8 Automotive ICs 12
| Part | RoHS | Manufacturer | Temperature Grade | No. of Terminals | Package Code | Package Shape | Surface Mount | Package Body Material | Maximum Supply Current (Isup) | Technology | Screening Level | Terminal Form | Nominal Supply Voltage (Vsup) | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Minimum Operating Temperature | Terminal Finish | Terminal Position | JESD-30 Code | Moisture Sensitivity Level (MSL) | Qualification | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Infineon Technologies |
8 |
SON |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
3 mA |
BICMOS |
NO LEAD |
5.5/18 |
SMALL OUTLINE |
SOLCC8,.12,25 |
Automotive Circuits |
.635 mm |
TIN |
DUAL |
R-PDSO-N8 |
2A |
Not Qualified |
e3 |
||||||||
|
|
NXP Semiconductors |
8 |
SOP |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
GULL WING |
5/27 |
SMALL OUTLINE |
SOP8,.25 |
Automotive Circuits |
1.27 mm |
DUAL |
R-PDSO-G8 |
Not Qualified |
|||||||||||||
|
Texas Instruments |
COMMERCIAL |
8 |
DIP |
RECTANGULAR |
NO |
PLASTIC/EPOXY |
BIPOLAR |
THROUGH-HOLE |
IN-LINE |
DIP8,.3 |
Automotive Circuits |
2.54 mm |
70 Cel |
0 Cel |
DUAL |
R-PDIP-T8 |
||||||||||||
|
Texas Instruments |
COMMERCIAL |
8 |
DIP |
RECTANGULAR |
NO |
PLASTIC/EPOXY |
BIPOLAR |
THROUGH-HOLE |
IN-LINE |
DIP8,.3 |
Automotive Circuits |
2.54 mm |
70 Cel |
0 Cel |
DUAL |
R-PDIP-T8 |
Not Qualified |
|||||||||||
|
Texas Instruments |
AUTOMOTIVE |
8 |
SOP |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
7.5 mA |
AEC-Q100 |
GULL WING |
5/27 |
SMALL OUTLINE |
SOP8,.25 |
Automotive Circuits |
1.27 mm |
125 Cel |
-40 Cel |
DUAL |
R-PDSO-G8 |
Not Qualified |
|||||||||
|
Texas Instruments |
COMMERCIAL |
8 |
DIP |
RECTANGULAR |
NO |
PLASTIC/EPOXY |
BIPOLAR |
THROUGH-HOLE |
IN-LINE |
DIP8,.3 |
Automotive Circuits |
2.54 mm |
70 Cel |
0 Cel |
DUAL |
R-PDIP-T8 |
||||||||||||
|
Onsemi |
AUTOMOTIVE |
8 |
SOP |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
15 mA |
BIPOLAR |
GULL WING |
7/10 |
SMALL OUTLINE |
SOP8,.25 |
Automotive Circuits |
1.27 mm |
125 Cel |
-40 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDSO-G8 |
Not Qualified |
e0 |
|||||||
|
Onsemi |
AUTOMOTIVE |
8 |
DIP |
RECTANGULAR |
NO |
PLASTIC/EPOXY |
15 mA |
BIPOLAR |
THROUGH-HOLE |
7/10 |
IN-LINE |
DIP8,.3 |
Automotive Circuits |
2.54 mm |
125 Cel |
-40 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDIP-T8 |
Not Qualified |
e0 |
|||||||
|
STMicroelectronics |
8 |
NO |
PLASTIC/EPOXY |
8/10 |
SIP8,.1TB |
Automotive Circuits |
2.54 mm |
SINGLE |
Not Qualified |
|||||||||||||||||||
|
|
NXP Semiconductors |
8 |
SOP |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
GULL WING |
5/27 |
SMALL OUTLINE |
SOP8,.25 |
Automotive Circuits |
1.27 mm |
DUAL |
R-PDSO-G8 |
Not Qualified |
|||||||||||||
|
|
NXP Semiconductors |
8 |
SOP |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
GULL WING |
5/27 |
SMALL OUTLINE |
SOP8,.25 |
Automotive Circuits |
1.27 mm |
NICKEL PALLADIUM GOLD SILVER |
DUAL |
R-PDSO-G8 |
1 |
Not Qualified |
e4 |
30 |
260 |
||||||||
|
|
NXP Semiconductors |
8 |
SOP |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
GULL WING |
5/27 |
SMALL OUTLINE |
SOP8,.25 |
Automotive Circuits |
1.27 mm |
DUAL |
R-PDSO-G8 |
Not Qualified |
Automotive ICs are electronic components designed specifically for use in vehicles, such as cars, trucks, and buses. They are used to control various systems in the vehicle, including the engine, transmission, brakes, and safety systems.
Automotive ICs must meet specific requirements to be suitable for use in vehicles. They must be able to withstand the harsh environmental conditions found in vehicles, such as high temperatures, vibration, and moisture. Additionally, they must meet safety standards and be able to operate reliably in the presence of electromagnetic interference.
One of the main applications of automotive ICs is in engine control modules (ECMs), which are responsible for controlling the fuel injection and ignition timing in gasoline and diesel engines. Other applications include transmission control modules (TCMs), anti-lock brake system (ABS) controllers, and airbag control modules.
Automotive ICs use various types of semiconductor technologies, including microcontrollers, power MOSFETs, and voltage regulators. They are often designed to operate over a wide temperature range and have low power consumption to conserve battery life.