Part | RoHS | Manufacturer | Oscillator Type | Mounting Feature | No. of Terminals | Frequency Stability | Frequency Adjustment (Mechanical) | Aging | Package Body Material | Maximum Supply Voltage | Technology | Screening Level | Output Load | Maximum Supply Current | Nominal Supply Voltage | Power Supplies (V) | Package Equivalence Code | Maximum Rise Time | Sub-Category | Physical Dimension | Minimum Supply Voltage | Maximum Operating Temperature | Minimum Operating Temperature | Terminal Finish | Nominal Operating Frequency | Maximum Fall Time | Maximum Symmetry (%) | Manufacturer Series | Qualification | Maximum Output Low Current | Additional Features | JESD-609 Code | Minimum Operating Frequency | Maximum Operating Frequency |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Renesas Electronics |
LVDS |
SURFACE MOUNT |
6 |
25 % |
NO |
3.465 V |
100 OHM |
100 mA |
3.3 V |
SOLCC6,.12 |
.4 ms |
5.0mm x 3.2mm x 1.1mm |
3.135 V |
85 Cel |
-40 Cel |
160.316 MHz |
.4 ns |
60/40 |
ENABLE/DISABLE FUNCTION; COMPLEMENTARY OUTPUT; DIFFERENTIAL OUTPUT |
|||||||||||||||
|
Euroquartz |
CMOS/LSTTL |
SURFACE MOUNT |
4 |
50 % |
NO |
3.465 V |
10 LS TTL, 15 pF |
3.3 V |
10 ms |
5.0mm x 3.2mm x 1.2mm |
3.135 V |
85 Cel |
-40 Cel |
Gold (Au) - with Nickel (Ni) barrier |
50 MHz |
10 ns |
TRI-STATE; ENABLE/DISABLE FUNCTION; 50 PF OPTIONAL LOAD AVAILABLE FOR 3.3V |
e4 |
|||||||||||||||
|
Silicon Labs |
CMOS |
SURFACE MOUNT |
25 % |
NO |
3.63 V |
15 pF |
3.3 V |
1.2 ms |
7.0mm x 5.0mm x 1.8mm |
2.97 V |
85 Cel |
-40 Cel |
Gold (Au) - with Nickel (Ni) barrier |
2.096 MHz |
1.2 ns |
52/48 |
TRI-STATE; ENABLE/DISABLE FUNCTION; TRAY |
e4 |
|||||||||||||||
|
Abracon |
CMOS |
SURFACE MOUNT |
4 |
50 % |
NO |
PLASTIC/EPOXY |
3.6 V |
10 KOHM, 15 pF |
10 mA |
3.3 V |
DILCC4,.08,65 |
2 ms |
2.5mm x 2mm x 0.85mm |
3 V |
85 Cel |
-40 Cel |
100 MHz |
2 ns |
55/45 |
TRI-STATE; STANDBY; ENABLE/DISABLE FUNCTION |
|||||||||||||
|
Abracon |
CMOS |
SURFACE MOUNT |
4 |
PLASTIC/EPOXY |
CMOS |
15 mA |
3.3 V |
1.8/3.3 |
DILCC4,.1,86 |
XO, Clock |
3.2mm x 2.5mm x 0.85mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
27 MHz |
Not Qualified |
e4 |
1 MHz |
150 MHz |
||||||||||||||
|
Abracon |
CMOS |
SURFACE MOUNT |
14 |
25 % |
NO |
PLASTIC/EPOXY |
3.6 V |
15 pF |
2.5/3.3 |
LCC14,.1X.12,20 |
2 ms |
XO, Clock |
3.2mm x 2.5mm x 0.85mm |
2.25 V |
85 Cel |
-40 Cel |
75 MHz |
2 ns |
55/45 |
ASEMDLC |
Not Qualified |
100 MHZ LVDS OUTPUT ALSO POSSIBLE; BY SELECTING FREQ SELECT BITS CAN SELECT O/P FREQ; TUBE |
10 MHz |
460 MHz |
|||||||||
|
Abracon |
LVDS |
SURFACE MOUNT |
6 |
PLASTIC/EPOXY |
CMOS |
32 mA |
2.5/3.3 |
SOLCC6,.12 |
XO, Clock |
5.0mm x 3.2mm x 0.85mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
148.5 MHz |
Not Qualified |
e4 |
10 MHz |
460 MHz |
|||||||||||||||
|
Abracon |
HCMOS/TTL |
SURFACE MOUNT |
4 |
20 % |
NO |
3.63 V |
10 TTL, 15 pF |
3.3 V |
4 ms |
7.0mm x 5.08mm x 1.8mm |
2.97 V |
70 Cel |
-20 Cel |
GOLD OVER NICKEL |
48 MHz |
4 ns |
40/60 |
TRI-STATE; ENABLE/DISABLE FUNCTION; TAPE AND REEL |
e4 |
||||||||||||||
|
Abracon |
LVDS |
SURFACE MOUNT |
6 |
25 % |
NO |
3.63 V |
100 OHM |
3.3 V |
LCC6,.1X.13,59/47 |
.4 ms |
3.2mm x 2.5mm x 1.0mm |
2.97 V |
85 Cel |
-40 Cel |
100 MHz |
.4 ns |
55/45 |
ENABLE/DISABLE FUNCTION; COMPLEMENTARY OUTPUT |
|||||||||||||||
|
Abracon |
HCSL |
SURFACE MOUNT |
6 |
25 % |
NO |
1.89 V |
50 OHM |
1.8 V |
LCC6,.1X.13,59/47 |
.6 ms |
3.2mm x 2.5mm x 1.0mm |
1.71 V |
85 Cel |
-40 Cel |
100 MHz |
.6 ns |
55/45 |
ENABLE/DISABLE FUNCTION; COMPLEMENTARY OUTPUT |
|||||||||||||||
|
Cts |
HCMOS/TTL |
SURFACE MOUNT |
4 |
50 % |
NO |
3.6 V |
10 TTL, 50 pF |
40 mA |
3.3 V |
DILCC4,.2,200 |
5 ms |
7.0mm x 5.0mm x 1.8mm |
3 V |
70 Cel |
-20 Cel |
Gold (Au) - with Nickel (Ni) barrier |
50 MHz |
5 ns |
55/45 |
8 Amp |
ENABLE/DISABLE FUNCTION |
e4 |
|||||||||||
|
Microchip Technology |
CMOS |
SURFACE MOUNT |
4 |
25 % |
NO |
10 KOHM, 15 pF |
3.3 V |
2 ms |
5.0mm x 3.2mm x 0.85mm |
105 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
50 MHz |
2 ns |
55/45 |
AEC-Q100; STANDBY; ENABLE/DISABLE FUNCTION; TR; 1.8 AND 2.5V SUPPLY VOLTAGE ALSO AVAILABLE |
e4 |
||||||||||||||||
|
Microchip Technology |
CMOS |
SURFACE MOUNT |
4 |
10 % |
NO |
10 KOHM, 15 pF |
3.3 V |
2 ms |
3.2mm x 2.5mm x 0.85mm |
105 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
12 MHz |
2 ns |
55/45 |
AEC-Q100; STANDBY; ENABLE/DISABLE FUNCTION; TR; 1.8 AND 2.5V SUPPLY VOLTAGE ALSO AVAILABLE |
e4 |
||||||||||||||||
|
Microchip Technology |
CMOS |
SURFACE MOUNT |
4 |
50 % |
NO |
10 KOHM, 15 pF |
3.3 V |
2 ms |
2.5mm x 2.0mm x 0.85mm |
105 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
33.3333 MHz |
2 ns |
55/45 |
AEC-Q100; STANDBY; ENABLE/DISABLE FUNCTION; TR; ALSO COMPATIBLE WITH 1.8 & 2.5V SUPPLY VOLTAGE |
e4 |
||||||||||||||||
|
Microchip Technology |
CMOS |
SURFACE MOUNT |
6 |
25 % |
NO |
3.6 V |
15 pF |
2 ms |
7.0mm x 5.0mm x 0.9mm |
2.25 V |
125 Cel |
-55 Cel |
NICKEL PALLADIUM GOLD |
25 MHz |
2 ns |
55/45 |
ENABLE/DISABLE FUNCTION; TUBE |
e4 |
|||||||||||||||
|
Microchip Technology |
LVDS |
SURFACE MOUNT |
10 % |
NO |
3.6 V |
100 OHM |
3.2mm x 2.5mm x 0.85mm |
2.25 V |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
100 MHz |
52/48 |
ENABLE/DISABLE FUNCTION; DIFFERENTIAL OUTPUT; TUBE |
e4 |
||||||||||||||||||
|
Ecs International |
LVDS |
SURFACE MOUNT |
6 |
50 % |
NO |
3.465 V |
100 OHM |
3.3 V |
.5 ms |
3.2mm x 2.5mm x 0.9mm |
3.135 V |
85 Cel |
-40 Cel |
Gold (Au) - with Nickel (Ni) barrier |
27 MHz |
.5 ns |
45/55 |
ENABLE/DISABLE FUNCTION; COMPLEMENTRAY OUTPUT; TR |
e4 |
||||||||||||||
|
Abracon |
HCMOS |
SURFACE MOUNT |
4 |
50 % |
NO |
3.465 V |
15 pF |
13 mA |
3.3 V |
LCC4,.08X.1,63/48 |
10 ms |
2.5mm x 2.0mm x 1.0mm |
3.135 V |
85 Cel |
-40 Cel |
GOLD OVER NICKEL |
25 MHz |
10 ns |
55/45 |
ENABLE/DISABLE FUNCTION |
e4 |
||||||||||||
|
Seiko Epson |
CMOS |
SURFACE MOUNT |
4 |
50 % |
NO |
3.63 V |
15 pF |
8.1 mA |
3.3 V |
DILCC4,.2,200 |
6 ms |
7.0mm x 5.0mm x 1.3mm |
2.7 V |
105 Cel |
-40 Cel |
GOLD OVER NICKEL |
40 MHz |
6 ns |
55/45 |
5 Amp |
ENABLE/DISABLE FUNCTION; OTHER SUPPLY VOLTAGE 1.8 AND 2.5V ALSO AVAILABLE |
e4 |
|||||||||||
|
Seiko Epson |
CMOS |
SURFACE MOUNT |
4 |
50 % |
NO |
3.63 V |
15 pF |
3.3 V |
DILCC4,.2,200 |
6 ms |
7.0mm x 5.0mm x 1.3mm |
2.7 V |
105 Cel |
-40 Cel |
GOLD OVER NICKEL |
4 MHz |
6 ns |
55/45 |
3 Amp |
ENABLE/DISABLE FUNCTION; OTHER SUPPLY VOLTAGE 1.8 AND 2.5V ALSO AVAILABLE |
e4 |
||||||||||||
|
Seiko Epson |
CMOS |
SURFACE MOUNT |
50 % |
NO |
3.6 V |
15 pF |
4 ms |
5.0mm x 3.2mm x 1.1mm |
1.6 V |
85 Cel |
-40 Cel |
GOLD OVER NICKEL |
12 MHz |
4 ns |
55/45 |
STANDBY; ENABLE/DISABLE FUNCTION; TR |
e4 |
||||||||||||||||
|
Sitime |
LVCMOS |
SURFACE MOUNT |
20 % |
NO |
3.63 V |
15 pF |
3.3 V |
2 ms |
2.5mm x 2.0mm x 0.75mm |
2.97 V |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
2.097152 MHz |
2 ns |
55/45 |
ENABLE/DISABLE FUNCTION; HCMOS COMPATIBLE OUTPUT ALSO AVAILABLE |
e4 |
|||||||||||||||
|
Sitime |
LVPECL |
SURFACE MOUNT |
6 |
20 % |
NO |
1.89 V |
MIL-STD-883F |
50 OHM |
1.8 V |
SOLCC6,.06,28 |
.2 ms |
2mm x 1.6mm x 0.8mm |
1.71 V |
105 Cel |
-40 Cel |
100 MHz |
.2 ns |
52/48 |
ENABLE/DISABLE FUNCTION |
||||||||||||||
|
Silicon Labs |
LVPECL |
SURFACE MOUNT |
6 |
50 % |
NO |
3.63 V |
50 OHM |
121 mA |
3.3 V |
3.3 |
DILCC6,.2 |
.35 ms |
Other Oscillators |
7.0mm x 5.0mm x 1.8mm |
2.97 V |
85 Cel |
-40 Cel |
Gold (Au) - with Nickel (Ni) barrier |
312.5 MHz |
.35 ns |
55/45 |
Not Qualified |
32 Amp |
TRI-STATE; ENABLE/DISABLE FUNCTION; COMPLEMENTARY OUTPUT |
e4 |
||||||||
|
Silicon Labs |
SURFACE MOUNT |
6 |
PLASTIC/EPOXY |
121 mA |
2.5 V |
2.5 |
DILCC6,.2 |
Other Oscillators |
85 Cel |
-40 Cel |
Gold (Au) - with Nickel (Ni) barrier |
121.109 MHz |
Not Qualified |
e4 |
10 MHz |
945 MHz |
|||||||||||||||||
|
Silicon Labs |
LVPECL |
SURFACE MOUNT |
6 |
PLASTIC/EPOXY |
121 mA |
2.5 V |
2.5 |
DILCC6,.2 |
Other Oscillators |
7.0mm x 5.0mm x 1.8mm |
85 Cel |
-40 Cel |
Gold (Au) - with Nickel (Ni) barrier |
121.109 MHz |
Not Qualified |
e4 |
10 MHz |
945 MHz |
|||||||||||||||
|
Silicon Labs |
LVPECL |
SURFACE MOUNT |
6 |
50 % |
NO |
PLASTIC/EPOXY |
3.63 V |
121 mA |
3.3 V |
3.3 |
DILCC6,.2 |
.35 ms |
Other Oscillators |
7.0mm x 5.0mm x 1.85mm |
2.97 V |
85 Cel |
-40 Cel |
Gold (Au) - with Nickel (Ni) barrier |
250 MHz |
.35 ns |
55/45 |
531 |
Not Qualified |
TAPE AND REEL |
e4 |
10 MHz |
945 MHz |
||||||
|
Silicon Labs |
|||||||||||||||||||||||||||||||||
|
Silicon Labs |
|||||||||||||||||||||||||||||||||
|
Silicon Labs |
LVPECL |
SURFACE MOUNT |
6 |
7 % |
NO |
2.75 V |
2.5 V |
.35 ms |
7.0mm x 5.0mm x 1.85mm |
2.25 V |
85 Cel |
-40 Cel |
Gold (Au) - with Nickel (Ni) barrier |
100 MHz |
.35 ns |
55/45 |
TRAY |
e4 |
|||||||||||||||
|
Silicon Labs |
LVPECL |
SURFACE MOUNT |
6 |
7 % |
NO |
2.75 V |
2.5 V |
.35 ms |
7.0mm x 5.0mm x 1.85mm |
2.25 V |
85 Cel |
-40 Cel |
Gold (Au) - with Nickel (Ni) barrier |
100 MHz |
.35 ns |
55/45 |
TAPE AND REEL |
e4 |
|||||||||||||||
|
Cts |
HCMOS |
SURFACE MOUNT |
50 % |
NO |
3.63 V |
15 pF |
3.3 V |
3 ms |
3.2mm x 2.5mm x 1.0mm |
2.97 V |
85 Cel |
-40 Cel |
GOLD OVER NICKEL |
8 MHz |
3 ns |
55/45 |
ENABLE/DISABLE FUNCTION; TR, 7 INCH |
e4 |
|||||||||||||||
|
Txc |
CMOS |
SURFACE MOUNT |
4 |
30 % |
NO |
3.63 V |
15 pF |
3.3 V |
3 ms |
5.0mm x 3.2mm x 1.2mm |
2.97 V |
70 Cel |
-10 Cel |
GOLD OVER NICKEL |
24 MHz |
3 ns |
55/45 |
ENABLE/DISABLE FUNCTION; TAPE AND REEL |
e4 |
||||||||||||||
|
Txc |
CMOS |
SURFACE MOUNT |
4 |
50 % |
NO |
CERAMIC |
2.75 V |
15 pF |
3 mA |
2.5 V |
2.5 |
LCC4,.09X.12,79/60 |
200 ms |
Other Oscillators |
3.2mm x 2.5mm x 1.0mm |
2.25 V |
85 Cel |
-40 Cel |
.032768 MHz |
200 ns |
55/45 |
Not Qualified |
TRI-STATE; ENABLE/DISABLE FUNCTION |
||||||||||
|
Wurth Elektronik |
CMOS |
SURFACE MOUNT |
4 |
50 % |
NO |
CERAMIC |
3.6 V |
15 pF |
20 mA |
3.3 V |
DILCC4,.13 |
10 ms |
5.2mm x 3.4mm x 1.3mm |
3 V |
85 Cel |
-40 Cel |
GOLD OVER NICKEL |
25 MHz |
10 ns |
40/60 |
ENABLE/DISABLE FUNCTION |
e4 |
|||||||||||
|
Abracon |
CMOS |
SURFACE MOUNT |
4 |
100 % |
NO |
2.625 V |
15 pF |
15 mA |
2.5 V |
DILCC4,.1,83 |
5 ms |
3.2mm x 2.5mm x 1.2mm |
2.375 V |
70 Cel |
-20 Cel |
40 MHz |
5 ns |
55/45 |
TRI-STATE; ENABLE/DISABLE FUNCTION |
||||||||||||||
|
Abracon |
LVCMOS |
SURFACE MOUNT |
75 % |
NO |
3.63 V |
15 pF |
200 ms |
1.54mm x 0.84mm x 0.6mm |
1.2 V |
70 Cel |
-10 Cel |
.032768 MHz |
200 ns |
52/48 |
ENABLE/DISABLE FUNCTION; TR, 7 INCH |
||||||||||||||||||
|
Cts |
HCMOS/TTL |
SURFACE MOUNT |
50 % |
NO |
5.5 V |
50 pF |
5 V |
10 ms |
7.0mm x 5.0mm x 1.8mm |
4.5 V |
85 Cel |
-40 Cel |
Gold (Au) - with Nickel (Ni) barrier |
1.8432 MHz |
10 ns |
55/45 |
ENABLE/DISABLE FUNCTION |
e4 |
|||||||||||||||
|
Microchip Technology |
CMOS |
SURFACE MOUNT |
4 |
10 % |
NO |
10 KOHM, 15 pF |
3.3 V |
2 ms |
3.2mm x 2.5mm x 0.85mm |
105 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
25 MHz |
2 ns |
55/45 |
AEC-Q100; STANDBY; ENABLE/DISABLE FUNCTION; TR; 1.8 AND 2.5V SUPPLY VOLTAGE ALSO AVAILABLE |
e4 |
||||||||||||||||
|
Ecs International |
HCMOS/TTL |
THROUGH HOLE MOUNT |
8 |
100 % |
NO |
METAL |
5.25 V |
10 TTL, 50 pF |
25 mA |
5 V |
DIP4/8,.3 |
5 ms |
13.2mm x 13.2mm x 6.2mm |
4.75 V |
70 Cel |
0 Cel |
4.9 MHz |
5 ns |
55/45 |
16 Amp |
|||||||||||||
|
Diodes Incorporated |
CMOS |
SURFACE MOUNT |
4 |
NO |
CERAMIC |
3.63 V |
CMOS |
15 pF |
55 mA |
3.3 V |
3.3 |
DILCC4,.12 |
7 ms |
Other Oscillators |
5.0mm x 3.2mm x 1.3mm |
2.97 V |
85 Cel |
-40 Cel |
25 MHz |
7 ns |
55/45 |
Not Qualified |
STANDBY; ENABLE/DISABLE FUNCTION; TR |
1.8432 MHz |
125 MHz |
||||||||
|
Diodes Incorporated |
CMOS |
SURFACE MOUNT |
4 |
NO |
CERAMIC |
3.63 V |
CMOS |
15 pF |
55 mA |
3.3 V |
3.3 |
DILCC4,.12 |
Other Oscillators |
5.0mm x 3.2mm x 1.3mm |
2.97 V |
85 Cel |
-40 Cel |
125 MHz |
55/45 |
Not Qualified |
STANDBY; ENABLE/DISABLE FUNCTION; TR |
1.8432 MHz |
125 MHz |
||||||||||
|
Diodes Incorporated |
CMOS |
SURFACE MOUNT |
4 |
NO |
CERAMIC |
2.75 V |
CMOS |
15 pF |
10 mA |
2.5 V |
3.3 |
LCC4,.09X.12,86/63 |
5 ms |
Other Oscillators |
3.2mm x 2.5mm x 1.0mm |
2.25 V |
85 Cel |
-40 Cel |
5 MHz |
5 ns |
55/45 |
Not Qualified |
4 Amp |
STANDBY; ENABLE/DISABLE FUNCTION; TR |
1.8432 MHz |
106.25 MHz |
|||||||
|
Diodes Incorporated |
CMOS |
SURFACE MOUNT |
4 |
NO |
2.75 V |
15 pF |
2.5 V |
5 ms |
3.2mm x 2.5mm x 1.0mm |
2.25 V |
50 MHz |
5 ns |
55/45 |
STANDBY; ENABLE/DISABLE FUNCTION; TR |
|||||||||||||||||||
|
Diodes Incorporated |
CMOS |
SURFACE MOUNT |
4 |
NO |
2.75 V |
15 pF |
2.5 V |
5 ms |
3.2mm x 2.5mm x 1.0mm |
2.25 V |
5 ns |
55/45 |
STANDBY; ENABLE/DISABLE FUNCTION; TR |
||||||||||||||||||||
|
Diodes Incorporated |
CMOS |
SURFACE MOUNT |
4 |
NO |
CERAMIC |
3.63 V |
10 LS TTL, 15 pF |
55 mA |
3.3 V |
3.3 |
DILCC4,.2,200 |
7 ms |
Other Oscillators |
7.0mm x 5.0mm x 1.8mm |
2.97 V |
85 Cel |
-40 Cel |
1 MHz |
7 ns |
Not Qualified |
STANDBY; ENABLE/DISABLE FUNCTION; TR |
1 MHz |
166 MHz |
||||||||||
|
Diodes Incorporated |
CMOS |
SURFACE MOUNT |
NO |
3.63 V |
10 LS TTL, 15 pF |
3.3 V |
7 ms |
7.0mm x 5.0mm x 1.8mm |
2.97 V |
1.8 MHz |
7 ns |
STANDBY; ENABLE/DISABLE FUNCTION; TR |
|||||||||||||||||||||
|
Diodes Incorporated |
CMOS |
SURFACE MOUNT |
4 |
NO |
CERAMIC |
3.63 V |
10 LS TTL, 15 pF |
55 mA |
3.3 V |
3.3 |
DILCC4,.2,200 |
7 ms |
Other Oscillators |
7.0mm x 5.0mm x 1.8mm |
2.97 V |
85 Cel |
-40 Cel |
14.3 MHz |
7 ns |
Not Qualified |
STANDBY; ENABLE/DISABLE FUNCTION; TR |
1 MHz |
166 MHz |
Crystal Oscillator (XO) Clock Oscillators are electronic devices that generate a stable clock signal with a fixed frequency. They use a quartz crystal resonator as the frequency-determining element, which provides a stable and accurate frequency over a wide temperature range.
One of the main advantages of XO Clock Oscillators is their ability to generate a stable and precise clock signal with a fixed frequency. This makes them ideal for use in applications that require precise timing, such as in digital signal processing, telecommunications, and scientific research.
XO Clock Oscillators offer a low phase noise, which is important in applications that require a clean and stable clock signal. They are capable of generating frequencies ranging from a few kilohertz to several hundred megahertz, making them suitable for use in various electronic circuits.
Additionally, XO Clock Oscillators have a relatively simple design and are easy to integrate into electronic systems. They are available in a range of package sizes and configurations, allowing them to be used in various applications, including in communication systems, network equipment, and instrumentation.