Part | RoHS | Manufacturer | Oscillator Type | Mounting Feature | No. of Terminals | Frequency Stability | Frequency Adjustment (Mechanical) | Aging | Package Body Material | Maximum Supply Voltage | Technology | Screening Level | Output Load | Maximum Supply Current | Nominal Supply Voltage | Power Supplies (V) | Package Equivalence Code | Maximum Rise Time | Sub-Category | Physical Dimension | Minimum Supply Voltage | Maximum Operating Temperature | Minimum Operating Temperature | Terminal Finish | Nominal Operating Frequency | Maximum Fall Time | Maximum Symmetry (%) | Manufacturer Series | Qualification | Maximum Output Low Current | Additional Features | JESD-609 Code | Minimum Operating Frequency | Maximum Operating Frequency |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Abracon |
CMOS |
SURFACE MOUNT |
4 |
10 % |
NO |
15 pF |
3.3 V |
2 ms |
3.2mm x 2.5mm x 0.85mm |
105 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
1 MHz |
2 ns |
55/45 |
STANDBY; TRI-STATE; ENABLE/DISABLE FUNCTION; TR, 7 INCH |
e4 |
||||||||||||||||
|
Abracon |
CMOS |
SURFACE MOUNT |
4 |
10 % |
NO |
15 pF |
3.3 V |
2 ms |
3.2mm x 2.5mm x 0.85mm |
105 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
10 MHz |
2 ns |
55/45 |
TRI-STATE; STAND-BY; ENABLE/DISABLE FUNCTION; SUPPLY VOLT 1.8,2.5 V ALSO AVAILABLE; TAPE AND REEL |
e4 |
||||||||||||||||
|
Abracon |
CMOS |
SURFACE MOUNT |
4 |
PLASTIC/EPOXY |
CMOS |
15 mA |
3.3 V |
1.8/3.3 |
DILCC4,.1,86 |
XO, Clock |
3.2mm x 2.5mm x 0.85mm |
105 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
16 MHz |
Not Qualified |
e4 |
1 MHz |
150 MHz |
||||||||||||||
|
Abracon |
CMOS |
SURFACE MOUNT |
4 |
10 % |
NO |
10 KOHM, 15 pF |
3.3 V |
2 ms |
3.2mm x 2.5mm x 0.85mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
19.2 MHz |
2 ns |
55/45 |
TRI-STATE; STAND-BY; TAPE AND REEL; SUPPLY VOLTAGE 1.8V AND 2.5V ALSO AVAILLABLE |
e4 |
||||||||||||||||
|
Abracon |
CMOS |
SURFACE MOUNT |
4 |
10 % |
NO |
PLASTIC/EPOXY |
CMOS |
15 pF |
15 mA |
3.3 V |
1.8/3.3 |
DILCC4,.12 |
2 ms |
XO, Clock |
5.0mm x 3.2mm x 0.85mm |
105 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
120 MHz |
2 ns |
55/45 |
Not Qualified |
TRI-STATE; STANDBY; TAPE AND REEL; SUPPLY VOLTAGE 1.8V AND 2.5V ALSO AVAILLABLE |
e4 |
1 MHz |
150 MHz |
|||||||
|
Abracon |
CMOS |
SURFACE MOUNT |
4 |
10 % |
NO |
PLASTIC/EPOXY |
CMOS |
15 pF |
15 mA |
3.3 V |
1.8/3.3 |
DILCC4,.12 |
2 ms |
XO, Clock |
5.0mm x 3.2mm x 0.85mm |
105 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
33 MHz |
2 ns |
55/45 |
Not Qualified |
TRI-STATE; STANDBY; TAPE AND REEL; SUPPLY VOLTAGE 1.8V AND 2.5V ALSO AVAILLABLE |
e4 |
1 MHz |
150 MHz |
|||||||
|
Abracon |
CMOS |
SURFACE MOUNT |
4 |
25 % |
NO |
PLASTIC/EPOXY |
CMOS |
15 pF |
15 mA |
3.3 V |
1.8/3.3 |
DILCC4,.12 |
2 ms |
XO, Clock |
5.0mm x 3.2mm x 0.85mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
50 MHz |
2 ns |
55/45 |
Not Qualified |
TRI-STATE; STANDBY; TAPE AND REEL; SUPPLY VOLTAGE 1.8V AND 2.5V ALSO AVAILLABLE |
e4 |
1 MHz |
150 MHz |
|||||||
|
Abracon |
CMOS |
SURFACE MOUNT |
4 |
10 % |
NO |
15 pF |
3.3 V |
2 ms |
5.0mm x 3.2mm x 0.85mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
72 MHz |
2 ns |
55/45 |
TRI-STATE; STANDBY; TAPE AND REEL; SUPPLY VOLTAGE 1.8V AND 2.5V ALSO AVAILLABLE |
e4 |
||||||||||||||||
|
Abracon |
CMOS |
SURFACE MOUNT |
4 |
PLASTIC/EPOXY |
CMOS |
15 mA |
1.8/3.3 |
DILCC4,.12 |
XO, Clock |
5.0mm x 3.2mm x 0.85mm |
85 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
80 MHz |
Not Qualified |
e4 |
1 MHz |
150 MHz |
|||||||||||||||
|
Abracon |
CMOS |
SURFACE MOUNT |
6 |
PLASTIC/EPOXY |
CMOS |
2.5/3.3 |
SOLCC6,.12 |
XO, Clock |
5.0mm x 3.2mm x 0.85mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
10 MHz |
Not Qualified |
6 Amp |
e4 |
10 MHz |
170 MHz |
|||||||||||||||
|
Abracon |
LVPECL |
SURFACE MOUNT |
6 |
25 % |
NO |
3.63 V |
50 OHM |
3.3 V |
LCC6,.1X.13,59/47 |
.4 ms |
3.2mm x 2.5mm x 1.0mm |
2.97 V |
85 Cel |
-40 Cel |
156.25 MHz |
.4 ns |
55/45 |
ENABLE/DISABLE FUNCTION; COMPLEMENTARY OUTPUT |
|||||||||||||||
|
Abracon |
LVPECL |
SURFACE MOUNT |
25 % |
NO |
2.75 V |
50 OHM |
2.5 V |
.35 ms |
7.0mm x 5.0mm x 1.8mm |
2.25 V |
85 Cel |
-40 Cel |
200 MHz |
.35 ns |
55/45 |
ENABLE/DISABLE FUNCTION; COMPLEMENTARY OUTPUT; TAPE |
|||||||||||||||||
|
Cts |
HCMOS/TTL |
SURFACE MOUNT |
4 |
50 % |
NO |
5.5 V |
50 pF |
50 mA |
5 V |
DILCC4,.2,200 |
8 ms |
7.0mm x 5.0mm x 1.8mm |
4.5 V |
85 Cel |
-40 Cel |
Gold (Au) - with Nickel (Ni) barrier |
25 MHz |
8 ns |
55/45 |
16 Amp |
ENABLE/DISABLE FUNCTION |
e4 |
|||||||||||
|
Cts |
HCMOS/TTL |
SURFACE MOUNT |
4 |
50 % |
NO |
CERAMIC |
3.6 V |
50 pF |
60 mA |
3.3 V |
3.3 |
DILCC4,.2,200 |
5 ms |
Other Oscillators |
7.0mm x 5.0mm x 1.7mm |
3 V |
85 Cel |
-40 Cel |
GOLD OVER NICKEL |
30 MHz |
5 ns |
55/45 |
CB3LV |
Not Qualified |
ENABLE/DISABLE FUNCTION; TAPE AND REEL |
e4 |
1.5 MHz |
160 MHz |
|||||
|
Microchip Technology |
CMOS |
SURFACE MOUNT |
4 |
50 % |
NO |
10 KOHM, 15 pF |
3.3 V |
2 ms |
7.0mm x 5.0mm x 0.85mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
25 MHz |
2 ns |
55/45 |
AEC-Q100; STANDBY; ENABLE/DISABLE FUNCTION; TR; 1.8 AND 2.5V SUPPLY VOLTAGE ALSO AVAILABLE |
e4 |
||||||||||||||||
Microchip Technology |
CMOS |
SURFACE MOUNT |
4 |
25 % |
NO |
10 KOHM, 15 pF |
3.3 V |
2 ms |
3.2mm x 2.5mm x 0.85mm |
70 Cel |
-20 Cel |
10 MHz |
2 ns |
55/45 |
AEC-Q100; STANDBY; ENABLE/DISABLE FUNCTION; TUBE; SUPPLY VOLTAGE OF 1.8V & 2.5V ALSO AVAILABLE |
|||||||||||||||||||
Microchip Technology |
CMOS |
SURFACE MOUNT |
4 |
25 % |
NO |
10 KOHM, 15 pF |
3.3 V |
2 ms |
3.2mm x 2.5mm x 0.85mm |
70 Cel |
-20 Cel |
10 MHz |
2 ns |
55/45 |
AEC-Q100; STANDBY; ENABLE/DISABLE FUNCTION; TR; SUPPLY VOLTAGE OF 1.8V & 2.5V ALSO AVAILABLE |
|||||||||||||||||||
|
Microchip Technology |
CMOS |
SURFACE MOUNT |
4 |
10 % |
NO |
10 KOHM, 15 pF |
3.3 V |
2 ms |
2.5mm x 2.0mm x 0.85mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
100 MHz |
2 ns |
55/45 |
AEC-Q100; STANDBY; ENABLE/DISABLE FUNCTION; TUBE |
e4 |
||||||||||||||||
|
Microchip Technology |
CMOS |
SURFACE MOUNT |
4 |
25 % |
NO |
10 KOHM, 15 pF |
3.3 V |
2 ms |
7.0mm x 5.0mm x 0.85mm |
70 Cel |
-20 Cel |
NICKEL PALLADIUM GOLD |
10 MHz |
2 ns |
55/45 |
AEC-Q100; STANDBY; ENABLE/DISABLE FUNCTION; TUBE; SUPPLY VOLTAGE OF 1.8V & 2.5V ALSO AVAILABLE |
e4 |
||||||||||||||||
|
Microchip Technology |
CMOS |
SURFACE MOUNT |
4 |
25 % |
NO |
10 KOHM, 15 pF |
3.3 V |
2 ms |
7.0mm x 5.0mm x 0.85mm |
70 Cel |
-20 Cel |
NICKEL PALLADIUM GOLD |
10 MHz |
2 ns |
55/45 |
AEC-Q100; STANDBY; ENABLE/DISABLE FUNCTION; TR; SUPPLY VOLTAGE OF 1.8V & 2.5V ALSO AVAILABLE |
e4 |
||||||||||||||||
|
Microchip Technology |
CMOS |
SURFACE MOUNT |
6 |
10 % |
NO |
3.6 V |
15 pF |
2 ms |
2.5mm x 2.0mm x 0.9mm |
2.25 V |
105 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
20 MHz |
2 ns |
55/45 |
STANDBY; ENABLE/DISABLE FUNCTION; TR |
e4 |
|||||||||||||||
|
Microchip Technology |
LVDS |
SURFACE MOUNT |
25 % |
NO |
3.6 V |
100 OHM |
3.2mm x 2.5mm x 0.85mm |
2.25 V |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
148.5 MHz |
52/48 |
STANDBY; ENABLE/DISABLE FUNCTION; DIFFERENTIAL OUTPUT; TR |
e4 |
||||||||||||||||||
|
Microchip Technology |
LVDS |
SURFACE MOUNT |
10 % |
NO |
3.6 V |
100 OHM |
3.2mm x 2.5mm x 0.85mm |
2.25 V |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
45 MHz |
52/48 |
STANDBY; ENABLE/DISABLE FUNCTION; DIFFERENTIAL OUTPUT; TUBE |
e4 |
||||||||||||||||||
|
Microchip Technology |
LVDS |
SURFACE MOUNT |
10 % |
NO |
3.6 V |
100 OHM |
3.2mm x 2.5mm x 0.85mm |
2.25 V |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
300 MHz |
52/48 |
STANDBY; ENABLE/DISABLE FUNCTION; DIFFERENTIAL OUTPUT; TUBE |
e4 |
||||||||||||||||||
|
Microchip Technology |
CMOS |
SURFACE MOUNT |
6 |
50 % |
NO |
3.6 V |
15 pF |
2 ms |
3.2mm x 2.5mm x 0.9mm |
2.25 V |
125 Cel |
-55 Cel |
NICKEL PALLADIUM GOLD |
16 MHz |
2 ns |
55/45 |
ENABLE/DISABLE FUNCTION; TUBE |
e4 |
|||||||||||||||
|
Microchip Technology |
CMOS |
SURFACE MOUNT |
4 |
10 % |
NO |
10 KOHM, 15 pF |
1.8 V |
3 ms |
7.0mm x 5.0mm x 0.85mm |
105 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
3 ns |
55/45 |
STANDBY; ENABLE/DISABLE FUNCTION; 2.5V 3.3V ARE AVAILABLE; TUBE |
e4 |
1 MHz |
150 MHz |
|||||||||||||||
|
Micrel |
CMOS |
DSC8101 |
|||||||||||||||||||||||||||||||
|
Ecs International |
HCMOS |
SURFACE MOUNT |
4 |
25 % |
NO |
CERAMIC |
3.63 V |
15 pF |
SOLCC4,.05,40 |
4.5 ms |
1.6mm x 1.2mm x 0.6mm |
1.6 V |
85 Cel |
-40 Cel |
24 MHz |
4.5 ns |
45/55 |
STANDBY; TRI-STATE; ENABLE/DISABLE FUNCTION |
|||||||||||||||
|
Ecs International |
HCMOS |
SURFACE MOUNT |
4 |
50 % |
NO |
CERAMIC |
3.6 V |
HCMOS |
15 pF |
7 mA |
LCC4,.08X.1,68/52 |
7 ms |
2.5mm x 2mm x 0.8mm |
1.6 V |
85 Cel |
-40 Cel |
Gold (Au) - with Nickel (Ni) barrier |
25 MHz |
7 ns |
45/55 |
TRI-STATE; ENABLE/DISABLE FIUNCTION |
e4 |
|||||||||||
|
Ecs International |
CMOS |
SURFACE MOUNT |
4 |
25 % |
NO |
CERAMIC |
3.63 V |
15 pF |
4 mA |
LCC4,.1X.12,83/65 |
7 ms |
3.2mm x 2.5mm x 1.2mm |
1.62 V |
85 Cel |
-40 Cel |
Gold (Au) |
25 MHz |
7 ns |
45/55 |
TRI-STATE; ENABLE/DISABLE FUNCTION |
e4 |
||||||||||||
|
Ecs International |
HCMOS |
SURFACE MOUNT |
4 |
100 % |
NO |
CERAMIC |
5.5 V |
30 pF |
25 mA |
5 V |
5 |
DILCC4,.2,200 |
10 ms |
Other Oscillators |
7.0mm x 5.0mm x 1.7mm |
4.5 V |
125 Cel |
-55 Cel |
GOLD OVER NICKEL |
20 MHz |
10 ns |
60/40 |
Not Qualified |
TR |
e4 |
1 MHz |
106.25 MHz |
||||||
|
Diodes Incorporated |
CMOS |
SURFACE MOUNT |
4 |
NO |
CERAMIC |
3.63 V |
15 pF |
45 mA |
3.3 V |
3.3 |
DILCC4,.12 |
Other Oscillators |
5.0mm x 3.2mm x 1.3mm |
2.97 V |
70 Cel |
-20 Cel |
100 MHz |
55/45 |
Not Qualified |
STANDBY; ENABLE/DISABLE FUNCTION; TR |
1 MHz |
133 MHz |
|||||||||||
|
Diodes Incorporated |
CMOS |
SURFACE MOUNT |
4 |
50 % |
NO |
CERAMIC |
3.63 V |
15 pF |
15 mA |
3.3 V |
3.3 |
DILCC4,.2,200 |
7 ms |
Other Oscillators |
7.0mm x 5.0mm x 1.4mm |
2.97 V |
70 Cel |
-20 Cel |
GOLD |
2.048 MHz |
7 ns |
55/45 |
FNGEPO002 |
Not Qualified |
ENABLE/DISABLE FUNCTION; TAPE AND REEL |
e4 |
|||||||
|
Renesas Electronics |
HCMOS |
SURFACE MOUNT |
25 % |
NO |
3.465 V |
15 pF |
3.3 V |
3 ms |
5.15mm x 3.35mm x 1.4mm |
3.135 V |
85 Cel |
-40 Cel |
Gold (Au) - with Nickel (Ni) barrier |
16.384 MHz |
3 ns |
55/45 |
TRI-STATE; ENABLE/DISABLE FUNCTION; TR, 7/10 INCH |
e4 |
|||||||||||||||
|
Renesas Electronics |
HCMOS |
SURFACE MOUNT |
6 |
25 % |
NO |
3.465 V |
15 pF |
3.3 V |
3 ms |
7.5mm x 5.2mm x 1.4mm |
3.135 V |
85 Cel |
-40 Cel |
Gold (Au) - with Nickel (Ni) barrier |
10 MHz |
3 ns |
55/45 |
TRI-STATE; ENABLE/DISABLE FUNCTION; TAPE AND REEL |
e4 |
||||||||||||||
|
Abracon |
CMOS |
SURFACE MOUNT |
4 |
50 % |
NO |
CERAMIC |
3.465 V |
15 pF |
20 mA |
3.3 V |
LCC4,.09X.12,86/69 |
6 ms |
3.2mm x 2.5mm x 1.2mm |
3.135 V |
85 Cel |
-40 Cel |
8 MHz |
6 ns |
55/45 |
TRI-STATE; ENABLE/DISABLE FUNCTION |
|||||||||||||
|
Diodes Incorporated |
CMOS |
SURFACE MOUNT |
4 |
NO |
3.63 V |
15 pF |
3.3 V |
12 ms |
3.2mm x 2.5mm x 1.0mm |
2.97 V |
85 Cel |
-40 Cel |
.032768 MHz |
12 ns |
55/45 |
STANDBY; ENABLE/DISABLE FUNCTION; TR |
|||||||||||||||||
|
Analog Devices |
CMOS |
SURFACE MOUNT |
5 |
20 % |
NO |
5.5 V |
5 pF |
.5 ms |
2.9mm x 1.75mm x 1.0mm |
2.7 V |
125 Cel |
-40 Cel |
MATTE TIN |
133 MHz |
.5 ns |
52.5/47.5 |
TAPE AND REEL |
e3 |
|||||||||||||||
|
Analog Devices |
CMOS |
SURFACE MOUNT |
6 |
22000 % |
NO |
PLASTIC/EPOXY |
5.5 V |
5 pF |
.17 mA |
TSOP6,.11,37 |
2.7 ms |
2.9mm x 1.75mm x 1.0mm |
2.25 V |
125 Cel |
-55 Cel |
MATTE TIN |
.000977 MHz |
2.4 ns |
ENABLE/DISABLE FUNCTION |
||||||||||||||
|
Connor Winfield |
LVPECL |
SURFACE MOUNT |
6 |
50 % |
NO |
CERAMIC |
3.465 V |
50 OHM |
90 mA |
3.3 V |
1 ms |
7.0mm x 5.0mm x 2.0mm |
3.135 V |
70 Cel |
0 Cel |
125 MHz |
1 ns |
55/45 |
TRI-STATE; ENABLE/DISABLE FUNCTION; COMPLEMENTRAY OUTPUT; TR, 7 INCH |
||||||||||||||
|
Seiko Epson |
CMOS |
GOLD |
e4 |
||||||||||||||||||||||||||||||
|
Seiko Epson |
CMOS |
SURFACE MOUNT |
4 |
50 % |
NO |
3.63 V |
15 pF |
3.3 V |
LCC4,.08X.1,67/51 |
6 ms |
2.5mm x 2.0mm x 0.7mm |
2.7 V |
105 Cel |
-40 Cel |
GOLD |
24.576 MHz |
6 ns |
55/45 |
3 Amp |
ENABLE/DISABLE FUNCTION; OTHER SUPPLY VOLTAGE 1.8 AND 2.5V ALSO AVAILABLE |
e4 |
||||||||||||
|
Seiko Epson |
CMOS |
||||||||||||||||||||||||||||||||
|
Seiko Epson |
CMOS |
SURFACE MOUNT |
4 |
50 % |
NO |
5.5 V |
50 pF |
20 mA |
5 V |
DILCC4,.12 |
5 ms |
5mm x 3.2mm x 1.1mm |
4.5 V |
85 Cel |
-40 Cel |
GOLD |
16 MHz |
5 ns |
60/40 |
16 Amp |
ENABLE/DISABLE FUNCTION |
e4 |
|||||||||||
|
Seiko Epson |
CMOS |
SURFACE MOUNT |
4 |
50 % |
NO |
3.6 V |
15 pF |
4 ms |
7.0mm x 5.0mm x 1.3mm |
1.6 V |
85 Cel |
-40 Cel |
Gold (Au) - with Nickel (Ni) barrier |
2.5 MHz |
4 ns |
55/45 |
STANDBY; ENABLE/DISABLE FUNCTION; TR |
e4 |
|||||||||||||||
|
Seiko Epson |
CMOS |
SURFACE MOUNT |
4 |
50 % |
NO |
3.6 V |
15 pF |
4 ms |
7.0mm x 5.0mm x 1.3mm |
1.6 V |
85 Cel |
-40 Cel |
GOLD OVER NICKEL |
25 MHz |
4 ns |
55/45 |
STANDBY; ENABLE/DISABLE FUNCTION; TAPE AND REEL |
e4 |
|||||||||||||||
|
Sitime |
LVCMOS |
SURFACE MOUNT |
4 |
75 % |
NO |
3.63 V |
15 pF |
.0013 mA |
200 ms |
2.0mm X 1.2mm X 0.55mm |
1.2 V |
70 Cel |
-10 Cel |
NICKEL PALLADIUM GOLD |
.032768 MHz |
200 ns |
52/48 |
.01 Amp |
e4 |
||||||||||||||
|
Sitime |
LVCMOS |
SURFACE MOUNT |
25 % |
NO |
3.63 V |
15 pF |
3.3 V |
2 ms |
2.0mm x 1.6mm x 0.75mm |
2.97 V |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
25 MHz |
2 ns |
55/45 |
ENABLE/DISABLE FUNCTION; HCMOS OUTPUT ALSO AVAILABLE |
e4 |
Crystal Oscillator (XO) Clock Oscillators are electronic devices that generate a stable clock signal with a fixed frequency. They use a quartz crystal resonator as the frequency-determining element, which provides a stable and accurate frequency over a wide temperature range.
One of the main advantages of XO Clock Oscillators is their ability to generate a stable and precise clock signal with a fixed frequency. This makes them ideal for use in applications that require precise timing, such as in digital signal processing, telecommunications, and scientific research.
XO Clock Oscillators offer a low phase noise, which is important in applications that require a clean and stable clock signal. They are capable of generating frequencies ranging from a few kilohertz to several hundred megahertz, making them suitable for use in various electronic circuits.
Additionally, XO Clock Oscillators have a relatively simple design and are easy to integrate into electronic systems. They are available in a range of package sizes and configurations, allowing them to be used in various applications, including in communication systems, network equipment, and instrumentation.