Part | RoHS | Manufacturer | Other IC type | Temperature Grade | No. of Terminals | Package Code | Package Shape | Surface Mount | Total Dose (V) | Maximum Switching Frequency | Package Body Material | Maximum Supply Current (Isup) | No. of Functions | No. of Channels | Technology | Screening Level | Nominal Bandwidth | Terminal Form | Maximum Negative Supply Voltage (Vsup) | Nominal Negative Supply Voltage (Vsup) | Nominal Supply Voltage (Vsup) | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Control Mode | Minimum Operating Temperature | Terminal Finish | Terminal Position | JESD-30 Code | Output (V) | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Maximum Signal Current | Height | Width (mm) | Qualification | Normal Position (V) | Nominal Off-state Isolation | Minimum Supply Voltage (Vsup) | Additional Features | Minimum Input Voltage | Minimum Negative Supply Voltage (Vsup) | JESD-609 Code | Switching (V) | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Maximum Switch-on Time | Maximum On-state Resistance (Ron) | Nominal Threshold Voltage (V) | Maximum Switch-off Time | Maximum Positive Input Voltage | Nominal On-state Resistance Match | Length | Adjustable Threshold | Maximum Input Voltage |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Analog Devices |
SPST |
INDUSTRIAL |
8 |
TSSOP |
SQUARE |
YES |
PLASTIC/EPOXY |
1 |
1 |
CMOS |
GULL WING |
3 V |
3/5 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.19 |
Multiplexer or Switches |
.65 mm |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
S-PDSO-G8 |
SEPARATE OUTPUT |
1 |
5.5 V |
1.1 mm |
3 mm |
Not Qualified |
NO |
55 dB |
1.8 V |
e3 |
BREAK-BEFORE-MAKE |
260 |
20 ns |
5 ohm |
13 ns |
1.5 ohm |
3 mm |
|||||||||||||||||||
Analog Devices |
SINGLE-ENDED MULTIPLEXER |
AUTOMOTIVE |
10 |
TSSOP |
SQUARE |
YES |
PLASTIC/EPOXY |
.004 mA |
1 |
4 |
CMOS |
GULL WING |
2.5 V |
1.8/3.3 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP10,.19,20 |
Multiplexer or Switches |
.5 mm |
125 Cel |
-40 Cel |
TIN LEAD |
DUAL |
S-PDSO-G10 |
1 |
3.6 V |
1.1 mm |
.3 A |
3 mm |
Not Qualified |
67 dB |
1.65 V |
e0 |
BREAK-BEFORE-MAKE |
240 |
30 ns |
.77 ohm |
7 ns |
.4 ohm |
3 mm |
||||||||||||||||||||
Analog Devices |
SPST |
MILITARY |
20 |
QCCN |
SQUARE |
YES |
CERAMIC, METAL-SEALED COFIRED |
1 |
1 |
CMOS |
MIL-STD-883 Class B |
NO LEAD |
-15 V |
15 V |
+-15 |
CHIP CARRIER |
LCC20,.35SQ |
Multiplexer or Switches |
1.27 mm |
125 Cel |
-55 Cel |
TIN LEAD |
QUAD |
S-CQCC-N20 |
SEPARATE OUTPUT |
Not Qualified |
NO |
80 dB |
e0 |
BREAK-BEFORE-MAKE |
300 ns |
90 ohm |
250 ns |
||||||||||||||||||||||||||
|
Analog Devices |
CROSS POINT SWITCH |
OTHER |
256 |
LBGA |
SQUARE |
YES |
PLASTIC/EPOXY |
1 |
34 |
BALL |
2.5 V |
GRID ARRAY, LOW PROFILE |
1.27 mm |
85 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B256 |
3 |
3.63 V |
1.7 mm |
27 mm |
Not Qualified |
2.25 V |
e1 |
30 |
260 |
57 ohm |
27 mm |
|||||||||||||||||||||||||||||
|
Analog Devices |
SPDT |
INDUSTRIAL |
10 |
HVSON |
SQUARE |
YES |
UNSPECIFIED |
2 |
2 |
BICMOS |
NO LEAD |
3.3 V |
3.3 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC10,.08,16 |
Multiplexer or Switches |
.4 mm |
85 Cel |
-40 Cel |
GOLD NICKEL |
DUAL |
S-XDSO-N10 |
SEPARATE OUTPUT |
1 |
3.6 V |
.8 mm |
2 mm |
Not Qualified |
26 dB |
3 V |
e4 |
BREAK-BEFORE-MAKE |
30 |
260 |
60 ns |
8 ohm |
30 ns |
.7 ohm |
2 mm |
|||||||||||||||||||
|
Analog Devices |
SPST |
INDUSTRIAL |
20 |
HVQCCN |
SQUARE |
YES |
UNSPECIFIED |
4 |
1 |
CMOS |
NO LEAD |
-20 V |
-15 V |
15 V |
+-4.5/+-20/4.5/36 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC20,.20SQ,25 |
Multiplexer or Switches |
.65 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
QUAD |
S-XQCC-N20 |
SEPARATE OUTPUT |
1 |
20 V |
.8 mm |
5 mm |
Not Qualified |
NO |
75 dB |
4.5 V |
-4.5 V |
e3 |
BREAK-BEFORE-MAKE |
30 |
260 |
225 ns |
10 ohm |
185 ns |
.3 ohm |
5 mm |
|||||||||||||||
|
Analog Devices |
SPST |
INDUSTRIAL |
8 |
TSSOP |
SQUARE |
YES |
PLASTIC/EPOXY |
2 |
1 |
BICMOS |
GULL WING |
3 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.65 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
S-PDSO-G8 |
1 |
5.5 V |
1.1 mm |
3 mm |
Not Qualified |
55 dB |
1.8 V |
e3 |
30 |
260 |
80 ns |
4.5 ohm |
40 ns |
.1 ohm |
3 mm |
||||||||||||||||||||||||
|
Analog Devices |
SPST |
INDUSTRIAL |
8 |
TSSOP |
SQUARE |
YES |
PLASTIC/EPOXY |
1 |
1 |
CMOS |
GULL WING |
-20 V |
-15 V |
15 V |
12/+-15 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.19 |
Multiplexer or Switches |
.65 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
S-PDSO-G8 |
1 |
20 V |
1.1 mm |
3 mm |
Not Qualified |
NO |
77 dB |
4.5 V |
-4.5 V |
e3 |
30 |
260 |
200 ns |
10 ohm |
100 ns |
3 mm |
||||||||||||||||||
|
Analog Devices |
SINGLE-ENDED MULTIPLEXER |
COMMERCIAL |
10 |
TSSOP |
SQUARE |
YES |
PLASTIC/EPOXY |
.01 mA |
1 |
4 |
CMOS |
GULL WING |
3 V |
3/5 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP10,.19,20 |
Multiplexer or Switches |
.5 mm |
70 Cel |
0 Cel |
Matte Tin (Sn) - annealed |
DUAL |
S-PDSO-G10 |
1 |
12 V |
1.1 mm |
.02 A |
3 mm |
Not Qualified |
75 dB |
2 V |
e3 |
BREAK-BEFORE-MAKE |
30 |
260 |
300 ns |
400 ohm |
200 ns |
2 ohm |
3 mm |
||||||||||||||||||
|
Analog Devices |
SPST |
COMMERCIAL |
48 |
QFP |
SQUARE |
YES |
PLASTIC/EPOXY |
16 |
BICMOS |
GULL WING |
3/5 |
FLATPACK |
QFP48,.35SQ,20 |
Multiplexer or Switches |
.5 mm |
70 Cel |
0 Cel |
Matte Tin (Sn) - annealed |
QUAD |
S-PQFP-G48 |
1 |
Not Qualified |
e3 |
3500 ns |
48 ohm |
|||||||||||||||||||||||||||||||||
|
Analog Devices |
SPST |
INDUSTRIAL |
10 |
HVSON |
SQUARE |
YES |
PLASTIC/EPOXY |
2 |
1 |
BICMOS |
NO LEAD |
5 V |
3.3/5 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC10,.12,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
S-PDSO-N10 |
SEPARATE OUTPUT |
1 |
5.5 V |
.8 mm |
3 mm |
Not Qualified |
NO/NC |
77 dB |
3 V |
e3 |
BREAK-BEFORE-MAKE |
30 |
260 |
200000 ns |
20 ohm |
400000 ns |
.058 ohm |
3 mm |
||||||||||||||||||
|
Analog Devices |
SPDT |
INDUSTRIAL |
25 |
VFBGA |
SQUARE |
YES |
PLASTIC/EPOXY |
1 |
1 |
CMOS |
BALL |
3 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.5 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B25 |
1 |
5.5 V |
.69 mm |
2.56 mm |
70 dB |
1.8 V |
e1 |
30 |
260 |
800 ns |
5.5 ohm |
800 ns |
.3 ohm |
2.56 mm |
|||||||||||||||||||||||||
|
Analog Devices |
SPST |
INDUSTRIAL |
64 |
LFBGA |
SQUARE |
YES |
PLASTIC/EPOXY |
1 |
1 |
BICMOS |
BALL |
3.3 V |
GRID ARRAY, LOW PROFILE, FINE PITCH |
.8 mm |
85 Cel |
-40 Cel |
BOTTOM |
S-PBGA-B64 |
5.5 V |
1.3 mm |
7 mm |
68 dB |
2.37 V |
NOT SPECIFIED |
NOT SPECIFIED |
5000 ns |
34 ohm |
3500 ns |
.54 ohm |
7 mm |
||||||||||||||||||||||||||||
Analog Devices |
SINGLE-ENDED MULTIPLEXER |
INDUSTRIAL |
20 |
HVQCCN |
SQUARE |
YES |
UNSPECIFIED |
.001 mA |
1 |
8 |
CMOS |
NO LEAD |
-2.75 V |
-2.5 V |
2.5 V |
+-2.5/3/5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
TSSOP16,.25 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
QUAD |
S-XQCC-N20 |
1 |
2.75 V |
.8 mm |
.03 A |
4 mm |
Not Qualified |
2.25 V |
-2.25 V |
e0 |
BREAK-BEFORE-MAKE |
20 ns |
3.5 ohm |
20 ns |
.2 ohm |
4 mm |
|||||||||||||||||||
|
Analog Devices |
SPST |
INDUSTRIAL |
16 |
FBGA |
SQUARE |
YES |
PLASTIC/EPOXY |
4 |
CMOS |
BALL |
3/5 |
GRID ARRAY, FINE PITCH |
BGA16,4X4,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
BOTTOM |
S-PBGA-B16 |
SEPARATE OUTPUT |
Not Qualified |
NO/NC |
BREAK-BEFORE-MAKE |
NOT SPECIFIED |
NOT SPECIFIED |
170 ns |
60 ohm |
|||||||||||||||||||||||||||||||
|
Analog Devices |
DPDT |
INDUSTRIAL |
36 |
VQCCN |
SQUARE |
YES |
UNSPECIFIED |
4 |
4 |
CMOS |
NO LEAD |
3 V |
3/5 |
CHIP CARRIER, VERY THIN PROFILE |
LCC36,.25SQ,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
QUAD |
S-XQCC-N36 |
SEPARATE OUTPUT |
1 |
5.5 V |
.8 mm |
6 mm |
Not Qualified |
95 dB |
1.8 V |
e3 |
BREAK-BEFORE-MAKE |
30 |
260 |
140 ns |
.85 ohm |
50 ns |
.35 ohm |
6 mm |
|||||||||||||||||||
Analog Devices |
SPST |
INDUSTRIAL |
8 |
HVSON |
SQUARE |
YES |
UNSPECIFIED |
2 |
1 |
NO LEAD |
5 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
.65 mm |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
S-XDSO-N8 |
1 |
12 V |
.8 mm |
3 mm |
Not Qualified |
76 dB |
2.7 V |
e0 |
245 |
100 ns |
60 ohm |
75 ns |
.8 ohm |
3 mm |
|||||||||||||||||||||||||||
|
Analog Devices |
SPDT |
INDUSTRIAL |
8 |
HVSON |
SQUARE |
YES |
PLASTIC/EPOXY |
1 |
1 |
BICMOS |
NO LEAD |
5 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
.65 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
S-PDSO-N8 |
1 |
5.5 V |
.8 mm |
3 mm |
77 dB |
3 V |
e3 |
30 |
260 |
1800000 ns |
2 ohm |
1000000 ns |
.0051 ohm |
3 mm |
|||||||||||||||||||||||||
|
Analog Devices |
SPST |
INDUSTRIAL |
8 |
TSSOP |
SQUARE |
YES |
PLASTIC/EPOXY |
2 |
1 |
CMOS |
GULL WING |
5 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.65 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
S-PDSO-G8 |
1 |
12 V |
1.1 mm |
3 mm |
Not Qualified |
45 dB |
2 V |
e4 |
30 |
260 |
150 ns |
70 ohm |
80 ns |
2 ohm |
3 mm |
||||||||||||||||||||||||
|
Analog Devices |
DPDT |
INDUSTRIAL |
16 |
HVQCCN |
SQUARE |
YES |
UNSPECIFIED |
2 |
2 |
CMOS |
NO LEAD |
3 V |
3/5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC16,.12SQ,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
QUAD |
S-XQCC-N16 |
SEPARATE OUTPUT |
1 |
5.5 V |
.8 mm |
3 mm |
Not Qualified |
76 dB |
1.8 V |
e3 |
BREAK-BEFORE-MAKE |
30 |
260 |
45 ns |
75 ohm |
25 ns |
2 ohm |
3 mm |
|||||||||||||||||||
|
Analog Devices |
INDUSTRIAL |
36 |
FBGA |
SQUARE |
YES |
PLASTIC/EPOXY |
4 |
CMOS |
BALL |
3/5 |
GRID ARRAY, FINE PITCH |
BGA36,6X6,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B36 |
SEPARATE OUTPUT |
1 |
Not Qualified |
e1 |
BREAK-BEFORE-MAKE |
30 |
260 |
140 ns |
4 ohm |
||||||||||||||||||||||||||||||
Analog Devices |
SINGLE-ENDED MULTIPLEXER |
INDUSTRIAL |
16 |
VQCCN |
SQUARE |
YES |
CERAMIC, METAL-SEALED COFIRED |
.6 mA |
1 |
8 |
CMOS |
NO LEAD |
-20 V |
-15 V |
15 V |
12/+-15 |
CHIP CARRIER, VERY THIN PROFILE |
LCC16,.2SQ,32 |
Multiplexer or Switches |
.8 mm |
85 Cel |
-40 Cel |
TIN LEAD |
QUAD |
S-CQCC-N16 |
1 |
20 V |
1 mm |
.03 A |
5 mm |
Not Qualified |
75 dB |
4.5 V |
-4.5 V |
e0 |
BREAK-BEFORE-MAKE |
500 ns |
400 ohm |
500 ns |
4 ohm |
5 mm |
||||||||||||||||||
Analog Devices |
SPST |
MILITARY |
20 |
QCCN |
SQUARE |
YES |
CERAMIC, METAL-SEALED COFIRED |
2 |
1 |
CMOS |
NO LEAD |
-20 V |
-15 V |
15 V |
5,+-15 |
CHIP CARRIER |
LCC20,.35SQ |
Multiplexer or Switches |
1.27 mm |
125 Cel |
-55 Cel |
TIN LEAD |
QUAD |
S-CQCC-N20 |
SEPARATE OUTPUT |
20 V |
2.54 mm |
8.89 mm |
Not Qualified |
NO |
72 dB |
4.5 V |
-4.5 V |
e0 |
BREAK-BEFORE-MAKE |
150 ns |
45 ohm |
100 ns |
.5 ohm |
8.89 mm |
|||||||||||||||||||
Analog Devices |
SPST |
INDUSTRIAL |
16 |
VQCCN |
SQUARE |
YES |
CERAMIC, METAL-SEALED COFIRED |
4 |
1 |
CMOS |
NO LEAD |
3 V |
3/5 |
CHIP CARRIER, VERY THIN PROFILE |
LCC16,.20SQ,32 |
Multiplexer or Switches |
.65 mm |
85 Cel |
-40 Cel |
TIN LEAD |
QUAD |
S-CQCC-N16 |
SEPARATE OUTPUT |
1 |
5.5 V |
1 mm |
4 mm |
Not Qualified |
NO/NC |
75 dB |
1.8 V |
e0 |
BREAK-BEFORE-MAKE |
245 |
16 ns |
7 ohm |
10 ns |
.1 ohm |
4 mm |
||||||||||||||||||||
|
Analog Devices |
DPDT |
COMMERCIAL |
10 |
TSSOP |
SQUARE |
YES |
PLASTIC/EPOXY |
1 |
2 |
CMOS |
GULL WING |
3 V |
3/5 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP10,.19,20 |
Multiplexer or Switches |
.5 mm |
70 Cel |
0 Cel |
Matte Tin (Sn) - annealed |
DUAL |
S-PDSO-G10 |
SEPARATE OUTPUT |
1 |
12 V |
1.1 mm |
3 mm |
Not Qualified |
2 V |
e3 |
BREAK-BEFORE-MAKE |
30 |
260 |
300 ns |
400 ohm |
200 ns |
3 mm |
|||||||||||||||||||||
Analog Devices |
SPST |
COMMERCIAL |
16 |
HVQCCN |
SQUARE |
YES |
UNSPECIFIED |
4 |
1 |
CMOS |
NO LEAD |
-6 V |
-5 V |
5 V |
3/5/+-5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC16,.12SQ,20 |
Multiplexer or Switches |
.65 mm |
70 Cel |
0 Cel |
TIN LEAD |
QUAD |
S-XQCC-N16 |
SEPARATE OUTPUT |
6 V |
1 mm |
4 mm |
Not Qualified |
NO/NC |
90 dB |
2 V |
ALSO OPERATE WITH 2V TO 12V SINGLE SUPPLY |
-2 V |
e0 |
BREAK-BEFORE-MAKE |
80 ns |
100 ohm |
30 ns |
1 ohm |
4 mm |
||||||||||||||||||
|
Analog Devices |
INDUSTRIAL |
48 |
QFP |
SQUARE |
YES |
PLASTIC/EPOXY |
16 |
BICMOS |
GULL WING |
3/5 |
FLATPACK |
QFP48,.35SQ,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-PQFP-G48 |
Not Qualified |
30 |
260 |
5000 ns |
52 ohm |
|||||||||||||||||||||||||||||||||||
Analog Devices |
SINGLE-ENDED MULTIPLEXER |
MILITARY |
28 |
QCCN |
SQUARE |
YES |
CERAMIC, GLASS-SEALED |
1 mA |
1 |
16 |
CMOS |
MIL-STD-883 Class B |
NO LEAD |
-20 V |
-15 V |
15 V |
12/+-15 |
CHIP CARRIER |
LCC28,.45SQ |
Multiplexer or Switches |
1.27 mm |
125 Cel |
-55 Cel |
QUAD |
S-GQCC-N28 |
1 |
20 V |
2.54 mm |
.03 A |
11.4554 mm |
Not Qualified |
69 dB |
4.5 V |
-4.5 V |
BREAK-BEFORE-MAKE |
200 ns |
100 ohm |
150 ns |
1.5 ohm |
11.4554 mm |
|||||||||||||||||||
|
Analog Devices |
INDUSTRIAL |
16 |
FBGA |
SQUARE |
YES |
PLASTIC/EPOXY |
4 |
CMOS |
BALL |
3/5 |
GRID ARRAY, FINE PITCH |
BGA16,4X4,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
BOTTOM |
S-PBGA-B16 |
SEPARATE OUTPUT |
1 |
Not Qualified |
e3 |
BREAK-BEFORE-MAKE |
140 ns |
1 ohm |
||||||||||||||||||||||||||||||||
|
Analog Devices |
CROSS POINT SWITCH |
INDUSTRIAL |
32 |
TFQFP |
SQUARE |
YES |
PLASTIC/EPOXY |
2 |
2 |
BIPOLAR |
GULL WING |
3.3 V |
3.3 |
FLATPACK, THIN PROFILE, FINE PITCH |
TQFP32,.28SQ |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
QUAD |
S-PQFP-G32 |
SEPARATE OUTPUT |
1 |
3.6 V |
1.2 mm |
5 mm |
Not Qualified |
3 V |
e3 |
30 |
260 |
.574 ns |
.555 ns |
5 mm |
|||||||||||||||||||||||
|
Analog Devices |
SPST |
COMMERCIAL |
8 |
TSSOP |
SQUARE |
YES |
PLASTIC/EPOXY |
2 |
1 |
CMOS |
GULL WING |
5 V |
3.3/5 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.19 |
Multiplexer or Switches |
.65 mm |
70 Cel |
0 Cel |
Matte Tin (Sn) - annealed |
DUAL |
S-PDSO-G8 |
SEPARATE OUTPUT |
1 |
12 V |
1.1 mm |
3 mm |
Not Qualified |
NO |
76 dB |
2.7 V |
e3 |
BREAK-BEFORE-MAKE |
30 |
260 |
100 ns |
60 ohm |
75 ns |
.8 ohm |
3 mm |
||||||||||||||||||
|
Analog Devices |
DPDT |
INDUSTRIAL |
16 |
VQCCN |
SQUARE |
YES |
CERAMIC, METAL-SEALED COFIRED |
2 |
2 |
CMOS |
NO LEAD |
3 V |
CHIP CARRIER, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
QUAD |
S-CQCC-N16 |
1 |
5.5 V |
1 mm |
3 mm |
Not Qualified |
76 dB |
1.8 V |
e3 |
30 |
260 |
35 ns |
75 ohm |
20 ns |
2 ohm |
3 mm |
||||||||||||||||||||||||
|
Analog Devices |
SPST |
INDUSTRIAL |
10 |
HVSON |
SQUARE |
YES |
UNSPECIFIED |
2 |
1 |
BICMOS |
NO LEAD |
3.3 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
S-XDSO-N10 |
1 |
3.6 V |
.8 mm |
3 mm |
Not Qualified |
26 dB |
3 V |
e3 |
30 |
260 |
60 ns |
8 ohm |
30 ns |
.7 ohm |
3 mm |
||||||||||||||||||||||||
|
Analog Devices |
SPST |
INDUSTRIAL |
16 |
HVQCCN |
SQUARE |
YES |
UNSPECIFIED |
4 |
1 |
CMOS |
NO LEAD |
-20 V |
-15 V |
15 V |
+-4.5/+-20/10/30 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC16,.20SQ,32 |
Multiplexer or Switches |
.8 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
QUAD |
S-XQCC-N16 |
SEPARATE OUTPUT |
1 |
20 V |
.8 mm |
5 mm |
Not Qualified |
NO |
60 dB |
4.5 V |
-4.5 V |
e3 |
BREAK-BEFORE-MAKE |
30 |
260 |
250 ns |
85 ohm |
120 ns |
4 ohm |
5 mm |
|||||||||||||||
|
Analog Devices |
SPST |
COMMERCIAL |
28 |
QCCJ |
SQUARE |
YES |
PLASTIC/EPOXY |
1 |
1 |
BCDMOS |
J BEND |
3 V |
3/13 |
CHIP CARRIER |
LDCC28,.5SQ |
Multiplexer or Switches |
1.27 mm |
70 Cel |
0 Cel |
Matte Tin (Sn) - annealed |
QUAD |
S-PQCC-J28 |
1 |
13.2 V |
4.57 mm |
11.505 mm |
Not Qualified |
NO |
77 dB |
2.7 V |
e3 |
245 |
5000 ns |
38 ohm |
5000 ns |
1.3 ohm |
11.505 mm |
|||||||||||||||||||||
Analog Devices |
DIFFERENTIAL MULTIPLEXER |
INDUSTRIAL |
20 |
HVQCCN |
SQUARE |
YES |
UNSPECIFIED |
.001 mA |
1 |
4 |
CMOS |
NO LEAD |
-2.75 V |
-2.5 V |
2.5 V |
+-2.5/3/5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC20,.16SQ,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
QUAD |
S-XQCC-N20 |
1 |
2.75 V |
.8 mm |
.03 A |
4 mm |
Not Qualified |
2.25 V |
-2.25 V |
e0 |
BREAK-BEFORE-MAKE |
20 ns |
3.5 ohm |
20 ns |
.2 ohm |
4 mm |
|||||||||||||||||||
Analog Devices |
DPST |
MILITARY |
20 |
QCCN |
SQUARE |
YES |
CERAMIC |
2 |
CMOS |
NO LEAD |
-15 V |
15 V |
+-15 |
CHIP CARRIER |
LCC20,.35SQ |
Multiplexer or Switches |
1.27 mm |
125 Cel |
-55 Cel |
QUAD |
S-XQCC-N20 |
SEPARATE OUTPUT |
Not Qualified |
NO |
BREAK-BEFORE-MAKE |
150 ns |
45 ohm |
||||||||||||||||||||||||||||||||
|
Analog Devices |
SPST |
INDUSTRIAL |
8 |
HVSON |
SQUARE |
YES |
UNSPECIFIED |
2 |
1 |
BICMOS |
NO LEAD |
3.3 V |
3.3 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.08,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
GOLD NICKEL |
DUAL |
S-XDSO-N8 |
SEPARATE OUTPUT |
1 |
3.6 V |
.8 mm |
2 mm |
Not Qualified |
NO |
26 dB |
3 V |
e4 |
BREAK-BEFORE-MAKE |
30 |
260 |
60 ns |
8 ohm |
30 ns |
.7 ohm |
2 mm |
||||||||||||||||||
|
Analog Devices |
SPST |
INDUSTRIAL |
16 |
VFBGA |
SQUARE |
YES |
PLASTIC/EPOXY |
1 |
4 |
CMOS |
BALL |
3 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.5 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B16 |
1 |
5.5 V |
.67 mm |
2.02 mm |
80 dB |
1.8 V |
e1 |
30 |
260 |
100 ns |
4.5 ohm |
50 ns |
.4 ohm |
2.02 mm |
|||||||||||||||||||||||||
Analog Devices |
CROSS POINT SWITCH |
COMMERCIAL |
44 |
QCCJ |
SQUARE |
YES |
PLASTIC/EPOXY |
1 |
CMOS |
J BEND |
-5 V |
5 V |
+-5 |
CHIP CARRIER |
LDCC44,.7SQ |
Multiplexer or Switches |
1.27 mm |
70 Cel |
0 Cel |
TIN LEAD |
QUAD |
S-PQCC-J44 |
SEPARATE OUTPUT |
Not Qualified |
e0 |
600 ohm |
|||||||||||||||||||||||||||||||||
Analog Devices |
SINGLE-ENDED MULTIPLEXER |
COMMERCIAL |
16 |
HVQCCN |
SQUARE |
YES |
UNSPECIFIED |
.001 mA |
1 |
8 |
CMOS |
NO LEAD |
-8 V |
-5 V |
5 V |
+-3/+-8/3/15 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC16(UNSPEC) |
Multiplexer or Switches |
.8 mm |
70 Cel |
0 Cel |
TIN LEAD |
QUAD |
S-XQCC-N16 |
8 V |
.8 mm |
.03 A |
5 mm |
Not Qualified |
75 dB |
3 V |
ALSO OPERATE WITH 3V TO 15V SINGLE SUPPLY |
-3 V |
e0 |
BREAK-BEFORE-MAKE |
150 ns |
100 ohm |
150 ns |
6 ohm |
5 mm |
||||||||||||||||||
Analog Devices |
SPST |
INDUSTRIAL |
9 |
VFBGA |
SQUARE |
YES |
UNSPECIFIED |
2 |
1 |
CMOS |
BALL |
3 V |
3/5 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA9,3X3,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
BOTTOM |
S-XBGA-B9 |
SEPARATE OUTPUT |
1 |
11 V |
.69 mm |
1.52 mm |
Not Qualified |
NO |
72 dB |
2 V |
e0 |
BREAK-BEFORE-MAKE |
245 |
150 ns |
50 ohm |
60 ns |
.8 ohm |
1.52 mm |
||||||||||||||||||||
|
Analog Devices |
SPST |
INDUSTRIAL |
8 |
TSSOP |
SQUARE |
YES |
PLASTIC/EPOXY |
1 |
1 |
CMOS |
GULL WING |
3 V |
3/5 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.19 |
Multiplexer or Switches |
.65 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
S-PDSO-G8 |
1 |
5.5 V |
1.1 mm |
3 mm |
Not Qualified |
NO |
55 dB |
1.8 V |
e3 |
BREAK-BEFORE-MAKE |
30 |
260 |
15 ns |
3.5 ohm |
10 ns |
3 mm |
||||||||||||||||||||
Analog Devices |
SPST |
INDUSTRIAL |
8 |
TSSOP |
SQUARE |
YES |
PLASTIC/EPOXY |
2 |
1 |
CMOS |
GULL WING |
3 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.65 mm |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
S-PDSO-G8 |
1 |
3.6 V |
1.1 mm |
3 mm |
Not Qualified |
55 dB |
1.6 V |
e0 |
24 ns |
.8 ohm |
16 ns |
.05 ohm |
3 mm |
|||||||||||||||||||||||||||
|
Analog Devices |
SPST |
INDUSTRIAL |
8 |
VSON |
SQUARE |
YES |
UNSPECIFIED |
2 |
1 |
CMOS |
NO LEAD |
3 V |
1.8/3 |
SMALL OUTLINE, VERY THIN PROFILE |
SOLCC8,.08,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
GOLD NICKEL |
DUAL |
S-XDSO-N8 |
SEPARATE OUTPUT |
1 |
3.6 V |
.8 mm |
2 mm |
Not Qualified |
NO |
55 dB |
1.6 V |
e4 |
BREAK-BEFORE-MAKE |
30 |
260 |
24 ns |
.8 ohm |
16 ns |
.05 ohm |
2 mm |
||||||||||||||||||
|
Analog Devices |
SPST |
INDUSTRIAL |
16 |
HVQCCN |
SQUARE |
YES |
UNSPECIFIED |
1 |
4 |
CMOS |
NO LEAD |
3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.65 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
QUAD |
S-XQCC-N16 |
1 |
5.5 V |
.8 mm |
4 mm |
80 dB |
1.8 V |
e3 |
30 |
260 |
100 ns |
4.5 ohm |
50 ns |
.4 ohm |
4 mm |
|||||||||||||||||||||||||
|
Analog Devices |
SPST |
INDUSTRIAL |
8 |
TSSOP |
SQUARE |
YES |
PLASTIC/EPOXY |
2 |
1 |
CMOS |
GULL WING |
1.8 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.65 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
S-PDSO-G8 |
1 |
3.6 V |
1.1 mm |
3 mm |
Not Qualified |
50 dB |
1.6 V |
e3 |
30 |
260 |
35 ns |
2.5 ohm |
25 ns |
3 mm |
|||||||||||||||||||||||||
|
Analog Devices |
SPST |
INDUSTRIAL |
10 |
HVSON |
SQUARE |
YES |
UNSPECIFIED |
2 |
1 |
BICMOS |
NO LEAD |
3.3 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
S-XDSO-N10 |
1 |
3.6 V |
.8 mm |
3 mm |
Not Qualified |
26 dB |
3 V |
e3 |
30 |
260 |
60 ns |
8 ohm |
30 ns |
.7 ohm |
3 mm |
Multiplexers and switches are electronic components used in digital and analog circuits to route signals between different inputs and outputs. They allow a single input signal to be sent to multiple output channels or vice versa.
A multiplexer, also known as a "mux," is a digital component that selects one of several input signals and forwards it to a single output. Multiplexers are often used in data communication systems to transmit multiple signals over a single communication channel. They can also be used in digital circuits to route control signals and address lines.
A switch is an electronic component that connects or disconnects two or more circuits. Switches can be mechanical or electronic and are used to control the flow of current in a circuit. In digital circuits, switches are used to connect or disconnect components and can be used to create logic gates and other digital components.
Multiplexers and switches are important components in various electronic systems, including communication systems, data processing systems, and control systems. They can be used to route signals between different parts of a circuit and to switch between different modes of operation. Multiplexers and switches can also be used to improve the efficiency of a system by reducing the number of components needed to perform a particular function.