Part | RoHS | Manufacturer | Oscillator Type | Mounting Feature | No. of Terminals | Frequency Stability | Frequency Adjustment (Mechanical) | Aging | Package Body Material | Maximum Supply Voltage | Technology | Screening Level | Output Load | Maximum Supply Current | Nominal Supply Voltage | Power Supplies (V) | Package Equivalence Code | Maximum Rise Time | Sub-Category | Physical Dimension | Minimum Supply Voltage | Maximum Operating Temperature | Minimum Operating Temperature | Terminal Finish | Nominal Operating Frequency | Maximum Fall Time | Maximum Symmetry (%) | Manufacturer Series | Qualification | Maximum Output Low Current | Additional Features | JESD-609 Code | Minimum Operating Frequency | Maximum Operating Frequency |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Microchip Technology |
CMOS |
SURFACE MOUNT |
4 |
10 % |
NO |
10 KOHM, 25 pF |
3.3 V |
2 ms |
2.5mm x 2.0mm x 0.85mm |
105 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
100 MHz |
2 ns |
55/45 |
AEC-Q100; STANDBY; ENABLE/DISABLE FUNCTION; TR; ALSO COMPATIBLE WITH 1.8 & 2.5V SUPPLY VOLTAGE |
e4 |
||||||||||||||||
|
Microchip Technology |
CMOS |
SURFACE MOUNT |
4 |
25 % |
NO |
10 KOHM, 40 pF |
3.3 V |
2 ms |
3.2mm x 2.5mm x 0.85mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
24.576 MHz |
2 ns |
55/45 |
AEC-Q100; STANDBY; ENABLE/DISABLE FUNCTION; TUBE; 1.8 AND 2.5V SUPPLY VOLTAGE ALSO AVAILABLE |
e4 |
||||||||||||||||
|
Microchip Technology |
CMOS |
SURFACE MOUNT |
4 |
10 % |
NO |
10 KOHM, 40 pF |
3.3 V |
2 ms |
3.2mm x 2.5mm x 0.85mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
50 MHz |
2 ns |
55/45 |
AEC-Q100; STANDBY; ENABLE/DISABLE FUNCTION; TUBE; ALSO COMPATIBLE WITH 1.8 & 2.5V SUPPLY VOLTAGE |
e4 |
||||||||||||||||
|
Microchip Technology |
CMOS |
SURFACE MOUNT |
4 |
25 % |
NO |
10 KOHM, 40 pF |
3.3 V |
2 ms |
3.2mm x 2.5mm x 0.85mm |
105 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
27 MHz |
2 ns |
55/45 |
AEC-Q100; STANDBY; ENABLE/DISABLE FUNCTION; TR; ASLO COMPATIBLE WITH 1.8 & 2.5V SUPPLY VOLTAGE |
e4 |
||||||||||||||||
|
Microchip Technology |
CMOS |
SURFACE MOUNT |
4 |
10 % |
NO |
10 KOHM, 40 pF |
3.3 V |
2 ms |
3.2mm x 2.5mm x 0.85mm |
105 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
16 MHz |
2 ns |
55/45 |
AEC-Q100; STANDBY; ENABLE/DISABLE FUNCTION; TR; ALSO COMPATIBLE WITH 1.8 & 2.5V SUPPLY VOLTAGE |
e4 |
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|
Microchip Technology |
|||||||||||||||||||||||||||||||||
|
Microchip Technology |
CMOS |
SURFACE MOUNT |
4 |
50 % |
NO |
3.6 V |
10 KOHM, 15 pF |
3.3 V |
2 ms |
3.2mm x 2.5mm x 0.85mm |
3 V |
85 Cel |
-40 Cel |
2.048 MHz |
2 ns |
55/45 |
STANDBY; ENABLE/DISABLE FUNCTION; TUBE |
||||||||||||||||
|
Microchip Technology |
CMOS |
SURFACE MOUNT |
6 |
50 % |
NO |
3.6 V |
15 pF |
2 ms |
7.0mm x 5.0mm x 0.9mm |
2.25 V |
70 Cel |
-20 Cel |
NICKEL PALLADIUM GOLD |
11 MHz |
2 ns |
55/45 |
STANDBY; ENABLE/DISABLE FUNCTION; TUBE |
e4 |
|||||||||||||||
|
Microchip Technology |
CMOS |
SURFACE MOUNT |
6 |
25 % |
NO |
3.6 V |
15 pF |
2 ms |
7.0mm x 5.0mm x 0.9mm |
2.25 V |
125 Cel |
-55 Cel |
NICKEL PALLADIUM GOLD |
14.395 MHz |
2 ns |
55/45 |
STANDBY; ENABLE/DISABLE FUNCTION; TR |
e4 |
|||||||||||||||
|
Microchip Technology |
CMOS |
SURFACE MOUNT |
10 % |
NO |
3.6 V |
15 pF |
2 ms |
3.2mm x 2.5mm x 0.85mm |
2.25 V |
70 Cel |
-20 Cel |
NICKEL PALLADIUM GOLD |
100 MHz |
2 ns |
55/45 |
STANDBY; ENABLE/DISABLE FUNCTION; TR |
e4 |
||||||||||||||||
|
Microchip Technology |
CMOS |
SURFACE MOUNT |
50 % |
NO |
3.6 V |
15 pF |
2 ms |
3.2mm x 2.5mm x 0.85mm |
2.25 V |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
125 MHz |
2 ns |
55/45 |
STANDBY; ENABLE/DISABLE FUNCTION; TR |
e4 |
||||||||||||||||
|
Microchip Technology |
CMOS |
SURFACE MOUNT |
6 |
10 % |
NO |
3.6 V |
15 pF |
2 ms |
3.2mm x 2.5mm x 0.9mm |
2.25 V |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
20 MHz |
2 ns |
55/45 |
STANDBY; ENABLE/DISABLE FUNCTION; TUBE |
e4 |
|||||||||||||||
|
Microchip Technology |
CMOS |
SURFACE MOUNT |
6 |
10 % |
NO |
3.6 V |
15 pF |
2 ms |
3.2mm x 2.5mm x 0.9mm |
2.25 V |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
25 MHz |
2 ns |
55/45 |
STANDBY; ENABLE/DISABLE FUNCTION; TUBE |
e4 |
|||||||||||||||
|
Microchip Technology |
CMOS |
SURFACE MOUNT |
10 % |
NO |
3.6 V |
15 pF |
2 ms |
3.2mm x 2.5mm x 0.85mm |
2.25 V |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
25 MHz |
2 ns |
55/45 |
STANDBY; ENABLE/DISABLE FUNCTION; TR |
e4 |
||||||||||||||||
|
Microchip Technology |
CMOS |
SURFACE MOUNT |
10 % |
NO |
3.6 V |
15 pF |
2 ms |
3.2mm x 2.5mm x 0.85mm |
2.25 V |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
100 MHz |
2 ns |
55/45 |
STANDBY; ENABLE/DISABLE FUNCTION; TR |
e4 |
||||||||||||||||
|
Microchip Technology |
CMOS |
SURFACE MOUNT |
6 |
10 % |
NO |
3.6 V |
15 pF |
2 ms |
3.2mm x 2.5mm x 0.9mm |
2.25 V |
105 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
14.7456 MHz |
2 ns |
55/45 |
STANDBY; ENABLE/DISABLE FUNCTION; TUBE |
e4 |
|||||||||||||||
|
Microchip Technology |
CMOS |
SURFACE MOUNT |
6 |
10 % |
NO |
3.6 V |
15 pF |
2 ms |
3.2mm x 2.5mm x 0.9mm |
2.25 V |
105 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
27 MHz |
2 ns |
55/45 |
STANDBY; ENABLE/DISABLE FUNCTION; TUBE |
e4 |
|||||||||||||||
|
Microchip Technology |
CMOS |
SURFACE MOUNT |
6 |
10 % |
NO |
3.6 V |
15 pF |
2 ms |
3.2mm x 2.5mm x 0.9mm |
2.25 V |
105 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
40 MHz |
2 ns |
55/45 |
STANDBY; ENABLE/DISABLE FUNCTION; TUBE |
e4 |
|||||||||||||||
|
Microchip Technology |
CMOS |
SURFACE MOUNT |
6 |
10 % |
NO |
3.6 V |
15 pF |
2 ms |
3.2mm x 2.5mm x 0.9mm |
2.25 V |
105 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
52.5 MHz |
2 ns |
55/45 |
STANDBY; ENABLE/DISABLE FUNCTION; TUBE |
e4 |
|||||||||||||||
|
Microchip Technology |
CMOS |
SURFACE MOUNT |
10 % |
NO |
3.6 V |
15 pF |
2 ms |
3.2mm x 2.5mm x 0.85mm |
2.25 V |
105 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
100 MHz |
2 ns |
55/45 |
STANDBY; ENABLE/DISABLE FUNCTION; TR |
e4 |
||||||||||||||||
|
Microchip Technology |
CMOS |
SURFACE MOUNT |
50 % |
NO |
3.6 V |
15 pF |
2 ms |
2.5mm x 2.0mm x 0.85mm |
2.25 V |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
125 MHz |
2 ns |
55/45 |
STANDBY; ENABLE/DISABLE FUNCTION; TR |
e4 |
||||||||||||||||
|
Microchip Technology |
CMOS |
SURFACE MOUNT |
6 |
25 % |
NO |
3.6 V |
15 pF |
2 ms |
2.5mm x 2.0mm x 0.9mm |
2.25 V |
125 Cel |
-55 Cel |
NICKEL PALLADIUM GOLD |
12 MHz |
2 ns |
55/45 |
STANDBY; ENABLE/DISABLE FUNCTION; TR |
e4 |
|||||||||||||||
|
Microchip Technology |
CMOS |
SURFACE MOUNT |
6 |
25 % |
NO |
3.6 V |
15 pF |
2 ms |
2.5mm x 2.0mm x 0.9mm |
2.25 V |
125 Cel |
-55 Cel |
NICKEL PALLADIUM GOLD |
33.3333 MHz |
2 ns |
55/45 |
STANDBY; ENABLE/DISABLE FUNCTION; TUBE |
e4 |
|||||||||||||||
|
Microchip Technology |
CMOS |
SURFACE MOUNT |
6 |
50 % |
NO |
3.6 V |
15 pF |
2 ms |
7.0mm x 5.0mm x 0.85mm |
2.25 V |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
125.0062 MHz |
2 ns |
55/45 |
STANDBY; ENABLE/DISABLE FUNCTION; TUBE |
e4 |
|||||||||||||||
|
Microchip Technology |
LVPECL |
SURFACE MOUNT |
10 % |
NO |
3.6 V |
50 OHM |
3.2mm x 2.5mm x 0.85mm |
2.25 V |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
25 MHz |
52/48 |
STANDBY; ENABLE/DISABLE FUNCTION; DIFFERENTIAL OUTPUT; TUBE |
e4 |
||||||||||||||||||
|
Microchip Technology |
LVDS |
SURFACE MOUNT |
6 |
25 % |
NO |
3.63 V |
100 OHM |
5.0mm x 3.2mm x 0.85mm |
2.25 V |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
100 MHz |
52/48 |
STANDBY; ENABLE/DISABLE FUNCTION; DIFFERENTIAL OUTPUT; TR |
e4 |
|||||||||||||||||
|
Microchip Technology |
LVDS |
SURFACE MOUNT |
6 |
25 % |
NO |
PLASTIC |
3.6 V |
LVDS |
100 OHM |
.095 mA |
5.0mm x 3.2mm x 0.85mm |
2.25 V |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
135 MHz |
52/48 |
STANDBY; ENABLE/DISABLE FUNCTION; DIFFERENTIAL OUTPUT; TUBE |
e4 |
||||||||||||||
|
Microchip Technology |
LVDS |
SURFACE MOUNT |
6 |
25 % |
NO |
3.63 V |
100 OHM |
5.0mm x 3.2mm x 0.85mm |
2.25 V |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
150 MHz |
52/48 |
STANDBY; ENABLE/DISABLE FUNCTION; DIFFERENTIAL OUTPUT; TUBE |
e4 |
|||||||||||||||||
|
Microchip Technology |
LVDS |
SURFACE MOUNT |
6 |
25 % |
NO |
3.63 V |
100 OHM |
3.3 V |
3.2mm x 2.5mm x 0.9mm |
2.25 V |
70 Cel |
-20 Cel |
NICKEL PALLADIUM GOLD |
135 MHz |
52/48 |
STANDBY; ENABLE/DISABLE FUNCTION; DIFFERENTIAL OUTPUT; TUBE |
e4 |
||||||||||||||||
|
Microchip Technology |
LVDS |
SURFACE MOUNT |
6 |
25 % |
NO |
PLASTIC/EPOXY |
3.6 V |
100 OHM |
.095 mA |
SOLCC6,.1,41 |
3.2mm x 2.5mm x 0.85mm |
2.25 V |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
125 MHz |
52/48 |
STANDBY; ENABLE/DISABLE FUNCTION; DIFFERENTIAL OUTPUT |
e4 |
||||||||||||||
|
Microchip Technology |
LVDS |
SURFACE MOUNT |
6 |
25 % |
NO |
3.63 V |
100 OHM |
3.2mm x 2.5mm x 0.9mm |
2.25 V |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
133.33 MHz |
52/48 |
STANDBY; ENABLE/DISABLE FUNCTION; DIFFERENTIAL OUTPUT; TUBE |
e4 |
|||||||||||||||||
|
Microchip Technology |
LVDS |
SURFACE MOUNT |
6 |
25 % |
NO |
3.63 V |
100 OHM |
3.2mm x 2.5mm x 0.9mm |
2.25 V |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
156.25 MHz |
52/48 |
STANDBY; ENABLE/DISABLE FUNCTION; DIFFERENTIAL OUTPUT; TUBE |
e4 |
|||||||||||||||||
|
Microchip Technology |
LVDS |
SURFACE MOUNT |
10 % |
NO |
3.6 V |
100 OHM |
3.2mm x 2.5mm x 0.85mm |
2.25 V |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
16 MHz |
52/48 |
STANDBY; ENABLE/DISABLE FUNCTION; DIFFERENTIAL OUTPUT; TR |
e4 |
||||||||||||||||||
|
Microchip Technology |
LVDS |
SURFACE MOUNT |
6 |
10 % |
NO |
3.63 V |
100 OHM |
3.2mm x 2.5mm x 0.9mm |
2.25 V |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
224.82 MHz |
52/48 |
STANDBY; ENABLE/DISABLE FUNCTION; DIFFERENTIAL OUTPUT; TUBE |
e4 |
|||||||||||||||||
|
Microchip Technology |
LVDS |
SURFACE MOUNT |
6 |
10 % |
NO |
3.63 V |
100 OHM |
3.2mm x 2.5mm x 0.9mm |
2.25 V |
105 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
106.25 MHz |
52/48 |
STANDBY; ENABLE/DISABLE FUNCTION; DIFFERENTIAL OUTPUT; TUBE |
e4 |
|||||||||||||||||
|
Microchip Technology |
LVDS |
SURFACE MOUNT |
10 % |
NO |
3.6 V |
100 OHM |
3.2mm x 2.5mm x 0.85mm |
2.25 V |
105 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
106.25 MHz |
52/48 |
STANDBY; ENABLE/DISABLE FUNCTION; DIFFERENTIAL OUTPUT; TR |
e4 |
||||||||||||||||||
|
Microchip Technology |
LVDS |
SURFACE MOUNT |
25 % |
NO |
3.6 V |
100 OHM |
2.5mm x 2.0mm x 0.85mm |
2.25 V |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
148.5 MHz |
52/48 |
STANDBY; ENABLE/DISABLE FUNCTION; DIFFERENTIAL OUTPUT; TR |
e4 |
||||||||||||||||||
|
Microchip Technology |
LVDS |
SURFACE MOUNT |
25 % |
NO |
3.6 V |
100 OHM |
2.5mm x 2.0mm x 0.85mm |
2.25 V |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
200 MHz |
52/48 |
STANDBY; ENABLE/DISABLE FUNCTION; DIFFERENTIAL OUTPUT; TUBE |
e4 |
||||||||||||||||||
|
Microchip Technology |
LVDS |
SURFACE MOUNT |
6 |
25 % |
NO |
3.63 V |
100 OHM |
2.5mm x 2.0mm x 0.9mm |
2.25 V |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
400 MHz |
52/48 |
STANDBY; ENABLE/DISABLE FUNCTION; DIFFERENTIAL OUTPUT; TR |
e4 |
|||||||||||||||||
|
Microchip Technology |
LVDS |
SURFACE MOUNT |
6 |
10 % |
NO |
3.63 V |
100 OHM |
2.5mm x 2.0mm x 0.9mm |
2.25 V |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
200 MHz |
52/48 |
STANDBY; ENABLE/DISABLE FUNCTION; DIFFERENTIAL OUTPUT; TUBE |
e4 |
|||||||||||||||||
|
Microchip Technology |
LVDS |
SURFACE MOUNT |
6 |
25 % |
NO |
3.63 V |
100 OHM |
2.5mm x 2.0mm x 0.9mm |
2.25 V |
105 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
135 MHz |
52/48 |
STANDBY; ENABLE/DISABLE FUNCTION; DIFFERENTIAL OUTPUT; TR |
e4 |
|||||||||||||||||
|
Microchip Technology |
LVDS |
SURFACE MOUNT |
6 |
25 % |
NO |
PLASTIC/EPOXY |
3.6 V |
100 OHM |
.095 mA |
DILCC6,.2 |
7.0mm x 5.0mm x 0.85mm |
2.25 V |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
125 MHz |
52/48 |
STANDBY; ENABLE/DISABLE FUNCTION; DIFFERENTIAL OUTPUT |
e4 |
||||||||||||||
|
Microchip Technology |
HCSL |
SURFACE MOUNT |
6 |
25 % |
NO |
3.6 V |
50 OHM, 2 pF |
.4 ms |
3.2mm x 2.5mm x 0.9mm |
2.25 V |
70 Cel |
-20 Cel |
MATTE TIN |
27 MHz |
52/48 |
STANDBY; ENABLE/DISABLE FUNCTION; COMPLEMENTARY OUTPUT; TR |
e3 |
||||||||||||||||
|
Microchip Technology |
HCSL |
SURFACE MOUNT |
6 |
25 % |
NO |
3.6 V |
50 OHM, 2 pF |
.4 ms |
3.2mm x 2.5mm x 0.9mm |
2.25 V |
85 Cel |
-40 Cel |
MATTE TIN |
27 MHz |
52/48 |
STANDBY; ENABLE/DISABLE FUNCTION; COMPLEMENTARY OUTPUT; TR |
e3 |
||||||||||||||||
|
Microchip Technology |
HCSL |
SURFACE MOUNT |
6 |
25 % |
NO |
PLASTIC/EPOXY |
3.6 V |
MIL-STD-883 |
50 OHM, 2 pF |
42 mA |
3.3 V |
SOLCC6,.1,41 |
.4 ms |
3.2mm x 2.5mm x 0.9mm |
2.25 V |
85 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
100 MHz |
52/48 |
STANDBY; ENABLE/DISABLE FUNCTION; COMPLEMENTARY OUTPUT |
e4 |
|||||||||||
|
Microchip Technology |
CMOS |
SURFACE MOUNT |
6 |
25 % |
NO |
3.6 V |
15 pF |
2 ms |
7.0mm x 5.0mm x 0.9mm |
2.25 V |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
13 MHz |
2 ns |
55/45 |
ENABLE/DISABLE FUNCTION; TUBE |
e4 |
|||||||||||||||
|
Microchip Technology |
CMOS |
SURFACE MOUNT |
6 |
10 % |
NO |
3.6 V |
15 pF |
2 ms |
7.0mm x 5.0mm x 0.9mm |
2.25 V |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
125.0032 MHz |
2 ns |
55/45 |
ENABLE/DISABLE FUNCTION; TUBE |
e4 |
|||||||||||||||
|
Microchip Technology |
CMOS |
SURFACE MOUNT |
6 |
10 % |
NO |
3.6 V |
15 pF |
2 ms |
7.0mm x 5.0mm x 0.9mm |
2.25 V |
105 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
112.24 MHz |
2 ns |
55/45 |
ENABLE/DISABLE FUNCTION; TUBE |
e4 |
Crystal Oscillator (XO) Clock Oscillators are electronic devices that generate a stable clock signal with a fixed frequency. They use a quartz crystal resonator as the frequency-determining element, which provides a stable and accurate frequency over a wide temperature range.
One of the main advantages of XO Clock Oscillators is their ability to generate a stable and precise clock signal with a fixed frequency. This makes them ideal for use in applications that require precise timing, such as in digital signal processing, telecommunications, and scientific research.
XO Clock Oscillators offer a low phase noise, which is important in applications that require a clean and stable clock signal. They are capable of generating frequencies ranging from a few kilohertz to several hundred megahertz, making them suitable for use in various electronic circuits.
Additionally, XO Clock Oscillators have a relatively simple design and are easy to integrate into electronic systems. They are available in a range of package sizes and configurations, allowing them to be used in various applications, including in communication systems, network equipment, and instrumentation.