAILABLE; BULK

e4

SIT1602AI-23-33S-33.333330

Sitime

LVCMOS

SURFACE MOUNT

50 %

NO

3.63 V

15 pF

3.3 V

2 ms

3.2mm x 2.5mm x 0.75mm

2.97 V

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

33.33333 MHz

2 ns

55/45

STANDBY; ENABLE/DISABLE FUNCTION; HCMOS OUTPUT ALSO AVAILABLE; BULK

e4

SIT1602AI-83-33E-33.000000

Sitime

LVCMOS

SURFACE MOUNT

50 %

NO

3.63 V

15 pF

3.3 V

2 ms

7.0mm x 5.0mm x 0.9mm

2.97 V

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

33 MHz

2 ns

55/45

ENABLE/DISABLE FUNCTION; HCMOS OUTPUT ALSO AVAILABLE; BULK

e4

SIT1602BC-13-18E-33.333330

Sitime

LVCMOS/HCMOS

SURFACE MOUNT

4

50 %

NO

PLASTIC/EPOXY

1.98 V

MIL-STD-883F

15 pF

1.8 V

SOLCC4,.1,49

2.5 ms

2.5mm x 2mm x 0.8mm

1.62 V

70 Cel

-20 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

33.33333 MHz

2.5 ns

55/45

2 Amp

ENABLE/DISABLE FUNCTION

e4

SIT1602BC-13-18N-25.000000

Sitime

LVCMOS/HCMOS

SURFACE MOUNT

4

50 %

NO

PLASTIC/EPOXY

1.98 V

MIL-STD-883F

15 pF

1.8 V

SOLCC4,.1,49

2.5 ms

2.5mm x 2mm x 0.8mm

1.62 V

70 Cel

-20 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

25 MHz

2.5 ns

55/45

2 Amp

e4

SIT1602BC-13-18N-25.000000D

Sitime

LVCMOS/HCMOS

SURFACE MOUNT

4

50 %

NO

PLASTIC/EPOXY

1.98 V

MIL-STD-883F

15 pF

1.8 V

SOLCC4,.1,49

2.5 ms

2.5mm x 2mm x 0.8mm

1.62 V

70 Cel

-20 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

25 MHz

2.5 ns

55/45

2 Amp

e4

SIT1602BC-23-33E-33.333330E

Sitime

LVCMOS/HCMOS

SURFACE MOUNT

4

50 %

NO

PLASTIC/EPOXY

3.63 V

MIL-STD-883F

15 pF

3.3 V

DILCC4,.1,83

2 ms

3.2mm x 2.5mm x 0.85mm

2.97 V

70 Cel

-20 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

33.33333 MHz

2 ns

55/45

4 Amp

ENABLE/DISABLE FUNCTION

e4

SIT1602BI-13-18E-25.000000

Sitime

LVCMOS/HCMOS

SURFACE MOUNT

4

50 %

NO

PLASTIC/EPOXY

1.98 V

MIL-STD-883F

15 pF

1.8 V

SOLCC4,.1,49

2.5 ms

2.5mm x 2mm x 0.8mm

1.62 V

85 Cel

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

25 MHz

2.5 ns

55/45

2 Amp

ENABLE/DISABLE FUNCTION

e4

SIT1602BI-13-33E-24.000000

Sitime

LVCMOS/HCMOS

SURFACE MOUNT

4

50 %

NO

PLASTIC/EPOXY

3.63 V

MIL-STD-883F

15 pF

3.3 V

SOLCC4,.1,49

2 ms

2.5mm x 2mm x 0.8mm

2.97 V

85 Cel

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

24 MHz

2 ns

55/45

4 Amp

ENABLE/DISABLE FUNCTION

e4

SIT1602BI-13-33E-25.000000

Sitime

LVCMOS/HCMOS

SURFACE MOUNT

4

50 %

NO

PLASTIC/EPOXY

3.63 V

MIL-STD-883F

15 pF

3.3 V

SOLCC4,.1,49

2 ms

2.5mm x 2mm x 0.8mm

2.97 V

85 Cel

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

25 MHz

2 ns

55/45

4 Amp

ENABLE/DISABLE FUNCTION

e4

SIT1602BI-13-33E-25.000000D

Sitime

LVCMOS/HCMOS

SURFACE MOUNT

4

50 %

NO

PLASTIC/EPOXY

3.63 V

MIL-STD-883F

15 pF

3.3 V

SOLCC4,.1,49

2 ms

2.5mm x 2mm x 0.8mm

2.97 V

85 Cel

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

25 MHz

2 ns

55/45

4 Amp

ENABLE/DISABLE FUNCTION

e4

SIT1602BI-13-33E-25.000000E

Sitime

LVCMOS/HCMOS

SURFACE MOUNT

4

50 %

NO

PLASTIC/EPOXY

3.63 V

MIL-STD-883F

15 pF

3.3 V

SOLCC4,.1,49

2 ms

2.5mm x 2mm x 0.8mm

2.97 V

85 Cel

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

25 MHz

2 ns

55/45

4 Amp

ENABLE/DISABLE FUNCTION

e4

SIT1602BI-13-33E-50.000000G

Sitime

LVCMOS

SURFACE MOUNT

4

50 %

NO

PLASTIC/EPOXY

3.63 V

15 pF

3.3 V

SOLCC4,.1,43

2 ms

2.5mm x 2.0mm x 0.75mm

2.97 V

85 Cel

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

50 MHz

2 ns

55/45

4 Amp

ENABLE/DISABLE FUNCTION; ALSO COMPATIBLE WITH HCMOS O/P

e4

SIT1602BI-13-33N-6.000000

Sitime

LVCMOS/HCMOS

SURFACE MOUNT

4

50 %

NO

PLASTIC/EPOXY

3.63 V

MIL-STD-883F

15 pF

3.3 V

SOLCC4,.1,49

2 ms

2.5mm x 2mm x 0.8mm

2.97 V

85 Cel

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

6 MHz

2 ns

55/45

4 Amp

e4

SIT1602BI-13-33S-48.000000E

Sitime

LVCMOS/HCMOS

SURFACE MOUNT

4

50 %

NO

PLASTIC/EPOXY

3.63 V

MIL-STD-883F

15 pF

3.3 V

SOLCC4,.1,49

2 ms

2.5mm x 2mm x 0.8mm

2.97 V

85 Cel

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

48 MHz

2 ns

55/45

4 Amp

STANDBY; ENABLE/DISABLE FUNCTION

e4

SIT1602BI-13-XXE-24.000000E

Sitime

LVCMOS/HCMOS

SURFACE MOUNT

4

50 %

NO

PLASTIC/EPOXY

3.63 V

MIL-STD-883F

15 pF

SOLCC4,.1,49

2 ms

2.5mm x 2mm x 0.8mm

2.25 V

85 Cel

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

24 MHz

2 ns

55/45

ENABLE/DISABLE FUNCTION

e4

SIT1602BI-13-XXS-19.200000D

Sitime

LVCMOS/HCMOS

SURFACE MOUNT

4

50 %

NO

PLASTIC/EPOXY

3.63 V

MIL-STD-883F

15 pF

SOLCC4,.1,49

2 ms

2.5mm x 2mm x 0.8mm

2.25 V

85 Cel

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

19.2 MHz

2 ns

55/45

STANDBY; ENABLE/DISABLE FUNCTION

e4

SIT1602BI-23-18E-33.333330

Sitime

LVCMOS/HCMOS

SURFACE MOUNT

4

50 %

NO

PLASTIC/EPOXY

1.98 V

MIL-STD-883F

15 pF

1.8 V

DILCC4,.1,83

2.5 ms

3.2mm x 2.5mm x 0.85mm

1.62 V

85 Cel

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

33.33333 MHz

2.5 ns

55/45

2 Amp

ENABLE/DISABLE FUNCTION

e4

SIT1602BI-23-18E-50.000000G

Sitime

LVCMOS

SURFACE MOUNT

4

50 %

NO

PLASTIC/EPOXY

1.98 V

15 pF

1.8 V

DILCC4,.1,83

2.5 ms

3.2mm x 2.5mm x 0.75mm

1.62 V

85 Cel

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

50 MHz

2.5 ns

55/45

2 Amp

ENABLE/DISABLE FUNCTION; ALSO COMPATIBLE WITH HCMOS O/P

e4

SIT1602BI-23-25E-25.000000G

Sitime

LVCMOS

SURFACE MOUNT

4

50 %

NO

PLASTIC/EPOXY

2.75 V

15 pF

2.5 V

DILCC4,.1,83

2 ms

3.2mm x 2.5mm x 0.75mm

2.25 V

85 Cel

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

25 MHz

2 ns

55/45

3 Amp

ENABLE/DISABLE FUNCTION; ALSO COMPATIBLE WITH HCMOS O/P

e4

SIT1602BI-23-33E-24.000000

Sitime

LVCMOS/HCMOS

SURFACE MOUNT

4

50 %

NO

PLASTIC/EPOXY

3.63 V

MIL-STD-883F

15 pF

3.3 V

DILCC4,.1,83

2 ms

3.2mm x 2.5mm x 0.85mm

2.97 V

85 Cel

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

24 MHz

2 ns

55/45

4 Amp

ENABLE/DISABLE FUNCTION

e4

XO Clock Oscillators

Crystal Oscillator (XO) Clock Oscillators are electronic devices that generate a stable clock signal with a fixed frequency. They use a quartz crystal resonator as the frequency-determining element, which provides a stable and accurate frequency over a wide temperature range.

One of the main advantages of XO Clock Oscillators is their ability to generate a stable and precise clock signal with a fixed frequency. This makes them ideal for use in applications that require precise timing, such as in digital signal processing, telecommunications, and scientific research.

XO Clock Oscillators offer a low phase noise, which is important in applications that require a clean and stable clock signal. They are capable of generating frequencies ranging from a few kilohertz to several hundred megahertz, making them suitable for use in various electronic circuits.

Additionally, XO Clock Oscillators have a relatively simple design and are easy to integrate into electronic systems. They are available in a range of package sizes and configurations, allowing them to be used in various applications, including in communication systems, network equipment, and instrumentation.